WO2013036026A2

WO2013036026A2 - Printed circuit board, display device including the same, and method of fabricating the same

Info

Publication number: WO2013036026A2
Application number: PCT/KR2012/007099
Authority: WO
Inventors: Woo Kil Jung
Original assignee: Lg Innotek Co., Ltd.
Priority date: 2011-09-09
Filing date: 2012-09-05
Publication date: 2013-03-14
Also published as: WO2013036026A3; KR20130028445A; KR102026197B1

Abstract

Disclosed are a printed circuit board, a display device including the same, and a method of fabricating the same. The printed circuit board includes an insulating layer, an electronic device mounted on a first surface of the insulating layer, and a metallic layer formed by plating a conductive material on a second surface of the insulating layer. The display device includes a display panel, and a printed circuit board provided thereon with an electronic device electrically connected to the display panel.

Description

PRINTED CIRCUIT BOARD, DISPLAY DEVICE INCLUDING THE SAME, AND METHOD OF FABRICATING THE SAME

The embodiment relates to a printed circuit board. More particularly, the embodiment relates to a printed circuit board which can serve as a portion of a case of a product, a display device including the same, and a method of fabricating the same.

A PCB (Printed Circuit Board) is formed by printing a circuit line pattern on an electrical insulating substrate by using a conductive material such as copper (Cu), and refers to a board right before electronic components are mounted thereon. In other words, the PCB refers to a circuit board in which the mounting positions of the electronic components are determined, and a circuit pattern connecting the electronic components is fixedly printed on a flat plate in order to densely mount electronic devices on the flat plate.

The PCB has been extensively used as a part used to realize circuits of all electric and electronic appliances ranging from various electric/electronic products such as a radio, TV, and a PCS to high technology electronic equipment including a computer.

The PCB includes an insulating layer such as a polyimide film. The surface of the insulating layer is protected by a protective layer such as solder resist (SR). In addition, various electronic devices are mounted on the upper portion of the printed circuit board.

The PCB is shown in FIG. 1.

Referring to FIG. 1, the PCB according to the related art includes an insulating layer. In order to protect the surface of the insulating layer, green or black solder resist is coated on the surface of the insulating layer.

In addition, the PCB is attached into various electronic devices including a display device.

However, the PCB attached into the electronic device is fabricated without taking into consideration the design characteristic. Accordingly, if the PCB is attached into the electronic device, the PCB does not serve as a case of the electronic device, but an additional case must be attached to the outer portion of the PCB.

The embodiment relates to a printed circuit board having a novel structure.

In addition, the embodiment provides a printed circuit board which can be utilized as a case to protect an outer portion of a product.

Meanwhile, the embodiments are not limited to the above object, and those skilled in the art can clearly understand other objects from following description.

According to the embodiment, there is provided a printed circuit board including an insulating layer, an electronic device mounted on a first surface of the insulating layer, and a metallic layer formed by plating a conductive material on a second surface of the insulating layer.

In addition, the first surface is a top surface of the insulating layer, and the second surface is a bottom surface opposite to the first surface.

In addition, the second surface includes a lateral side extending from the bottom surface of the insulating layer.

Further, the metallic layer includes at least one metallic material of gold (Ag), platinum (Pt), titanium (Ti), and alumina.

In addition, the printed circuit board further includes a circuit pattern formed on the first surface of the insulating layer and electrically connected to the mounted electronic device.

In addition, the first surface includes a first region provided at a central region of the first surface and a second region provided at an edge region of the first surface, and wherein the circuit pattern is formed on the first region of the first surface.

In addition, the printed circuit board further includes a heat radiation fin buried in a heat radiation hole, which is formed through the first and second surfaces of the insulating layer, and making contact with the electronic device.

Further, the heat radiation fin makes contact with the metallic layer.

Meanwhile, according to the embodiment, there is provided a display device includes a display panel, and a printed circuit board provided thereon with an electronic device electrically connected to the display panel. The printed circuit board has an outer peripheral surface surrounded by a metallic layer formed by plating a conductive material.

In addition, the metallic layer includes at least one conductive material of titanium (Ti) and alumina.

