CN109068489B - Self-heating mirror plate for laminating circuit board - Google Patents
Self-heating mirror plate for laminating circuit board Download PDFInfo
- Publication number
- CN109068489B CN109068489B CN201811137694.8A CN201811137694A CN109068489B CN 109068489 B CN109068489 B CN 109068489B CN 201811137694 A CN201811137694 A CN 201811137694A CN 109068489 B CN109068489 B CN 109068489B
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- CN
- China
- Prior art keywords
- conductive layer
- insulating layer
- self
- mirror plate
- circuit board
- Prior art date
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 37
- 238000010030 laminating Methods 0.000 title claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 57
- 239000000463 material Substances 0.000 claims abstract description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 13
- 239000011889 copper foil Substances 0.000 abstract description 13
- 230000002269 spontaneous effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 10
- 238000003475 lamination Methods 0.000 description 6
- 230000007547 defect Effects 0.000 description 3
- 238000007731 hot pressing Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 238000006056 electrooxidation reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a self-heating mirror plate for laminating a circuit board, which comprises the following components: a substrate comprising a substrate body, and an inner insulating layer completely or incompletely coated on the substrate body; the conductive layer is coated on the base material, a disconnection part is arranged on the conductive layer, so that the conductive layer obtains two end parts, and the two end parts of the conductive layer form positive and negative electrodes of the conductive layer when being electrified. This a spontaneous heating mirror plate for pressfitting circuit board can effectually save the copper foil, has simple structure, convenient to use's advantage.
Description
Technical Field
The invention relates to the technical field of mirror plates, in particular to a self-heating mirror plate for laminating a circuit board.
Background
In manufacturing a main body substrate for producing a circuit board (PCB), a plurality of layers of different materials are laminated using a press, and the working principle of the press is to heat a processed adhesive resin material by copper foil and laminate the plurality of layers of materials for at least half an hour by applying a certain pressure, so that the circuit board substrate is manufactured, and in the lamination process using the press, a single lamination operation is often required to simultaneously laminate a plurality of circuit board substrates in order that the plurality of circuit board substrates are not affected by each other during lamination, and a special insulating mirror plate is required to be interposed therebetween. The conventional mirror plate has the functions of insulation, heat transfer, support and separation, but does not have the function of heating, and needs to conduct heat through the copper foil, as shown in fig. 1, the defects are that: 1) During lamination, the copper foil 01 needs to be wound between the mirror plate 02 and the circuit board 03 to be laminated in an S-shaped mode, and the defects of copper foil waste, difficult lamination and low discharging efficiency exist; 2) When the copper foil 01 is wound on the mirror plate, the copper foil is easy to damage, the production efficiency is low, and resource waste is easy to cause; therefore, it is necessary to study a self-heating mirror plate for bonding a wiring board.
Disclosure of Invention
Aiming at the defects in the technology, the invention provides the self-heating mirror plate for laminating the circuit board, which can avoid the waste of copper foil.
The technical scheme adopted for solving the technical problems is as follows: a self-heating mirror plate for laminating circuit boards, comprising: a substrate comprising a substrate body, and an inner insulating layer completely or incompletely coated on the substrate body; the conductive layer is coated on the base material, a disconnection part is arranged on the conductive layer, so that the conductive layer obtains two end parts, and the two end parts of the conductive layer form positive and negative electrodes of the conductive layer when being electrified.
Preferably, the self-heating mirror plate for laminating the circuit board further comprises an outer insulating layer coated on the conductive layer.
Preferably, a notch part opposite to the disconnection part is arranged on the outer insulating layer, and two ends of the conductive layer respectively extend out of the notch part of the outer insulating layer so as to form an anode and a cathode of the conductive layer when the conductive layer is electrified.
Preferably, the inner insulating layer is completely coated, and the substrate body is completely coated inside the inner insulating layer.
Preferably, the inner insulating layer is not completely coated, and the pair of opposite sides of the substrate main body respectively have at least one exposed end, so that the inner insulating layer cannot completely cover the substrate main body.
Preferably, the thickness of the substrate is 0.1 to 2.0mm.
Preferably, the thickness of the inner insulating layer and the outer insulating layer is 10 to 150 μm.
Preferably, the thickness of the conductive layer is 0.1 to 200 μm.
Preferably, the conductive layer is in the form of a'"Or"/>Type "of the material.
Preferably, gaps T and H are respectively formed between the upper and lower ends of the conductive layer and a sidewall of the substrate.
