CN116669321A - Gold-plated auxiliary lead, gold-plated plate manufacturing method, plate substrate and gold-plated plate - Google Patents
Gold-plated auxiliary lead, gold-plated plate manufacturing method, plate substrate and gold-plated plate Download PDFInfo
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- CN116669321A CN116669321A CN202310738996.5A CN202310738996A CN116669321A CN 116669321 A CN116669321 A CN 116669321A CN 202310738996 A CN202310738996 A CN 202310738996A CN 116669321 A CN116669321 A CN 116669321A
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- gold
- conductive layer
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- substrate
- auxiliary lead
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- 239000000758 substrate Substances 0.000 title claims abstract description 66
- 238000004519 manufacturing process Methods 0.000 title claims description 32
- 238000007747 plating Methods 0.000 claims abstract description 63
- 238000000034 method Methods 0.000 claims abstract description 46
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 45
- 229910052802 copper Inorganic materials 0.000 claims abstract description 45
- 239000010949 copper Substances 0.000 claims abstract description 45
- 238000001035 drying Methods 0.000 claims abstract description 40
- 238000011282 treatment Methods 0.000 claims abstract description 22
- 238000005530 etching Methods 0.000 claims abstract description 21
- 238000002360 preparation method Methods 0.000 claims abstract description 10
- 238000005260 corrosion Methods 0.000 claims abstract description 6
- 230000007797 corrosion Effects 0.000 claims abstract description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 68
- 229910052737 gold Inorganic materials 0.000 claims description 68
- 239000010931 gold Substances 0.000 claims description 68
- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 claims description 13
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 claims description 13
- 239000007788 liquid Substances 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 239000010408 film Substances 0.000 description 30
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 16
- 239000003054 catalyst Substances 0.000 description 10
- 229910052763 palladium Inorganic materials 0.000 description 7
- 238000000151 deposition Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 230000000669 biting effect Effects 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 238000005137 deposition process Methods 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 3
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemically Coating (AREA)
- Laminated Bodies (AREA)
Abstract
The application discloses a gold-plated auxiliary lead, a gold-plated plate preparation method, a plate substrate and a gold-plated plate, which can reduce the substrate rejection rate. The method comprises the following steps: carrying out electroless copper plating on the surface of the substrate to form a uniform conductive layer; drying the conductive layer on the plate surface to form a uniform and stable conductive layer; respectively performing film pasting, exposure and development treatment on the plate surface on which the uniform and stable conductive layer is formed, so as to form a part of the exposed conductive layer and another part of the conductive layer surrounded by the corrosion-resistant layer on the plate surface; and carrying out pattern etching on the conductive layer exposed on the plate surface, carrying out film removing treatment on the conductive layer surrounded by the resist layer, and forming a gold-plated auxiliary lead on the exposed conductive layer after film removing.
Description
Technical Field
The application relates to the technical field of circuit board manufacturing, in particular to a gold-plated auxiliary lead, a gold-plated plate manufacturing method, a plate substrate and a gold-plated plate.
Background
With the rapid development of the electronics industry, the demand for printed circuit boards (Printed Circuit Board, PCBs) is changing, wherein there are some customers or products themselves that require nickel plating.
Currently, when plating nickel gold is required and a gold plated lead is not designed, a gold plated auxiliary lead needs to be designed by itself. Copper is used as a common conductive layer of a substrate, has the advantages of easily available materials, simple equipment, simple process and the like, and is a method for realizing auxiliary lead manufacturing by adopting a chemical copper deposition method at present, however, in the traditional copper deposition process, a palladium catalyst is remained on the surface, and the gold plating process leads to gold plating at the palladium residue position, namely, the problem of diffusion plating exists, and the rejection rate is high.
Disclosure of Invention
Based on the foregoing, there is a need to provide a gold-plated auxiliary lead, a gold-plated board manufacturing method, a board substrate and a gold-plated board, so as to solve the problem of palladium residue caused by the gold plating process in the prior art.
