CN103354702B - The circuit board that microwave circuit board manufacturing method and the method make - Google Patents
The circuit board that microwave circuit board manufacturing method and the method make Download PDFInfo
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- CN103354702B CN103354702B CN201310321085.9A CN201310321085A CN103354702B CN 103354702 B CN103354702 B CN 103354702B CN 201310321085 A CN201310321085 A CN 201310321085A CN 103354702 B CN103354702 B CN 103354702B
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Abstract
The invention provides a kind of preparation method of microwave circuit boards and the circuit board that the method makes. The preparation method step of described microwave circuit boards is as follows: 1) surperficial copper-clad base plate is provided, sets microwave graphic making district and general area at substrate surface; 2) mask on substrate, the lip-deep microwave graphic making of covered substrate district; 3) electroplate at substrate surface; 4) take off the dry film except microwave graphic making district, and mask is carried out in general area and microwave graphic making district, expose microwave line in microwave graphic making district and make space; 5) provide etching solution to carry out etching to the copper layer of bottom surface, space, after etching, take off except dry film, make microwave line in microwave graphic making district; 6) substrate surface is carried out to mask again, expose ordinary lines in general area and make space; 7) provide etching solution to carry out etching to the copper layer of bottom surface, space, after etching, take off except dry film, make ordinary lines in general area, so, make the microwave line High-precision Microwave circuit board different from the thickness of ordinary lines.
Description
Technical field
The present invention relates to the preparation method of circuit board, particularly a kind of microwave circuit board manufacturing method andThe circuit board that the method makes.
Background technology
Along with information-based industry develop rapidly, microwave board trends towards the requirement of higher frequency, and it is to microwaveLine precision control range require more and more higher, from early stage ± be promoted to ± 0.8mil of 1mil, very laterTo can be promoted to ± 0.6mil or less. In existing microwave board, the making of microwave line and ordinary lines is logicalCross an operation and machine, microwave line is identical with the thickness of ordinary lines, is difficult to meet microwave line and makesThe requirement of precision. Therefore, in this case, use traditional fabrication method in earlier stage cannot meet thisClass high request, needs the new technique of exploitation to comply with the development trend that Line-width precision is more and more higher.
Summary of the invention
In view of the above, the present invention is necessary to provide a kind of making side of high-precision microwave circuit boardsMethod.
A preparation method for microwave circuit boards, step is as follows:
1) provide surperficial copper-clad base plate, set microwave graphic making district and remove microwave at substrate surfaceGeneral area outside graphic making district;
2) mask on substrate, the lip-deep microwave graphic making of covered substrate district;
3) electroplate in the general area of substrate surface;
4) take off the dry film except microwave graphic making district, and to general area and microwave figure after electroplatingMake district and carry out mask, expose microwave line in microwave graphic making district and make space;
5) provide etching solution etching, make etching solution pass microwave line and make space to bottom surface, spaceCopper layer carries out etching, takes off except dry film after etching, makes microwave line in the microwave graphic making district of substrate;
6) substrate surface is carried out to mask again, expose ordinary lines in general area and make space;
7) provide etching solution etching, make etching solution pass ordinary lines and make space to bottom surface, spaceCopper layer carries out etching, takes off except dry film after etching, makes ordinary lines in the general area of substrate, so,Make the microwave line microwave circuit boards different from the thickness of ordinary lines.
Further, in step 3), electroplating is at general area surface electrical copper facing layer.
In addition, the microwave circuit boards that provides a kind of described preparation method to make is provided in the present invention.
Compared to prior art, the preparation method of microwave circuit boards of the present invention is by adopting twice etching workSkill is produced High-precision Microwave plate. Mainly contain the following aspects effect: 1) adopt twice etching workSkill can subregion be made different designs and requires the outer-layer circuit of (different-thickness, different accuracy require),Regional area can be made High-precision Microwave circuit; Microwave line thickness is little, and at the bottom of etching, copper is thin, circuit precisionHigh. 2) adopt this technique ensureing making High-precision Microwave circuit under common line finished product thickness,Even can make ± 0.6mil or more minor control field microwave line.
Brief description of the drawings
Above-mentioned explanation is only the general introduction of technical solution of the present invention, in order to be illustrated more clearly in skill of the present inventionArt scheme, does the accompanying drawing to required use in embodiment or description of the Prior Art to be situated between simply belowContinue, the accompanying drawing in description is only corresponding to specific embodiments of the invention, for the common skill in this areaArt personnel, are not paying under the prerequisite of creative work, can also be according to this in needsA little accompanying drawings obtain other accompanying drawing.
Fig. 1 is the process chart of the preparation method of microwave circuit boards of the present invention;
Fig. 2 is the making flowage structure schematic diagram of microwave circuit boards of the present invention;
Fig. 3 is the schematic cross-section of the microwave circuit boards that makes of the present invention.