Compared with the prior art, the invention has the beneficial effects that: according to the self-heating mirror plate for the laminated circuit board, the conductive layer and the outer insulating layer are additionally arranged on the basis of the traditional mirror plate, heat can be generated by the conductive layer after the conductive layer is electrified to realize hot pressing of the circuit board, and the conductive layer replaces the traditional copper foil, so that S-shaped winding of the copper foil is avoided, the copper foil is effectively saved, the press structure is simplified, copper-free operation of an electric heating press is realized, and the self-heating mirror plate has the advantages of convenience in lamination and high discharging efficiency; the conductive layer and the outer insulating layer are sequentially coated on the base material, namely integrated with the base material, and the conductive layer and the outer insulating layer have the advantages of simple structure and convenience in use; the outer insulating layer has a protective effect on the conductive layer, and the service life of the mirror plate is long.
Drawings
FIG. 1 is a schematic diagram of the positional relationship among a conventional press, a mirror plate and a copper foil;
FIG. 2 is a schematic diagram of a self-heating mirror plate for bonding circuit boards according to the present invention;
FIG. 3 is a schematic side view of a self-heating mirror plate for bonding circuit boards according to the present invention;
FIG. 4 is a schematic diagram of a substrate according to the present invention;
FIG. 5 is a schematic view of the horizontal cross-sectional structure of FIG. 4;
FIG. 6 is a second schematic diagram of the structure of the substrate of the present invention;
FIG. 7 is a schematic view of the horizontal cross-sectional structure of FIG. 6;
FIG. 8 is a schematic diagram of the operation of the self-heating mirror plate for bonding circuit boards according to the present invention;
FIG. 9 is a schematic diagram of a self-heating mirror plate for bonding circuit boards according to a second embodiment of the present invention;
FIG. 10 is a schematic diagram of a self-heating mirror plate for bonding circuit boards according to a third embodiment of the present invention;
FIG. 11 is a schematic diagram of a self-heating mirror plate for bonding circuit boards according to the present invention;
Fig. 12 is a schematic structural view of the conductive layer of the present invention.
In the figure: 10. a substrate; 11. a substrate body; 12. an inner insulating layer; 13. exposing the end; 20. a conductive layer; 30. an outer insulating layer; 40. a conductive block; 50. and marking the end.
Detailed Description
The present invention is described in further detail below with reference to the drawings to enable those skilled in the art to practice the invention by referring to the description.
As shown in fig. 2 and 3, the present invention provides a self-heating mirror plate for laminating a circuit board, comprising: a base material 10; a conductive layer 20 coated on the substrate 10; and an outer insulating layer 30 coated on the conductive layer 20; the conductive layer 20 is provided with a breaking portion for enabling the conductive layer 20 to obtain two end portions, as shown in fig. 12, the conductive layer 20 includes a first plane coated on a top end surface of the substrate 10, a second plane coated on a bottom end surface of the substrate 10, and a third plane coated on a side surface of the substrate 10for connecting the first plane and the second plane, the top end surface and the bottom end surface of the substrate 10 are planes where a length X of the substrate 10 is wide, the side surface is a plane in a height direction of the substrate 10, the breaking portion is a region M, a notch portion opposite to the breaking portion is provided on the outer insulating layer 30, and two end portions of the conductive layer 20 respectively extend out of the notch portion of the outer insulating layer 30 to form a positive electrode and a negative electrode electrically connected with the conductive layer 20 when the power is applied.
As an embodiment of the present disclosure, the substrate 10 includes a substrate body 11, and an inner insulating layer 12 completely or incompletely covering the substrate body 11; the inner insulating layer 12 has two cladding modes: fig. 4 and 5 are schematic structural views of the inner insulating layer 12 when the inner insulating layer 12 is completely coated, and the substrate body 11 is completely coated inside the inner insulating layer 12 when the inner insulating layer 12 is completely coated; fig. 6 and fig. 7 are schematic structural diagrams of the inner insulating layer 12 when the inner insulating layer 12 adopts a non-complete coating, where a pair of opposite sides of the substrate body 11 respectively have at least one exposed end 13, so that the inner insulating layer 12 cannot completely cover the substrate body 11, the substrate body 11 has a length, a width and a height, and the sides of the substrate body 11 are planes where the heights are located. The function of the exposed end portion 13 is: the substrate body 11 is subjected to electrochemical oxidation treatment as a conductive point so that the surface of the substrate body 11 can be covered with the inner insulating layer 12. The extension of the exposed end portion 13 on the side is preferably 0.1 to 10mm. The extension length here refers to the length distance along the direction perpendicular to the height direction. The extension length should be limited, if the extension length is less than 0.1mm, a stable supporting point cannot be provided for the electrode when the inner insulating layer 12 is coated, so that uneven coating of the inner insulating layer 12 is easily caused, and the flatness of the self-heating mirror plate for laminating the circuit board is affected; if the extension length is more than 10mm, the exposed portion will be too much, which is easy to corrode after long-term use, and the bonding strength between the substrate body 11 and the inner insulating layer 12 at the periphery will be negatively affected.
