CN114710848A - Ultrathin heating plate based on etching process and preparation method thereof - Google Patents
Ultrathin heating plate based on etching process and preparation method thereof Download PDFInfo
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- CN114710848A CN114710848A CN202210195667.6A CN202210195667A CN114710848A CN 114710848 A CN114710848 A CN 114710848A CN 202210195667 A CN202210195667 A CN 202210195667A CN 114710848 A CN114710848 A CN 114710848A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
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Abstract
The invention relates to an ultrathin heating plate based on an etching process and a preparation method thereof. Wherein, the conductive heating sheet is provided with a copper electrode, and the copper electrode is connected with a lead; the conductive heating sheet is formed by laminating a ceramic insulating substrate, a welding flux and a copper foil, then performing high-temperature vacuum sintering and performing graphical processing. The preparation method comprises mother board preparation, welding layer imaging, conductive heating sheet preparation and heating board preparation. The invention uses the high melting point low resistance AMB welding layer as the heating body, can be continuously used at the temperature of below 400 ℃, and the resistivity of the welding layer is 1.5-5 multiplied by 10‑6Omega.m, overcomes the defect of low use temperature of the traditional metal foil heating sheet insulated by polyimide material. In the aspect of heating uniformity, the material used on the upper surface is high-heat-conductivity aluminum nitride ceramic, the heat conductivity is more than 170W/m.K, and the heat conductivity can be ensuredThe uniformity of heat generation is demonstrated.
Description
Technical Field
The invention belongs to the technical field of heating plates, and particularly relates to an ultrathin heating plate based on an etching process and a preparation method thereof.
Background
With the vigorous promotion of energy conservation and high efficiency and the rapid development of semiconductor technology, the miniaturization, integration and energy conservation trend of power electronic equipment is obvious, and the miniaturization development of heating materials is also promoted. The existing electric heating body mainly has three types: metal heating materials (metal wires or metal sheets), electrothermal films (carbon-based ink or coatings) and carbon fiber heating materials. The conventional electrothermal alloy wire is usually made of metal materials such as iron-chromium-aluminum alloy, nickel-chromium alloy and the like. The electrothermal alloy wire has the advantages of high resistivity, good corrosion resistance, low price, capability of being used at extremely high temperature, bearing great surface load and high radiance after high-temperature oxidation. The etched metal heating element circuit is better in consistency and more suitable for a surface heating element needing uniform temperature control.
For metal heating materials, many studies have been made in the prior art: for example, patent CN213280131U discloses an iron-chromium-aluminum heating plate. The thickness of the heating layer is 0.02-0.03mm, the heating layer is compounded between two layers of polyimide films, and the characteristics of the polyimide films, such as mechanical strength, electrical insulation, flame retardance and the like, are utilized to perform better insulation protection on the heating metal layer; patent CN109618429B discloses a metal foil heat generating sheet capable of resisting 250 ℃, which is obtained by coating a heat-fusible polyamic acid liquid on the surface of a thermosetting polyimide film to obtain a viscous polyimide film. Finally, compounding a polyimide film with viscosity on the surface of the metal foil to prepare a whole heating sheet; patent CN209488833U discloses an etching heat generating sheet, in which a resistance slurry is filled in an etched resistance groove, so that a copper sheet and the resistance slurry form a heat generating mechanism of the heat generating sheet. Whole electric heat piece detachably installs in the mica plate of predetermineeing the fixed slot, and the mica plate plays insulating and high temperature resistance effect. Patent CN205723871U has invented an aluminum plate etching chip battery heating plate, and its metal heating layer can reach 1.0mm, and the insulating layer has also adopted the polyimide film material. Patent CN104795128A discloses a lead-free resistance paste, which is printed on a glass ceramic plate by adopting a screen printing technology, and is made into a glass ceramic heating plate after certain sintering, wherein the thickness of the film is 13 mu m, and multiple purposes are realized by adjusting the component ratio of the paste. The method has the advantages of complex process, various raw materials and high cost, but has long service life, high electric heat utilization efficiency and small volume, and can be applied to some small heating devices.
