CN209402846U - A kind of spontaneous heating wiring board packet - Google Patents

Abstract

The utility model discloses a kind of spontaneous heating wiring board packets, comprising: at least one piece of wiring board；At least two pieces of spontaneous thermal insulation runner plates of two sides above and below the wiring board, the spontaneous thermal insulation runner plate includes the conductive layer of substrate and cladding on the substrate, a disconnecting unit for making the conductive layer obtain both ends is provided on the conductive layer, the both ends of the conductive layer form the positive and negative anodes of the conductive layer when being powered；And at least one piece of conducting block, its blocks for being set as a continuous catadioptric and constant amplitude fold and conductive energy, the cathode of the conductive layer of the spontaneous thermal insulation runner plate of the one of the top end part of conducting block surface adjacent thereto is electrically connected, the anode electrical connection of the conductive layer of another spontaneous thermal insulation runner plate of the bottom end of conducting block underface adjacent thereto.The spontaneous heating wiring board packet has the advantages that structure is simple, easy to use.

Description

A kind of spontaneous heating wiring board packet

Technical field

The utility model relates to route panel manufacturing apparatus technical field more particularly to spontaneous heating wiring board packets.

Background technique

In the main body substrate of manufacturing line road plate (PCB), need using electric press come by the different material of multilayer into Row pressing, the working principle of this electric press is the tacky resin material being processed by copper foil conductive heater, and passes through application Multilayer material is pressure bonded to not a half hour by certain pressure, so that board substrate is made, and during the pressing process, in order to make multi-disc Board substrate is not affected each other in pressing, needs to overlap them, and is inserted into a kind of special insulation between them Runner plate, above-mentioned insulation runner plate and copper foil constitute the packet for suppressing wiring board.Above-mentioned insulation runner plate has insulation, heat transfer, branch Support and isolated effect, but do not have the function of fever, it need to be by copper foil conductive exothermal, as shown in Figure 1, being traditionally used for pressing 1) packet of wiring board processed has the disadvantage in that need to be wound around runner plate 02 and route to be laminated for copper foil 01 in a manner of serpentine Between plate, have the defects that waste copper foil, lamination difficulty, blowing low efficiency；2) runner plate is in winding copper foil 01, copper easy to damage Foil, production efficiency is low and easily causes the wasting of resources；Therefore, it is necessary to study a kind of spontaneous heating wiring board packets.

Utility model content

Shortcoming present in view of the above technology, it is simple, easy to use that the utility model provides a kind of structure Spontaneous heating wiring board packet.

The technical scheme adopted by the utility model to solve the technical problem is as follows: a kind of spontaneous heating wiring board packet, comprising: extremely Few one piece of wiring board；At least two pieces of spontaneous thermal insulation runner plates of two sides, the spontaneous thermal insulation mirror above and below the wiring board Plate includes the conductive layer of substrate and cladding on the substrate, is provided with one on the conductive layer and the conductive layer is obtained The disconnecting unit at both ends, the both ends of the conductive layer form the positive and negative anodes of the conductive layer when being powered；And at least one piece Conducting block is set as the blocks of a continuous catadioptric and constant amplitude fold and conductive energy, the top end part of the conducting block The cathode of the conductive layer of the spontaneous thermal insulation runner plate of the one of surface adjacent thereto is electrically connected, the bottom end of the conducting block with The anode electrical connection of the conductive layer of another spontaneous thermal insulation runner plate of its adjacent underface.

Preferably, the spontaneous thermal insulation runner plate is successively spaced apart from each other stacking with the wiring board from top to bottom and banks up.

Preferably, be installed with a upper spacer right above the spontaneous thermal insulation runner plate of top, the bottom it is described A lower clapboard is installed with immediately below spontaneous thermal insulation runner plate.

Preferably, positioned at the anode of the conductive layer of the spontaneous thermal insulation runner plate of top and positioned at described in the bottom The cathode of the conductive layer of spontaneous thermal insulation runner plate is mutually conducted by external power supply.

