CN113891579A - Manufacturing method of HDI board deep V blind hole - Google Patents
Manufacturing method of HDI board deep V blind hole Download PDFInfo
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- CN113891579A CN113891579A CN202111107250.1A CN202111107250A CN113891579A CN 113891579 A CN113891579 A CN 113891579A CN 202111107250 A CN202111107250 A CN 202111107250A CN 113891579 A CN113891579 A CN 113891579A
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- layer
- blind hole
- laser
- pad
- hole
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 238000005553 drilling Methods 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims abstract description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052802 copper Inorganic materials 0.000 claims abstract description 11
- 239000010949 copper Substances 0.000 claims abstract description 11
- 239000011347 resin Substances 0.000 claims abstract description 4
- 229920005989 resin Polymers 0.000 claims abstract description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007727 pp-medium Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a method for manufacturing a deep V blind hole of an HDI (high Density interconnection) plate, which comprises the following steps: cutting-inner layer circuit (including PAD), pressing-brown thin copper-laser drilling-mechanical drilling-hole filling electroplating-resin hole filling, wherein: (1) when the inner layer circuit is used, a blind hole is arranged on the L3 layer to receive PAD, and a blind hole limiting PAD is arranged on the L2 layer; (2) the laser alignment target inner target design is firstly carried out before laser drilling, and specifically comprises the following steps: the design is carried out by adopting an L1-2-3 mode, the L1 layer and the L3 layer are all copper sheets, and a round hole of 0.8mm is etched on the L2 layer; (3) the laser drilling operation comprises the following steps: adopting laser drilling, firstly windowing and ablating 3.5 × 3.5mm step holes on the L1 layer until the step holes penetrate through 0.8mm round hole holes on the L2 layer to ablate to the bearing PAD on the L3 layer, and then automatically grabbing the round hole holes on the L2 layer by a laser drilling machine to carry out alignment laser operation; the manufacturing method is simple and easy to implement, the quality risk of laser leakage can be avoided, and the quality requirement of cross-layer laser L1-3 blind hole telecommunication energy can be met.
Description
Technical Field
The invention relates to a manufacturing method of a blind hole, in particular to a manufacturing method of a cross-layer deep V blind hole of a high-density interconnection HDI board, and belongs to the technical field of printed circuit board manufacturing.
Background
Based on printed circuit high density interconnection HDI board, cross deep V blind hole structure, dielectric layer thickness and hole depth, blind hole accept PAD and the key technical field of aperture aspect ratio little. In the prior art, an exaggerated blind hole of L1-3 is disassembled into L1-2 and L2-3 to be subjected to laser, copper filling and electroplating, and a blind hole is stacked to be manufactured, wherein the aperture of the required laser blind hole exceeds the processing capacity of hole filling and electroplating due to the fact that the PP medium of a laser layer is thicker (more than 6-8 mil). The size of a blind PAD bearing layer L3 is only 10 mils, the aperture of a laser blind hole needs to be larger than 6-8 mils, the hole ring is only 2 mils, and the potential large laser blind hole step leakage quality risk exists if the conventional L1-3 blind hole design is adopted.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a manufacturing method of a deep V blind hole of an HDI plate, which is simple and feasible, can avoid the quality risk of laser leakage steps and can meet the telecommunication energy quality requirement of a cross-layer laser L1-3 blind hole.
In order to solve the technical problem, the invention provides a method for manufacturing a deep V blind hole of an HDI board, which specifically comprises the following steps: cutting-inner layer circuit (including PAD), pressing-brown thin copper-laser drilling-mechanical drilling-hole filling electroplating-resin hole filling, wherein:
(1) when the inner layer circuit is used, a blind hole is arranged on the L3 layer to receive PAD, and a blind hole limiting PAD is arranged on the L2 layer;
(2) the laser alignment target inner target design is firstly carried out before laser drilling, and specifically comprises the following steps:
the design is carried out by adopting an L1-2-3 mode, the L1 layer and the L3 layer are both all copper sheets, and a round hole of 0.8mm is etched on the L2 layer;
(3) the specific operation of laser drilling is as follows:
and (3) adopting laser drilling, windowing and ablating 3.5-by-3.5-mm step holes on the L1 layer until the step holes penetrate through the 0.8-mm round hole on the L2 layer to ablate to the bearing PAD on the L3 layer, and then automatically grabbing the round hole on the L2 layer by a laser drilling machine to carry out alignment laser operation.
