KR20130028445A - Printed circuit board and display device having the same and method of manufacturing the same - Google Patents

Abstract

PURPOSE: A printed circuit board, a display device including the same, and a method of fabricating the same are provided to offer an ultra-slim product by utilizing the printed circuit as a case of the product. CONSTITUTION: A printed circuit board comprises an insulating layer(110), and an electronic device(150) mounted on a first surface of the insulating layer; a metallic layer(160) formed by plating a conductive material on a second surface of the insulating layer. The first surface of the insulating layer is a top surface of the insulating layer, and the second surface is a bottom surface opposite to the first surface. The second surface includes a lateral side extending from the bottom surface of the insulating layer.

Description

Printed circuit board and display device including the same and method for manufacturing the same {Printed circuit board and display device having the same and method of manufacturing the same}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board, and more particularly, to a printed circuit board, a display device including the same, and a method of manufacturing the same, by plating a metallic material on a rear surface of the printed circuit board so that the printed circuit board itself becomes part of a product case. It is about.

Printed circuit boards are solidifying their status as one of electronic components with the development of semiconductors and electronic devices, and all electric and electronic devices such as radios, televisions, PCS, and various other electrical and electronic products, as well as computers and high-tech electronic equipment. It is widely used as a component for implementing the circuit of.

The printed circuit board includes an insulating layer such as a polyimide film, and the surface of the insulating layer is protected by a protective layer such as solder resist (SR). In addition, various electronic devices are mounted on the printed circuit board.

Such a printed circuit board is as shown in FIG.

Referring to FIG. 1, a printed circuit board according to the related art applies green or black solder resist to protect the exterior.

The printed circuit board is attached to various electronic devices including the display device.

However, as described above, the printed circuit board attached to the electronic device is manufactured without considering design characteristics. Accordingly, when the printed circuit board is attached to the electronic device, the printed circuit board itself serves as a case of the electronic device. There is a problem in that the case must be mounted to the outside of the printed circuit board separately.

Embodiments according to the present invention to provide a printed circuit board of a new structure.

In addition, the embodiment according to the present invention to provide a display device manufactured by using a printed circuit board itself.

 Technical problems to be achieved in the present invention are not limited to the technical problems mentioned above, and other technical problems not mentioned above are clearly understood by those skilled in the art to which the embodiments proposed from the following description belong. Could be.

The printed circuit board according to the embodiment of the present invention, the insulating layer; An electronic device mounted on the first surface of the insulating layer; And a metal layer formed by plating a conductive material on the second surface of the insulating layer.

In addition, the display device according to an embodiment of the present invention, the display panel; And a metal layer formed by plating a conductive material to surround the outer circumferential surface, and includes a printed circuit board on which an electronic device electrically connected to the display panel is mounted.

In addition, the manufacturing method of the display device according to an embodiment of the present invention, the manufacturing method of the display device, comprising the steps of preparing a printed circuit board on which the electronic device is mounted; Forming a display panel connected to the electronic device on the printed circuit board; And forming a metal layer forming an exterior of the display apparatus by plating a conductive material on the outside of the printed circuit board.

According to the embodiment according to the present invention, by using the printed circuit board itself as a case of the product can provide an ultra-thin product, there is an effect that can improve the price competitiveness by eliminating the separate case design and appliance deployment.

1 is a view showing a printed circuit board according to the prior art.
2 is a diagram illustrating a printed circuit board according to an exemplary embodiment of the present invention.
3 to 9 are views for explaining a method of manufacturing a printed circuit board according to an embodiment of the present invention in the order of process.
10 to 11 are views for explaining a method of manufacturing a display device according to an embodiment of the present invention in the order of process.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

Throughout the specification, the terminology used is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular forms "a", "an" and "the" include plural referents unless the context clearly dictates otherwise. Or in the present application, the term "comprises" or "having" is intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, one or more other It should be understood that the features or numbers, steps, operations, components, parts or combinations thereof do not preclude the existence or possibility of addition.

In order to clearly illustrate the present invention in the drawings, thicknesses are enlarged in order to clearly illustrate various layers and regions, and parts not related to the description are omitted, and like parts are denoted by similar reference numerals throughout the specification .

