CN114466516B - Manufacturing method of vehicle-mounted flexible board and vehicle-mounted flexible board - Google Patents
Manufacturing method of vehicle-mounted flexible board and vehicle-mounted flexible board Download PDFInfo
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- CN114466516B CN114466516B CN202210103434.9A CN202210103434A CN114466516B CN 114466516 B CN114466516 B CN 114466516B CN 202210103434 A CN202210103434 A CN 202210103434A CN 114466516 B CN114466516 B CN 114466516B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 69
- 238000000034 method Methods 0.000 claims abstract description 49
- 238000001039 wet etching Methods 0.000 claims abstract description 16
- 238000005520 cutting process Methods 0.000 claims abstract description 15
- 238000003825 pressing Methods 0.000 claims description 11
- 238000003466 welding Methods 0.000 claims description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 238000007731 hot pressing Methods 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 description 24
- 238000010030 laminating Methods 0.000 description 12
- 238000004140 cleaning Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 238000003475 lamination Methods 0.000 description 4
- 238000004080 punching Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 238000002788 crimping Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 239000003755 preservative agent Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000009824 pressure lamination Methods 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009954 braiding Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a manufacturing method of a vehicle-mounted flexible board and the vehicle-mounted flexible board. The manufacturing method of the vehicle-mounted soft board comprises the following steps: dividing a design module of the vehicle-mounted soft board into a plurality of sub-design modules according to different processes; respectively manufacturing according to the plurality of sub-design modules to form a plurality of sub-finished product modules; and connecting a plurality of the sub-finished product modules. According to the invention, the design module of the vehicle-mounted flexible circuit board is divided into a plurality of sub-design modules, so that the module with a longer circuit and the module with a shorter circuit on the vehicle-mounted flexible circuit board can be divided, the module with a longer circuit can be manufactured by a dry die cutting process, the circuit module with a shorter circuit can be manufactured by a wet etching process, and after each sub-finished product module is manufactured, the plurality of sub-finished product modules are connected to form a whole vehicle-mounted flexible circuit board, so that the difficulty of the manufacturing process of the circuit of the vehicle-mounted flexible circuit board is solved, the yield is high, the circuit is easy to control, and the cost is effectively reduced.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a manufacturing method of a vehicle-mounted flexible board and the vehicle-mounted flexible board.
Background
A flexible circuit board (abbreviated as a flexible board) is generally used for connection of batteries in electric automobiles, and the vehicle-mounted flexible circuit board for connection of the batteries has a long circuit length (more than 1.5 m), and the line width/line distance of battery wires is large (more than 0.6mm generally), but the line width/line distance (less than 0.2mm generally) of fuses on the flexible board is smaller and shorter. These features result in difficulty in controlling the quality and yield of line width/line spacing in addition to the special manufacturing equipment and process adaptation to long lines when manufacturing lines using conventional wet etching processes for circuit boards, so that the line forming process of the vehicle-mounted flexible circuit board is the core and pain point of the whole manufacturing process.
Disclosure of Invention
In order to solve the technical problems, the invention mainly aims to provide a manufacturing method of a vehicle-mounted flexible board and the vehicle-mounted flexible board, and aims to solve the problem that the conventional manufacturing method of the flexible board cannot meet the manufacturing requirements of the flexible board when long lines exist and short lines exist.
In order to achieve the above purpose, the present invention provides a method for manufacturing a vehicle-mounted flexible board, comprising the following steps:
dividing a design module of the vehicle-mounted soft board into a plurality of sub-design modules according to different processes;
respectively manufacturing according to the plurality of sub-design modules to form a plurality of sub-finished product modules;
and connecting a plurality of the sub-finished product modules.
Optionally, the plurality of sub-design modules include a first sub-design module, a second sub-design module, and a third sub-design module, where a process of the first sub-design module, a process of the second sub-design module, and a process of the third sub-design module are all set differently.
Optionally, the first sub-design module includes a main flexible circuit board module, the second sub-design module includes a fuse flexible circuit board module, and the third sub-design module includes a sensor flexible circuit board module.
Optionally, the manufacturing is performed according to a plurality of the sub-design modules to form a plurality of sub-finished product modules, which specifically includes the following steps:
the main flexible circuit board adopts a dry die cutting process, the fuse flexible circuit board adopts a wet etching process, and the process of the sensor flexible circuit board comprises a wet etching process and an SMT processing process.