In a first aspect, a method for preparing a gold plated auxiliary lead is provided, including:
carrying out electroless copper plating on the surface of the substrate to form a conductive layer;
drying the conductive layer on the plate surface to form a uniform conductive layer;
respectively performing film pasting, exposure and development on the plate surface on which the uniform conductive layer is formed, so as to form a part of the exposed conductive layer and another part of the conductive layer surrounded by the corrosion-resistant layer on the plate surface;
and carrying out pattern etching on the conductive layer exposed on the plate surface, carrying out film removing treatment on the conductive layer surrounded by the resist layer, and forming a gold-plated auxiliary lead on the exposed conductive layer after film removing.
Optionally, before the conducting layer on the board surface is dried to form a uniform conducting layer, the method further includes:
the uniform conductive layer was rinsed with hot water.
Optionally, the drying the conductive layer on the board surface to form a uniform conductive layer includes:
and placing the substrate in a drying groove, and drying the conductive layer on the plate surface through the drying groove to form a uniform conductive layer.
Optionally, the hot air for drying is at 60 ℃, and the drying time is 60 seconds.
Optionally, the pattern etching of the exposed conductive layer on the board surface includes:
and covering the plate surface by sodium persulfate liquid to carry out pattern etching on the exposed conductive layer.
Optionally, the surface of the substrate includes an upper surface and/or a lower surface of the substrate.
In a second aspect, there is provided a method for manufacturing a gold plated board, comprising:
preparing a gold-plated auxiliary lead of the substrate by using the method;
sticking a film on the substrate, exposing and developing again according to the gold-plated auxiliary lead, so as to expose the part needing gold plating, and carrying out gold plating treatment on the exposed part;
and after the exposed part is subjected to gold plating treatment, removing the film from the substrate after gold plating, and removing the gold plating auxiliary lead to obtain a gold-plated plate.
Optionally, the removing the gold-plated auxiliary lead of the substrate to obtain a gold-plated plate, including:
and covering the surface of the substrate with sodium persulfate solution to remove the gold-plated auxiliary lead.
In a third aspect, a board substrate is provided, and the board substrate is prepared by adopting the gold-plated auxiliary lead preparation method according to any one of the previous claims.
In a fourth aspect, there is provided a gold plated plate member prepared by the method of any one of the preceding claims.
In any one of the above provided schemes, since the drying process is added after electroless copper deposition, the formed conductive layer is uniform and stable, and the problem of palladium catalyst residue in the traditional copper deposition process treatment mode can be solved or reduced by combining with the subsequent treatment, and the rejection rate is reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments of the present application will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic flow chart of a method for manufacturing a gold plated auxiliary lead according to an embodiment of the application;
FIG. 2 is a schematic flow chart of a method for preparing a gold plated auxiliary lead according to an embodiment of the present application;
FIG. 3 is a schematic flow chart of a method for manufacturing a gold plated board according to an embodiment of the application;
fig. 4 is a schematic flow chart of a method for manufacturing a gold plated board according to an embodiment of the application.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects solved by the application more clear, the application is further described in detail below with reference to the accompanying drawings and embodiments.
It is to be understood that the embodiments set forth below represent the necessary information to enable those skilled in the art to practice the embodiments and illustrate the best mode of practicing the embodiments. Upon reading the following description in light of the accompanying drawing figures, those skilled in the art will understand the concepts of the disclosure and will recognize applications of these concepts not particularly addressed herein. It should be understood that these concepts and applications fall within the scope of the disclosure and the accompanying claims.
It will be further understood that, although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the present disclosure. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
It will also be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements may be present. In contrast, when an element is referred to as being "directly connected" or "directly coupled" to another element, there are no intervening elements present.
It will be further understood that the terms "upper," "lower," "left," "right," "front," "rear," "bottom," "middle," "top," and the like may be used herein to describe various elements and that the orientation or positional relationship indicated is based on the orientation or positional relationship shown in the drawings merely to facilitate describing the application and simplifying the description, and do not indicate or imply that the devices or elements being referred to must have a particular orientation, be constructed and operate in a particular orientation, and that these elements should not be limited by these terms.
These terms are only used to distinguish one element from another element. For example, a first element could be termed a "upper" element, and, similarly, a second element could be termed a "upper" element, depending on the relative orientation of the elements, without departing from the scope of the present disclosure.