Detailed description of the invention
The technical scheme of taking for reaching predetermined technique object in order to elaborate the present invention, belowIn connection with the accompanying drawing in the embodiment of the present invention, to the technical scheme in the embodiment of the present invention carry out clear,Intactly describe, obviously, described embodiment is only part embodiment of the present invention, instead ofWhole embodiment, and, do not paying under the prerequisite of creative work, in embodiments of the inventionTechnological means or technical characterictic can replace, come to say in detail below with reference to the accompanying drawings and in conjunction with the embodimentsBright the present invention.
Refer to Fig. 1 and Fig. 2, the preparation method of a kind of microwave circuit boards of the present invention, comprises following stepRapid:
1) provide surperficial copper-clad base plate, set microwave graphic making district and remove microwave at substrate surfaceGeneral area outside graphic making district. In Fig. 2 a, be depicted as a copper-clad base plate, substrate surface is covered with copperLayer 11, sets microwave graphic making district 101 and general area 102 by substrate surface. Copper layer 11 isWhile making substrate, form on its surface, copper layer thickness needs to set according to making, as thick in 10mil.
2) mask on substrate, the lip-deep microwave graphic making of covered substrate district. In Fig. 2 a, micro-Ripple graphic making district 101 is coated with dry film 12, and general area 102 does not cover dry film 12.
3) electroplate in the general area of substrate surface. In Fig. 2 b, electroplate at substrate surface,Microwave graphic making district 101 can not electroplate owing to being coated with dry film 12, electroplates in general area102 carry out, in the present embodiment for electro-coppering, so, will be in general area 102 further copper facing of surface,At the newly-increased copper layer 13 of surface coverage one of native copper layer 11, increase substrate surface general area global copper layerThickness. The thickness of newly-increased copper layer 13 is electroplated as required, as global copper layer thickness needs 30mil,Only 10mil of native copper layer, newly-increased copper layer 13 needs plating 20mil thick.
4) take off the dry film except microwave graphic making district, and to general area and microwave figure after electroplatingMake district and carry out mask, expose microwave line in microwave graphic making district and make space. In Fig. 2 c, micro-After the dry film 12 in ripple graphic making district 101 takes off and removes, expose the copper layer 11 that its surface is covered with; At Fig. 2 dIn, substrate surface is covered to dry film 14, dry film 14 covers microwave graphic making district 101 and electroplatesAfter general area 102, and on dry film 14, form microwave line in corresponding microwave graphic making district 101Make space 141.
5) provide etching solution etching, make etching solution pass microwave line and make space to bottom surface, spaceCopper layer carries out etching, takes off except dry film after etching, makes microwave line in the microwave graphic making district of substrate.In Fig. 2 d, etching solution is made bottom surface, 141Zhi space, space, erosion through exposing microwave line on dry film 14Carve the copper layer 11 of bottom surface, space, the overlay area that etching solution can not etching dry film 14. In Fig. 2 e,After etching, take off except dry film 14, newly-increased copper layer 13, microwave graphic making district system are exposed in general area 102Microwave line 15, microwave line 15 by space 141 isolated and with general area 102 not conductings.
6) substrate surface is carried out to mask again, expose ordinary lines in general area and make space; Fig. 2 fIn, covering dry film 16 at substrate surface, dry film 16 covers microwave graphic making district 101 and electroplatesAfter general area 102, and form on dry film 16 in general area 102 ordinary lines make space 161,Expose the newly-increased copper layer 13 of bottom, space by space.
7) provide etching solution etching, make etching solution pass ordinary lines and make space to bottom surface, spaceCopper layer carries out etching, takes off except dry film after etching, makes ordinary lines in the general area of substrate, so,Make the microwave line microwave circuit boards different from the thickness of ordinary lines. In Fig. 2 g, etching solution is through dryOn film 16, expose ordinary lines and make bottom surface, 161Zhi space, space, the newly-increased copper layer of etched voids bottom surface13 with copper layer of the former end 11, the region of the covering that etching solution can not etching dry film 16. After etching, take off except dryFilm 16, general area 102 is formed with ordinary lines 17, and microwave graphic making district 101 is formed with microwaveLine 15, ordinary lines 17 by space 161 isolated and with general area 102 not conductings, microwave line 15By space 141 isolated and with general area 102 not conductings. The thickness of ordinary lines 17 and microwave line 15Difference, the thickness of ordinary lines 17 is greater than the thickness of microwave line 15, and the thickness of ordinary lines 17 is new for increasingCopper layer 13 thickness and native copper layer 11 thickness sum, the thickness of microwave line 15 is the thickness of native copper layer 11.
Refer to Fig. 3, the microwave circuit boards making, comprises basalis 20, is formed on basalis 20Microwave line 15 and the ordinary lines 17 on surface, the thickness of microwave line 15 is lower than the thickness of ordinary lines 17.Microwave line 15 is only that an end copper layer forms, and ordinary lines 17 forms for electroplating a bronze medal layer on end copper layer.
The preparation method of microwave circuit boards of the present invention, can subregion system by adopting twice etch processDo different designs requirement, make the outer-layer circuit of different-thickness, different Line-width precisions, regional area canMake High-precision Microwave circuit; Adopt this technique under guarantee common line finished product thickness, to make high-precisionDegree microwave line, makes and has reduced the integral thickness of microwave line, makes can make ± 0.6mil or moreMinor control field microwave line.