When a portion of a layer, film, region, plate, etc. is said to be "on top" of another part, this includes not only when the other part is "right over" but also when there is another part in the middle. Conversely, when a part is "directly over" another part, it means that there is no other part in the middle.

In the drawings, the thickness or size of each layer is exaggerated, omitted or schematically illustrated for convenience and clarity of description. In addition, the size of each component does not entirely reflect the actual size.

2 is a diagram illustrating a printed circuit board according to an exemplary embodiment of the present invention.

Referring to FIG. 2, the printed circuit board 100 may include an insulating layer 110, a circuit pattern 125 formed on the insulating layer, an electronic device 150 electrically connected to the circuit pattern 125, and the electronic device. The appearance of the solder fillet 140 providing adhesive force between the 150 and the circuit pattern 125, the heat dissipation fin 135, and the printed circuit board 100 that release heat generated from the electronic device 150. The metal layer 160 is included.

The insulating layer 110 may be a supporting substrate of the printed circuit board 100. In this case, although only one insulating layer is illustrated in FIG. 2, the insulating layer 110 may include a plurality of stacked structures in which a plurality of insulating layers are attached to each other, and an insulating layer region in which one circuit pattern 125 of the printed circuit board is formed. It may mean.

In this case, the insulating layer 110 may be a thermosetting or thermoplastic polymer substrate, a ceramic substrate, an organic-inorganic composite material substrate or a glass fiber impregnated substrate, and may include an epoxy-based insulating resin when the polymer resin is included therein. Alternatively, polyimide resins may be included.

In addition, the insulating layer 110 may include an epoxy-based insulating resin having a low thermal conductivity (about 0.2 to 0.4 W / mk), and alternatively, may include a polyimide resin having a relatively high thermal conductivity. have.

The circuit pattern 125 is formed on the first surface of the insulating layer 110. In this case, the first surface of the insulating layer 110 may be an upper surface, and the second surface may be a lower surface opposite to the upper surface.

In addition, the circuit pattern 125 may be formed of a material having high electrical conductivity and low resistance. In particular, the circuit pattern 125 may be formed by patterning copper foil as a conductive layer.

That is, the circuit pattern 125 may be formed by plating a metal material on the first surface of the insulating layer 110 to form a plating layer and patterning the formed plating layer. In addition, the circuit pattern 125 may be formed by patterning copper foil in a copper clad laminate (CCL) laminated structure, unlike the pattern formed by patterning the electroless plating.

The insulating layer 110 includes at least one hole.

At this time, the hole includes a heat radiation hole 130 for forming a heat radiation structure. The heat dissipation hole 130 may be formed by a laser.

In addition, although only one heat dissipation hole 130 is illustrated in the drawing, it will be apparent to those skilled in the art that a plurality of heat dissipation holes 130 may be formed. For example, the heat dissipation hole 130 may be formed in a number corresponding to the number of electronic elements 150 mounted on the insulating layer 110.

In addition, although only the heat dissipation hole 130 is illustrated in the drawing, a through hole (not shown) for electrically penetrating with an external device may be further formed.

That is, the printed circuit board 100 may further include a via hole (not shown) and a conductive via (not shown) for electrically connecting circuit patterns buried between the plurality of insulating layers to each other. The via hole (not shown) may be formed by a laser, and the cross section of the via hole may have a circular or rectangular shape according to design. In addition, the via hole (not shown), the via hole may be formed by a laser, the cross-section of the via hole may have a circular or rectangular shape according to the design. In addition, the via hole may be formed to be inclined at an angle to the insulating layer. Alternatively, the via hole may be vertically formed.

At this time, the heat dissipation hole 130 is formed in the thickness direction of the insulating layer 110, as shown in the figure may be formed to a thickness thinner than the thickness of the insulating layer 110, the insulating layer 110 It may be formed to the same thickness as).