As an example of the present embodiment, the thickness of the substrate 10 is 0.1 to 2.0mm.
As an example of this embodiment, the thickness of the inner insulating layer 12 and the outer insulating layer 30 is 10 to 150 μm.
As an example of the present embodiment, the thickness of the conductive layer 20 is 0.1 to 200 μm.
As an embodiment of the present invention, the material of the substrate body 11 may be either a conductor or an insulator, so long as the strength and hardness of the material meet the requirements of use. The inner insulating layer 12 and the outer insulating layer 30 are made of a hard insulating material.
As an embodiment of the present disclosure, one end of the conductive layer 20 is located on the top surface of the substrate 10, and the other end is located on the bottom surface of the substrate 10, and the conductive layer 20 needs to cover the substrate 10 as much as possible to make the mirror plate generate heat uniformly.
As an example of this embodiment, the conductive layer 20 is ""Or"/>"The upper and lower ends of the conductive layer 20 and a sidewall of the substrate 10 have gaps T and H, respectively, specifically, the upper and lower ends of the conductive layer 20 and a side surface of the substrate 10 that is completely exposed in the break portion have the following positional relationships, and the side surface that is completely exposed in the break portion is disposed opposite to the third plane, as shown in fig. 2 and 3, and the upper and lower ends of the conductive layer 20 are disposed flush with the side surface of the substrate 10, i.e., the gap t=h=0; alternatively, as shown in fig. 9, a gap a with the same gap value exists between the two ends of the conductive layer 20 and the side surface of the substrate 10, that is, a gap t=h=a; as shown in fig. 10, a gap b exists between one end of the conductive layer 20 and the side surface of the substrate 10, and the other end is disposed flush with the side surface of the substrate 10, i.e., t=b and h=0; still alternatively, as shown in fig. 11, a gap b exists between one end of the conductive layer 20 and the side surface of the substrate 10, and a gap c exists between the other end and the side surface of the substrate 10, i.e., t=b and h=c.
As an embodiment of the scheme, the self-heating mirror plate for pressing the circuit board is 800-1400 mm in length and 500-850 mm in width. The length and width of the self-heating mirror plate for the laminated circuit board should be limited, and when the length and width of the self-heating mirror plate for the laminated circuit board are too large, the bonding strength between the substrate body 11 and the inner insulating layer 12 is not uniform enough, which results in that when the self-heating mirror plate for the laminated circuit board is cooled after the hot pressing is finished, an excessive temperature difference forms a huge surface shrinkage stress, and the inner insulating layer 12, the conductive layer 20 and the outer insulating layer 30 are extremely easy to damage after long-term use; when the length and the width of the self-heating mirror plate used for laminating the circuit board are too small, the number of the single hot-pressing circuit boards is reduced, so that the production cost is increased by phase change, and the self-heating mirror plate used for laminating the circuit board loses practical application capability.
As an embodiment of the present solution, as shown in fig. 2, the surface of the outer insulating layer 30 of the self-heating mirror plate for the laminated circuit board is provided with a marking end 50, where the marking end 50 has the functions of identification, identification and traceability, so that the self-heating mirror plate for the laminated circuit board can be tracked and supervised in real time.
Fig. 8 is a schematic diagram of the self-heating mirror plate for laminating a circuit board in a working state, wherein black thick lines are conductive paths of current, and when laminating the circuit board 03, a conductive block 40 is required to be arranged between two adjacent mirror plates to electrically connect the conductive layers 20 of the upper and lower mirror plates, so as to form a current conductive path capable of replacing copper foil in the drawing.
