CN107809841A - A kind of preparation method and its circuit board of product substrate - Google Patents
A kind of preparation method and its circuit board of product substrate Download PDFInfo
- Publication number
- CN107809841A CN107809841A CN201710896259.2A CN201710896259A CN107809841A CN 107809841 A CN107809841 A CN 107809841A CN 201710896259 A CN201710896259 A CN 201710896259A CN 107809841 A CN107809841 A CN 107809841A
- Authority
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- China
- Prior art keywords
- copper foil
- metallic insulation
- product substrate
- fusion parameters
- metal form
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 65
- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 102
- 238000009413 insulation Methods 0.000 claims abstract description 70
- 229910052751 metal Inorganic materials 0.000 claims abstract description 61
- 239000002184 metal Substances 0.000 claims abstract description 61
- 238000000034 method Methods 0.000 claims abstract description 24
- 229910052802 copper Inorganic materials 0.000 claims abstract description 15
- 239000010949 copper Substances 0.000 claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 claims abstract description 15
- 230000008569 process Effects 0.000 claims abstract description 8
- 239000011889 copper foil Substances 0.000 claims description 87
- 230000004927 fusion Effects 0.000 claims description 53
- 239000003822 epoxy resin Substances 0.000 claims description 40
- 229920000647 polyepoxide Polymers 0.000 claims description 40
- 238000002844 melting Methods 0.000 claims description 11
- 230000008018 melting Effects 0.000 claims description 11
- 239000000155 melt Substances 0.000 claims description 9
- 239000004642 Polyimide Substances 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- 229920006267 polyester film Polymers 0.000 claims description 3
- 238000001465 metallisation Methods 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 abstract description 7
- 238000004321 preservation Methods 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 26
- 239000000203 mixture Substances 0.000 description 19
- 239000000853 adhesive Substances 0.000 description 11
- 230000001070 adhesive effect Effects 0.000 description 11
- 229930185605 Bisphenol Natural products 0.000 description 8
- 235000010469 Glycine max Nutrition 0.000 description 6
- 244000068988 Glycine max Species 0.000 description 6
- 239000010410 layer Substances 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- HSRJKNPTNIJEKV-UHFFFAOYSA-N Guaifenesin Chemical compound COC1=CC=CC=C1OCC(O)CO HSRJKNPTNIJEKV-UHFFFAOYSA-N 0.000 description 5
- 229920002125 Sokalan® Polymers 0.000 description 5
- 239000004584 polyacrylic acid Substances 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 238000010309 melting process Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000005995 Aluminium silicate Substances 0.000 description 2
- 235000012211 aluminium silicate Nutrition 0.000 description 2
- 239000010426 asphalt Substances 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 2
- 238000003698 laser cutting Methods 0.000 description 2
- 238000010329 laser etching Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052755 nonmetal Inorganic materials 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000005030 aluminium foil Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
- H05K3/4608—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated comprising an electrically conductive base or core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The present invention relates to circuit-board processes manufacture technology field, more particularly to a kind of preparation method and its circuit board of product substrate.Wherein, this method includes：The metal form and non-metallic insulation medium of prefabricated figure are provided；Metal form is positioned in particular manufacturing craft, and non-metallic insulation medium is laid in the upper and lower surface of metal form respectively；Non-metallic insulation medium is melted, so as to non-metallic insulation media packs metal form and form product substrate.The step of it avoids being etched the metal form of similar copper coin, copper-coating, so as to improve production efficiency and make the quality preservation for the circuit substrate to be formed stable.Also, user can select the metal form of corresponding thickness, to meet the operating current requirements of circuit board.
Description
Technical field
The present invention relates to circuit-board processes manufacture technology field, a kind of preparation method more particularly to product substrate and its
Circuit board.
Background technology
The copper thickness of printed wiring board (Printed Circuit Board, PCB) is in 0.5Oz (18um) -3Oz at present
Between (105um), its maximum is no more than 30A by electric current, and it not yet meets significant power demand, for example：New-energy automobile
Secondary power system, high-power charging station, track traffic signal power supply, communication base station Switching Power Supply etc., powerful device
It is maximum to be typically greater than by electric current or equal to 50A's.