That is, the heat dissipation hole 130 may be formed through the first surface of the insulating layer 110 and the second surface opposite to the first surface. This is to contact the heat dissipation fin 135 formed in the heat dissipation hole 130 and the metal layer 160 formed on the second surface of the insulating layer 110 later. That is, the heat dissipation fin 135 and the metal layer 160 are in contact with each other, so that the heat discharged through the heat dissipation fin 135 is easily discharged to the outside through the metal layer 160.

The heat dissipation fins 135 are embedded in the heat dissipation holes 130.

The heat dissipation fin 135 may be formed to include a metal having high thermal conductivity. For example, the heat dissipation fin 135 may be formed of an alloy of copper and nickel as an alloy containing copper. In addition, the heat dissipation fin 135 may be formed of an alloy including silver or aluminum, which is commonly used for plating.

Alternatively, the heat dissipation fins 135 may be formed by filling the heat dissipation holes 130 by plating the metal material having the high thermal conductivity described above in the heat dissipation holes 130.

In this case, the heat dissipation fin 135 may have an area larger than that of the heat dissipation hole 130. In other words, the top surface of the heat dissipation fin 135 may be formed to protrude a predetermined height from the first surface of the insulating layer 110. This is to easily mount the electronic device 150 later.

An electronic device 150 is electrically mounted on the heat dissipation fin 135 to be electrically connected to the circuit pattern 125. In this case, the electronic device 150 may include an active device as well as a passive device.

The solder fillet 140 is formed on the circuit pattern 125.

The electronic device 150 is mounted on the circuit pattern 125 by the formed solder fillet 140, and as the electronic device 150 is mounted, the solder fillet 140 is formed of the electronic device 150. It is formed to extend laterally.

The solder fillet 140 has at least one solder cream selected from the group consisting of a low melting point solder, a high melting point solder, a solder composed of alloy particles, a solder containing a resin, and a combination thereof, on the circuit pattern 125. The electronic device 150 is coated, and the electronic device 150 is deposited on the coated solder cream, thereby being deposited in the lateral direction of the electronic device 150.

In this case, the height of the solder fillet 140 affects the stress applied to the mounted electronic device 150. That is, as the height of the solder fillet 140 increases, the stress generated due to the mismatch of thermal expansion coefficients between polymer materials increases, thereby increasing the stress applied to the electronic device 150. On the contrary, as the height of the solder fillet 140 decreases, the stress generated due to the mismatch of thermal expansion coefficients between polymer materials decreases, thereby reducing the stress applied to the electronic device 150. Accordingly, the solder fillet 140 is formed to have a predetermined height in consideration of the stress applied to the electronic device 150.

The metal layer 160 is formed on the second surface opposite to the first surface of the insulating layer 110. The metal layer 160 is formed to protect the second surface of the insulating layer 110.

The metal layer 160 is formed by electroless plating at least one metal material of titanium and alumina on the second surface of the insulating layer 110. That is, the metal layer 160 is formed of a metal material having a certain strength, and protects the surface of the insulating layer 110 and at the same time forms the appearance of the product to which the printed circuit board 100 is attached.

That is, in the embodiment of the present invention, instead of forming a solder resist on the second surface of the insulating layer 110 to protect the insulating layer 110, a metal material on the second surface of the insulating layer 110. By plating the metal layer to form the metal layer, the insulating layer 110 is protected and at the same time the printed circuit board 100 on which the metal layer 160 is formed can be used as an exterior case of the product.

Hereinafter, a method of manufacturing the printed circuit board as described above and a method of manufacturing the display device using the printed circuit board will be described.

3 to 9 are views for explaining a method of manufacturing a printed circuit board according to an embodiment of the present invention in the order of the process, Figures 10 to 11 illustrate a method for manufacturing a display device according to an embodiment of the present invention in the process order It is a figure for following.

First, the conductive layer 120 is formed on the insulating layer 110 as shown in FIG. 3.

The first insulating plate 110 and the conductive layer 120 may be formed by thermal compression, and the temperature of the thermal compression is determined according to the reaction temperature of the curing agent of the insulating layer 110.

In addition, the conductive layer as described above may be further included in the lower portion of the insulating layer 110, and the adhesion between the lower conductive layer and the insulating layer 110 may be formed by thermocompression bonding.