Preferably, the substrate includes substrate body and the inner insulating layer that is coated in the substrate body.

Preferably, the substrate with a thickness of 0.1~2.0mm, the inner insulating layer with a thickness of 10~150 μm.

Preferably, the spontaneous thermal insulation runner plate further includes the external insulation layer being coated on the conductive layer, described outer exhausted A notch section opposite with the disconnecting unit is provided in edge layer, the both ends of the conductive layer each extend over out the external insulation The notch section of layer is to form the positive and negative anodes of the conductive layer when being powered.

Preferably, the external insulation layer with a thickness of 10~150 μm.

Preferably, the surface of the external insulation layer is equipped with retrospective label end, and the retrospective label end includes figure Case unit, text unit, digital units or alphabetical unit.

Preferably, the conductive layer is inOrType, the conductive layer with a thickness of 0.1~200 μm.

The utility model compared with prior art, the beneficial effect is that: spontaneous heating wiring board packet provided by the utility model, Its spontaneous thermal insulation runner plate adds conductive layer and external insulation layer on the basis of traditional runner plate, and adjacent spontaneous thermal insulation runner plate it Between conductive layer be connected by conducting block, which can generate heat after powered up to realize the heat to wiring board Pressure, effectively saves copper foil, simplifies press knot instead of traditional copper foil so as to avoid the serpentine winding of copper foil Structure has the advantages that structure is simple, lamination is convenient, blowing is high-efficient so that realizes electric heating press is turned into industry without copper foil；It leads Electric layer and external insulation layer are successively coated on substrate, i.e., integrated with substrate, have the advantages that structure is simple, easy to use；Outside Insulating layer has the function of protection to conductive layer, effectively extends the service life of spontaneous thermal insulation runner plate；Conducting block is using company Continue catadioptric and constant amplitude fold mode to be made, the purpose being arranged in this way is: so that there is conducting block the elasticity similar to spring to stretch Contracting performance, to be suitable for the laminating operation of the wiring board of different-thickness.

Detailed description of the invention

Fig. 1 is the positional diagram between the runner plate and copper foil of traditional spontaneous heating wiring board packet；

Fig. 2 is the structural schematic diagram of the spontaneous thermal insulation runner plate of the utility model；

Fig. 3 is one of the structural schematic diagram of side-looking direction of the spontaneous thermal insulation runner plate of the utility model；

Fig. 4 is one of structural schematic diagram of substrate of the utility model；

Fig. 5 is the schematic diagram of the section structure of the horizontal direction of Fig. 4；

Fig. 6 is the second structural representation of the substrate of the utility model；

Fig. 7 is the schematic diagram of the section structure of the horizontal direction of Fig. 6；

Fig. 8 is the operation schematic diagram of spontaneous heating wiring board packet described in the utility model；

Fig. 9 is the second structural representation of the side-looking direction of the spontaneous thermal insulation runner plate of the utility model；

Figure 10 is the third structural representation of the side-looking direction of the spontaneous thermal insulation runner plate of the utility model；

Figure 11 is the four of the structural schematic diagram of the side-looking direction of the spontaneous thermal insulation runner plate of the utility model；

Figure 12 is the structural schematic diagram of the conductive layer of the utility model；

Figure 13 is the decomposition texture schematic diagram of the wiring board of the utility model.

In figure: 10, substrate；11, substrate body；12, inner insulating layer；13, uncoated end portion；20, conductive layer；30, external insulation Layer；40, conducting block；50, end is marked；60, wiring board；61, prepreg；62, internal layer circuit plate；70, upper spacer；80, under every Plate.

Specific embodiment

The following describes the utility model in further detail with reference to the accompanying drawings, to enable those skilled in the art referring to explanation Book text can be implemented accordingly.

