CN211557628U

CN211557628U - FR-4 high-thermal-conductivity printed circuit board

Info

Publication number: CN211557628U
Application number: CN202020358480.XU
Authority: CN
Inventors: 倪蕴之; 朱永乐; 杨存杰
Original assignee: Kunshan Suhang Circuit Board Co ltd
Current assignee: Kunshan Suhang Circuit Board Co ltd
Priority date: 2020-03-20
Filing date: 2020-03-20
Publication date: 2020-09-22
Anticipated expiration: 2030-03-20

Abstract

The utility model discloses a FR-4 high heat conduction printed circuit board, include the printing board substrate insulating layer of making by FR-4 substrate and be located the circuit copper layer on two opposite flanks of this printing board substrate insulating layer, the oxide layer on this circuit copper layer surface is got rid of, the printing board substrate insulating layer with the circuit copper layer on it gets rid of the part outside the pad of welding components and parts and covers one deck heat conduction glue film, this heat conduction glue film is the formation of printing heat conduction glue, the coefficient of heat conductivity of this heat conduction glue is greater than or equal to 3W/m.k, the thermal resistance is less than 0.09 ℃/W, thickness is greater than or equal to 60 mu m, dielectric strength is greater than > 20 KV/mm. The utility model discloses utilize ordinary FR-4 substrate preparation two-sided circuit pattern to make FR-4 high heat conduction printing board product, improve the coefficient of heat conductivity of product greatly. The product is applied to a high-speed variable frequency motor, the heat dissipation performance and various performance indexes of the product can be effectively improved, the condition that the system works unstably due to thermal overload when the product works for a long time is fundamentally solved, and the application prospect is very wide.

Description

FR-4 high-thermal-conductivity printed circuit board

Technical Field

The utility model belongs to the technical field of the printing board, specific saying so relates to a FR-4 high heat conduction printed circuit board.

Background

With the continuous development of electronic technology, products are continuously developed towards miniaturization, and the power of the products is continuously increased. The volume of the product is smaller and smaller, and the power is continuously increased, so that the heat generated when the product works is greatly increased. The traditional printed circuit board has low heat conductivity coefficient of only 0.4W/m.k-0.5W/m.k, and the generated heat cannot be dissipated in time, so that the board temperature of the printed circuit board is increased rapidly, and the system works abnormally. A printed circuit board for a high-speed variable frequency motor is provided, and due to the fact that power is high, a traditional FR-4 printed circuit board product is used, heat generated during working is often conducted out, and a system cannot work normally. In the industry, for printed board products with heat conduction requirements, ceramic printed board products are generally selected, or metal-based printed board products are used. The ceramic printed board product has high cost and complex process, and is not accepted by customers. The metal-based printed board product is used for a high-speed motor because the insulating layer is very thin and is only 0.05mm-0.1mm, and is not suitable for a high-speed variable frequency motor because the insulating layer can be damaged and the risk of electric leakage is easily generated under the vibration environment for a long time. In order to solve the problems of high reliability, simple process and low cost required by customers, an FR-4 high-thermal-conductivity printed circuit board product is developed to meet the requirements of a printed circuit board for a high-speed variable frequency motor.

Disclosure of Invention

In order to overcome the defects, the utility model provides a FR-4 high heat conduction printed circuit board makes the coefficient of heat conductivity of product be greater than or equal to 1W/m.k, replaces ceramic base printed circuit board, or metal base printed board, is applied to high-speed inverter motor product, solves high-speed inverter motor and uses ordinary FR-4 printed circuit board product bad heat conduction can appear, the unusual condition of work can appear in the system, this new product has satisfied reliable operation simultaneously, and simple process, low cost's expectation.

The utility model discloses a solve the technical scheme that its technical problem adopted and be: the FR-4 high-thermal-conductivity printed circuit board comprises a printed board substrate insulating layer made of FR-4 substrate and circuit copper layers positioned on two opposite sides of the printed board substrate insulating layer, wherein a thermal-conductivity glue layer covers the printed board substrate insulating layer and the part, except a welding pad for welding components, of the circuit copper layers on the printed board substrate insulating layer.

As a further improvement of the utility model, the heat-conducting glue layer is formed by printing heat-conducting glue, the heat conductivity coefficient of the heat-conducting glue is more than or equal to 3W/m.k, the thermal resistance is less than 0.09 ℃/W, the thickness is more than or equal to 60 mu m, and the insulating strength is more than 20 KV/mm.

As a further improvement, the oxide layer on the surface of the copper layer of the circuit is covered after being removed by the heat-conducting adhesive layer.

The utility model has the advantages that: the utility model discloses utilize ordinary FR-4 substrate preparation two-sided circuit pattern, then handle bare copper face, expose fresh copper surface to print the heat conduction glue that coefficient of heat conductivity is more than or equal to 3W/m.k on it, make FR-4 high heat conduction printing board product, can make the coefficient of heat conductivity of product improve by 0.5W/m.k to more than or equal to 1W/m.k. The product is applied to a high-speed variable frequency motor, the heat dissipation performance of the product can be effectively improved, various performance indexes meet the design requirements, the problem that the system is unstable in work due to heat overload when the original product works for a long time is fundamentally solved, and the product application prospect is very wide.