It will be further understood that the terms "comprises," "comprising," "includes" and/or "including," when used herein, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
Unless defined otherwise, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms used herein should be interpreted as having a meaning that is consistent with their meaning in the context of this specification and the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
The first aspect of the present application provides a method for preparing a gold plated auxiliary lead, as shown in fig. 1, comprising the steps of:
s101: and carrying out electroless copper plating on the surface of the substrate to form a conductive layer.
S102: and drying the conductive layer on the plate surface to form a uniform conductive layer.
The substrate is a basic material for manufacturing a PCB board, typically, the substrate is a copper clad laminate, and in manufacturing, single-sided and double-sided printed boards are generally manufactured by selectively performing hole processing, electroless copper plating, electrolytic copper plating, etching and other processes on a substrate material, namely a copper clad laminate (Copper Clad Laminate, CCL), to obtain a required circuit pattern. The performance, quality, workability in manufacturing, manufacturing cost, manufacturing level, etc. of the printed board are largely dependent on the substrate material, which is often required for gold plating.
Electroless copper deposition, also known as electroless copper plating, is a process in the manufacture of printed circuit boards, and in step S101, a layer of copper is deposited on a substrate as a conductive layer by reducing copper ions to elemental copper by palladium-catalyzed formaldehyde to adsorb the elemental copper on the non-conductive substrate, mainly by a series of chemical processes. In the traditional process preparation method, the combination of the copper conducting layer and the dielectric material 2 of the substrate is too stable due to the traditional electroless copper plating process, so that the palladium catalyst is easy to remain, and the gold plating and the plating penetration are caused, so that the rejection probability is higher. In order to solve the technical problem, in the application, in step S101, a electroless copper plating process is utilized to form a first conductive layer on the surface of a substrate, and then the conductive layer on the surface is dried, so that the copper conductive layer is not easy to oxidize and a stable and uniform conductive layer is formed, and the formed conductive layer is the copper conductive layer.
S103: and respectively performing film pasting, exposure and development on the plate surface on which the uniform conductive layer is formed, so as to form a part of the exposed conductive layer and another part of the conductive layer surrounded by the corrosion-resistant layer on the plate surface.
S104: and carrying out pattern etching on the conductive layer exposed on the plate surface, carrying out film removing treatment on the conductive layer surrounded by the resist layer, and forming a gold-plated auxiliary lead on the exposed conductive layer after film removing.
After the stable and uniform conductive layer is formed on the substrate, film pasting, exposure and development treatments are respectively carried out on the substrate surface on which the uniform conductive layer is formed, so that a part of the exposed conductive layer and the other part of the conductive layer surrounded by the resist layer are formed on the substrate, namely, the unnecessary conductive layer is exposed, and the resist layer protection is formed when the unnecessary conductive layer is exposed. And carrying out pattern etching on the exposed conductive layer, and carrying out film removing treatment on the conductive layer surrounded by the resist layer, wherein the exposed conductive layer after film removing is a gold-plated auxiliary lead, namely, an auxiliary lead which is required by gold plating is formed.
The film pasting refers to filling a dry film in a molten flow state at a microscopic gap of a copper surface of a conductive layer so as to be flatly attached to the surface of a substrate; the exposure can be performed by irradiation of a negative film and ultraviolet light (UV light), so that the dry film of the irradiated portion is polymerized to become a resist layer. Development refers to the dissolution and washing of the dry film of the non-photopolymerized portion to expose the conductive layer there. The pattern etching can utilize the principle of etching copper by Sodium Persulfate (SPS), so that the lead wire of the unexposed part is etched away, and after the resist layer of the exposed part is removed, the gold-plated auxiliary lead wire finally emerges. Removing the film, namely removing the dry film of the corrosion-resistant layer by using a chemical or physical action mode, and finally completing the manufacture of the auxiliary lead of the plate. The above process may have other embodiments, and is not limited herein.
Therefore, the embodiment of the application provides a preparation method of a gold-plated auxiliary lead, which is used for preparing gold-plated auxiliary leads of various PCB (printed circuit board) boards, and can be used for carrying out subsequent gold-plating processes after the preparation of the gold-plated auxiliary leads is completed. In the preparation method provided by the embodiment of the application, the formed conductive layer is uniform and stable by adding the drying process after electroless copper deposition, and the problem of palladium catalyst residue in the traditional copper deposition process treatment mode can be solved or reduced by combining with subsequent treatment, so that the rejection rate is reduced.