As shown in Fig. 2 to Figure 13, the utility model provides a kind of spontaneous heating wiring board packet, comprising: at least one piece of route Plate 60；At least two pieces of spontaneous thermal insulation runner plates positioned at about 60 two sides of wiring board, the spontaneous thermal insulation runner plate include Substrate 10, the conductive layer 20 being coated on the substrate 10 and the external insulation layer 30 being coated on the conductive layer 20；And make The conductive layer 20 of adjacent two pieces of spontaneous thermal insulation runner plates up and down is logical in energization phase transconductance, with cause it is adjacent up and down At least one piece of conducting block 40 of two pieces of spontaneous thermal insulation runner plate consistent heat generations；Wherein, the spontaneous thermal insulation runner plate and the line Road plate 60 is successively spaced apart from each other stacking from top to bottom and banks up.

As an embodiment of this programme, as shown in Figures 2 and 3, it is provided with one on the conductive layer 20 and makes described lead Electric layer 20 obtains the disconnecting unit at both ends, is provided with a notch section opposite with the disconnecting unit, institute on the external insulation layer 30 The both ends for stating conductive layer 20 each extend over out the notch section of the external insulation layer 30 to form the conductive layer 20 when being powered Positive and negative anodes.

As an embodiment of this programme, the one end part of the conductive layer 20 on the top end face of the substrate 10, it is another For one end part on the bottom face of the substrate 10, the conductive layer 20 as much as possible need to envelope the substrate 10 so that institute It is uniform to state spontaneous thermal insulation runner plate fever.

As an embodiment of this programme, as shown in Figures 2 and 3, the conductive layer 20 is inOrType, institute State the one end part of conductive layer 20 on the top end face of the substrate 10, the other end is located on the bottom face of the substrate 10. As shown in figure 12, the conductive layer 20 include one be coated on 10 top end face of substrate the first plane, one be coated on it is described The second plane and one on 10 bottom face of substrate, which are coated on 10 side of substrate, is connected first plane for connecting With the third plane of second plane, the top end face and bottom face of the substrate 10 are that the long place X wide of the substrate 10 is flat Face, the side are the plane in the short transverse of the substrate 10, and the disconnecting unit is region M.The conductive layer 20 it is upper, The one side wall of lower both ends and the substrate 10 is respectively present gap T and H, the upper/lower terminal portion of the conductive layer 20 with it is described There are between the complete exposed side in the disconnecting unit following several positional relationships on substrate 10, it is above-mentioned completely exposed in institute The side and the third plane stated in disconnecting unit are set as shown in Figures 2 and 3 in opposite directions, the upper/lower terminal of the conductive layer 20 Portion flushes setting, i.e. gap T=H=0 with the side of the substrate 10；Or as shown in figure 9, the conductive layer 20 two There are the identical gap a of gap width, i.e. gap T=H=a between end and the side of the substrate 10；And or such as Figure 10 Shown, there are a gap b, the other end and the substrates 10 between one end of the conductive layer 20 and the side of the substrate 10 The side flush setting, i.e. T=b and H=0；Again or, as shown in figure 11, one end of the conductive layer 20 and the substrate There are there are a gap c, i.e. T=b and H between the side of a gap b, the other end and the substrate 10 between 10 side =c.

As an embodiment of this programme, as shown in figure 8, the conducting block 40 is a continuous catadioptric and constant amplitude fold and has The blocks having conductivity, the spontaneous thermal insulation runner plate of the one of the top end part surface adjacent thereto of the conducting block 40 The cathode of conductive layer 20 is electrically connected, another spontaneous thermal insulation mirror of the bottom end underface adjacent thereto of the conducting block 40 The anode electrical connection of the conductive layer 20 of plate.

As an embodiment of this programme, as shown in figure 8, being located at the conductive layer of the spontaneous thermal insulation runner plate of top 20 anode passes through external power supply phase transconductance with the cathode of the conductive layer 20 for the spontaneous thermal insulation runner plate for being located at the bottom It is logical.

As an embodiment of this programme, as shown in Figures 4 to 7, the substrate 10 includes substrate body 11 and is coated on Inner insulating layer 12 in the substrate body 11.