In addition, the printed circuit board includes an insulating layer, and a circuit pattern selectively formed only on a central region of a top surface of the insulating layer except for an edge region of the top surface of the insulating layer and electrically connected to the electronic device. The metallic layer surrounds a lateral side and a bottom surface of the insulating layer.

Further, the printed circuit board further includes a heat radiation fin buried in a heat radiation hole formed through the top and bottom surfaces of the insulating layer and making contact with the electronic device.

In addition, the heat radiation fin makes contact with the metallic layer.

Meanwhile, according to the embodiment, there is provided a method of manufacturing a display device. The method includes preparing a printed circuit board provided thereon with an electronic device, forming a display panel connected to the electronic device on the printed circuit board, and forming a metallic layer forming an outer portion of the display device by plating a conductive material on an outer portion of the printed circuit board.

In addition, the forming of the metallic layer forming the outer portion of the display device by plating the conductive material on the outer portion of the printed circuit board includes electroless-plating at least one conductive material of titanium (Ti) and alumina on an insulating layer constituting the printed circuit board.

In addition, the metallic layer is formed on at least one of a lateral side of the display panel and a bottom surface and a lateral side of the printed circuit board.

Further, the preparing of the printed circuit board provided thereon with the electronic device includes preparing an insulating layer, forming a circuit pattern on a top surface of the insulating layer, and mounting the electronic device on the circuit pattern.

In addition, the forming of the circuit pattern on the top surface of the insulating layer includes forming the circuit pattern only on a central region of a top surface of the insulating layer except for an edge region of the top surface of the insulating layer.

In addition, the metallic layer directly makes contact with a surface of the insulating layer.

Further, the method further includes forming a heat radiation hole through top and bottom surfaces of the insulating layer, and burying a heat radiation fin in the heat radiation hole. The heat radiation fin directly makes contact with the metallic layer.

As described above, according to the embodiment, the printed circuit board is utilized as a case of a product, so that an ultra-slim product can be provided. In addition, an additional case design is not required and the cost for an additional appliance is reduced, so that price competitiveness can be improve.

FIG. 1 is a view showing a printed circuit board according to the related art;

FIG. 2 is a sectional view showing a printed circuit board according to the embodiment;

FIGS. 3 to 9 are sectional views sequentially showing the fabricating process of the printed circuit board according to the embodiment; and

FIGS. 10 and 11 are sectional views showing the manufacturing process of a display device according to the embodiment.

Hereinafter, embodiments will be described in detail with reference to accompanying drawings so that those skilled in the art can easily work with the embodiments. However, the embodiments may have various modifications.

The terms of the embodiment are used only for the illustrative purpose of the embodiment, and the embodiment is not limited thereto. The term expressed in the singular includes a plural meaning unless the term obviously specifies different meanings in context. In the following description of the embodiment, the terms include or have are used to indicate the feature, number, step, operation, elements, parts or combination thereof without excluding other feature, number, step, operation, elements, parts or combination thereof.

The thickness and size of each layer shown in the drawings may be exaggerated, omitted or schematically drawn for the purpose of convenience or clarity. In addition, the size of elements does not utterly reflect an actual size. The same reference numbers will be assigned the same elements throughout the drawings.

In the description of the embodiments, it will be understood that, when a layer (or film), a region, or a plate is referred to as being on or under another layer (or film), another region, or another plate, it can be directly or indirectly on the other layer (or film), region, plate, or one or more intervening layers may also be present

The size or the thickness of layers shown in the drawings can be simplified or magnified for the purpose of clear explanation. In addition, the size of each component may not reflect a real size.

Hereinafter, a printed circuit board which can be utilized as a case of a product, a display device including the printed circuit board, and a method of fabricating the same will be disclosed.

FIG. 2 is a view showing a printed circuit board according to the embodiment.

Referring to FIG. 2, a printed circuit board 100 includes an insulating layer 110, a circuit pattern 125 formed on the insulating layer 110, an electronic device 150 electrically connected to the circuit pattern 125, a solder fillet 140 providing an adhesive strength between the electronic device 150 and the circuit pattern 125, a heat radiation fin 135 to discharge heat generated from the electronic device 150 to the outside, and a metallic layer 160 forming an outer portion of the printed circuit board 100.