The technical scheme of the invention is further defined as follows:
furthermore, in the manufacturing method of the deep V blind hole of the HDI board, the diameter of the blind hole on the L3 layer for bearing the PAD is 10mil, the aperture of the blind hole is 6mil, and the ring of the blind hole is less than or equal to 2 mil.
In the manufacturing method of the deep V blind hole of the HDI board, the size of the blind hole limiting PAD on the L2 layer is 14mil, a circular hole with the diameter of 6mil is arranged in the middle of the limiting PAD, and the ring is 4 mil.
The technical effect, design has 6 mil's round hole and 4 mil's ring in the middle of L2 layer blind hole spacing PAD, and at laser's in-process, laser energy does not burn the principle that the copper only ablates the substrate, and when laser drilling appeared harmomegathus off normal, laser energy sees through the accurate landing on L3 layer of the round hole of 6mil in the spacing PAD on the PAD of accepting.
In the manufacturing method of the HDI board deep V blind hole, the browned thin copper adopts an LDD browned process.
The laser drilling process has the advantages that laser energy is relatively small, and damage to inner-layer copper cannot be caused, so that when laser is deflected, laser energy is focused again by using the blind hole limiting PAD of the L2 layer, and the quality problem of missed connection when the blind hole hits the L3 layer is solved.
The invention has the beneficial effects that:
the design of the invention is mainly that the size of the blind hole of the L3 layer for bearing the PAD is insufficient, and direct laser drilling through the L1-3 layer cannot be carried out, so that the limit PAD of the blind hole is designed on the L2 layer. The method aims to solve the problem that blind holes of the L3 th layer are missed (deviated) when the L1-3 layers are radiussed.
Even if the laser drilling tool is used for drilling in a wrong way at the beginning, the laser drilling tool is used for drilling the blind hole bottom PAD of the L3 layer due to the existence of the blind hole limiting PAD of the L2 layer, and therefore the purpose that the blind hole of the L3 layer is not missed is achieved.
According to the manufacturing method of the HDI board deep V blind hole, the quality requirement that the size of the PAD hole ring is less than or equal to 2mil and no missing connection is realized; the invention greatly improves the precision of laser drilling and the reliability of blind hole quality.
Drawings
Fig. 1 is a schematic view of an L1-3 deep V blind via manufactured by an embodiment of the present invention.
FIG. 2 is a schematic cross-sectional view of a deep V-shaped blind hole fabricated in an embodiment of the present invention;
FIG. 3 is a schematic diagram of the layer L3 in FIG. 2 bearing a PAD;
FIG. 4 is a schematic diagram of a limiting PAD layer L2 in FIG. 2;
FIG. 5 is a cross-sectional view of an inner target in an embodiment of the present invention.
FIG. 6 is a schematic view of a normal L1-3 deep V blind via manufactured according to an embodiment of the present invention.
FIG. 7 is a schematic view of another L1-3 deep V blind via manufactured according to an embodiment of the present invention;
FIG. 8 is a schematic diagram of an L1-3 deep V blind via leakage step fabricated by a prior art method.