Optionally, the design module of the vehicle-mounted soft board is divided into a plurality of sub-design modules according to different manufacturing procedures, and specifically includes the following steps:
the method comprises the steps of dividing a module with line width or line distance smaller than a preset value during manufacturing in a vehicle-mounted flexible board into a second sub-design module, dividing a module which needs SMT during manufacturing into a third sub-design module, and dividing the rest modules into the first sub-design modules.
Optionally, the design module of the vehicle-mounted soft board is divided into a plurality of sub-design modules according to different manufacturing procedures, and specifically includes the following steps:
according to different processes, the design module of the vehicle-mounted soft board is divided into a plurality of sub-design modules, and a connecting bonding pad and an alignment mark are arranged at the dividing part of the plurality of sub-design modules.
Alternatively, the alignment marks may be arranged as concentric circles or cross.
Optionally, at least two alignment marks are arranged in a straight line, or at least two alignment marks are arranged diagonally.
Optionally, the connecting a plurality of the sub-finished modules specifically includes the following steps:
the plurality of sub-finished product modules are connected in an assembly welding, hot-pressing tin melting welding or pressing mode.
The invention also provides a vehicle-mounted flexible board which is manufactured by adopting the manufacturing method of the vehicle-mounted flexible board.
The technical scheme provided by the invention has the following beneficial effects:
the invention provides a manufacturing method of a vehicle-mounted soft board, which comprises the following steps: dividing a design module of the vehicle-mounted soft board into a plurality of sub-design modules according to different processes; respectively manufacturing according to the plurality of sub-design modules to form a plurality of sub-finished product modules; and connecting a plurality of the sub-finished product modules. The design module of the vehicle-mounted flexible board is divided into a plurality of sub-design modules, so that the module with longer circuit and the module with shorter circuit on the vehicle-mounted flexible board can be divided, the module with longer circuit and larger line width can be suitable for manufacturing by a dry die cutting process, the circuit module with shorter circuit and smaller line width can be manufactured by a wet etching process, and after each sub-finished product module is manufactured, the sub-finished product modules are connected to form a whole vehicle-mounted flexible board, the difficulty of the circuit manufacturing process of the vehicle-mounted flexible circuit board is solved, the quality is easy to control, and the cost is effectively reduced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic flow chart of an embodiment of a method for manufacturing a vehicle-mounted flexible board according to the present invention;
FIG. 2 is a schematic diagram of a partial structure of an embodiment of a design module of a vehicle-mounted compliance board according to the present invention;
FIG. 3 is a schematic diagram of the first sub-design module shown in FIG. 2;
FIG. 4 is a schematic diagram of the third sub-design module shown in FIG. 2;
FIG. 5 is a schematic diagram of the first sub-design module and the third sub-design module shown in FIGS. 3 and 4 after being connected;
FIG. 6 is a schematic view of a partial structure of another embodiment of a design module of a vehicle-mounted compliance board according to the present invention;
FIG. 7 is a schematic diagram of the first sub-design module shown in FIG. 6;
FIG. 8 is a schematic diagram of the second sub-design module shown in FIG. 6;
fig. 9 is a schematic structural diagram of the first sub-design module and the second sub-design module shown in fig. 7 and 8 after being connected.
Reference numerals illustrate:
100-a design module of a vehicle-mounted soft board; a vehicle-mounted flexible board after 100' -recombination; 1-a first sub-design module; 2-a second sub-design module; 3-a third sub-design module; 4-bonding pads; 5-para-position mark.
The achievement of the object, functional characteristics and excellent effects of the present invention will be further described with reference to specific embodiments and drawings.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the case where a directional instruction is involved in the embodiment of the present invention, the directional instruction is merely used to explain the relative positional relationship, movement condition, etc. between the components in a specific posture, and if the specific posture is changed, the directional instruction is changed accordingly.
In addition, if there is a description of "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" as it appears throughout includes three parallel schemes, for example "A and/or B", including the A scheme, or the B scheme, or the scheme where A and B are satisfied simultaneously. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.