In summary, the conventional metal heating sheet mostly adopts polyimide material or mica sheet as the outer coating, and the two types of heating sheets also have obvious defects: on one hand, the traditional metal foil heating sheet insulated by polyimide materials has the problem of low use temperature; on the other hand, the combination of the heating sheet and the mica sheet with excellent insulating and temperature-resistant properties is yet to be strengthened. Meanwhile, the thickness of the metal heating body needs to be further reduced.
Silicide is one of the key materials for manufacturing large-scale integrated circuits due to its high melting point and low resistance, and is mainly used as ohmic contact and electrode lead of the circuit. Among silicides, titanium silicide has the lowest resistivity, relatively high melting point, and is compatible with Si integration process, and is widely used in the manufacture of contacts and interconnects in Metal Oxide Semiconductor Field Effect Transistors (MOSFETs) and Dynamic Random Access Memories (DRAMs) in very large scale integrated circuits.
The active metal brazing technology (AMB) can realize that a ceramic sheet and a copper sheet are welded into a whole through vacuum sintering of active metal solder, and the AMB copper-clad ceramic sheet has the characteristics of high heat conduction and high insulation, and is mainly applied to a semiconductor module and a power semiconductor device with high power and larger heat generation. By utilizing the conventional process of AMB, a conductive layer including a titanium silicide layer can be generated in a solder layer through the adjustment of the thickness and the components of the solder, and by utilizing the low resistivity and the high melting point of the conductive layer, the ultrathin heating plate which is low in resistivity, high in insulating strength, uniform in heating and high in bonding strength of a heating body and an insulating material can be realized based on the mature etching process of AMB.
Disclosure of Invention
The invention provides an ultrathin heating plate based on an etching process by utilizing the feasibility of manufacturing a heating plate by using an AMB (advanced micro-electromechanical system). The heating body of the heating plate is ultrathin in thickness and uniform in heating, is generated by vacuum sintering, and has extremely high peel strength with a ceramic insulating substrate.
The principle on which the invention is based is as follows: in the manufacturing process of the AMB, the copper foil and the ceramic insulating substrate are sintered in vacuum through a titanium-containing metal foil to form a brazed copper-clad ceramic substrate, a welding layer containing titanium silicide is formed in the sintering process, and the welding layer can be used as a heating material due to proper electric conductivity and excellent connection strength with the ceramic insulating substrate. The method provides a new idea for developing a novel heating material with excellent performance by using the welding layer as the heating material, and has important significance for designing the heating material with high reliability.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
in a first aspect of the present invention, an ultra-thin heating plate based on an etching process is provided, which has the following technical characteristics: comprises an electric heating sheet and a high heat conduction ceramic temperature-equalizing plate arranged on a pattern layer of the electric heating sheet. Wherein, the conductive heating sheet is provided with a copper electrode, and the copper electrode is connected with a lead; the conductive heating sheet is formed by laminating a ceramic insulating substrate, a solder and a copper foil, then sintering at high temperature in vacuum and processing by a graphical process.
Preferably, in the ultrathin heating plate based on the etching process, the ceramic insulating substrate is a silicon nitride ceramic wafer, the thickness of the ceramic insulating substrate is 0.2-1.0mm, the insulating strength of the ceramic insulating substrate is greater than 20kV/mm, and the thermal conductivity of the ceramic insulating substrate is greater than 80W/m.K.
Preferably, in the ultra-thin heating plate based on the etching process, the conductive heating sheet is formed by laminating a ceramic insulating substrate, a solder and a copper foil and sintering the laminated ceramic insulating substrate, the solder and the copper foil through an AMB (advanced micro electro mechanical system) process.
Preferably, in the ultrathin heating plate based on the etching process, the solder is a titanium-containing metal foil with the thickness of 3-15 μm, and is laminated with the silicon nitride ceramic chip and the copper foil to form a welding layer after vacuum sintering reaction; the thickness of the welding layer is substantially the same as that of the original foil, and the resistivity is 1.5-5 x 10-6Omega m, the solder composition and the copper foil thickness are adjusted to adjust the solder layer composition and further the resistivity.
Preferably, in the ultra-thin heating plate based on the etching process provided by the present invention, the peel strength between the ceramic insulating substrate and the soldering layer is greater than 25000 gf/in.