Drawings

Fig. 1 is a schematic structural diagram of step 1 of the manufacturing method according to the embodiment of the present invention;

fig. 2 is a schematic structural diagram of the thermal conductive adhesive pattern of step 3 of the manufacturing method according to the embodiment of the present invention;

fig. 3 is a schematic structural diagram of the FR-4 high thermal conductivity printed circuit board of step 3 of the manufacturing method according to the embodiment of the present invention;

fig. 4 is a schematic cross-sectional view of fig. 3.

The following description is made with reference to the accompanying drawings:

1-insulating layer of printed board substrate; 2-a line copper layer;

3-heat conducting glue layer; 11-FR-4 substrate;

12-pattern of lines; 13-first printed circuit board;

14-bonding pad; 15-heat-conducting glue;

16-FR-4 high heat conduction printed circuit board.

Detailed Description

The following description of a preferred embodiment of the present invention will be made in conjunction with the accompanying drawings.

Referring to fig. 3-4, for an FR-4 high heat conduction printed circuit board, include the printing board substrate insulating layer 1 made by the FR-4 substrate and be located this printing board substrate insulating layer 1's two circuit copper layers 2 on the opposite side, printing board substrate insulating layer 1 and the circuit copper layer 2 on it get rid of the part outside the pad of welding components and parts and cover one deck heat-conducting glue layer 3.

The copper layer of the circuit is covered with the heat-conducting adhesive layer after the oxide layer on the surface of the copper layer of the circuit is removed, the heat-conducting adhesive layer is formed by printing heat-conducting adhesive, the heat-conducting adhesive has the heat conductivity coefficient of more than or equal to 3W/m.k, the thermal resistance of less than 0.09 ℃/W, the thickness of more than or equal to 60 mu m, and the insulation strength of more than or equal to 20 KV/mm.

Referring to fig. 1-4, the manufacturing method of the FR-4 high thermal conductive printed circuit board according to the present invention includes the following steps:

step 1, using an FR-4 substrate 11 to respectively manufacture conductive circuit patterns 12 on two side surfaces of the substrate, and under the condition of ensuring the minimum insulation distance, utilizing a wiring space to the maximum extent, enlarging the wiring area of a circuit and forming a first printed circuit board 13;

step 2, after the circuit is manufactured, removing the oxide layers on the surfaces of the copper layers on the circuit patterns on the two side surfaces of the first printed circuit board by using a mechanical or chemical method to expose the bare copper surfaces of the circuits to form a second printed circuit board;

and 3, printing a layer of heat-conducting glue 15 on the surface of the second printed circuit board except for the bonding pad 14 of the component to be welded, wherein the heat-conducting glue is shown in figure 2, the heat conductivity coefficient of the heat-conducting glue is more than or equal to 3W/m.k, the thermal resistance is less than 0.09 ℃/W, the thickness is more than or equal to 60 mu m, the insulating strength is more than or equal to 20KV/mm, and the FR-4 high-heat-conductivity printed circuit board 16 is obtained.

Therefore, the utility model discloses utilize ordinary FR-4 substrate preparation two-sided circuit pattern, then handle naked copper face, expose fresh copper surface to print the heat conduction glue that coefficient of heat conductivity is more than or equal to 3W/m.k on it, make FR-4 high heat conduction printed board product, can make the coefficient of heat conductivity of product improve to more than or equal to 1W/m.k from 0.5W/m.k. The product is applied to a high-speed variable frequency motor, the heat dissipation performance of the product can be effectively improved, various performance indexes meet the design requirements, the problem that the system is unstable in work due to heat overload when the original product works for a long time is fundamentally solved, and the product application prospect is very wide.

In the previous description, numerous specific details were set forth in order to provide a thorough understanding of the invention. The foregoing description is only illustrative of the preferred embodiments of the invention, which can be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. All the contents that do not depart from the technical solution of the present invention, any simple modification, equivalent change and modification made to the above embodiments according to the technical substance of the present invention all still belong to the protection scope of the technical solution of the present invention.

Claims

1. An FR-4 high thermal conductive printed circuit board comprising a printed board substrate insulating layer (1) made of an FR-4 substrate and wiring copper layers (2) on two opposite sides of the printed board substrate insulating layer (1), characterized in that: and the printed board base material insulating layer (1) and the part, on the printed board base material insulating layer, of the circuit copper layer (2) except the bonding pad for welding the component are covered with a heat-conducting glue layer (3).

2. The FR-4 high thermal conductivity printed circuit board of claim 1, wherein: the heat conducting glue layer is formed by printing heat conducting glue, the heat conducting coefficient of the heat conducting glue is more than or equal to 3W/m.k, the thermal resistance is less than 0.09 ℃/W, the thickness is more than or equal to 60 mu m, and the insulating strength is more than or equal to 20 KV/mm.

3. The FR-4 high thermal conductivity printed circuit board of claim 1, wherein: and after the oxide layer on the surface of the copper layer of the circuit is removed, covering the heat-conducting adhesive layer.