KR101213076B1 - Printed circuit board for effective heat-emission, method thereof and led lighting apparatus - Google Patents

Abstract

The printed circuit board according to the present invention includes an intermediate layer including at least one insulating layer, a conductive layer including a predetermined pattern formed of a conductive material on the intermediate layer such that at least a portion thereof is electrically connected to an electrical and electronic device, and A heat dissipation layer formed of a material, wherein the intermediate layer is interposed between the conductive layer and the heat dissipation layer, wherein the electric current does not flow among the electric and electronic elements when an external power source is applied to the heat dissipation layer and a predetermined pattern of the conductive layer. And at least one heat transfer part configured to connect the insulation portion and the heat dissipation layer through at least the intermediate layer, thereby transferring heat generated in the electrical and electronic device to the heat dissipation layer.

Description

Printed Circuit Board for Efficient Heat Dissipation, Manufacturing Method and LED Light Emitting Apparatus {PRINTED CIRCUIT BOARD FOR EFFECTIVE HEAT-EMISSION, METHOD THEREOF AND LED LIGHTING APPARATUS}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board for efficient heat dissipation, a method of manufacturing the same, and an LED light emitting device. More particularly, a printed circuit board for efficiently dissipating heat generated by an electric and electronic device on a printed circuit board from a substrate itself, A manufacturing method and an LED light emitting device including the printed circuit board.

Common bulbs used for lighting are generally classified into fluorescent, incandescent, or metallic neon lamps used for industrial purposes, and most of these bulbs are gas discharge tube configurations in which gas is injected into glass tubes. In the case of such a general light bulb, when the gas is leaked due to breakage of the glass tube, it may cause air pollution, and when the brightness is to be brightened, power consumption increases accordingly, and power line construction must be performed accordingly. There were problems such as excessive cost of facility and maintenance.

In addition, in addition to the field of silk lighting, in general, as a display element (including a general dimming push button or dimming lamp) for displaying on the panel whether or not a power source is applied, whether an electric / electronic component or a mechanical element is operating, or a state, is mainly used. Tungsten filament lamps are also used. These lamps have holders that can support and light them, down-trans for converting AC 110V or 220V AC to 24V or 6.3V, or winding resistors for DC power, and luminaires. And a color globe for emitting a predetermined color as well as a pilot lamp. The lamp constructed as described above has good brightness, but the lamp is composed of tungsten filament heating wires, and the filament heating wires may be caused by poor contact with the socket of the lamp, or by an irregular power supply or impact voltage at the time of on / off or due to prolonged deterioration. This disconnection is frequently required and frequent exchange is required. In addition, such lamps may be deformed due to the heat generated from the filament heating wire, the lamps or the globes may be damaged due to shock or vibration, the filaments may be easily broken, and the waterproofing and explosion proof may be difficult to be considered. .

As an alternative to solve the problems of the above-mentioned lighting or display bulbs, in recent years, development of lighting lamps or indicators using LEDs with low power consumption has been proposed. In other words, efforts to use the LED chip as a lighting device to compensate for the above-described disadvantages, LED chip is typically mounted on the PCB to receive power to emit light.

An LED chip is a kind of pn junction semiconductor that emits light through a combination of electrons and holes. For example, an LED chip generates a carrier composed of a few electrons and holes through the flow of electric current. It is one of the semiconductor devices that emit light emitted by the recombination process as light.

Hereinafter, a conventional LED lamp will be described with reference to FIG. 1.

1 is a view showing the structure of a conventional LED lamp (LED lamp).

The LED chip 110 is mounted on a printed circuit board 120 having a predetermined metal pattern 121 formed on the surface of the insulating material 125 (sometimes referred to as a substrate). (mounting; for example, mounted in a die bonding method), the circuit is constituted by a wire 130 electrically connecting the LED chip 110 and the metal pattern 121 to emit light by applying current. . A schematic operation principle of the LED chip 110 has been described above, and a description thereof will be omitted.

The LED chip 110, which is a semiconductor device, is accompanied by heat generation. That is, it is preferable that all of the energy generated when the electrons and holes meet is converted to light, but in reality, a large portion of the energy is converted into a form of thermal energy.