In addition, the pattern etching mode can also improve the lead biting effect.
In an embodiment, the surface of the substrate includes an upper surface and/or a lower surface of the substrate. That is, as an example, the gold plating auxiliary leads may be formed on the upper and lower surfaces of the substrate at the same time, and the required gold plating auxiliary leads may be formed on both surfaces of the substrate at the same time, thereby greatly improving the efficiency of manufacturing the gold plating auxiliary leads. It is also worth to say that, in the traditional scheme, the gold-plated auxiliary lead is also often manufactured by using a sputtering copper process, the traditional mode is limited by the process characteristics of the traditional mode, only one side of the traditional mode is provided with a copper layer thin film conducting layer, the efficiency is low, the embodiment can be performed on two sides, and the manufacturing efficiency of the gold-plated auxiliary lead is relatively high.
In one embodiment, in step S102, that is, the drying the conductive layer on the board surface to form a uniform conductive layer includes: and placing the substrate in a drying groove, and drying the conductive layer on the plate surface through the drying groove to form a uniform conductive layer.
Illustratively, the hot air is 60 ℃ and the drying time is 60 seconds. It should be noted that the process is only illustrative, and the temperature and the drying duration of the hot air may be determined by other experimental experience, and are not particularly limited, for example, the hot air for drying is 65 ℃, the drying duration is 70 seconds, and the like, the hot air for drying is 55 ℃, the drying duration is 60 seconds, and the like.
In this embodiment, the drying is performed directly by using the drying tank, which is fast and convenient, and it is also notable that, compared with the drying by using the large oven, the drying manner by using the drying tank does not make the combination between the conductive layer and the dielectric material of the substrate too stable, and reduces the probability of the residual plating to cause the plating of the gold, so that the gold plating auxiliary lead wire manufactured by using the process provided by the application has higher stability and conductivity uniformity.
In an embodiment, before step S102, that is, before the conducting layer on the board is dried to form a uniform conducting layer, the method further includes:
s104: the uniform conductive layer was rinsed with hot water.
In this embodiment, the uniform conductive layer is also rinsed with hot water before drying, so that the residual catalyst can be further clarified, and the probability of gold plating and plating due to the residual catalyst can be further reduced.
In an embodiment, step S10, the performing pattern etching on the exposed conductive layer on the board surface includes: and covering the plate surface by sodium persulfate liquid to carry out pattern etching on the exposed conductive layer.
In this embodiment, in order to further improve the removal effect of the palladium catalyst, in this embodiment, the plate surface is covered with sodium persulfate solution to perform pattern etching on the exposed conductive layer, it is worth to be noted that, the copper conductive layer is not easy to oxidize by adopting the drying tank for drying, and further, the residual palladium catalyst is further ensured not to exist by matching with the sodium persulfate etching, thereby further reducing the dip plating rejection.
Besides sodium persulfate solution, immersion liquid having the same or similar characteristics as the sodium persulfate solution may be used for the biting etching, and the embodiment of the present application is not limited.
For example, in the above embodiment, the manufacturing process of the gold plating auxiliary lead is taken as an example, and as shown in fig. 2, the substrate before the gold plating auxiliary lead is manufactured includes an upper plate surface (a surface 1 a), a lower plate surface (B surface 1B) and a dielectric material 2, in the manufacturing process, copper is chemically deposited first, an upper copper conductive layer 3a of the a surface is formed, a copper conductive layer 3B on the B surface is formed, and then a drying tank is used for drying, so that stable and uniform copper conductive layers 3a and 3B are formed, elemental copper generated during copper chemical deposition is uniformly adsorbed on the two surfaces of the substrate a and the substrate B, and the formed copper conductive layer is not easy to oxidize due to the drying in the drying tank. The substrate is exposed with unnecessary copper conductive layers after film pasting, exposure and development of specific pattern data, the necessary copper conductive layers (4 a, 4 b) are protected by resist layers, the unnecessary copper conductive layers are etched by pattern etching, and the copper conductive layers (4 a, 4 b) protected by the resist layers are finally exposed after passing through the film, and finally become necessary gold-plated auxiliary leads.