Detailed Description
Example 1
In the method for manufacturing the HDI board deep V blind hole provided in this embodiment, taking a 10-layer HDI board as an example, an L1-2 common blind hole, an L1-3 deep V blind hole & L10-9 common blind hole, and an L10-8 deep V blind hole are designed (the L10-8 blind hole is manufactured as L1-3), and the thicknesses of the L2 and L9 layers of copper are designed as 2oz thick copper, and the method for manufacturing the blind hole specifically includes the following steps: cutting-inner layer circuit (including PAD), pressing-brown thin copper-laser drilling-mechanical drilling-hole filling electroplating-resin hole filling, wherein:
(1) when the inner layer circuit is used, a blind hole is arranged on the L3 layer to receive PAD, and a blind hole limiting PAD is arranged on the L2 layer;
(2) the laser alignment target inner target design is firstly carried out before laser drilling, as shown in fig. 5, specifically:
the design is carried out by adopting an L1-2-3 mode, the L1 layer and the L3 layer are both all copper sheets, and a round hole of 0.8mm is etched on the L2 layer;
(3) the specific operation of laser drilling is as follows:
laser drilling is adopted, 3.5-3.5 mm stepped holes are firstly windowed and ablated on the L1 layer until the stepped holes penetrate through 0.8mm round hole holes of the L2 layer and are ablated to the bearing PAD of the L3 layer, then a laser drilling machine automatically grabs the round hole holes of the L2 layer to carry out alignment laser operation to form blind holes as shown in the figure 1-2, so that the blind holes are matched with the design height, the precision of laser drilling is greatly improved, and the reliability of the quality of the blind holes is improved.
The laser drilling method comprises the steps of pre-positioning by utilizing a target-seeing pattern during laser drilling, burning out a laser inner target, wherein the inner target is shown in fig. 5, then grabbing a 0.8mm round hole in the inner target for re-positioning, performing laser drilling operation, wherein the position of the grabbed 0.8mm round hole pattern is on the layer L2, laser energy penetrates through the layer L2 blind hole limiting PAD, and the laser drilling is performed on the layer L3 blind hole bottom PAD, so that the aim of preventing the L3 blind holes from being missed is fulfilled.
In this embodiment, other processes such as cutting, inner layer circuit, and pressing are performed according to the prior art.
In the present embodiment, as shown in FIG. 3, the diameter of the blind via PAD on the L3 layer is 10mil, the aperture of the blind via is 6mil, and the ring of the blind via ring is less than or equal to 2 mil.
In this embodiment, as shown in fig. 4, the size of the blind-hole PAD on the L2 layer is 14mil, and a circular hole with a diameter of 6mil is formed in the middle of the PAD, and the ring is 4 mil.
In this example, the thin copper brown is formed using an LDD brown process.
The blind holes manufactured by the manufacturing method of the invention are as follows:
a. normally as shown in fig. 6;
b. with the PAD in place, the L1-2 layer is laser biased, but the L3 layer has no leakage step, as shown in fig. 7.
Blind holes manufactured by the prior art:
without a PAD, the blind via has a leakage step, as shown in fig. 8.
The blind holes are manufactured by the manufacturing method, the limit PAD of the blind hole is designed on the L2 layer, the purpose is to avoid the problem that the blind hole of the L3 th layer is missed (deviated) when the laser of the L1-3 layers is carried out, even under the condition that the laser of the L1-2 layers is deviated, the laser is drilled to the PAD at the bottom of the blind hole of the L3 layer due to the existence of the limit PAD of the blind hole on the L2 layer, so that the purpose that the blind hole of the L3 layer is not missed is achieved, the quality requirement that the blind hole of the blind hole ring with the size of the blind hole carrying the PAD being less than or equal to 2 mils is met, the precision of laser drilling is greatly improved, and the reliability of the quality of the blind hole is improved.
In addition to the above embodiments, the present invention may have other embodiments. All technical solutions formed by adopting equivalent substitutions or equivalent transformations fall within the protection scope of the claims of the present invention.
Claims (4)
1. The manufacturing method of the HDI board deep V blind hole is characterized by comprising the following steps: cutting-inner layer circuit (including PAD), pressing-brown thin copper-laser drilling-mechanical drilling-hole filling electroplating-resin hole filling, wherein:
(1) when the inner layer circuit is used, a blind hole is arranged on the L3 layer to receive PAD, and a blind hole limiting PAD is arranged on the L2 layer;
(2) the laser alignment target inner target design is firstly carried out before laser drilling, and specifically comprises the following steps:
the design is carried out by adopting an L1-2-3 mode, the L1 layer and the L3 layer are both all copper sheets, and a round hole of 0.8mm is etched on the L2 layer;
(3) the specific operation of laser drilling is as follows:
and (3) adopting laser drilling, windowing and ablating 3.5-by-3.5-mm step holes on the L1 layer until the step holes penetrate through the 0.8-mm round hole on the L2 layer to ablate to the bearing PAD on the L3 layer, and then automatically grabbing the round hole on the L2 layer by a laser drilling machine to carry out alignment laser operation.