In order to meet the high current demand of above-mentioned powerful device, conventional art provides a kind of heavy copper circuit board, and its is relative
Improve high current handling capacity in ground.Conventional art mainly makes heavy copper circuit board by heavy copper mode.
Inventor has found that conventional art at least has problems with during the present invention is realized：Conventional art uses
Etching or electroplating technology make heavy copper circuit board, but it needs longer time, and due to operational characteristic, conducting wire
Lateral erosion forms defect, the surface irregularity of heavy copper circuit board, and quality is not sufficiently stable, and yields is not high, homogeneity of product
It is not high.
The content of the invention
One purpose of the embodiment of the present invention aims to provide a kind of preparation method and its circuit board of product substrate, to solve to pass
The technique that technology of uniting makes circuit board is cumbersome with the unstable technical problem of quality.
In order to solve the above technical problems, the embodiment of the present invention provides following technical scheme：
In a first aspect, the embodiment of the present invention provides a kind of preparation method of product substrate, methods described includes：There is provided pre-
The metal form for shape of charting and non-metallic insulation medium；The metal form is positioned in particular manufacturing craft, and by the non-gold
Category dielectric is laid in the upper and lower surface of the metal form respectively；The non-metallic insulation medium is melted, so that described non-
Metal form described in metal-insulator media packs simultaneously forms product substrate.
Alternatively, the metal form includes copper foil template；The melting non-metallic insulation medium, so that described non-
Metal form described in metal-insulator media packs simultaneously forms product substrate, including：According to each copper foil area of the copper foil template
The copper foil circuit width in domain, determine fusion parameters corresponding to each copper foil region；According to each copper foil area of determination
Fusion parameters corresponding to domain, the non-metallic insulation medium is melted, so that metal film described in the non-metallic insulation media packs
Plate simultaneously forms product substrate.
Alternatively, the fusion parameters include the first fusion parameters and the second fusion parameters；It is described according to the copper foil mould
The copper foil circuit width in each copper foil region of plate, fusion parameters corresponding to each copper foil region are determined, including：Judge each
Whether the copper foil circuit width in individual copper foil region is more than predetermined width threshold value；If being less than, the copper foil region corresponding first is determined
Fusion parameters；If being more than, corresponding second fusion parameters in the copper foil region are determined；Wherein, first fusion parameters are less than institute
State the second fusion parameters.
Alternatively, the copper foil template includes at least two different copper foil regions of fusion parameters；It is described according to determination
Fusion parameters corresponding to each copper foil region, melt the non-metallic insulation medium, so that the non-metallic insulation medium
Coat the metal form and form product substrate, including：According to fusion parameters corresponding to each copper foil region of determination,
Segmented melts the non-metallic insulation medium, so as to metal form described in the non-metallic insulation media packs and form product
Substrate.
Alternatively, each fusion parameters all include temperature and pressure；Each copper foil region pair according to determination
The fusion parameters answered, segmented melts the non-metallic insulation medium, so that metal described in the non-metallic insulation media packs
Template simultaneously forms product substrate, including：According to the temperature and pressure of first fusion parameters, institute is melted with the first preset duration
State non-metallic insulation medium；According to the temperature and pressure of second fusion parameters, melted again with the melting of the second preset duration
The non-metallic insulation medium, so as to metal form described in the non-metallic insulation media packs and product substrate is formed, wherein,
First preset duration is less than second preset duration.
Alternatively, after the non-metallic insulation medium is melted, methods described also includes：It is laminated the product of corresponding number
Substrate；The product substrate of corresponding number after being laminated is cut, to form the circuit board.
Alternatively, the product substrate of the stacking corresponding number, including：Product substrate correspondence position processing after stacking
Fixing hole simultaneously makes the fixed block metallize, and to form plated through-hole, aperture, shape and the quantity of the plated through-hole are according to institute
The operating current for stating circuit board determines.
Alternatively, the non-metallic insulation medium includes any one following medium：Epoxy resin film, polyimides, gather
Ester film.
Alternatively, the metal form that prefabricated figure is provided, including：Using laser cutting or etching or punching press or cross cutting
Mode processes metal form product, to form the metal form with prefabricated figure.
Alternatively, the non-metallic insulation medium includes epoxy resin film, polyimides, polyester film.