That is, heat may cause disconnection of the wire 130 electrically connecting the LED chip 110 and the metal pattern 121, and may cause deterioration of the LED chip 110 due to heat.

Since the high and low heat dissipation effect is directly proportional to the luminous efficiency, the corresponding heat dissipation structure must be supported for sufficient light emitting effect. However, in the conventional LED chip mounting structure, heat generated from the LED chip 110 is generated on the PCB 120. Since it is emitted only through the limited metal pattern 121, the heat dissipation effect is low, and thus there is a limit in mounting the LED chip of sufficient brightness and using it as an illumination (or display) device.

2 shows a conventional example using a metal PCB.

For convenience of illustration, each layer is shown separately, and in fact, each layer is in contact. The same applies to the following drawings.

In FIG. 2, the LED chip 110 has an LED heat dissipation pad 210 and a solder joint 220 on its bottom surface. If necessary, a phosphor 110-1 may be formed on the LED chip 110 to correct the color of light emitted from the LED chip 110.

In FIG. 1, the LED chip 110 and the metal pattern 121 are connected through the wire 130, but in FIG. 2, the solder joint 220 (which serves as the wire 130 of FIG. 1) is somewhat different from this. It can be seen that through the circuit connection unit 230 (which serves as the metal pattern 121 of FIG. 1).

Below the LED chip 110, a metal PCB 280 is present. The metal PCB 280 includes a circuit connection unit 230, an adhesive 1 240, an insulation cloth 250, an adhesive 2 260, and a metal ( 270).

3 illustrates a state in which a heat sink is attached to the example of FIG. 2.

A heat conductive plate of a high heat transfer material (usually a metal) is attached to the bottom of the structure as shown in FIG. 2, wherein a heat conductive paste is disposed between the metal 270 of the metal PCB 280 and the heat sink 310 to increase thermal conductivity. Apply 320. The heat sink 310 typically includes a plurality of heat sink fins.

FRP PCB, epoxy PCB and the like are also available, but the reason for using a metal PCB as shown in Figure 2, is to increase the heat dissipation efficiency by attaching the heat sink 310 as shown in FIG.

As shown in FIG. 2, it can be seen that the metal PCB 280 has a multilayer structure in performing surface mount. That is, an insulation cloth 250 for insulation must be inserted between the circuit connection portion 230 (for example, made of copper foil (copper foil)) and the metal 270, and the circuit connection portion 230 and the insulation cloth ( The first adhesive 240 is required to adhere the 250, and the second adhesive 260 is required to bond the insulating cloth 250 and the metal 270 to each other.

Such dissimilar materials include barriers to the direct and rapid release of heat generated by the LEDs into the heat sink.

This phenomenon is also called thermal resistance, and the thermal resistance increases as the resistance value increases through various other objects, which interferes with dissipating heat generated from the LED toward the heat sink.

In particular, when the thermally conductive paste 320 is added as shown in FIG. 3, it can also be expected that the thermal resistance will be somewhat increased due to the combination of different materials.

In the above, the problem that occurs when using the LED chip has been described, but this is not a problem that occurs only for the LED chip. Almost all other circuit elements mounted on the substrate also generate heat incidentally upon application of current (or voltage). This may weaken the connection between the circuit element and the substrate or reduce the characteristics of the circuit element itself.

A printed circuit board according to the present invention includes an intermediate layer including at least one insulating layer; a conductive layer including a predetermined pattern formed of a conductive material on the intermediate layer such that at least a portion of the printed circuit board is electrically connected to an electrical and electronic device; A heat dissipation layer formed of a conductive material, wherein the intermediate layer is interposed between the conductive layer and the heat dissipation layer; And heat generated in the electrical and electronic device by connecting the insulation portion and the heat dissipation layer, which are portions in which no current flows, when the external power is applied to a predetermined pattern of the conductive layer, at least through the intermediate layer. It includes; one or more heat transfer unit for transmitting to the heat dissipation layer.