A flexible circuit board (abbreviated as a flexible board) is generally used for connection of batteries in electric automobiles, and the vehicle-mounted flexible circuit board for connection of the batteries has a long circuit length (more than 1.5 m), and the line width/line distance of battery wires is large (more than 0.6mm generally), but the line width/line distance (less than 0.2mm generally) of fuses on the flexible board is smaller and shorter. These features result in difficulty in controlling the quality and yield of line width/line spacing in addition to the special manufacturing equipment and process adaptation to long lines when manufacturing lines using conventional wet etching processes for circuit boards, so that the line forming process of the vehicle-mounted flexible circuit board is the core and pain point of the whole manufacturing process. In view of the above, the invention provides a manufacturing method of a vehicle-mounted flexible board and the vehicle-mounted flexible board.
As shown in fig. 1, the invention provides a manufacturing method of a vehicle-mounted soft board, which comprises the following steps:
s100, dividing a design module 100 of the vehicle-mounted soft board into a plurality of sub-design modules according to different manufacturing procedures;
s200, manufacturing according to a plurality of sub-design modules respectively to form a plurality of sub-finished product modules;
and S300, connecting a plurality of sub-finished product modules.
According to the manufacturing method of the vehicle-mounted flexible board, the design module 100 of the vehicle-mounted flexible board is divided into the plurality of sub-design modules, so that the modules with longer circuits, larger line widths and shorter circuits and smaller line widths on the vehicle-mounted flexible board can be divided, the modules with longer circuits and larger line widths can be suitable for manufacturing by a dry die cutting process, the circuit modules with shorter circuits and smaller line widths can be manufactured by a wet etching process, and after the manufacturing of each sub-finished product module is completed, the plurality of sub-finished product modules are connected to form the whole vehicle-mounted flexible board, the difficulty of the manufacturing process of the vehicle-mounted flexible circuit board is solved, the quality is easy to control, and the cost is effectively reduced.
Further, as shown in fig. 3 and 4, and fig. 7 and 8, the multiple sub-design modules in S100 include a first sub-design module 1, a second sub-design module 2 and a third sub-design module 3, where the manufacturing process of the first sub-design module 1, the manufacturing process of the second sub-design module 2 and the manufacturing process of the third sub-design module 3 are all set differently, so when the vehicle-mounted flexible board includes multiple types of circuit structures, different circuit structures can be separated respectively, and then each module is manufactured by different manufacturing processes separately, so as to simplify the manufacturing process of the whole vehicle-mounted flexible board. The second sub-design module and the third sub-design module can be subjected to jointed board operation, a plurality of second sub-design modules and a plurality of third sub-design modules are processed and manufactured simultaneously, and the second sub-design modules and the third sub-design modules can be respectively matched with different first sub-design modules, so that the production efficiency of the wet etching process is matched with the production efficiency of dry die cutting, and the overall processing efficiency is improved.
Further, the first sub-design module 1 includes a main flexible circuit board module, the second sub-design module 2 includes a fuse flexible circuit board module, and the third sub-design module 3 includes a sensor flexible circuit board module.
As shown in fig. 3 and 7, since the main flexible circuit board module of the vehicle-mounted flexible circuit board includes a circuit structure with longer and wider circuit, and the line width is generally greater than 0.6mm, the main flexible circuit board can be manufactured by adopting a dry die-cutting process, in particular:
1) Acid washing, namely cleaning the surface of the copper foil for manufacturing the main flexible circuit board, or adopting chemical cleaning;
2) Cutting, namely cutting the main flexible circuit board by using hob die cutting equipment, wherein the hob die cutting equipment is the prior art, and can produce the circuit board with the line width of more than 0.6 mm;
3) Attaching a protective film, automatically attaching the protective film by using a clamp or a machine, and performing false-pressure attaching by using a pre-attaching machine after attaching to prevent the protective film from moving before laminating; the bonding pads are arranged at the dividing positions of the plurality of sub-design modules so as to facilitate the connection of the plurality of subsequent sub-finished product modules, and the bonding pad openings can be punched by using a die before the protective film is attached;
4) Pressing the upper protective film, and pressing and curing the upper protective film by adopting a quick press, wherein the quick press with a customized large platform can be used for pressing, and a normal commercially available pressing machine can be used for stepping and pressing for multiple times;
5) Surface treatment, carrying out gold deposition or OSP (Organic Solderability Preservatives, organic solder mask) process on the bonding pad of the main body, so as to facilitate the subsequent welding or crimping of the bonding pad;
6) Appearance and function inspection, and the main flexible circuit board which is qualified is inspected to wait for assembly.