The insulating layer 110 may serve as a support substrate of the printed circuit board 100. In this case, although FIG. 2 shows only one insulating layer, the insulating layer 110 may refer to an insulating layer region having any one circuit pattern 125 in a printed circuit board having a plurality of lamination structures including a plurality of insulating layers attached to each other.

The insulating layer 110 may include thermosetting polymer substrate, thermoplastic polymer substrate, a ceramic substrate, an organic-inorganic composite material substrate, or a glass fiber impregnation substrate. If the insulating layer 110 includes a polymer resin, the insulating layer 110 may include an epoxy-based insulating resin, or may include polyimide-based resin.

In addition, the insulating layer 110 may include epoxy-based insulating resin representing low thermal conductivity (about 0.24W/mk to about 0.4W/mk). In addition, the insulating layer 110 may include polyimide-based resin representing higher thermal conductivity.

The insulating layer 110 is provided on a first surface thereof with a circuit pattern 125. In this case, the first surface of the insulating layer 110 may be a top surface, and a second surface of the insulating layer 110 may be a bottom surface provided in opposition to the top surface.

In addition, the circuit pattern 125 may include a material representing high electrical conductivity and low resistance. In particular, the circuit pattern 125 may be formed by patterning a copper film as a conductive layer.

In other words, the circuit pattern 125 may be formed by electroless-plating a metallic material on the first surface of the insulating layer 110 to form a plated layer, and patterning the plated layer. Different from the case in which the circuit pattern 125 is formed by patterning the plated layer formed through an electroless plating process, the circuit pattern 125 may be formed by patterning a copper foil in a copper clad laminate (CCL) structure.

Meanwhile, although the embodiment has been described in that the circuit pattern 125 is formed by using a copper foil, the embodiment is not limited thereto. In other words, the circuit pattern 125 may be formed by using a metallic material, such as an alloy including at least one of silver (Ag), platinum (Pt), nickel (Ni), and palladium (Pd), representing high electrical conductivity.

The circuit pattern 125 may be formed through the fabricating process of a typical printed circuit board, such as an additive process, a subtractive process, a modified semi-additive process (MSAP), or a semi additive process (SAP), and the details thereof will be omitted.

The insulating layer 110 includes at least one hole.

In this case, the hole includes a heat radiation hole 130 to discharge heat, which emitted from the electronic device mounted on the printed circuit board, to the outside. The heat radiation hole 130 may be formed through any one of a laser processing scheme, and a mechanically processing scheme, and a chemically processing scheme.

If the heat radiation hole 130 is formed through a mechanically process scheme, a milling scheme, a drill scheme, or a routing scheme may be used. If the heat radiation hole 130 is formed through a laser process, a UV laser scheme or a CO₂ laser scheme may be used. If the heat radiation hole 130 is formed a chemically process scheme, the insulating layer 110 may be open by using chemicals such as aminosilane, or ketones.

Meanwhile, according to the processing scheme by a laser, optical energy is concentrated on a surface of a material, so that a portion of the material can be cut in a desirable form by melting and evaporating the portion of the material, and a complex form of a material can be easily processed through a computer program. In addition, a complex material hard to be cut can be processed.

In addition, according to the processing scheme by the laser, a material can be cut to a diameter of 0.005 mm. In addition, according to the processing scheme, an allowable process thickness range is wide.

For the laser process, an yttrium aluminum garnet (YAG) laser, a CO₂ laser, or a UV laser preferably is used. The YAG laser is a laser to process both of a copper foil layer and an insulating layer, and the CO₂ layer is a laser to process only an insulating layer.

In addition, although drawings show that only one heat radiation hole 130 is formed, those skilled in the art generally know that a plurality of heat radiation holes 130 may be formed. For example, the heat radiation holes 130 may be formed corresponding to the number of electronic devices mounted on the insulating layer 110.

In addition, although only a heat radiation hole 130 is shown in drawings, a through hole (not shown) may be additionally formed for the electrical connection with an external device.