Preferably, the heat transfer part directly penetrates the intermediate layer, the conductive layer, and the heat dissipation layer, thereby directly connecting the insulating portion of the electrical and electronic device and the penetrating side surface of the heat dissipation layer.

Preferably, the heat transfer part penetrates through the intermediate layer, thereby connecting the insulating portion of the electrical and electronic device to the conductive layer of the heat dissipation layer via the conductive layer.

Preferably, the heat transfer part directly penetrates the intermediate layer and the conductive layer to directly connect the insulating portion of the electrical and electronic device with the surface facing the conductive layer of the heat dissipation layer.

Preferably, the heat transfer part penetrates the intermediate layer and the heat dissipation layer, and connects the insulating portion of the electric and electronic element and the penetrating side surface of the heat dissipation layer via the conductive layer.

Preferably, the surface opposite to the surface facing the conductive layer of the heat dissipation layer faces outward.

Preferably, the metal forming the pattern of the conductive layer and the metal forming the heat dissipation layer are the same.

Preferably, the metal for forming the pattern of the conductive layer and the heat dissipation layer is copper.

Preferably, the heat transfer part is formed of a metal.

Preferably, the metal forming the heat transfer part is lead.

Preferably, further comprising a heat sink in contact with the heat radiation layer.

Preferably, the opposite side of the surface of the conductive layer facing the insulating layer faces outward.

The LED light emitting device according to the present invention includes the printed circuit board and includes, as the electric and electronic device, an LED chip (Light-Emitting Diode chip) that emits light through a combination of electrons and holes.

Preferably, the opposite side of the surface of the conductive layer facing the insulating layer faces outward.

Preferably, further comprising an LED heat dissipation pad interposed between the insulating portion of the LED chip and the printed circuit board, wherein the heat transfer unit connects the LED heat dissipation pad and the heat dissipation layer through at least the intermediate layer. The heat generated from the LED chip is transferred to the heat dissipation layer through the LED heat dissipation pad.

Preferably, the LED heat dissipation pad is made of a metal material, and is formed to contact a portion of the conductive layer where no current flows when an external power source is applied to a predetermined pattern of the conductive layer.

Preferably, the LED heat dissipation pad has a shape that at least a portion thereof outward from the LED chip when viewed in plan view, at least one of the one or more heat transfer portion is one side of the LED heat dissipation pad than the LED chip of the LED heat dissipation pad It is formed on the part which comes out.

Preferably, further comprising a heat sink in contact with the heat radiation layer.

The method of manufacturing a printed circuit board according to the present invention comprises the steps of forming an intermediate layer including at least one insulating layer; Forming a conductive layer on the intermediate layer, the conductive layer comprising a predetermined pattern formed of a conductive material so that at least a portion thereof is electrically connected to the electrical and electronic device; Forming a heat dissipation layer formed of a conductive material, wherein the intermediate layer is interposed between the conductive layer and the heat dissipation layer; Forming a hole through at least the intermediate layer; And filling a metal into the hole.

Preferably, the metal of the filling step is lead.

According to the present invention, in a multi-layer substrate having two or more conductive layers, since the circuit element and the conductive layer are not electrically connected to each other, the existing thermal resistance can be greatly reduced.

In addition, heat can be radiated through the entire conductive layer used as the heat sink, that is, the heat radiation layer, so that the device can efficiently radiate heat in a larger area than the original area in contact with the substrate.

Since the conductive layer of the substrate itself is used as the heat sink without a separate process such as attaching a separate heat sink to the substrate, it provides convenience in the manufacturing process.

In addition, the heat transfer part may be easily formed by filling a filler material such as lead in a form such as a conventional via hole formed on the substrate, thereby providing convenience in the manufacturing process.