The production efficiency of the dry die-cutting main flexible circuit board is superior to that of the wet etching process. But the linewidth capability of the dry die cut line process is lower than the wet etch process
As shown in fig. 6, since the fuse flexible circuit board includes a circuit structure with a short and small line width, generally having a line width of less than 0.2mm, which exceeds the limit of the dry die-cutting process, the fuse flexible circuit board may be manufactured by a wet etching process of a single-layer flexible circuit board, in particular:
1) Chemical cleaning, namely cleaning pollution on the surface of the copper foil, and acid cleaning can be adopted;
2) Forming a circuit, namely sticking a dry film on the copper foil surface, exposing and removing the film, and manufacturing and forming a fuse flexible board circuit structure;
3) Attaching a protective film, automatically attaching the protective film by using a clamp or a machine, and performing false-pressure attaching by using a pre-attaching machine after attaching to prevent the protective film from moving before laminating; the bonding pads are arranged at the dividing positions of the plurality of sub-design modules so as to facilitate the connection of the plurality of subsequent sub-finished product modules, and the bonding pad openings are punched by using a die before the protective film is attached;
4) Pressing the upper protective film, and pressing and curing the upper protective film by adopting a quick press;
5) Surface treatment, carrying out gold deposition or OSP (Organic Solderability Preservatives, organic solder mask) process on the bonding pad of the main body, so as to facilitate the subsequent welding or crimping of the bonding pad;
6) Punching the flexible plate into single pieces;
7) Performing appearance and function inspection, and waiting for the next working procedure by the qualified flexible board;
8) The qualified single fuse flexible plate is made into a material belt package by using an automatic braiding machine or any other mode.
When the wet etching process is adopted, the fuse flexible circuit board can be subjected to splicing operation, and a plurality of modules are processed and manufactured simultaneously, so that the overall processing efficiency can be effectively improved.
As shown in fig. 4, since the sensor flexible circuit board includes a sensor, the sensor is generally attached to the flexible circuit board of the sensor by using an SMT method, and thus, the process of the sensor flexible circuit board includes a wet etching process and an SMT processing process, the wet etching process of the sensor flexible circuit board generally employs a pure copper foil, a single-sided double-contact process, specifically:
1) Acid washing, namely cleaning the surface of the copper foil for manufacturing the flexible circuit board of the sensor, or adopting chemical cleaning;
2) Laminating a lower protective film, automatically laminating an upper protective film by using a clamp or a machine, and performing false-pressure lamination by using a pre-laminating machine after lamination to prevent the protective film from moving before lamination;
2.1, before the protective film is attached, punching a bonding pad opening by using a die;
2.2, laminating the protective film, and laminating and curing the protective film by adopting a quick press;
3) Forming a circuit, namely normally pasting and pressing a dry film on two sides, exposing, developing, etching and removing the film, and manufacturing and forming a flexible circuit structure of the sensor;
4) Laminating an upper protective film, automatically laminating the upper protective film by using a clamp or a machine, and performing false-pressure lamination by using a pre-laminating machine after lamination to prevent the protective film from moving before lamination;
4.1, before the protective film is attached, punching a bonding pad opening by using a die;
4.2, laminating the protective film, and laminating and curing the protective film by adopting a quick press;
5) Surface treatment, carrying out gold deposition or OSP (Organic Solderability Preservatives, organic solder mask) process on the bonding pad of the main body, so as to facilitate the subsequent welding or crimping of the bonding pad;
6) The normal assembly flow of SMT, print solder paste, paste the temperature sensor, reflow soldering to the flexible plate of the sensor, weld temperature sensor and flexible plate of the sensor together;
7) Attaching and reinforcing, wherein the reinforcing is fixed on the sensor flexible plate by using a thermosensitive adhesive or glue;
8) Dispensing, namely fixing the sensor by using glue to prevent the sensor element from falling off;
9) Appearance and function inspection, namely punching and cutting the qualified flexible plate into single pieces;
10 Using an automated taping machine or any other means, a single piece of fuse flexible board is packaged as a tape.
The specific dividing principle of the design module 100 of the vehicle-mounted soft board is as follows: dividing a module with line width or line distance smaller than a preset value during manufacturing in the vehicle-mounted soft board into a second sub-design module 2, wherein the preset value is between 0.5mm and 0.8mm, preferably 0.6mm, processing the soft board module by adopting a dry die cutting process when the line width or line distance of the soft board module is larger than or equal to 0.6mm, and processing the soft board module by adopting a wet etching process when the line width or line distance of the soft board module is smaller than 0.6 mm; the module that needs SMT during fabrication is divided into a third sub-design module 3, and the remaining modules are the first sub-design module 1. Therefore, each sub-design module can be processed in a processing mode which is more suitable for the user, and the processed finished product is higher in quality and efficiency.