Alternatively, the metal form includes red copper template.
In second aspect, the embodiment of the present invention provides the circuit that a kind of method using described in any of the above-described is fabricated to
Plate.
, then again will be nonmetallic exhausted by the way that metal form is positioned in particular manufacturing craft in each embodiment of the present invention
Edge medium is laid in the upper and lower surface of metal form respectively, non-metallic insulation medium is finally melted, so that non-metallic insulation medium
Cladding metal form simultaneously forms product substrate, and therefore, it avoids being etched the metal form of similar copper coin, copper-coating
Step, so as to improve production efficiency and make the quality preservation for the circuit substrate to be formed stable.Also, user can select correspondingly
The metal form of thickness, to meet the operating current requirements of circuit board.
Brief description of the drawings
One or more embodiments are illustrative by the picture in corresponding accompanying drawing, these exemplary theorys
The bright restriction not formed to embodiment, the element for having same reference numbers label in accompanying drawing are expressed as similar element, removed
Non- have a special statement, and composition does not limit the figure in accompanying drawing.
Fig. 1 a are that conventional art provides a kind of structural representation of product substrate under 20 times of magnifying glasses；
Fig. 1 b are that the embodiment of the present invention provides a kind of structural representation of product substrate under 20 times of magnifying glasses；
Fig. 1 c are that the embodiment of the present invention provides a kind of schematic flow sheet of circuit board manufacturing method；
Fig. 2 is the schematic flow sheet of step 13 in Fig. 1；
Fig. 3 is the schematic flow sheet of step 131 in Fig. 2；
Fig. 4 is that another embodiment of the present invention provides a kind of schematic flow sheet of circuit board manufacturing method.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that specific embodiment described herein is only to explain the present invention, not
For limiting the present invention.
If circuit board provided in an embodiment of the present invention can be stacked by dried layer product substrate layer, can also be by single-layer products
Substrate forms.Wherein, the circuit board can be used for the pcb board, common bus product, the special type of professional domain of thick process for copper making
Industry substrates etc..
As it was previously stated, conventional art use etching or electroplating technology making heavy copper circuit board, its surface irregularity, and
Quality is not sufficiently stable, and yields is not high, and homogeneity of product is not high.Fig. 1 a are referred to, Fig. 1 a are that conventional art provides a kind of product
Structural representation of the substrate under 20 times of magnifying glasses.As shown in Figure 1a, due to lateral erosion, the copper foil circuit 1a1's of the product substrate
The defects of uneven be present in surface.It is uneven because copper foil circuit 1a1 subregion is angular structures, therefore, when this
During product substrate galvanization, electric charge is easily concentrated in corner region, and cusp electric discharge phenomena occurs in the product substrate, and cusp electric discharge is held
Easily breakdown product substrate or heating bulge, so that the work of product substrate is not sufficiently stable or circuit board failure.
However, in embodiments of the present invention, referring to Fig. 1 b, Fig. 1 b are that a kind of product substrate of offer of the embodiment of the present invention exists
Structural representation under 20 times of magnifying glasses.The copper foil circuit 1b1 of the product substrate is smooth as shown in Figure 1 b.When the product base
During plate galvanization, electric charge is uniformly distributed, and therefore, the product substrate can reliablely and stablely work.
Further, the embodiment of the present invention uses following preparation method to produce the product substrate, described in detail below.
Fig. 1 c are referred to, Fig. 1 c are that the embodiment of the present invention provides a kind of schematic flow sheet of the preparation method of product substrate.
As illustrated in figure 1 c, the preparation method 100 of the product substrate includes：
Step 11, the metal form and non-metallic insulation medium that prefabricated figure is provided；
Step 12, metal form is positioned in particular manufacturing craft, and non-metallic insulation medium is laid in metal pattern respectively
The upper and lower surface of plate；
Step 13, melting non-metallic insulation medium, so as to non-metallic insulation media packs metal form and form product base
Plate.
In the present embodiment, user can use laser cutting or etching or punching press or cross cutting mode to process metal form,
To form the metal form with prefabricated figure.Metal form with prefabricated figure includes some copper foil regions, due to copper foil
The discrete component that region is connected is different, and the copper foil circuit width positioned at copper foil region can be different.The metal form includes
Copper foil template, aluminium foil template and other material templates etc., wherein, the copper foil template can be red copper template.