The insulating layer 110 may include an epoxy resin or a polyimide resin without using an expensive ceramic material having high thermal conductivity, and the conductive layer 120 may include copper having high electrical conductivity and low resistance. Copper foil may be a thin thin film.

When the conductive layer 120 formed on the upper or lower portion of the insulating layer 110 is copper foil containing copper, a stacked clad laminate of FIG. 3 may use a cupper clad laminate (CCL).

Next, as shown in FIG. 4, the conductive layer 120 formed on the upper or lower portion of the insulating layer 110 is etched in a predetermined pattern to form a circuit pattern 125.

In this case, the circuit pattern 125 may be formed by etching through a photolithography process or by performing a laser process to form a pattern directly with a laser.

In addition, the circuit pattern 125 may be formed on the upper and lower portions of the insulating layer 110, and the circuit pattern 125 may be formed only on the upper portion.

In this case, as illustrated in FIG. 5, the first surface of the insulating layer 110 includes a first region A and a second region B formed at an edge of the first region A. FIG.

In addition, the circuit pattern 125 is formed on the first surface of the insulating layer 110, wherein the circuit pattern 125 is formed only in the first region A of the first surface.

That is, the circuit pattern 125 is selectively formed only in the central region of the first surface of the insulating layer 110 except for the edge region.

This is to increase the reliability of the printed circuit board 100 by preventing the metal layer 160 and the circuit pattern 125 formed on the side surface of the insulating layer 110 from coming into contact with each other.

Next, as shown in FIG. 6, a heat dissipation hole 130 is formed in the first surface of the insulating layer 110.

Preferably, the heat dissipation hole 130 may be formed on the first surface of the insulating layer 110 and may not penetrate the second surface of the insulating layer 110. This can be achieved by adjusting the drill or laser machining time.

In this case, when the heat dissipation hole 130 is formed using a laser, an inner wall of the insulating layer 110 may be opened using a YAG laser or a CO ₂ laser. In addition, the heat dissipation hole 130 may be formed by drilling.

The heat dissipation hole 130 may be formed through the first surface of the insulating layer 110 and the second surface opposite to the first surface.

Next, the heat dissipation fins 135 are buried in the heat dissipation holes 130 formed as shown in FIG. 7.

The heat dissipation fin 135 may be formed of a material having a high thermal conductivity having an area equal to or smaller than that of the heat dissipation hole 130.

Preferably, the heat dissipation fin 135 may be formed of any one of an alloy including copper, an alloy including silver, and an alloy including aluminum.

In addition, the corners of the heat dissipation fin 135 may be formed to be bent, so that the heat dissipation fin 135 may be easily inserted into the heat dissipation hole 130. At this time, the insertion of the heat radiation fins 135 may be performed by aligning the heat radiation fins 135 with the heat radiation holes 130 and applying heat and pressure.

In addition, the heat dissipation fin 135 may be manufactured to have an area smaller than the area of the heat dissipation hole 130 in advance, and the manufacture of the heat dissipation fin 135 may be performed by a mold or by laser cutting. It may be a surface treated material such as etching.

On the other hand, the heat radiation fin 135 may be formed by plating the metal material described above in the heat radiation hole. That is, the heat dissipation fin 135 may be formed by electroless plating a metal material having high thermal conductivity in the heat dissipation hole. Alternatively, the heat dissipation fin 135 may be formed by forming a seed layer on the outer circumferential surface of the heat dissipation hole 130 and thereby electroplating a metal material using the formed seed layer.

Next, as shown in FIG. 8, the electronic device 150 is mounted on the formed circuit pattern 125.

To this end, first, solder cream is applied to the upper surface of the circuit pattern 125. The solder cream is a conductive paste for attaching an electronic device, and may be a solder paste, and may include metal powder to secure conductivity.

As the electronic device 150 is seated on the solder cream, the solder fillet 140 may be formed to extend from the sidewall of the electronic device 150 to surround the electronic device 150.

Next, as shown in FIG. 9, the metal layer 160 is formed on the second surface of the insulating layer 110.

That is, the metal layer 160 is formed by electroplating a metal material including at least one of titanium and alumina on the lower surface of the insulating layer 110.