In other words, the printed circuit board 100 may further include a via hole (not shown) to electrically connect circuit patterns, which are buried in a plurality of insulating layers, to each other and a conductive via (not shown) formed by filling the vial hole with a conductive paste.

The via hole (not shown) may be formed by a laser. A sectional surface of the via hole may have a circular shape or a rectangular shape according to the design. In addition, the via hole (not shown) may be formed by a laser. A sectional surface of the via hole may have a circular shape or a rectangular shape according to the design.

In addition, the via hole may be formed while being inclined at a predetermined angle. In addition, the via hole may be formed in a vertical direction.

In this case, the heat radiation hole 130 is formed in a direction of a thickness of the insulating layer 110. As shown in drawings, the heat radiation hole 130 may have a thickness thinner than that of the insulating layer 110 or may have a thickness equal to that of the insulating layer 110.

In other words, the heat radiation hole 130 may be formed through the first surface of the insulating layer 110 and the second surface opposite to the first surface. Accordingly, the metallic layer 160 formed on the second surface of the insulating layer 110 may make contact with the heat radiation fin 135 formed in the heat ration hole 130. In other words, the heat radiation fin 135 makes contact with the metallic layer 160 so that the heat discharged through the heat radiation fin 135 can be easily discharged to the outside through the metallic layer 160.

The heat radiation fin 135 is filled (inserted) in the heat radiation hole 130.

The heat radiation fin 135 may be formed by metal representing high thermal conductivity. For example, the heat radiation fin 135 may be formed by the alloy of copper (Cu), such as the alloy of Cu and Ni. In addition, the heat radiation fin 135 may include the alloy including silver (Ag) or aluminum (Al) mainly used in a plating scheme.

In addition, the heat radiation fin 135 may be formed by plating a metallic material into the heat radiation hole 130 to fill the heat radiation hole 130 with a metallic material representing high thermal conductivity.

In this case, the heat radiation fin 135 may have an area greater than that of the heat radiation hole 130. In other words, a top surface of the heat radiation fin 135 protrudes from the first surface of the insulating layer 110 by a predetermined height. Accordingly, the electronic device 150 may be easily mounted on the heat radiation fin 135 thereafter.

The heat radiation fin 135 is provided thereon with the electronic device 150 electrically connected to the circuit pattern 125. In this case, the electronic device 150 may include a passive device as well as a passive device.

Meanwhile, although drawings show that the heat radiation fin does not make contact with the metallic layer for the convenience of explanation, the heat radiation hole is actually formed through the top and bottom surfaces of the insulating layer. Accordingly, the heat radiation fin is buried in the heat radiation hole, so that the heat radiation fin makes contact with the metallic layer.

The solder fillet 140 is formed on the circuit pattern 125.

The electronic device 150 is mounted on the circuit pattern 125 by the solder fillet 140. As the electronic device 150 is mounted on the circuit pattern 125, the solder fillet 140 extends toward the lateral side of the electronic device 150.

The solder fillet 140 is deposited and formed in a lateral direction of the electronic device 150 by coating solder cream, which includes at least one selected from the group consisting of a low melting point solder, a high melting point solder, a solder including alloy particles, a solder including resin, and the combination thereof, on the circuit pattern 125, and mounting the electronic device 150 on the solder cream.

In this case, the height of the solder fillet 140 exerts an influence on the stress applied to the electronic device 150. In other words, as the height of the solder fillet 140 is increased, stress generated due to the mismatching of a thermal expansion coefficient between polymer materials is increased, so that the stress applied to the electronic device 150 is increased. In other words, as the height of the solder fillet 140 is decreased, stress generated due to the mismatching of a thermal expansion coefficient between polymer materials is decreased, so that the stress applied to the electronic device 150 is decreased. Therefore, the solder fillet 140 has a predetermined height based on the stress applied to the electronic device 150. Preferably, the lateral height of the solder fillet 140 corresponds to 60% to 70% of the height of the electronic device 150.

The metallic layer 160 is formed on the second surface provided in opposition to the first surface of the insulating layer 110. The metallic layer 160 protects the second surface of the insulating layer 110.