1 is a cross-sectional view showing the structure of a conventional LED lamp (LED lamp).
2 is a cross-sectional view showing a conventional example using a metal PCB.
3 is a cross-sectional view illustrating a state in which a heat sink is attached to the example of FIG. 2.
4 is a cross-sectional view showing an embodiment of an LED light emitting device according to the present invention.
5 (a) to 5 (c) are cross-sectional views showing another embodiment of the present invention.
6 (a) is a plan view showing another embodiment of the present invention.
FIG. 6B is a cross-sectional view of the embodiment of FIG. 6A.
7A shows IsoLux 3D simulation results of an example of an LED device according to the present invention.
7B shows IsoLux 3D simulation results of an example of an LED device not in accordance with the inventive arrangements.
8 shows an illumination level of an example of an LED device according to the invention.
9 is a view showing a light intensity distribution of one example of the LED device according to the present invention.
10 is a view showing the light intensity distribution (lower 10%) of an example of the LED device according to the present invention.
11 shows an optical flux table of an example of an LED device according to the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The LED chip, which is the focus of the present invention, will be described, but the present invention is not limited to the LED chip as described above. It is electrically connectable with the substrate and may be applied to any electrical and electronic device that generates heat incidentally to its original function upon application of current (or voltage). These may include, for example, LED chips, individual passive devices, transistors, ICs, and the like.

4 is a view showing an embodiment of an LED light emitting device according to the present invention.

The LED light emitting device according to the present invention includes an LED chip 110 and a double-sided substrate 400. The LED chip 110 corresponds to the electric and electronic device of the present invention, and the double-sided board 400 corresponds to the printed circuit board. The printed circuit board to which the present invention is applied is a multilayer board to be described later. However, since the present embodiment uses the double-sided board 400, the printed circuit board includes a conductive layer 420 and a heat dissipating layer 440 facing outwards, respectively. Here, the direction toward the outside is located at the most substantial outer layer of the substrate, so that each conductive layer 420 and the heat dissipation layer 440 are not only in contact with the atmosphere but also thin for protecting the conductive layer 420. Or a heat sink is attached to the heat dissipation layer 440. In other words, some other layers (for example, protective films) may be added in addition to the conductive layer serving as the wiring layer in the printed circuit board, but the conductive layer 420 and the heat dissipating layer 440 are substantially the outermost layers. Means that.

The conductive layer 420 may be disposed between the upper surface and the upper surface of the printed circuit board as well as between the heat dissipating layer 440 which is a lower surface. Done.

An intermediate layer including an insulating layer is interposed between the conductive layer 420 and the heat dissipation layer 440. That is, the intermediate layer may be composed of one insulating layer, and may further include one or more conductive layers and / or one or more other insulating layers. However, since the printed circuit board of the present embodiment is a double-sided board 400, the intermediate layer is formed of only one insulating layer 460.

In the insulating layer 460, a heat transfer part 480, which is a passage connecting the insulating portion of the LED chip 110 and the heat dissipating layer 440, is formed through the insulating layer 460. As mentioned above, each layer was shown separately for convenience of illustration, and each layer actually touches. That is, the heat transfer part 480 does not support each layer including an empty space. This is also the same in the following drawings.

The multilayer board including the double-sided board 400 of the present embodiment is used to three-dimensionally connect complicated circuit wiring, which is difficult to be made in one wiring layer, using various wiring layers. In general, each wiring layer has a predetermined pattern. Is formed.

However, in the present invention, one wiring layer, that is, the conductive layer 420 is used as a wiring layer for connecting the LED chip, but the other heat dissipation layer 440 is a wiring layer to which the original electronic and electronic devices are connected. Rather than being used, it is used for heat generation of the LED chip 110. This will be described in detail below.

In the present embodiment, the current (or power) is supplied to the patterns 420a and 420b of the patterns 420a, 420b and 425 of the conductive layer 420 by an external power source (not shown). The solder joint 220 of the LED chip 110 is connected to the patterns 420a and 420b, so that a current (or voltage) supplied by an external power source is supplied to the LED chip 110 through the patterns 420a and 420b. do. As a result, the LED chip 110 is turned on and heat is incidentally generated in the LED chip 110.