In order to realize large current characteristic, user according to product demand, can select the metal form of corresponding thickness to make
Circuit board.For example：Using metal form be copper foil template as example, user can select thickness can for 30z to 200z or
Person is more than 200z copper foil template, and the copper foil template of this thickness range passes through in which can realize high current.
Non-metallic insulation medium includes the insulating materials such as epoxy resin, polyimides, polyester film.Non-metallic insulation medium
Melted by heating, therefore, non-metallic insulation medium can coat metal form to form product substrate.
In the present embodiment, user can select N layers metal form and N+1 non-metallic insulation medium according to product demand
Laid and melted, such as：When user needs 3 layers of metal form, it can select 4 layers of non-metallic insulation medium to lay respectively
Any metal form in this 3 layers of metal forms, wherein, the adjacent surface of adjacent metal template shares same non-metallic insulation medium.
Further, when melting non-metallic insulation medium, inappropriate melting condition can produce to copper foil circuit width
Raw harmful effect, for example：When melting temperature or too high melt pressure, the non-metallic insulation medium under molten condition
The narrow copper foil of copper foil circuit width is easily destroyed, occurs misplacing and concatenating mutually for example, it can extrude adjacent copper foil.Cause
This, when melting non-metallic insulation medium, as shown in Fig. 2 step 13 includes：
Step 131, the copper foil circuit width according to each copper foil region of copper foil template, determine that each copper foil region is corresponding
Fusion parameters；
Step 132, the fusion parameters according to corresponding to each copper foil region of determination, non-metallic insulation medium is melted, so that
Non-metallic insulation media packs metal form simultaneously forms product substrate.
For a piece of copper foil template, it divides copper foil region according to copper foil circuit width, for example, the first copper foil circuit width
Corresponding first copper foil region, the corresponding second copper foil region of the second copper foil circuit width, the first copper foil circuit width and the second copper foil
Line width is different.Copper foil circuit width can be specific width value, can also be specific width scope.
Further, in order to allow users to pointedly process the circuit board of high-quality according to copper foil circuit width,
It can according to corresponding to the flexible configuration of each copper foil region fusion parameters.Wherein, fusion parameters include the first fusion parameters with
Second fusion parameters, each fusion parameters all include temperature, pressure, duration etc..Therefore, the process of step 131 is being performed, such as
Shown in Fig. 3, step 131 includes：
Step 1311, judge whether the copper foil circuit width in each copper foil region is more than predetermined width threshold value；
If step 1312, being less than, corresponding first fusion parameters in copper foil region are determined；
If step 1313, being more than, corresponding second fusion parameters in copper foil region are determined；
In the present embodiment, the first fusion parameters are less than the second fusion parameters.For example：When the first fusion parameters are the
One temperature, when the second fusion parameters are second temperature, the first temperature is less than second temperature.Similarly, when the first fusion parameters are the
One pressure, when the second fusion parameters are second pressure, first pressure is less than second pressure.Therefore, when each copper of copper foil template
When the copper foil circuit width in paper tinsel region is smaller than predetermined width threshold value, it melts non-metallic insulation according to the first fusion parameters and is situated between
Matter, so as to non-metallic insulation media packs metal form and form product substrate.It can similarly obtain, when each copper foil of copper foil template
When the copper foil circuit width in region is all more than predetermined width threshold value, it melts non-metallic insulation medium according to the second fusion parameters,
So as to non-metallic insulation media packs metal form and form product substrate.In the present embodiment, predetermined width threshold value is by user
It is self-defined according to product demand, it will not be described here.