The metallic layer 160 is formed by electroless-plating a metallic material including at least one of titanium (Ti) and alumina on the second surface of the insulating layer 110. In other words, the metallic layer 160 includes a metallic material having a predetermined strength, and protects the surface of the insulating layer 110 while forming an outer portion of a product having the printed circuit board 100 attached thereto.

In other words, according to the embodiment, in order to protect the insulating layer 110, the metallic layer 160 is formed by plating a metallic material on the second surface of the insulating layer 110 instead of forming solder resist on the second surface of the insulating layer, thereby protecting the insulating layer 110 and allowing the printed circuit board 100 having the metallic layer 160 to serve as an outer case of a product.

Meanwhile, the circuit pattern 125 is formed on the first surface of the insulating layer 110, and the metallic layer 160 is formed on the second surface of the insulating layer 110.

In this case, if the circuit pattern 125 makes contact with the metallic layer 160, a problem may occur in the reliability of the printed circuit board. Therefore, the metallic layer 160 surrounds both of the lateral side and the bottom surface of the insulating layer 110, and the circuit pattern 125 is formed on only the central region of the top surface of the insulating layer 110 instead of an outer region of the top surface of the insulating layer 110.

Hereinafter, a method of fabricating the above printed circuit board, and a method of manufacturing a display device using the printed circuit board will be described.

FIGS. 3 to 9 are sectional views sequentially showing the fabricating process of the printed circuit board according to the embodiment, and FIGS. 10 to 11 are sectional views sequentially showing the manufacturing process of the display device according to the embodiment.

First, as shown in FIG. 3, a conductive layer 120 is formed on the insulating layer 110.

The insulating layer 110 and the conductive layer 120 may be formed through a thermocompression molding scheme. The temperature in the thermocompression molding scheme may be determined according to the reaction temperature of a curing agent of the insulating layer 110.

In addition, the above conductive layer may be further formed on the bottom surface of the insulating layer 110. The conductive layer may be bonded with the insulating layer 110 through the thermocompression molding scheme.

The insulating layer 110 may include epoxy-based resin or polyimide-based resin instead of a high-price ceramic material representing high thermal conductivity. The conductive layer 120 may include a copper foil which is a thin film including copper (Cu) representing high electrical conductivity and low resistance.

When the conductive layer 120 formed on the top surface or the bottom surface of the insulating layer 110 includes a copper foil including copper (Cu), the lamination structure of FIG. 3 may employ a copper clad laminate (CCL).

In addition, the conductive layer 120 may be formed by performing an electroless plating scheme with respect to the top surface of the insulating layer 110. In this case, if the conductive layer 120 is formed through the electroless plating scheme, the roughness is applied on the insulating layer 110, so that the conductive layer 120 can be more smoothly formed.

Thereafter, as shown in FIG. 4, the circuit pattern 125 is formed by etching the conductive layer 120 formed on the top surface or the bottom surface of the insulating layer 110 at a predetermined pattern.

In this case, the circuit pattern 125 may be formed by performing an etching process based on a photolithography process, or performing a laser process to directly form a pattern by using a laser.

In other words, the circuit pattern 125 may be formed through the fabricating process of a typical printed circuit board, such as an additive process, a subtractive process, a modified semi-additive process (MSAP), or a semi additive process (SAP), and the details thereof will be omitted.

In addition, the circuit pattern 125 may be formed on the top surface and the bottom surface of the insulating layer 110. In addition, the circuit pattern 125 may be formed only on the top surface of the insulating layer 110.

In this case, as shown in FIG. 5, the first surface of the insulating layer 110 includes a first region A and a second region B formed at the edge of the first region A.

In addition, the circuit pattern 125 is formed on the first surface of the insulating layer 110. In this case, the circuit pattern 125 is formed only on the first region A of the first surface.

In other words, the circuit pattern 125 is selectively formed only on the central region of the first surface of the insulating layer 110 except for the edge region of the first surface.

Accordingly, the metallic layer 160 formed on the lateral side of the insulating layer 110 thereafter do not make contact with the circuit pattern 125, so that the reliability of the printed circuit board 100 can be increased.

Thereafter, as shown in FIG. 6, the heat radiation hole 130 is formed in the first surface of the insulating layer 110.

