WO2013036026A3 - Printed circuit board, display device including the same, and method of fabricating the same - Google Patents

Printed circuit board, display device including the same, and method of fabricating the same Download PDF

Info

Publication number
WO2013036026A3
WO2013036026A3 PCT/KR2012/007099 KR2012007099W WO2013036026A3 WO 2013036026 A3 WO2013036026 A3 WO 2013036026A3 KR 2012007099 W KR2012007099 W KR 2012007099W WO 2013036026 A3 WO2013036026 A3 WO 2013036026A3
Authority
WO
WIPO (PCT)
Prior art keywords
same
circuit board
printed circuit
display device
fabricating
Prior art date
Application number
PCT/KR2012/007099
Other languages
French (fr)
Other versions
WO2013036026A2 (en
Inventor
Woo Kil Jung
Original Assignee
Lg Innotek Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lg Innotek Co., Ltd. filed Critical Lg Innotek Co., Ltd.
Publication of WO2013036026A2 publication Critical patent/WO2013036026A2/en
Publication of WO2013036026A3 publication Critical patent/WO2013036026A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB

Landscapes

  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Thermal Sciences (AREA)
  • Structure Of Printed Boards (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Disclosed are a printed circuit board, a display device including the same, and a method of fabricating the same. The printed circuit board includes an insulating layer, an electronic device mounted on a first surface of the insulating layer, and a metallic layer formed by plating a conductive material on a second surface of the insulating layer. The display device includes a display panel, and a printed circuit board provided thereon with an electronic device electrically connected to the display panel.
PCT/KR2012/007099 2011-09-09 2012-09-05 Printed circuit board, display device including the same, and method of fabricating the same WO2013036026A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020110092012A KR102026197B1 (en) 2011-09-09 2011-09-09 Printed circuit board and display device having the same and method of manufacturing the same
KR10-2011-0092012 2011-09-09

Publications (2)

Publication Number Publication Date
WO2013036026A2 WO2013036026A2 (en) 2013-03-14
WO2013036026A3 true WO2013036026A3 (en) 2013-05-10

Family

ID=47832702

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2012/007099 WO2013036026A2 (en) 2011-09-09 2012-09-05 Printed circuit board, display device including the same, and method of fabricating the same

Country Status (2)

Country Link
KR (1) KR102026197B1 (en)
WO (1) WO2013036026A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019045777A (en) * 2017-09-06 2019-03-22 セイコーエプソン株式会社 Electro-optical device, electronic apparatus, and projector
CN114449744B (en) * 2022-03-29 2024-03-22 江西景旺精密电路有限公司 Manufacturing method of high-heat-dissipation circuit board and high-heat-dissipation circuit board

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000148031A (en) * 1998-11-13 2000-05-26 Toshiba Corp Flat display device
KR20050082018A (en) * 2004-02-17 2005-08-22 텔레포스 주식회사 Flip chip bonding method using screen printing method
KR20060099640A (en) * 2005-03-14 2006-09-20 (주)셀시아테크놀러지스한국 Printed circuit board including heat transfer structure
US20060286959A1 (en) * 2005-06-17 2006-12-21 Knecht Thomas A RF front-end module for picocell and microcell base station transceivers
KR20090090636A (en) * 2008-02-21 2009-08-26 오석준 Pcb module

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05259669A (en) * 1992-03-16 1993-10-08 Fujitsu Ltd Heat radiating structure of printed wiring board
KR101213076B1 (en) * 2010-05-26 2012-12-18 주식회사 루미맥스테크놀러지 Printed circuit board for effective heat-emission, method thereof and led lighting apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000148031A (en) * 1998-11-13 2000-05-26 Toshiba Corp Flat display device
KR20050082018A (en) * 2004-02-17 2005-08-22 텔레포스 주식회사 Flip chip bonding method using screen printing method
KR20060099640A (en) * 2005-03-14 2006-09-20 (주)셀시아테크놀러지스한국 Printed circuit board including heat transfer structure
US20060286959A1 (en) * 2005-06-17 2006-12-21 Knecht Thomas A RF front-end module for picocell and microcell base station transceivers
KR20090090636A (en) * 2008-02-21 2009-08-26 오석준 Pcb module

Also Published As

Publication number Publication date
KR20130028445A (en) 2013-03-19
WO2013036026A2 (en) 2013-03-14
KR102026197B1 (en) 2019-09-27

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