The metal layer 160 not only protects the outer circumferential surface of the insulating layer 110, but also serves as a case of a product to which the printed circuit board 100 is attached.

In this case, although the drawing shows that the metal layer 160 is formed only on the bottom surface of the insulating layer 110, the metal layer 160 may also be formed on the side surface of the insulating layer 110.

In addition, if the manufacturing method of the display device will be described, as shown in FIG. 10, the printed circuit board 100 shown in FIG. 2 is prepared, and the display panel 200 is attached to the prepared printed circuit board 100. .

The display panel 200 may be a display panel such as an LCD, a PDP, and an LED.

Subsequently, the metal layer 300 is formed by surrounding the outer circumferential surfaces of the display panel 200 and the printed circuit board 100.

As described above, the metal layer 300 may be formed by electrolessly plating a conductive material such as gold and platinum or a differentiated exterior metal material such as titanium and alumina, and may attach a design sheet as necessary.

The metal layer 300 forms an outer case of the display device and protects the outer circumferential surface of the printed circuit board, more specifically, the outer circumferential surface of the insulating layer.

According to the embodiment according to the present invention, by using the printed circuit board itself as a case of the product can provide an ultra-thin product, there is an effect that can improve the price competitiveness by eliminating the separate case design and appliance deployment.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, It belongs to the scope of right.

100: printed circuit board
110: insulating layer
125: circuit pattern
135: heat sink fin
140: solder fillet
150: electronic device
160: metal layer

Claims (18)

Insulating layer;
An electronic device mounted on the first surface of the insulating layer; And
Printed circuit board comprising a metal layer formed by plating a conductive material on the second surface of the insulating layer. The method of claim 1,
The first surface is an upper surface of the insulating layer,
The second surface is a bottom surface opposite to the first surface. The method of claim 2,
The second surface further comprises a side surface of the insulating layer. The method of claim 1,
The metal layer is formed by electroplating at least one metal material of gold, platinum, titanium and alumina. The method of claim 1,
And a circuit pattern formed on the first surface of the insulating layer and electrically connected to the mounted electronic device. 6. The method of claim 5,
The first surface includes a first region and a second region formed at an edge of the first region,
The circuit pattern is formed on the first region of the first surface. The method of claim 1,
The printed circuit board further comprises a heat radiation fin formed between the insulating layer and the electronic device. 8. The method of claim 7,
The heat dissipation fins are in contact with the metal layer. Display panel; And
And a metal layer formed by plating a conductive material, surrounding the outer circumferential surface, and including a printed circuit board on which an electronic device is electrically connected to the display panel. The method of claim 9,
The metal layer is a display device formed by electroless plating at least one conductive material of titanium and alumina on the insulating layer. The method of claim 9,
The printed circuit board,
An insulating layer comprising a first region and a second region formed at an edge of the first region;
And a circuit pattern formed in the first region of the insulating layer. 12. The method of claim 11,
The printed circuit board,
And a heat dissipation fin formed between the insulating layer and the electronic device and connected to the metal layer. 8. The method of claim 7,
The heat dissipation fin is in contact with the metal layer. In the manufacturing method of the display device,
Preparing a printed circuit board on which an electronic device is mounted;
Forming a display panel connected to the electronic device on the printed circuit board; And
And plating a conductive material on the outside of the printed circuit board to form a metal layer forming an exterior of the display device. The method of claim 14,
The forming of the metal layer may include:
And electrolessly plating at least one conductive material of titanium and alumina on the insulating layer forming the printed circuit board. The method of claim 14,
And the metal layer is formed on at least one of a side surface of the display panel, a bottom surface and a side surface of the printed circuit board. The method of claim 14,
The printed circuit board includes a circuit pattern electrically connected to the electronic device.
And the circuit pattern is formed in the first region of the first region of the insulating layer and the second region formed at the edge of the first region. The method of claim 14,
The printed circuit board further includes a heat dissipation fin for dissipating heat generated from the electronic device.
And the metal layer is in direct contact with the heat dissipation fins formed on the printed circuit board.

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