In addition, an LED heat dissipation pad 210 is optionally interposed between the insulating portion of the LED chip 110 and the conductive layer 420. The LED heat dissipation pad 210 is connected to the insulated portion of the LED chip 110 so as not to affect the operation of the LED chip 110. In detail, when the external power is applied to the patterns 420a and 420b, the LED heat dissipation pad 210 is in contact with a portion where the current of the LED chip 110 does not flow. That is, the LED heat dissipation pad 210 is in contact with the LED chip 110 so as not to contact the solder joint 220 through which current flows.

In addition, the LED heat dissipation pad 210 in contact with the insulating portion of the LED chip 110 is in contact with the conductive layer 420. In this case, the conductive layer 420 on the upper surface of the pattern 420a, 420b, 425 means that. Since the conductive layer 420 has a portion where the patterns 420a, 420b, and 425 exist and some portions do not exist when viewed in cross section, the LED heat dissipation pad 210 contacts the top of the patterns 420a, 420b, and 425. Or contact the top of the insulating layer 460 between the patterns 420a, 420b, and 425, or the insulating layer 460 between the patterns 420a, 420b and 425 and the patterns 420a, 420b, and 425. May be in contact.

In the present embodiment, the LED heat dissipation pad 210 is in contact with the pattern 425 in which the current (or power) is not supplied by the external power source of the conductive layer 420. Therefore, even if the LED heat dissipation pad 210 is a conductive material, it does not interfere with the flow of current (or voltage) and thus does not affect the operation of the LED chip 110. The LED heat dissipation pad 210 may be in contact with the portion of the insulating layer 460 between the patterns 420a, 420b, and 425.

However, if the LED heat dissipation pad 210 is an insulating material, the LED chip 110 may be contacted with the patterns 420a and 420b as well as the insulating layer between the patterns 425 and / or the patterns 420a, 420b and 425. It may not affect the operation. In this case, however, thermal conductivity will not be as good as that of the LED heat dissipation pad 210.

The LED heat dissipation pad 210 is an optional configuration as it serves to help the heat generated from the LED chip 110 is transferred to the heat transfer unit 480 to be described later. If the LED heat dissipation pad 210 is not present, the insulating portion of the LED chip 110 may be a pattern of iv) 425, or ii) an insulating layer 460, or iii) between the patterns 420a, 420b, 425. 425 and the insulating layer 460 between the patterns 420a, 420b, and 425.

The heat transfer part 480 connects the insulating portion of the LED chip 110 and the heat dissipation layer 440 through at least an intermediate layer, that is, the insulating layer 460 in this embodiment. Accordingly, heat generated from the LED chip 110 is discharged through the heat dissipation layer 440 through the LED heat dissipation pad 210, the pattern 425, and the heat transfer part 480, which are in contact with the insulating portion of the LED chip 110. .

Even without the heat transfer part 480, the heat generated from the LED chip 110 escapes to the LED heat dissipation pad 210 and the pattern 425 in contact with the LED heat dissipation pad 210 of the conductive layer 420, or the insulating layer. After passing through 460, the heat radiation layer 440 may exit. However, in this case, since the area of the LED heat dissipation pad 210 and the pattern 425 in contact therewith is not very large, there is not much heat that can be dissipated through the LED heat dissipation pad 210 and the conductive layer 460. An embodiment as a solution will be described later with reference to FIGS. 6A and 6B). In addition, since the insulating layer 460 having poor electrical conductivity is generally poor thermal conductivity, there is not much heat transferred to the heat dissipating layer 440 having a larger area.

Accordingly, by forming the heat transfer part 480 made of a material having a higher thermal conductivity than the insulating layer, the heat dissipation can be efficiently generated in the insulating layer 460. As a material for forming the heat transfer part 480, a metal is preferable. In addition, the heat transfer part 480 is more preferably formed of lead (Pb) so that the heat transfer part 480 together when soldering the LED chip 110 to the printed circuit board.

In the present embodiment, the cross section of the heat transfer part 480 connects the LED heat dissipation pad 210, that is, the LED chip 110, and the heat dissipation layer 440 in a straight line so that heat transfer through the heat transfer part 480 occurs most efficiently. It is not necessary to make the cross section of the heat transfer part 480 in a straight line due to the shape, the circumstances in which the separate elements, the wiring of the conductive layer 420, the heat transfer part, and the like exist.