As shown in fig. 2 to 5, the design module 100 of the original vehicle-mounted soft board includes a first sub-design module 1 and a third sub-design module 3, and after the original vehicle-mounted soft board is divided, a separate first sub-design module 1 and a separate third sub-design module 3 are formed, and after the first sub-finished product module is manufactured according to the first sub-design module 1 and the third sub-finished product module is manufactured according to the third sub-design module 3, the first sub-finished product module and the third sub-finished product module can be connected together to form the recombined vehicle-mounted soft board 100' shown in fig. 5. Specifically, as shown in fig. 2 to 4, the design module of the vehicle-mounted flexible board in fig. 2 is provided with two bonding pads 4, after being divided into a main flexible circuit board and a sensor flexible circuit board, the two bonding pads 4 on the left side of the sensor flexible circuit board in fig. 4 correspond to the two bonding pads 4 of the design module of the original vehicle-mounted flexible board and are used for connecting the sensor, and the upper bonding pad 4 and the lower bonding pad 4 in the main flexible circuit board in fig. 3 are used for connecting the upper bonding pad 4 and the lower bonding pad 4 of the right side in fig. 4, and are connected into a conducting circuit through each bonding pad 4, so that the sensor can work normally.
Similarly, as shown in fig. 6 to 9, the design module 100 of the original vehicle-mounted soft board includes a first sub-design module 1 and a second sub-design module 2, and after the original vehicle-mounted soft board is divided, a separate first sub-design module 1 and a separate second sub-design module 2 are formed, and after the first sub-finished product module is manufactured according to the first sub-design module 1 and the second sub-finished product module is manufactured according to the second sub-design module 2, the first sub-finished product module and the second sub-finished product module can be connected together to form the recombined vehicle-mounted soft board 100' shown in fig. 9. Specifically, as shown in fig. 6 to 9, the left and right pads 4 of the main flexible circuit board in fig. 7 are used to connect with the left and right pads 4 of the fuse flexible circuit board in fig. 8, and the fuse can be ensured to operate normally by connecting the respective pads 4 into conductive lines.
Likewise, the second sub-product module and the third sub-product module may be simultaneously combined with the first sub-product module to form the vehicle-mounted flexible board 100'.
After the plurality of sub-finished product modules are manufactured, in order to better connect each sub-finished product module to form a whole, when the design module 100 of the vehicle-mounted soft board is divided into a plurality of sub-design modules, a connecting bonding pad 4 and an alignment mark 5 can be arranged at the dividing part of the plurality of sub-design modules, the connecting bonding pad 4 ensures that the two sub-modules can be connected into a conducting circuit, the alignment mark 5 ensures that the connecting bonding pads 4 of the two sub-modules are aligned accurately, so that the plurality of sub-finished product modules can be aligned quickly and accurately, and the connection is also more efficient.
Further, the shape of the alignment mark 5 is not particularly limited, for example, the alignment mark 5 may be concentric circles or cross, so that alignment is more convenient when two sub-product modules are connected.
Moreover, at least two alignment marks 5 are arranged in a straight line, or at least two alignment marks 5 are arranged diagonally, and alignment is more stable.
Further, the plurality of sub-finished product modules can be connected in a mode of assembly welding, hot-pressing tin melting welding or pressing, and assembly is simpler.
In addition, the invention further provides the vehicle-mounted flexible board, and the vehicle-mounted flexible board is manufactured by the vehicle-mounted flexible board manufacturing method.
The invention makes the manufacture of the vehicle-mounted soft board more convenient, and the vehicle-mounted soft board is divided into a plurality of sub-finished product modules for processing, the plurality of sub-finished product modules can be manufactured respectively and simultaneously, the manufacturing speed is faster, the quality of the manufactured finished product of the vehicle-mounted soft board is higher, and special processing equipment is not required to be manufactured, so that the manufacturing cost can be effectively saved.