Further, when copper foil template includes at least two different copper foil region of fusion parameters, it can be according to true
Fusion parameters corresponding to fixed each copper foil region, segmented melting non-metallic insulation medium, so that non-metallic insulation medium bag
Cover metal form and form product substrate.For example：It can be pre- with first according to the temperature and pressure of the first fusion parameters
If duration melts non-metallic insulation medium；And then, it can also be pre- with second according to the temperature and pressure of the second fusion parameters
If duration melting melts non-metallic insulation medium again, so as to non-metallic insulation media packs metal form and form product base
Plate, wherein, the first preset duration is less than the second preset duration.Again for example：In first paragraph melting process, its temperature melted
Spend for 90 to 130 degrees Celsius, pressure 250psi, the first preset duration is 5 minutes.And then, in second segment melting process,
Its temperature melted is 130 to 170 degrees Celsius, pressure 360psi, and the second preset duration is 60 minutes.Because first paragraph melts
Duration, temperature and pressure it is smaller, non-metallic insulation medium can lenitively, stably coat metal form, so as to avoid
The narrow copper foil of copper foil circuit width is excessively intensely destroyed, now, non-metallic insulation medium can coat copper foil well
The narrow copper foil of line width.In second segment melting process, duration, temperature and the pressure that second segment melts are bigger, its
Coatedly stability and uniformity can be ensured.
When non-metallic insulation media packs metal form and after form product substrate, user can be laminated multiple circuit bases
Plate has formed circuit board.Therefore, in certain embodiments, after step 13, as shown in figure 4, the circuit board manufacturing method 100
Also include：
Step 14, the product substrate for being laminated corresponding number；
Step 15, the product substrate for cutting corresponding number after stacking, to form circuit board.
In the present embodiment, the overlapped way between each circuit substrate includes：Product substrate after stacking corresponds to position
Put processing fixing hole and make to fix hole metallization, to form plated through-hole, aperture, shape and the quantity of plated through-hole are according to circuit board
Operating current determine.Related product substrate is subjected to lamination by technology hole, further processing, user can basis
Design is needed to form final products circuit board.
To sum up, using the circuit board manufacturing method, the works such as it avoids being etched the metal form of similar copper coin, electroplated
Skill step, so as to improve production efficiency and make the quality preservation for the circuit substrate to be formed stable.Also, user can select pair
The metal form of thickness is answered, to meet the operating current requirements of circuit board.
The embodiment of the present invention provides a kind of epoxy resin, and it can improve the performance of the circuit board of the present embodiment offer.Tool
Body, the epoxy resin is made up of the following raw material:
20-40 parts of bisphenol A type epoxy resin
2-12 parts of bisphenol f type epoxy resin
10-20 parts of glycerin ether
Soybean adhesive 15-30 parts
5-15 parts of adhesive
Polyacrylic acid 2-10 parts
5-10 parts of kaolin
Nano-titanium oxide 1-6 parts.
One of which preferred scheme is:
Bisphenol A type epoxy resin, bisphenol f type epoxy resin, the weight ratio of soybean adhesive are 30-35：6-10：6-10.
One of which preferred scheme is:
Bisphenol A type epoxy resin, the weight ratio of bisphenol f type epoxy resin are 30-35：6-10.
In certain embodiments, the composition epoxy resin with specific composition proportion can be used, obtaining has more
The wiring board of good performance.Below in conjunction with corresponding specific embodiment, the asphalt mixtures modified by epoxy resin that the embodiment of the present invention uses is described in detail
The Material synthesis of oil/fat composition.
Embodiment 1
A kind of product substrate composition epoxy resin, its raw material include according to percentage by weight：Bisphenol A type epoxy resin
40 parts, it is 2 parts of bisphenol f type epoxy resin, 20 parts of glycerin ether, 15 parts of adhesive, 15 parts of soybean adhesive, 10 parts of polyacrylic acid, high
6 parts of 7 parts of ridge soil and nano-titanium oxide.
Embodiment 2
A kind of product substrate composition epoxy resin, its raw material include according to percentage by weight：Bisphenol A type epoxy resin
20 parts, 12 parts of bisphenol f type epoxy resin, 10 parts of glycerin ether, 20 parts of soybean adhesive, 5 parts of adhesive, 10 parts of polyacrylic acid and
4 parts of nano-titanium oxide.
Embodiment 3
A kind of product substrate composition epoxy resin, its raw material include according to percentage by weight：Bisphenol A type epoxy resin
35 parts, 6 parts of bisphenol f type epoxy resin, 30 parts of glycerin ether, 15 parts of adhesive, 14 parts of polyacrylic acid, 1 part of kaolin and nano oxygen
Change 6 parts of titanium.