In the plan view, the shape of the heat transfer part 480 may be generally circular, as illustrated, but may be a polygonal shape such as a rectangle or a hexagon.

In addition, as described above, the present embodiment has described a double-sided substrate 400 having two conductive layers 420 and 440 as an example, but in addition to the conductive layer functioning as a wiring layer which is an original role, It is sufficient if it is a multilayer substrate provided with two or more conductive layers provided with the other conductive layer which functions as a heat sink on the lower surface.

In addition, there may be one or more separate conductive layers that function as heat sinks. In other words, the conductive layer on the inside of the substrate and the conductive layer on the surface may function together as a heat sink.

In addition, since the present embodiment has described the LED chip 110, which is a light emitting device, as an element, for example, the conductive layer 420 on which the LED chip 110 is mounted is located on the surface of the substrate. The heat transfer part 480 may be formed to connect the device mounted on the layer located at the heat dissipation layer 440.

5 (a) to 5 (c) are views showing another embodiment of the heat dissipation device according to the present invention.

Even if the heat transfer part 480 is formed as shown in FIG. 4, heat generated from the LED chip 110 is selectively passed through the LED heat dissipation pad 210, and the conductive layer 420 and the heat transfer part 480 having different materials are subjected to heat. Since the heat transfer layer 440 is transferred to the heat dissipation layer 440, the above-described heat resistance may be generated slightly. In order to solve this problem, the heat transfer part 480 is formed through the conductive layer 420 of the substrate, so that one side thereof is in direct contact with the LED chip 110 or the LED heat dissipation pad 210 (FIG. 5A). Formed through the heat dissipation layer 220 of the substrate, the other side of which is in contact with the side surface of the heat dissipation layer 440 of the substrate (see FIG. 5 (b)), or the conductive layer 420 and the heat dissipation layer of the substrate. By being formed to penetrate all the 440, one side thereof may be in direct contact with the LED chip 110 or the LED heat dissipation pad 210, and the other side thereof may be in contact with the side surface of the heat dissipation layer 440 (FIG. 5C). Reference).

At this time, the heat transfer part 480 represented by hatching may be filled with a material having good thermal conductivity, or may be empty inside.

In addition, although the portion of the heat transfer part 480 exposed to the outside of the substrate 400 is shown flat, it may be formed to be convex to the outside. That is, when the top surface of the heat transfer part 480 of FIG. 5A, the bottom surface of the heat transfer part 480 of FIG. 5B, and the top or bottom surface of the heat transfer part 480 of FIG. It may be a convex shape.

In particular, (c) of FIG. 5 directly connects the LED chip 110 and the heat dissipation layer 440, thereby minimizing heat resistance and thus may be most efficiently dissipating heat. In addition, (a) and (b) of FIG. 5 should form the heat transfer part 480 during the manufacturing process of the double-sided substrate 400, while (c) of FIG. 5 is a general through to the completed double-sided substrate 400 It can be easily formed by drilling holes in the conductive layer 420, the insulating layer 460, and the heat dissipating layer 440 at a time by forming a through hole, and filling a material having good thermal conductivity therein. Manufacturing convenience is provided.

In this case, as a material to be filled, lead, which is a general soldering material, may be used. This provides manufacturing convenience that the heat transfer part 480 can be formed together when soldering the LED chip 110 to the conductive layer 420. In addition, the same material as the heat dissipation layer (usually the same material as the conductive layer since the conductive layers use the same material) so that the thermal resistance is the smallest, that is, copper generally used as the material of the wiring layer may be used. Whether lead is used for manufacturing convenience or copper for minimizing thermal resistance will be a matter of choice.

Although the present embodiment also described the LED chip 110 and the double-sided substrate 400 by way of example, it will be apparent to those skilled in the art that the principles of the present invention can be applied to other electrical and electronic devices and / or multilayer substrates.

FIG. 6 (a) is a plan view showing another embodiment of the present invention, and FIG. 6 (b) is a sectional view of the embodiment of FIG. 6 (a).