Preferably, in the ultrathin heating plate based on the etching process, the high-thermal-conductivity ceramic temperature-equalizing plate is an aluminum nitride ceramic chip, the thermal conductivity is greater than 170W/m.K, the insulating strength is greater than 20kV/mm, and the high thermal conductivity ensures the uniformity of the temperature of the whole plate surface.
In a second aspect of the present invention, there is provided a method for preparing the ultra-thin heating plate based on the etching process, including the following steps:
s1) master plate preparation: stacking the ceramic insulating substrate, the solder and the copper foil, and placing the stacked ceramic insulating substrate, the solder and the copper foil into a vacuum sintering furnace for vacuum active brazing, wherein the temperature is 700-940 ℃, the vacuum degree is less than 0.01Pa, and the sintering time is 60-540 min;
s2) solder layer patterning: taking the copper-clad ceramic plate prepared in the step S1 as a mother plate, preparing a graphical welding layer by the mother plate through a graphical process, and combining thin copper on the surface of the mother plate;
s3) preparing a conductive heating sheet: covering and drying a silk-screen wet film at the position of a required copper electrode, and carrying out copper etching, film stripping and anti-oxidation treatment again to obtain a patterned welding layer with the copper electrode, so that the ceramic insulating substrate, the patterned welding layer and the copper electrode are integrated into a whole to be used as a conductive heating sheet;
s4) preparing a heating plate: the conductive heating sheet is combined with the high-heat-conductivity ceramic temperature-equalizing plate in a covering manner and leads are led out.
Compared with the prior art, the heating plate structure and the process design of the invention have the following beneficial effects:
in the aspect of thickness, the whole thickness of the ultrathin heating plate is ultrathin and is lower than 15 mu m, so that the volume of the whole device can be greatly reduced;
in the strength aspect, the conductive heating sheet is formed by laminating a ceramic insulating substrate, a welding flux and a copper foil, then sintering at high temperature in vacuum and processing by a graphical process, the heating body and the insulating and heat-conducting ceramic sheet are tightly combined, the peel strength is extremely high and is more than 25000gf/in, and the temperature resistance and the cold-hot circulation performance of the integral heating plate are ensured;
in terms of heat-generating performance, the invention uses the high-melting-point low-resistance AMB welding layer as a heating element, can be continuously used at the temperature of below 400 ℃, and the resistivity of the welding layer is 1.5-5 multiplied by 10-6Omega.m, overcomes the defect of low use temperature of the traditional metal foil heating sheet insulated by polyimide material;
in the aspect of heating uniformity, the material used on the upper surface is high-heat-conductivity aluminum nitride ceramic, the heat conductivity is more than 170W/m.K, and the heating uniformity can be ensured.
Drawings
Fig. 1 is an exploded view of an ultra-thin heating panel according to an embodiment of the present invention.
Fig. 2 is a schematic cross-sectional view of an ultra-thin heating panel according to an embodiment of the present invention.
Fig. 3 is a process flow of the preparation of the ultra-thin heating plate in the embodiment of the present invention.
Detailed Description
The following examples are given to illustrate the practice of the present invention, and the following examples are given on the premise of the technical solution of the present invention, and give detailed embodiments and specific procedures, but the scope of the present invention is not limited to the following examples.
Ultra-thin heating plate structure based on etching process
Referring to fig. 1 and 2, the ultra-thin heating plate in the present embodiment includes a ceramic insulating substrate 1, a solder layer 2, a copper electrode 3, a lead wire 4, and a high thermal conductive ceramic temperature-uniforming plate 5. For ease of understanding, fig. 2 shows a schematic cross-sectional view of an ultra-thin heating plate with lead wires 4 leading from copper electrodes 3.
The ceramic insulating substrate 1, the welding layer 2 and the copper electrode 3 form a conductive heating sheet 6, and the conductive heating sheet is formed by laminating the ceramic insulating substrate 1, a welding flux and a copper foil 3, then carrying out high-temperature vacuum sintering by an AMB process, and carrying out graphic process treatment.
The ceramic insulating substrate 1 is a silicon nitride ceramic chip, the thickness is 0.2-1.0mm, the insulating strength is more than 20kV/mm, and the thermal conductivity is more than 80W/m.K.