As an embodiment of this programme, as shown in Figure 4 and Figure 5, the inner insulating layer 12 is complete clad type, the base Material main body 11 is coated on completely inside the inner insulating layer 12.

As an embodiment of this programme, as shown in Figure 6 and Figure 7, the inner insulating layer 12 is non-fully clad type, described A pair of substrate body 11 is respectively provided at least one uncoated end portion 13 on opposite side, so that the inner insulating layer 12 can not The substrate body 11 is enveloped completely.Attached drawing 6 and attached drawing 7 are the structure when inner insulating layer 12 takes non-fully clad type Schematic diagram, when the inner insulating layer 12 takes non-fully clad type, on the opposite side of a pair of the substrate body 11 respectively With at least one uncoated end portion 13, so that the inner insulating layer 12 can not envelope the substrate body 11 completely, it is described Substrate body 11 has length and width and height, and the side of the substrate body 11 is the plane at high place.The work of the uncoated end portion 13 Using is: coming to carry out electrochemicial oxidation to the substrate body 11 as conductiving point, in the 11 surface energy of substrate body It is coated with the inner insulating layer 12.Development length of the uncoated end portion 13 in side is preferably 0.1~10mm.Here extension Length refers to prolonging the length distance perpendicular on high direction.Development length should be restricted, if development length is less than 0.1mm can not provide stable supporting point then when coating the inner insulating layer 12 for electrode, to easily cause described interior exhausted The cladding of edge layer 12 is uneven, influences the flatness of spontaneous thermal insulation runner plate；If development length is greater than 10mm, will lead to exposed Part outside is excessive, corrosion is easily caused after long-time service, while to the substrate body 11 of periphery and the inner insulating layer 12 bond strength adversely affects.

As an embodiment of this programme, the substrate 10 with a thickness of 0.1~2.0mm；The inner insulating layer 12 and institute The thickness for stating external insulation layer 30 is 10~150 μm；The conductive layer 20 with a thickness of 0.1~200 μm.

As an embodiment of this programme, the material of the substrate body 11 either conductor is also possible to insulator, As long as the intensity and hardness of the selection of material meet requirement.The inner insulating layer 12 and the external insulation layer 30 select heavily fortified point Hard insulating materials is made.

As an embodiment of this programme, the length of the spontaneous thermal insulation runner plate is 800~1400mm, width 500 ~850mm.The length and width of spontaneous thermal insulation runner plate should be limited, when spontaneous thermal insulation runner plate is when growing and being wider than big, institute It states substrate body 11 and the bond strength of the inner insulating layer 12 is not uniform enough, this will lead to spontaneous thermal insulation runner plate in sinter When cooling after beam, the excessive temperature difference will form huge surface shrinkage stress, and the inner insulating layer is easily caused after long-time service 12, the damage of the conductive layer 20 and the external insulation layer 30；And when spontaneous thermal insulation runner plate is when growing and being wider than small, and can subtract The quantity of few single hot pressing wiring board makes spontaneous thermal insulation runner plate lose actual answer in a disguised form improve production cost Use ability.

As an embodiment of this programme, as shown in Fig. 2, the surface of the traceable spontaneous heating runner plate is equipped with label end 50, the label end 50 there is identification, mark and traceable function, it can be achieved that real-time tracing to traceable spontaneous heating runner plate and Supervision；The retrospective label end 50 includes pattern unit, text unit, digital units or alphabetical unit, specifically, label Holding 50 information includes pattern, text, number, letter etc., and content includes production supplier, date of manufacture, board or batch etc..

As an embodiment of this programme, as shown in figure 8, the surface of the spontaneous thermal insulation runner plate of top is fixed There is a upper spacer 70, is installed with a lower clapboard 80 immediately below the spontaneous thermal insulation runner plate of the bottom.

As an embodiment of this programme, as shown in figure 13, the wiring board 60 includes 62 He of an at least internal layer circuit plate At least a pair of of prepreg 61, the internal layer circuit plate 62 are clamped between a pair of adjacent prepreg 61.