As described above with reference to FIG. 4, even when the heat transfer part 480 is formed, if the area of the LED heat dissipation pad 210 is not large, the area of the conductive layer 420 in contact with the LED heat dissipation pad 210 is also not wide. do. Therefore, the amount of heat generated by the LED chip 110 escapes to the LED heat dissipation pad 210 and the conductive layer 420.

6 (a) is a state in which the LED heat dissipation pad is attached to the printed circuit board according to the present invention, and is before the LED chip 110 is attached.

In the printed circuit board used in the LED light emitting device according to the present invention, as shown in Fig. 6 (a), the wing 600 which functions as an LED heat dissipation pad of the LED chip 110 of the LED chip 110 It is wide outward. That is, the LED lighting apparatus of the present embodiment is in contact with a portion of the insulating portion of the LED chip 110 as well as the LED heat dissipation pad 210 directly in contact with the insulating portion of the LED chip 110 to the outside of the LED chip 110. It has a wing portion 600 formed wide. The wing unit 600 is formed to share the wing unit 600 of the neighboring LED chip 210 to be formed as wide as possible. Of course, the wing 600 may be formed within a range that does not interfere with the patterns 420a and 420b of the conductive layer 420.

Accordingly, the area in which the heat transfer part 480 can be installed is widened, and when viewed in plan view, the area of each heat transfer part 480 can be increased or the number of heat transfer parts 480 can be increased. Therefore, the area of the heat transfer part 480, which serves as a passage for transferring heat generated by the LED chip 110 to the heat dissipation layer 440 (a plurality of sums of the respective areas) in a plan view, becomes wider, and thus the LED chip. Heat generated at 110 may be efficiently emitted from the heat dissipation layer 440 of the double-sided substrate 400.

7A shows IsoLux 3D simulation results of an example of an LED device according to the present invention.

Even if the same LED chip is used, the performance of the luminous efficiency and the like is not always the same. There are many factors that affect the performance of the luminous efficiency and the like, but one of them is temperature. In other words, the performance of the same LED chip may vary depending on how effective the heat dissipation is.

In FIG. 7A, the luminous efficiency of the LED light emitting device according to the present invention is represented by three-dimensional graphics. It can be seen that the luminous efficiency is generally higher as the surface is upward in the figure.

7B shows IsoLux 3D simulation results of an example of an LED device not in accordance with the inventive arrangements.

Compare FIG. 7A (corresponding to the configuration of the present invention) and FIG. 9B (not corresponding to the configuration of the present invention). Although the two embodiments are somewhat different in scale, the luminous efficiency can be seen by looking at a rough three-dimensional shape. That is, compared to the shape of FIG. 7A, the upper end portion has a sharp point, and the shape of FIG. 7A has a relatively blunt upper end portion. This means that with the configuration of the present invention it emits light which is brighter and uniform at the peak portion. Of course, the two embodiments are not completely identical in scale, luminance, etc., so it is difficult to make a detailed comparison, but the approximate appearance is obtained through the three-dimensional shape.

8 shows an illumination level of an example of an LED device according to the invention.

As shown in the figure, it can be seen that the red part of the center (including orange) is relatively uniform, which means that the light emission of the peak region of the LED device of the present invention is uniform and efficient as described above. .

9 is a view showing a light intensity distribution of one example of the LED device according to the present invention.

9 shows Luminous Intensity Distribution. It can be seen that a relatively uniform light intensity of 3200-4400 cd was obtained over a range of approximately -45 degrees to +45 degrees.

10 is a view showing the light intensity distribution (lower 10%) of an example of the LED device according to the present invention.

This figure is an enlarged view of a portion of FIG. 9, in which the light intensity portion of the lower 10% region is enlarged.

11 shows an optical flux table of an example of an LED device according to the present invention.

The luminous flux is a measure of the light energy passing through a unit area of a surface for a unit of time in the human eye, and the light flux of an example of the LED device according to the configuration of the present invention is approximately 15 degrees. It can be seen that it is uniform in the range of ˜55 degrees, and when such LEDs are repeatedly installed, a highly efficient device that provides a uniform light flux in a fairly large area can be obtained.