The solder is a titanium-containing metal foil with a thickness of 3-15 μm, and nitrogenLaminating the silicon ceramic chip and the copper foil, and forming a welding layer 2 after vacuum sintering reaction; the thickness of the welding layer is substantially the same as that of the original foil, and the resistivity is 1.5-5 x 10-6Omega. m, can be used continuously at a temperature below 400 ℃. The components of the welding layer are adjusted by adjusting the components of the welding flux and the thickness of the copper foil, and further the resistivity is adjusted.
After sintering, the peel strength between the ceramic insulating substrate and the solder layer is greater than 25000gf/in, ensuring the thermal shock reliability of the heater plate.
The high-thermal-conductivity ceramic temperature-equalizing plate 5 is an aluminum nitride ceramic chip, the thermal conductivity is more than 170W/m.K, the insulating strength is more than 20kV/mm, and the high thermal conductivity ensures the uniformity of the temperature of the whole plate surface.
Preparation of ultrathin heating plate
The whole manufacturing process of the heating plate refers to the existing AMB copper-clad ceramic substrate process, and as shown in figure 3, the whole manufacturing process comprises the following three steps:
step one, the ceramic insulating substrate, the solder and the copper foil are laminated and put into a vacuum sintering furnace for vacuum active brazing, the temperature is 700-. And taking the prepared copper-clad ceramic plate as a mother plate. The ceramic insulating substrate used was silicon nitride ceramic with a thickness of 0.32mm, the solder was a foil of titanium as a main component with a thickness of 12 μm, and the copper foil was OFHC copper with a thickness of 0.3 mm.
And step two, pasting a photosensitive film on the mother board, exposing the photosensitive film under a specific film, and preparing a graphical welding layer through exposure, development, copper etching, film stripping and welding layer etching, wherein the surface of the graphical welding layer is combined with thin copper. Screen printing a wet film at the position of a required copper electrode and drying, etching copper again and removing the film to remove the copper except the position of the electrode, and then carrying out anti-oxidation treatment to obtain a patterned welding layer 2 with the copper electrode 3, so that the ceramic insulating substrate 1, the patterned welding layer 2 and the copper electrode 3 are integrated into a whole to be used as a conductive heating plate;
and step three, combining the heating plate and the high-thermal-conductivity ceramic temperature equalizing plate 5 and connecting a lead 4 from the copper electrode 3. The high-thermal-conductivity ceramic temperature-uniforming plate is aluminum nitride ceramic with the thickness of 0.5 mm.
The ultra-thin heating plate that this embodiment provided has following technological effect:
in the aspect of thickness, the whole thickness of the ultrathin heating plate is ultrathin and is lower than 15 mu m, so that the volume of the whole device can be greatly reduced;
in the strength aspect, the conductive heating sheet is formed by laminating a ceramic insulating substrate, a welding flux and a copper foil, then sintering at high temperature in vacuum and processing by a graphical process, the heating body and the insulating and heat-conducting ceramic sheet are tightly combined, the peel strength is extremely high and is more than 25000gf/in, and the temperature resistance and the cold-hot circulation performance of the integral heating plate are ensured;
in terms of heat-generating performance, the invention uses the high-melting-point low-resistance AMB welding layer as a heating element, can be continuously used at the temperature of below 400 ℃, and the resistivity of the welding layer is 1.5-5 multiplied by 10-6Omega.m, overcomes the defect of low use temperature of the traditional metal foil heating sheet insulated by polyimide material;
in the aspect of heating uniformity, the material used on the upper surface is high-heat-conductivity aluminum nitride ceramic, the heat conductivity is more than 170W/m.K, and the heating uniformity can be ensured.
While the preferred embodiments of the present invention have been described in detail, it will be understood by those skilled in the art that the invention is not limited thereto, and that various changes and modifications may be made without departing from the spirit of the invention, and the scope of the appended claims is to be accorded the full scope of the invention.
Claims (7)
1. An ultra-thin heating plate based on etching process is characterized by comprising an electric heating sheet and a high heat conduction ceramic temperature-equalizing plate arranged on a pattern layer of the electric heating sheet,
wherein, the conductive heating sheet is provided with a copper electrode, and the copper electrode is connected with a lead;
the conductive heating sheet is formed by laminating a ceramic insulating substrate, a welding flux and a copper foil, then sintering at high temperature in vacuum and processing by a graphical process.