Although embodiments of the present invention have been disclosed above, it is not limited to the details and embodiments shown and described, it is well suited to various fields of use for which the invention would be readily apparent to those skilled in the art, and accordingly, the invention is not limited to the specific details and illustrations shown and described herein, without departing from the general concepts defined in the claims and their equivalents.
Claims (4)
1. A self-heating mirror plate for laminating a circuit board, comprising:
A substrate (10) comprising a substrate body (11), and an inner insulating layer (12) entirely or incompletely coated on the substrate body (11);
The conductive layer (20) is coated on the base material (10), the conductive layer (20) is provided with a disconnection part which enables the conductive layer (20) to obtain two end parts, and the two end parts of the conductive layer (20) form positive and negative poles of the conductive layer (20) when the conductive layer is electrified;
The conductive layer (20) is in the form of Or/>A shape;
when the circuit board is pressed, a conductive block is arranged between two adjacent self-heating mirror plates, so that the conductive layers (20) of the upper self-heating mirror plate and the lower self-heating mirror plate are electrically connected to form a current conduction path;
the length of the self-heating mirror plate is 800-1400 mm, and the width is 500-850 mm;
the conductive layer (20) is coated with an outer insulating layer (30), the outer insulating layer (30) is provided with a notch part opposite to the disconnection part, and the two ends of the conductive layer (20) respectively extend out of the notch part of the outer insulating layer (30) to form the anode and the cathode of the conductive layer (20) when the conductive layer is electrified;
the thickness of the base material (10) is 0.1-2.0 mm, the thickness of the inner insulating layer (12) and the thickness of the outer insulating layer (30) are 10-150 mu m, and the thickness of the conductive layer (20) is 0.1-200 mu m.
2. Self-heating mirror plate for a laminated circuit board according to claim 1, characterized in that the inner insulating layer (12) is entirely coated, the substrate body (11) being entirely coated inside the inner insulating layer (12).
3. Self-heating mirror plate for a laminated circuit board according to claim 1, characterized in that the inner insulating layer (12) is incompletely coated, and the substrate body (11) has at least one exposed end (13) on each of a pair of opposite sides, so that the inner insulating layer (12) cannot completely coat the substrate body (11).
4. The self-heating mirror plate for bonding a circuit board according to claim 1, wherein gaps T and H are respectively present between the upper and lower end portions of the conductive layer (20) and a side wall of the base material (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811137694.8A CN109068489B (en) | 2018-09-27 | 2018-09-27 | Self-heating mirror plate for laminating circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811137694.8A CN109068489B (en) | 2018-09-27 | 2018-09-27 | Self-heating mirror plate for laminating circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109068489A CN109068489A (en) | 2018-12-21 |
| CN109068489B true CN109068489B (en) | 2024-04-26 |
Family
ID=64766613
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811137694.8A Active CN109068489B (en) | 2018-09-27 | 2018-09-27 | Self-heating mirror plate for laminating circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109068489B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2912342B1 (en) * | 1998-03-26 | 1999-06-28 | 富山日本電気株式会社 | Method for producing multilayer copper-clad laminate |
| CN103118494A (en) * | 2013-01-29 | 2013-05-22 | 苏州市嘉明机械制造有限公司 | Pressing runner plate of electric press for pressing processing of printed circuit boards |
| CN205378366U (en) * | 2016-02-03 | 2016-07-06 | 苏州市嘉明机械制造有限公司 | Be used as insulation board of baffle when pressfitting circuit board |
| CN209402843U (en) * | 2018-09-27 | 2019-09-17 | 盐城嘉腾机电有限公司 | It is a kind of for pressing the spontaneous heating runner plate of wiring board |
-
2018
- 2018-09-27 CN CN201811137694.8A patent/CN109068489B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2912342B1 (en) * | 1998-03-26 | 1999-06-28 | 富山日本電気株式会社 | Method for producing multilayer copper-clad laminate |
| CN103118494A (en) * | 2013-01-29 | 2013-05-22 | 苏州市嘉明机械制造有限公司 | Pressing runner plate of electric press for pressing processing of printed circuit boards |
| CN205378366U (en) * | 2016-02-03 | 2016-07-06 | 苏州市嘉明机械制造有限公司 | Be used as insulation board of baffle when pressfitting circuit board |
| CN209402843U (en) * | 2018-09-27 | 2019-09-17 | 盐城嘉腾机电有限公司 | It is a kind of for pressing the spontaneous heating runner plate of wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109068489A (en) | 2018-12-21 |
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