2. The method for manufacturing the HDI board deep V blind hole according to claim 1, wherein the method comprises the following steps: the diameter of a blind hole on the L3 layer for receiving the PAD is 10mil, the aperture of the blind hole is 6mil, and the ring of the blind hole is less than or equal to 2 mil.
3. The method for manufacturing the HDI board deep V blind hole according to claim 1, wherein the method comprises the following steps: the size of the blind hole limiting PAD on the L2 layer is 14mil, a circular hole with the diameter of 6mil is arranged in the middle of the limiting PAD, and the ring is 4 mil.
4. The method for manufacturing the HDI board deep V blind hole according to claim 1, wherein the method comprises the following steps: the browned thin copper adopts an LDD browning process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111107250.1A CN113891579A (en) | 2021-09-22 | 2021-09-22 | Manufacturing method of HDI board deep V blind hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111107250.1A CN113891579A (en) | 2021-09-22 | 2021-09-22 | Manufacturing method of HDI board deep V blind hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113891579A true CN113891579A (en) | 2022-01-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202111107250.1A Pending CN113891579A (en) | 2021-09-22 | 2021-09-22 | Manufacturing method of HDI board deep V blind hole |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114945251A (en) * | 2022-04-15 | 2022-08-26 | 奥士康科技股份有限公司 | Method for manufacturing cross-layer blind hole with high thickness-diameter ratio |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101745744A (en) * | 2008-12-18 | 2010-06-23 | 北大方正集团有限公司 | Direct laser pore-forming method |
| US20180332717A1 (en) * | 2015-10-28 | 2018-11-15 | Akm Electronics Technology (Suzhou) Co., Ltd. | Method for full filling inter-layer blind hole of hdi rigid-flex laminate with copper |
| CN110213912A (en) * | 2019-06-26 | 2019-09-06 | 江门市众阳电路科技有限公司 | The radium-shine blind hole alignment method of HDI multi-layer board |
| CN111615265A (en) * | 2020-06-01 | 2020-09-01 | 景旺电子科技(龙川)有限公司 | Blind hole processing method of LCP multilayer board |
| CN111757602A (en) * | 2020-06-02 | 2020-10-09 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of blind hole |
| CN113286434A (en) * | 2021-05-14 | 2021-08-20 | 宜兴硅谷电子科技有限公司 | Alignment method of HDI (high Density interconnection) boards in any interconnection |
-
2021
- 2021-09-22 CN CN202111107250.1A patent/CN113891579A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101745744A (en) * | 2008-12-18 | 2010-06-23 | 北大方正集团有限公司 | Direct laser pore-forming method |
| US20180332717A1 (en) * | 2015-10-28 | 2018-11-15 | Akm Electronics Technology (Suzhou) Co., Ltd. | Method for full filling inter-layer blind hole of hdi rigid-flex laminate with copper |
| CN110213912A (en) * | 2019-06-26 | 2019-09-06 | 江门市众阳电路科技有限公司 | The radium-shine blind hole alignment method of HDI multi-layer board |
| CN111615265A (en) * | 2020-06-01 | 2020-09-01 | 景旺电子科技(龙川)有限公司 | Blind hole processing method of LCP multilayer board |
| CN111757602A (en) * | 2020-06-02 | 2020-10-09 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of blind hole |
| CN113286434A (en) * | 2021-05-14 | 2021-08-20 | 宜兴硅谷电子科技有限公司 | Alignment method of HDI (high Density interconnection) boards in any interconnection |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114945251A (en) * | 2022-04-15 | 2022-08-26 | 奥士康科技股份有限公司 | Method for manufacturing cross-layer blind hole with high thickness-diameter ratio |
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