2. The ultra-thin heating plate based on an etching process according to claim 1, wherein:
wherein the ceramic insulating substrate is a silicon nitride ceramic chip, the thickness of the ceramic insulating substrate is 0.2-1.0mm, the insulating strength is more than 20kV/mm, and the thermal conductivity is more than 80W/m.K.
3. The ultra-thin heating plate based on an etching process of claim 1, wherein:
the conductive heating sheet is formed by laminating a ceramic insulating substrate, a welding flux and a copper foil and then sintering the laminated ceramic insulating substrate, the welding flux and the copper foil through an AMB (advanced manufacturing bus) process.
4. The ultra-thin heating plate based on an etching process of claim 3, wherein:
wherein the solder is a titanium-containing metal foil with the thickness of 3-15 μm, and forms a welding layer after vacuum sintering reaction with the silicon nitride ceramic chip and the copper foil,
the thickness of the welding layer is substantially the same as that of the original foil, and the resistivity is 1.5-5 x 10-6Omega m, the solder composition and the copper foil thickness are adjusted to adjust the solder layer composition and further the resistivity.
5. The ultra-thin heating plate based on an etching process of claim 4, wherein:
wherein the peel strength between the ceramic insulating substrate and the solder layer is greater than 25000 gf/in.
6. The ultra-thin heating plate based on an etching process of claim 1, wherein:
the high-thermal-conductivity ceramic temperature-equalizing plate is an aluminum nitride ceramic chip, the thermal conductivity is greater than 170W/m.K, and the insulating strength is greater than 20 kV/mm.
7. The method for manufacturing an ultra-thin heating plate of any one of claims 1 to 6, comprising the steps of:
s1) master plate preparation: stacking the ceramic insulating substrate, the solder and the copper foil, and placing the stacked ceramic insulating substrate, the solder and the copper foil into a vacuum sintering furnace for vacuum active brazing, wherein the temperature is 700-940 ℃, the vacuum degree is less than 0.01Pa, and the sintering time is 60-540 min;
s2) solder layer patterning: taking the copper-clad ceramic plate prepared in the step S1 as a mother plate, preparing a graphical welding layer by the mother plate through a graphical process, and combining thin copper on the surface of the mother plate;
s3) preparing a conductive heating sheet: covering and drying a silk-screen wet film at the position of a required copper electrode, and carrying out copper etching, film stripping and anti-oxidation treatment again to obtain a patterned welding layer with the copper electrode, so that the ceramic insulating substrate, the patterned welding layer and the copper electrode are integrated into a whole to be used as a conductive heating sheet;
s4) preparing a heating plate: the conductive heating sheet is combined with the high-heat-conductivity ceramic temperature-equalizing plate in a covering manner and leads are led out.
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| CN202210195667.6A CN114710848A (en) | 2022-03-01 | 2022-03-01 | Ultrathin heating plate based on etching process and preparation method thereof |
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| CN202210195667.6A CN114710848A (en) | 2022-03-01 | 2022-03-01 | Ultrathin heating plate based on etching process and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115053996A (en) * | 2022-07-19 | 2022-09-16 | 江苏富乐华功率半导体研究院有限公司 | Electronic cigarette heating sheet based on AMB (advanced manufacturing Board) process and preparation method thereof |
| CN115153112A (en) * | 2022-08-04 | 2022-10-11 | 江苏富乐华功率半导体研究院有限公司 | High-efficiency electronic cigarette double-sided heating sheet and preparation method thereof |
-
2022
- 2022-03-01 CN CN202210195667.6A patent/CN114710848A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115053996A (en) * | 2022-07-19 | 2022-09-16 | 江苏富乐华功率半导体研究院有限公司 | Electronic cigarette heating sheet based on AMB (advanced manufacturing Board) process and preparation method thereof |
| CN115153112A (en) * | 2022-08-04 | 2022-10-11 | 江苏富乐华功率半导体研究院有限公司 | High-efficiency electronic cigarette double-sided heating sheet and preparation method thereof |
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