The above, be only preferred embodiment of the present invention, not the present invention made to any formOn restriction, although the present invention disclose as above with preferred embodiment, but not in order to limit thisBright, any those skilled in the art, are not departing within the scope of technical solution of the present invention, when canUtilize the technology contents of above-mentioned announcement to make a little change or be modified to the equivalent embodiment of equivalent variations,In every case be not depart from technical solution of the present invention content, according to technical spirit of the present invention, of the present inventionWithin spirit and principle, any simple amendment that above embodiment is done, be equal to and replace and improvementDeng, within all still belonging to the protection domain of technical solution of the present invention.
Claims (4)
1. a preparation method for microwave circuit boards, step is as follows:
1) provide surperficial copper-clad base plate, set microwave graphic making district and remove microwave at substrate surfaceGeneral area outside graphic making district;
2) mask on substrate, the lip-deep microwave graphic making of covered substrate district;
3) electroplate in the general area of substrate surface;
4) take off the dry film except microwave graphic making district, and to general area and microwave figure after electroplatingMake district and carry out mask, expose microwave line in microwave graphic making district and make space;
5) providing etching solution to make etching solution pass microwave line making space enters the copper layer of bottom surface, spaceRow etching, takes off after etching except dry film, makes microwave line in the microwave graphic making district of substrate;
6) substrate surface is carried out to mask again, expose ordinary lines in general area and make space;
7) providing etching solution to make etching solution pass ordinary lines making space enters the copper layer of bottom surface, spaceRow etching, takes off after etching except dry film, makes ordinary lines in the general area of substrate, so, makes micro-The microwave circuit boards that swash is different from the thickness of ordinary lines.
2. the preparation method of microwave circuit boards according to claim 1, is characterized in that: step 3)Middle plating is at general area surface electrical copper facing layer.
3. the preparation method of microwave circuit boards according to claim 1, is characterized in that: microwave lineThickness be less than the thickness of ordinary lines.
4. a microwave circuit boards, is characterized in that: the system described in employing claims 1 to 3 any oneMake as method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310321085.9A CN103354702B (en) | 2013-07-26 | 2013-07-26 | The circuit board that microwave circuit board manufacturing method and the method make |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310321085.9A CN103354702B (en) | 2013-07-26 | 2013-07-26 | The circuit board that microwave circuit board manufacturing method and the method make |
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| Publication Number | Publication Date |
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| CN103354702A CN103354702A (en) | 2013-10-16 |
| CN103354702B true CN103354702B (en) | 2016-05-25 |
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| CN201310321085.9A Active CN103354702B (en) | 2013-07-26 | 2013-07-26 | The circuit board that microwave circuit board manufacturing method and the method make |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104902689A (en) * | 2014-03-05 | 2015-09-09 | 立诚光电股份有限公司 | Method for manufacturing circuit and a ceramic substrate having circuit pattern |
| CN114466516B (en) * | 2022-01-27 | 2024-03-12 | 盐城维信电子有限公司 | Manufacturing method of vehicle-mounted flexible board and vehicle-mounted flexible board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101902883A (en) * | 2010-07-16 | 2010-12-01 | 施吉连 | Method for manufacturing microwave high-frequency ceramic circuit board |
| CN102244985A (en) * | 2011-04-21 | 2011-11-16 | 深南电路有限公司 | Processing method of surface-mounted pads on thick copper circuit board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB0108655D0 (en) * | 2001-04-06 | 2001-05-30 | Koninkl Philips Electronics Nv | Microwave circuit |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101902883A (en) * | 2010-07-16 | 2010-12-01 | 施吉连 | Method for manufacturing microwave high-frequency ceramic circuit board |
| CN102244985A (en) * | 2011-04-21 | 2011-11-16 | 深南电路有限公司 | Processing method of surface-mounted pads on thick copper circuit board |
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| CN103354702A (en) | 2013-10-16 |
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Address after: 523127 Dongcheng District City, Guangdong province (with sand) science and Technology Industrial Park Road, No. 33 vibration with the number of Patentee after: Shengyi electronic Limited by Share Ltd Address before: 523039, Guangdong, Dongcheng District province (the same sand) science and Technology Industrial Park, No. 33, vibration road, Dongguan Patentee before: Dongguan Shengyi Electronics Ltd. |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
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Denomination of invention: Manufacturing method for microwave circuit board and circuit board manufactured by using the same Effective date of registration: 20180103 Granted publication date: 20160525 Pledgee: China Co truction Bank Corp Dongguan branch Pledgor: Shengyi electronic Limited by Share Ltd Registration number: 2017440000224 |
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Date of cancellation: 20200522 Granted publication date: 20160525 Pledgee: China Co truction Bank Corp Dongguan branch Pledgor: SHENGYI ELECTRONICS Co.,Ltd. Registration number: 2017440000224 |