As described above, the LED chip 110 is described as a device part, but it is obvious that the present invention can be applied to all other circuit elements such as a resistor, a capacitor, an inductor, and the like, which additionally generates heat.

In addition, although demonstrated centering on the double-sided board 400, the board | substrate to which this invention is applied may be a multilayer board with two or more conductive layers.

Although specific examples have been described above, the present invention is not limited to the above embodiments, and many modifications are possible within the essential spirit of the present invention as set forth in the appended claims by those skilled in the art. Of course. Various other modifications should be considered to be within the scope of the present invention, without departing from the basic spirit of the invention.

110: LED chip
110-1: phosphor
210: LED heat dissipation pad
220: solder joint
230: circuit connection
240: first adhesive
250: insulation cloth
260: second adhesive
270: metal
280: PCB (metal)
310: heat sink
320: thermally conductive paste
400: double-sided board
420: conductive layer
420a, 420b, 425: pattern
440: heat dissipation layer
460: insulation layer
480: heat transfer unit
600: wing

Claims (21)

An intermediate layer including at least one insulating layer;
A conductive layer comprising a predetermined pattern formed of a conductive material on the intermediate layer such that at least a portion of the conductive layer is electrically connected to the electrical and electronic device;
A heat dissipation layer formed of a conductive material, wherein the intermediate layer is interposed between the conductive layer and the heat dissipation layer; And
One or more heat transfers to transfer heat generated in the electrical and electronic device to the heat dissipating layer by connecting the electrical and electronic device and the heat dissipation layer through at least the intermediate layer when an external power source is applied to a predetermined pattern of the conductive layer. part;
Printed circuit board comprising a,
An LED light emitting device comprising as an electric and electronic device a LED chip (Light-Emitting Diode chip) that emits light through a combination of electrons and holes,
Further comprising a LED heat dissipation pad interposed between the LED chip and the printed circuit board,
The heat transfer part connects the LED heat dissipation pad and the heat dissipation layer through at least the intermediate layer, thereby transferring heat generated from the LED chip to the heat dissipation layer through the LED heat dissipation pad,
The LED heat dissipation pad has a shape at least partially outward from the LED chip when viewed in plan,
At least one of said one or more heat transfer parts is formed in a portion of said LED heat dissipation pad that comes out from said LED chip in plan view. delete The method of claim 1,
And the heat transfer portion penetrates through the intermediate layer to connect the insulating portion of the electrical and electronic element to the surface facing the conductive layer of the heat dissipation layer via the conductive layer. delete The method of claim 1,
And the heat transfer part penetrates the intermediate layer and the heat dissipation layer, thereby connecting the insulating portion of the electric and electronic element and the penetrating side surface of the heat dissipation layer via the conductive layer. The method of claim 1,
The opposite side of the surface of the heat dissipation layer toward the conductive layer is directed toward the outside. The method according to any one of claims 1, 3, 5 and 6,
And a metal forming the pattern of the conductive layer and a metal forming the heat dissipating layer are the same. The method of claim 7, wherein
The pattern of the said conductive layer and the metal which forms the said heat radiating layer are LED light emitting apparatuses characterized by the above-mentioned. The method according to any one of claims 1, 3, 5 and 6,
LED is characterized in that the heat transfer portion is formed of a metal. 10. The method of claim 9,
The LED light-emitting device, characterized in that the metal forming the heat transfer portion is lead. The method according to any one of claims 1, 3, 5 and 6,
And a heat sink in contact with the heat radiation layer. The method according to any one of claims 1, 3, 5 and 6,
And a surface opposite to the surface of the conductive layer facing the insulating layer faces outward. delete delete delete The method of claim 1,
The LED heat dissipation pad is made of a metal material, and the LED light emitting device, characterized in that formed in contact with the portion of the conductive layer does not flow current when external power is applied to a predetermined pattern of the conductive layer. delete delete delete delete The method of claim 1,
And the LED heat dissipation pad is connected to the LED heat dissipation pad of another LED light emitting device.

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