The working principle of the spontaneous heating wiring board packet is as follows: when pressing wiring board 60, being connected to external power supply, and by leading Electric block 40 is electrically connected the conductive layer 20 of adjacent two pieces of upper and lower spontaneous thermal insulation runner plates to cause spontaneous heating insulation runner plate Consistent heat generation, to realize the hot pressing to wiring board 60.

Although the embodiments of the present invention have been disclosed as above, it is not limited in institute in specification and embodiments Column use, it can be applied to various fields suitable for the present invention completely, for those skilled in the art, can Easily realize other modification, therefore without departing from the general concept defined in the claims and the equivalent scope, this is practical It is novel to be not limited to specific details and legend shown and described herein.

Claims (10)

1. a kind of spontaneous heating wiring board packet characterized by comprising

At least one piece of wiring board (60)；

At least two pieces of spontaneous thermal insulation runner plates positioned at the wiring board (60) two sides up and down, the spontaneous thermal insulation runner plate include Substrate (10) and the conductive layer (20) being coated on the substrate (10), be provided on the conductive layer (20) one make it is described Conductive layer (20) obtains the disconnecting unit at both ends, and the both ends of the conductive layer (20) form the conductive layer (20) when being powered Positive and negative anodes；And

At least one piece of conducting block (40) is set as the blocks of a continuous catadioptric and constant amplitude fold and conductive energy, institute State the negative electricity of the conductive layer (20) of a spontaneous thermal insulation runner plate of the top end part surface adjacent thereto of conducting block (40) Connection, the conductive layer (20) of another spontaneous thermal insulation runner plate of the bottom end underface adjacent thereto of the conducting block (40) Anode electrical connection.

2. spontaneous heating wiring board packet as described in claim 1, which is characterized in that the spontaneous thermal insulation runner plate and the route Plate (60) is successively spaced apart from each other stacking from top to bottom and banks up.

3. spontaneous heating wiring board packet as described in claim 1, which is characterized in that the spontaneous thermal insulation runner plate of top Surface is installed with a upper spacer (70), is installed with a lower clapboard immediately below the spontaneous thermal insulation runner plate of the bottom (80)。

4. spontaneous heating wiring board packet as described in claim 1, which is characterized in that positioned at the spontaneous thermal insulation mirror of top The anode of the conductive layer (20) of plate passes through outer with the cathode of the conductive layer (20) for the spontaneous thermal insulation runner plate for being located at the bottom Power supply is connect mutually to conduct.

5. spontaneous heating wiring board packet as described in claim 1, which is characterized in that the substrate (10) includes substrate body (11) With the inner insulating layer (12) being coated on the substrate body (11).

6. spontaneous heating wiring board packet as claimed in claim 5, which is characterized in that the substrate (10) with a thickness of 0.1~ 2.0mm, the inner insulating layer (12) with a thickness of 10~150 μm.

7. spontaneous heating wiring board packet as described in claim 1, which is characterized in that the spontaneous thermal insulation runner plate further includes cladding It is opposite with the disconnecting unit to be provided with one on the external insulation layer (30) for external insulation layer (30) on the conductive layer (20) Notch section, the both ends of the conductive layer (20) each extend over out the notch section of the external insulation layer (30) to be formed when being powered The positive and negative anodes of the conductive layer (20).

8. spontaneous heating wiring board packet as claimed in claim 7, which is characterized in that the external insulation layer (30) with a thickness of 10~ 150μm。

9. spontaneous heating wiring board packet as claimed in claim 7, which is characterized in that the surface of the external insulation layer (30) is equipped with can The label end (50) of retrospect, the retrospective label end (50) include that pattern unit, text unit, digital units or letter are single Member.

10. spontaneous heating wiring board packet as described in claim 1, which is characterized in that the conductive layer (20) is inOrType, the conductive layer (20) with a thickness of 0.1~200 μm.