The foregoing description is only of the preferred embodiments of the present invention, and is not intended to limit the scope of the invention, but is intended to cover all equivalent structures described in the specification and drawings, or any other related technical field, directly or indirectly, as would be within the scope of the invention.
Claims (6)
1. The manufacturing method of the vehicle-mounted soft board is characterized by comprising the following steps of:
dividing a module with line width or line distance smaller than a preset value during manufacturing in a vehicle-mounted flexible board into a second sub-design module, dividing a module which needs SMT during manufacturing into a third sub-design module, and dividing the rest of the modules into a first sub-design module, wherein the manufacturing process of the first sub-design module, the manufacturing process of the second sub-design module and the manufacturing process of the third sub-design module are all set differently, and the preset value is 0.5-0.8 mm;
respectively manufacturing according to the plurality of sub-design modules to form a plurality of sub-finished product modules;
connecting a plurality of sub-finished product modules, wherein the connecting of the plurality of sub-finished product modules specifically comprises the following steps: the plurality of sub-finished product modules are connected in an assembly welding, hot-pressing tin melting welding or pressing mode;
the first sub-design module comprises a main flexible circuit board module, the second sub-design module comprises a fuse flexible circuit board module, and the third sub-design module comprises a sensor flexible circuit board module.
2. The method for manufacturing the vehicle-mounted soft board according to claim 1, wherein the manufacturing is performed according to a plurality of the sub-design modules to form a plurality of sub-finished product modules, specifically comprising the following steps:
the main flexible circuit board adopts a dry die cutting process, the fuse flexible circuit board adopts a wet etching process, and the process of the sensor flexible circuit board comprises a wet etching process and an SMT processing process.
3. The method for manufacturing the vehicle-mounted soft board according to claim 1, wherein the design module of the vehicle-mounted soft board is divided into a plurality of sub-design modules according to different manufacturing procedures, and the method specifically comprises the following steps:
according to different processes, the design module of the vehicle-mounted soft board is divided into a plurality of sub-design modules, and a connecting bonding pad and an alignment mark are arranged at the dividing part of the plurality of sub-design modules.
4. A method of manufacturing a vehicle-mounted flexible board according to claim 3, wherein the alignment marks are concentric circles or cross-shaped.
5. The method for manufacturing the vehicle-mounted soft board according to claim 3, wherein at least two alignment marks are arranged, at least two alignment marks are arranged in a straight line, or at least two alignment marks are arranged diagonally.
6. A vehicle-mounted flexible board, characterized in that the vehicle-mounted flexible board is manufactured by adopting the manufacturing method of the vehicle-mounted flexible board as claimed in any one of claims 1 to 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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| CN114466516B true CN114466516B (en) | 2024-03-12 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003101218A (en) * | 2001-09-21 | 2003-04-04 | Hitachi Chem Co Ltd | Method for manufacturing printed circuit board |
| CN102244985A (en) * | 2011-04-21 | 2011-11-16 | 深南电路有限公司 | Processing method of surface-mounted pads on thick copper circuit board |
| CN103354702A (en) * | 2013-07-26 | 2013-10-16 | 东莞生益电子有限公司 | Manufacturing method for microwave circuit board and circuit board manufactured by using the same |
| CN209015200U (en) * | 2018-11-16 | 2019-06-21 | 苏州昭舜物联科技有限公司 | A kind of substrate can natural degradation completely RFID label tag |
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2022
- 2022-01-27 CN CN202210103434.9A patent/CN114466516B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003101218A (en) * | 2001-09-21 | 2003-04-04 | Hitachi Chem Co Ltd | Method for manufacturing printed circuit board |
| CN102244985A (en) * | 2011-04-21 | 2011-11-16 | 深南电路有限公司 | Processing method of surface-mounted pads on thick copper circuit board |
| CN103354702A (en) * | 2013-07-26 | 2013-10-16 | 东莞生益电子有限公司 | Manufacturing method for microwave circuit board and circuit board manufactured by using the same |
| CN209015200U (en) * | 2018-11-16 | 2019-06-21 | 苏州昭舜物联科技有限公司 | A kind of substrate can natural degradation completely RFID label tag |
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| CN114466516A (en) | 2022-05-10 |
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