In fig. 2, only two sides are taken as an example, and when a single side is used, the processing procedure is similar, and the description is not repeated here.
In a second aspect, as shown in fig. 3, the embodiment of the present application further provides a method for preparing a gold-plated board, including the following steps:
s201: and carrying out electroless copper plating on the surface of the substrate to form a conductive layer.
S202: and drying the conductive layer on the plate surface to form a uniform conductive layer.
S203: and respectively performing film pasting, exposure and development on the plate surface on which the uniform conductive layer is formed, so as to form a part of the exposed conductive layer and another part of the conductive layer surrounded by the corrosion-resistant layer on the plate surface.
S204: and carrying out pattern etching on the conductive layer exposed on the plate surface, carrying out film removing treatment on the conductive layer surrounded by the resist layer, and forming a gold-plated auxiliary lead on the exposed conductive layer after film removing.
It should be noted that, corresponding to steps S201 to S204, reference may be made to step S104 in the foregoing embodiment, and the description is not repeated here.
S205: and sticking a film on the substrate, exposing and developing again according to the gold-plated auxiliary lead, so as to expose the part needing gold plating, and carrying out gold plating treatment on the exposed part.
S206: and after the exposed part is subjected to gold plating treatment, removing the film from the substrate after gold plating, and removing the gold plating auxiliary lead to obtain a gold-plated plate.
After the gold-plated auxiliary lead is prepared according to the preparation method of the gold-plated auxiliary lead, the gold-plated auxiliary lead can be used for plating the plate, the gold-plated auxiliary lead comprises the steps of using and removing the gold-plated auxiliary lead, the substrate is subjected to film pasting, exposure and development according to the gold-plated auxiliary lead in the using process again, the part needing to be plated with gold is exposed, the exposed part is subjected to gold plating treatment, nickel gold can be plated at the position after the exposed part is subjected to gold plating treatment, the requirement of a customer is met, the substrate is subjected to film removing, and the gold-plated auxiliary lead of the substrate is subjected to removing treatment, so that the gold-plated plate is obtained.
The gold-plated auxiliary lead of the substrate is subjected to a removal treatment process, and is also quite simple, and after the electroplating of gold is completed, the gold-plated auxiliary lead can be removed through film removal and pattern etching. In one embodiment, the removing the gold-plated auxiliary lead of the substrate to obtain a gold-plated plate includes: and covering the surface of the substrate with sodium persulfate solution to remove the gold-plated auxiliary lead. The surface of the substrate can be covered by sodium sulfate liquid so as to quickly and completely remove the gold-plated auxiliary lead.
According to the embodiment, the substrate with less or no catalyst residue can be used for gold plating operation, so that the success rate and the effectiveness of the gold plated plate are greatly improved; and the removal of the gold-plated auxiliary lead is simpler, the gold-plating efficiency can be improved, and the immersion plating rejection is low when the gold is plated, so that stable leadless gold plating is realized.
In the embodiment of the application, a plate substrate is also provided, and the plate substrate is prepared by adopting the gold-plated auxiliary lead preparation method mentioned in any one of the previous embodiments.
In the embodiment of the application, a gold-plated plate is also provided, and the gold-plated plate is prepared by adopting the preparation method of the gold-plated plate mentioned in any one of the previous embodiments.
The method for preparing the gold-plated auxiliary lead is worth to explain, the plate substrate prepared by the method for preparing the gold-plated auxiliary lead is used for preparing the gold-plated auxiliary lead, so that the manufacturing efficiency of the auxiliary lead is greatly improved, palladium catalyst residues are avoided, the practicability is higher, and the method is convenient to use in a plate gold-plating process. The gold-plated plate prepared by the method for preparing the gold-plated plate in any embodiment of the application also has the advantages of high stability and conductive uniformity of the gold-plated auxiliary lead, easy removal, low plating-penetrating scrap during electroplating, and realization of stable leadless gold plating.