Preferably, the heat radiation hole 130 may be formed in the first surface of the insulating layer 110 in such a manner that the heat radiation hole 130 does not pass through the second surface of the insulating layer 110. This can be realized by adjusting the processing time of a drill or a laser.

In this case, when the heat radiation hole 130 is formed by using a laser, the inner wall of the insulating layer 110 may be open by using a YAG laser or a CO2 laser. In addition, the heat radiation hole 130 may be formed through a drill process.

Meanwhile, the heat radiation hole 130 may be formed through the first surface of the insulating layer 110 and the second surface provided in opposition to the first surface.

Next, as shown in FIG. 7, the heat radiation fin 135 may be buried in the heat radiation hole 130.

The heat radiation fin 135 has an area equal to or smaller than that of the heat radiation hole 130, and may include a material representing high thermal conductivity.

Preferably, the heat radiation fin 135 may include any one of metallic materials such as the alloy including copper (Cu), the alloy including silver (Ag), and the alloy including aluminum (Al).

In addition, the edge of the heat radiation fin 135 is curved, so that the heat radiation fin 135 may be easily inserted into the heat radiation hole 130. In this case, the heat radiation fin 135 may be inserted by applying heat and press to the heat radiation fin 135 after aligning the heat radiation fin 135 on the heat radiation hole 130.

In addition, the heat radiation fin 135 may be previously molded with an area smaller than that of the heat radiation hole 130. The heat radiation fin 135 may be manufactured by a mold or may be manufactured through a laser cutting scheme. The heat radiation fin 135 may include a material subject to the surface treatment through an etching process.

Meanwhile, the heat radiation fin 135 may be formed by plating the above metallic material on the inner part of the heat radiation hole 130. In other words, the heat radiation fin 135 may be formed by electroless plating a metallic material representing high thermal conductivity on the inner part of the heat radiation hole 130. In addition, the heat radiation fin 135 may be formed by forming a seed layer on an outer peripheral surface of the heat radiation hole 130 and electroless-plating the metallic material by using the seed layer.

Thereafter, as shown in FIG. 8, the electronic device 150 is mounted on the circuit pattern 125.

To this end, the solder cream is coated on the top surface of the circuit pattern 125. The solder cream is a conductive paste used to attach the electronic device. The solder cream may include solder paste. The solder cream includes metallic powder to ensure conductivity.

The solder fillet 140 may be formed by seating the electronic device 150 on the solder cream to allow the solder cream to extend from the sidewall of the electronic device 150 so that the electronic device 150 can be surrounded by the solder cream.

Thereafter, as shown in FIG. 9, the metallic layer 160 is formed on the second surface of the insulating layer 110.

The metallic layer 160 is formed by plating a metallic material including at least one of titanium (Ti) and alumina on the bottom surface of the insulating layer 110.

The metallic layer 160 not only protects an outer peripheral surface of the insulating layer 110, but also serves as a case of a product attached to the printed circuit board 100.

In this case, although the drawings show that the metallic layer 160 is formed only on the bottom surface of the insulating layer 110, the metallic layer 160 may be formed at the lateral side of the insulating layer 110.

The metallic layer 160 may be formed through an electroless plating scheme. The electroless plating scheme may include a degreasing process, a soft corrosion process, a preliminary catalytic treatment process, a catalytic treatment process, an activation process, an electroless plating scheme, and an anti-oxidation treatment process.

In addition, regarding the method of manufacturing the display device, as shown in FIG. 10, after preparing the printed circuit board 100 shown in FIG. 2, a display panel 200 is attached onto the printed circuit board 100.

The display panel 200 may include a display panel such as a liquid crystal display (LCD), a plasma display panel (PDP), a light emitting diode (LED), and an organic light-emitting diode (OLED).

Thereafter, a metallic layer 300 is formed around the display panel 200 and the printed circuit board 100.

The metallic layer 300 may be formed by electroless-plating a conductive material such as Ag or Pt or a differentiated metallic material for an exterior portion such as Ti or alumina. If necessary, a design sheet may be attached to the metallic layer 300.