Embodiment 4 (control group)
A kind of product substrate composition epoxy resin, its raw material include according to percentage by weight：Bisphenol A type epoxy resin
6 parts of 30 parts, 3 parts of bisphenol f type epoxy resin, 20 parts of glycerin ether, 5 parts of adhesive, 10 parts of polyacrylic acid and nano-titanium oxide.
There is more excellent performance in order to fully weigh modified composition epoxy resin,
Insulating reliability, anti-flammability and adhesion strength are carried out to modified composition epoxy resin to test, and are obtained
Testing result it is specific as follows：
Table 1
Based on the testing result shown in above table 1, inventor to composition epoxy resin during developing
It was found that：
(1) comparing embodiment 1 and the testing result of embodiment 4 are passed through, it may be determined that：
Under conditions of anti-flammability and adhesion strength do not change, the insulation for the composition epoxy resin that embodiment 1 provides
Reliability has relative to existing composition (embodiment 4) to be obviously improved, and this is due to kaolinic addition, makes asphalt mixtures modified by epoxy resin
The increased result of insulating properties of oil/fat composition.
(2) testing result of comparing embodiment 2, embodiment 3 and embodiment 4 is passed through, it may be determined that：
Under conditions of anti-flammability and insulating reliability do not change, the composition epoxy resin of the offer of embodiment 2 glues
Intensity relative to embodiment 3 and embodiment 4 with being obviously improved, this is due to 35 parts of bisphenol A type epoxy resin and Bisphenol F
6 parts of type epoxy resin, make the increased result of adhesion strength of composition epoxy resin.
Although epoxy resin can be improved by the ratio for adjusting day bisphenol A type epoxy resin and bisphenol f type epoxy resin
The anti-flammability of composition, but during improvement, other performances of epoxy resin group can be influenceed, for example, adhesion strength, solidifying
Glue time etc., therefore the improvement that the present invention is reached is that those skilled in the art institute is unexpected.
(2) testing result of comparing embodiment 1, embodiment 2 and embodiment 4 is passed through, it may be determined that：
Under conditions of insulating reliability and anti-flammability do not change, the epoxy resin group of embodiment 1 and the offer of embodiment 2
The adhesion strength of compound has lifting relative to embodiment 4, and this is due to the result that soybean adhesive adds, and in the present invention
It is that the addition of soybean adhesive is more, and adhesion strength is better in content range that embodiment is limited.
As the another aspect of the embodiment of the present invention, the embodiment of the present invention provides a kind of circuit board, and the circuit board is using upper
The method described in each embodiment is stated to be made.
Finally it should be noted that：The above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；At this
Under the thinking of invention, it can also be combined between the technical characteristic in above example or different embodiments, step can be with
Realized with random order, and many other changes of the different aspect of the present invention as described above be present, for simplicity, they do not have
Have and provided in details；Although the present invention is described in detail with reference to the foregoing embodiments, the ordinary skill people of this area
Member should be understood：It can still modify to the technical scheme described in foregoing embodiments, or to which part skill
Art feature carries out equivalent substitution；And these modifications or replacement, the essence of appropriate technical solution is departed from each reality of the application
Apply the scope of a technical scheme.
Claims (10)
- A kind of 1. preparation method of product substrate, it is characterised in that including：The metal form and non-metallic insulation medium of prefabricated figure are provided；The metal form is positioned in particular manufacturing craft, and the non-metallic insulation medium is laid in the metal pattern respectively The upper and lower surface of plate；The non-metallic insulation medium is melted, so as to metal form described in the non-metallic insulation media packs and form product base Plate.
- 2. according to the method for claim 1, it is characterised in that the metal form includes copper foil template；The melting non-metallic insulation medium, so as to metal form described in the non-metallic insulation media packs and form production Product substrate, including：According to the copper foil circuit width in each copper foil region of the copper foil template, determine to melt corresponding to each copper foil region Melt parameter；According to fusion parameters corresponding to each copper foil region of determination, the non-metallic insulation medium is melted, so that described Metal diaphragm plate described in non-metallic insulation media packs simultaneously forms product substrate.