For example, the above embodiment is also taken as an example of the two-sided manufacturing, and the plate gold plating manufacturing process is described with reference to fig. 4, after the required gold plating auxiliary lead is obtained, the secondary film pasting, exposure and development are performed, the portion to be gold plated is exposed, that is, the copper conductive layer where the gold plating auxiliary lead is located is surrounded by the resist layer, the copper conductive layer where the non-gold plating auxiliary lead is located is exposed, and the exposed portion is gold plated, for example, at the 5a and 5b gold plating positions in fig. 4, after nickel gold plating, the secondary film removing is performed, the gold plating process is completed, and finally the final gold plated plate is obtained by using sodium persulfate biting.
In fig. 4, only two sides are taken as an example, and when a single side is used, the processing procedure is similar, and the description is not repeated here.
The above embodiments are only for illustrating the technical solution of the present application, and not for limiting the same; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present application, and are intended to be included in the scope of the present application.
Claims (10)
1. The preparation method of the gold-plated auxiliary lead is characterized by comprising the following steps of:
carrying out electroless copper plating on the surface of the substrate to form a conductive layer;
drying the conductive layer on the plate surface to form a uniform conductive layer;
respectively performing film pasting, exposure and development on the plate surface on which the uniform conductive layer is formed, so as to form a part of the exposed conductive layer and another part of the conductive layer surrounded by the corrosion-resistant layer on the plate surface;
and carrying out pattern etching on the conductive layer exposed on the plate surface, carrying out film removing treatment on the conductive layer surrounded by the resist layer, and forming a gold-plated auxiliary lead on the exposed conductive layer after film removing.
2. The method for manufacturing a gold plated auxiliary lead according to claim 1, wherein before the conducting layer on the board surface is baked to form a uniform conducting layer, the method further comprises:
the uniform conductive layer was rinsed with hot water.
3. The method for manufacturing a gold plated auxiliary lead according to claim 1, wherein the step of drying the conductive layer on the board surface to form a uniform conductive layer comprises:
and placing the substrate in a drying groove, and drying the conductive layer on the plate surface through the drying groove to form a uniform conductive layer.
4. The method for manufacturing a gold plated auxiliary lead of a substrate according to claim 3, wherein the dried hot air is at 60 ℃ and the drying time period is 60 seconds.
5. The method for manufacturing a gold plated auxiliary lead according to claim 1, wherein the pattern etching of the exposed conductive layer on the board surface comprises:
and covering the plate surface by sodium persulfate liquid to carry out pattern etching on the exposed conductive layer.
6. The method for manufacturing a gold plated auxiliary lead according to claim 1, wherein the plate surface of the substrate includes an upper plate surface and/or a lower plate surface of the substrate.
7. A method for producing a gold plated board, comprising:
preparing a gold plated auxiliary lead of a substrate using the method of any one of claims 1 to 6;
sticking a film on the substrate, exposing and developing again according to the gold-plated auxiliary lead, so as to expose the part needing gold plating, and carrying out gold plating treatment on the exposed part;
and after the exposed part is subjected to gold plating treatment, removing the film from the substrate after gold plating, and removing the gold plating auxiliary lead to obtain a gold-plated plate.
8. The method of manufacturing a gold plated board according to claim 7, wherein the removing the gold plated auxiliary lead to obtain a gold plated board comprises:
and covering the surface of the substrate with sodium persulfate solution to remove the gold-plated auxiliary lead.
9. A board substrate prepared by the method for preparing a gold plated auxiliary lead according to any one of claims 1 to 6.
10. A gold-plated plate member, characterized by being produced by the method for producing a gold-plated plate member according to claim 7 or 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310738996.5A CN116669321A (en) | 2023-06-20 | 2023-06-20 | Gold-plated auxiliary lead, gold-plated plate manufacturing method, plate substrate and gold-plated plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310738996.5A CN116669321A (en) | 2023-06-20 | 2023-06-20 | Gold-plated auxiliary lead, gold-plated plate manufacturing method, plate substrate and gold-plated plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116669321A true CN116669321A (en) | 2023-08-29 |
Family
ID=87713667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310738996.5A Pending CN116669321A (en) | 2023-06-20 | 2023-06-20 | Gold-plated auxiliary lead, gold-plated plate manufacturing method, plate substrate and gold-plated plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116669321A (en) |
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2023
- 2023-06-20 CN CN202310738996.5A patent/CN116669321A/en active Pending
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