The metallic layer 300 forms an outer case of the display device. The metallic layer 300 protects an outer peripheral portion of the printed circuit board. In more detail, the metallic layer 300 protects the outer peripheral portion of the insulating layer.

According to the embodiment, the printed circuit board is utilized as a case of a product, so that an ultra-slim product can be provided. In addition, an additional case design is not required and the cost for an additional appliance is reduced, so that price competitiveness can be improved.

Although the exemplary embodiments of the present invention have been described, it is understood that the present invention should not be limited to these exemplary embodiments but various changes and modifications can be made by one ordinary skilled in the art within the spirit and scope of the present invention as hereinafter claimed.

Claims

A printed circuit board comprising:

an insulating layer;

an electronic device mounted on a first surface of the insulating layer; and

a metallic layer formed by plating a conductive material on a second surface of the insulating layer
The printed circuit board of claim 1, wherein the first surface is a top surface of the insulating layer, and the second surface is a bottom surface opposite to the first surface.
The printed circuit board of claim 2, wherein the second surface includes a lateral side extending from the bottom surface of the insulating layer.
The printed circuit board of claim 1, wherein the metallic layer includes at least one metallic material of gold (Ag), platinum (Pt), titanium (Ti), and alumina.
The printed circuit board of claim 1, further comprising a circuit pattern formed on the first surface of the insulating layer and electrically connected to the mounted electronic device.
The printed circuit pattern of claim 5, wherein the first surface includes a first region provided at a central region of the first surface and a second region provided at an edge region of the first surface, and wherein the circuit pattern is formed on the first region of the first surface.
The printed circuit board of claim 2, further comprising a heat radiation fin buried in a heat radiation hole, which is formed through the first and second surfaces of the insulating layer, and making contact with the electronic device.
The printed circuit board of claim 7, wherein the heat radiation fin makes contact with the metallic layer.
A display device comprising:

a display panel; and

a printed circuit board provided thereon with an electronic device electrically connected to the display panel,

wherein the printed circuit board has an outer peripheral surface surrounded by a metallic layer formed by plating a conductive material.
The display device of claim 9, wherein the metallic layer includes at least one conductive material of titanium (Ti) and alumina.
The display device of claim 9, wherein the printed circuit board includes an insulating layer; and

a circuit pattern selectively formed only on a central region of a top surface of the insulating layer except for an edge region of the top surface of the insulating layer and electrically connected to the electronic device, and

wherein the metallic layer surrounds a lateral side and a bottom surface of the insulating layer.
The display device of claim 11, wherein the printed circuit board further includes a heat radiation fin buried in a heat radiation hole formed through the top and bottom surfaces of the insulating layer and making contact with the electronic device.
The display device of claim 12, wherein the heat radiation fin makes contact with the metallic layer.
A method of manufacturing a display device, the method comprising:

preparing a printed circuit board provided thereon with an electronic device;

forming a display panel connected to the electronic device on the printed circuit board; and

forming a metallic layer forming an outer portion of the display device by plating a conductive material on an outer portion of the printed circuit board.
The method of claim 14, wherein the forming of the metallic layer forming the outer portion of the display device by plating the conductive material on the outer portion of the printed circuit board includes electroless-plating at least one conductive material of titanium (Ti) and alumina on an insulating layer constituting the printed circuit board.
The method of claim 14, wherein the metallic layer is formed on at least one of a lateral side of the display panel and a bottom surface and a lateral side of the printed circuit board.
The method of claim 14, wherein the preparing of the printed circuit board provided thereon with the electronic device includes:

preparing an insulating layer;

forming a circuit pattern on a top surface of the insulating layer; and

mounting the electronic device on the circuit pattern.
The method of claim 17, wherein the forming of the circuit pattern on the top surface of the insulating layer includes forming the circuit pattern only on a central region of a top surface of the insulating layer except for an edge region of the top surface of the insulating layer.
The method of claim 17, wherein the metallic layer directly makes contact with a surface of the insulating layer.
The method of claim 17, further comprising:

forming a heat radiation hole through top and bottom surfaces of the insulating layer; and

burying a heat radiation fin in the heat radiation hole,

wherein the heat radiation fin directly makes contact with the metallic layer