- 3. according to the method for claim 2, it is characterised in that the fusion parameters include the first fusion parameters and melted with second Melt parameter；The copper foil circuit width in each copper foil region according to the copper foil template, determine that each copper foil region is corresponding Fusion parameters, including：Judge whether the copper foil circuit width in each copper foil region is more than predetermined width threshold value；If being less than, corresponding first fusion parameters in the copper foil region are determined；If being more than, corresponding second fusion parameters in the copper foil region are determined；Wherein, first fusion parameters are less than second fusion parameters.
- 4. according to the method for claim 3, it is characterised in that the copper foil template includes different at least two of fusion parameters Individual copper foil region；Fusion parameters corresponding to each copper foil region according to determination, melt the non-metallic insulation medium, so that Metal form described in the non-metallic insulation media packs simultaneously forms product substrate, including：According to fusion parameters corresponding to each copper foil region of determination, segmented melts the non-metallic insulation medium, with Make metal form described in the non-metallic insulation media packs and form product substrate.
- 5. according to the method for claim 4, it is characterised in that each fusion parameters all include temperature and pressure；Fusion parameters corresponding to each copper foil region according to determination, segmented melt the non-metallic insulation and are situated between Matter, so as to metal form described in the non-metallic insulation media packs and product substrate is formed, including：According to the temperature and pressure of first fusion parameters, the non-metallic insulation medium is melted with the first preset duration；According to the temperature and pressure of second fusion parameters, the non-metallic insulation is melted with the melting of the second preset duration again Medium, so as to metal form described in the non-metallic insulation media packs and form product substrate, wherein, described first it is default when Length is less than second preset duration.
- 6. according to the method for claim 1, it is characterised in that after the non-metallic insulation medium is melted, the side Method also includes：It is laminated the product substrate of corresponding number；The product substrate of corresponding number after being laminated is cut, to form the circuit board.
- 7. according to the method for claim 6, it is characterised in that the product substrate of the stacking corresponding number, including：Product substrate correspondence position after stacking processes fixing hole and makes the fixed hole metallization, to form plated through-hole, Aperture, shape and the quantity of the plated through-hole determine according to the operating current of the circuit board.
- 8. according to the method described in any one of claim 1 to 7, it is characterised in that the non-metallic insulation medium includes following Any one medium：Epoxy resin film, polyimides, polyester film.
- 9. according to the method described in any one of claim 1 to 7, it is characterised in that the metal form includes red copper template.
- A kind of 10. circuit board that method using as described in any one of claim 1 to 9 is fabricated to.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710896259.2A CN107809841B (en) | 2017-09-28 | 2017-09-28 | Circuit board manufacturing method and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710896259.2A CN107809841B (en) | 2017-09-28 | 2017-09-28 | Circuit board manufacturing method and circuit board |
Publications (2)
| Publication Number | Publication Date |
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| CN107809841A true CN107809841A (en) | 2018-03-16 |
| CN107809841B CN107809841B (en) | 2020-03-27 |
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| CN201710896259.2A Expired - Fee Related CN107809841B (en) | 2017-09-28 | 2017-09-28 | Circuit board manufacturing method and circuit board |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101631433A (en) * | 2009-07-31 | 2010-01-20 | 田先平 | Implementation method of printing thick copper foil in PCB |
| CN103974546A (en) * | 2013-01-28 | 2014-08-06 | 深南电路有限公司 | Circuit board bearing large currents and manufacturing method thereof |
| CN204761832U (en) * | 2015-05-06 | 2015-11-11 | 浙江万正电子科技有限公司 | Cover high temperature resistant multilayer circuit board of super thick copper |
-
2017
- 2017-09-28 CN CN201710896259.2A patent/CN107809841B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101631433A (en) * | 2009-07-31 | 2010-01-20 | 田先平 | Implementation method of printing thick copper foil in PCB |
| CN103974546A (en) * | 2013-01-28 | 2014-08-06 | 深南电路有限公司 | Circuit board bearing large currents and manufacturing method thereof |
| CN204761832U (en) * | 2015-05-06 | 2015-11-11 | 浙江万正电子科技有限公司 | Cover high temperature resistant multilayer circuit board of super thick copper |
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| Publication number | Publication date |
|---|---|
| CN107809841B (en) | 2020-03-27 |
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