CN209402843U - It is a kind of for pressing the spontaneous heating runner plate of wiring board - Google Patents
It is a kind of for pressing the spontaneous heating runner plate of wiring board Download PDFInfo
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- CN209402843U CN209402843U CN201821589124.8U CN201821589124U CN209402843U CN 209402843 U CN209402843 U CN 209402843U CN 201821589124 U CN201821589124 U CN 201821589124U CN 209402843 U CN209402843 U CN 209402843U
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- conductive layer
- wiring board
- pressing
- runner plate
- spontaneous heating
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Abstract
The utility model discloses a kind of for pressing the spontaneous heating runner plate of wiring board, comprising: substrate comprising substrate body and the inner insulating layer being coated in the substrate body completely or non-fully；Conductive layer on the substrate is coated, a disconnecting unit for making the conductive layer obtain both ends is provided on the conductive layer, the both ends of the conductive layer form the positive and negative anodes of the conductive layer when being powered.The spontaneous heating runner plate for being used to press wiring board can effectively save copper foil, have the advantages that structure is simple, easy to use.
Description
Technical field
The utility model relates to runner plate technical fields, more particularly, to press the spontaneous heating runner plate of wiring board.
Background technique
In the main body substrate of manufacturing line road plate (PCB), need using electric press come by the different material of multilayer into
Row pressing, the working principle of this electric press is the tacky resin material being processed by copper foil conductive heater, and passes through application
Multilayer material is pressure bonded to not a half hour by certain pressure, so that board substrate is made, and in using electric press bonding processes,
For cost consideration, single stitching operation generally requires to press multi-disc board substrate simultaneously, and in order to make multi-disc wiring board base
Material is not affected each other in pressing, needs to overlap them, and is inserted into a kind of special insulation runner plate between them.It passes
The runner plate of system has insulation, heat transfer, support and isolated effect, but does not have the function of fever, need to be sent out by copper foil conduction
Heat, as shown in Figure 1, its have the disadvantage that 1) pressing when, copper foil 01 need to be wound around in a manner of serpentine runner plate 02 and to
Between the wiring board 03 of pressing, have the defects that waste copper foil, lamination difficulty, blowing low efficiency；2) runner plate is in winding copper foil 01
When, copper foil easy to damage, production efficiency is low and easily causes the wasting of resources；Therefore, it is necessary to study a kind of for pressing wiring board
Spontaneous heating runner plate.
Utility model content
Shortcoming present in view of the above technology, the utility model provide a kind of being used for for avoidable copper foil waste
Press the spontaneous heating runner plate of wiring board.
The technical scheme adopted by the utility model to solve the technical problem is as follows: a kind of for pressing the spontaneous heating of wiring board
Runner plate, comprising: substrate comprising substrate body and the inner insulating layer being coated in the substrate body completely or non-fully；Packet
Conductive layer on the substrate is covered, a disconnecting unit for making the conductive layer obtain both ends is provided on the conductive layer,
The both ends of the conductive layer form the positive and negative anodes of the conductive layer when being powered.
Preferably, the described spontaneous heating runner plate for pressing wiring board further include be coated on the conductive layer it is outer absolutely
Edge layer.
Preferably, it is provided with a notch section opposite with the disconnecting unit on the external insulation layer, the two of the conductive layer
Extend the notch section of the external insulation layer respectively to form the positive and negative anodes of the conductive layer when being powered in end.
Preferably, the inner insulating layer is complete clad type, and the substrate body is coated on the inner insulating layer completely
It is internal.
Preferably, the inner insulating layer is that non-fully clad type, a pair of the substrate body have respectively on opposite side
There is at least one uncoated end portion, so that the inner insulating layer can not envelope the substrate body completely.
Preferably, the substrate with a thickness of 0.1~2.0mm.
Preferably, the thickness of the inner insulating layer and the external insulation layer is 10~150 μm.
Preferably, the conductive layer with a thickness of 0.1~200 μm.
Preferably, the conductive layer in "" or "" type.
Preferably, the upper/lower terminal portion of the conductive layer and the one side wall of the substrate are respectively present gap T and H.
The utility model compared with prior art, the beneficial effect is that: it is provided by the utility model for pressing wiring board
Spontaneous heating runner plate, conductive layer and external insulation layer are added on the basis of traditional runner plate, the conductive layer after powered up can
Heat is generated to realize the hot pressing to wiring board, the conductive layer instead of traditional copper foil, so as to avoid copper foil serpentine around
If effectively saving copper foil, simplifying press structure, so that realizes electric heating press is turned into industry without copper foil, there is lamination
Advantage convenient, blowing is high-efficient；Conductive layer and external insulation layer are successively coated on substrate, i.e., integrated with substrate, have knot
Simple, the easy to use advantage of structure；External insulation layer has the function of protection, the long service life of runner plate to conductive layer.
Detailed description of the invention
Fig. 1 is the positional diagram between traditional press, runner plate and copper foil；
Fig. 2 is described in the utility model for pressing one of the structural schematic diagram of the spontaneous heating runner plate of wiring board；
Fig. 3 is described in the utility model for pressing the structural schematic diagram of the side-looking direction of the spontaneous heating runner plate of wiring board；
Fig. 4 is one of structural schematic diagram of substrate of the utility model；
Fig. 5 is the schematic diagram of the section structure of the horizontal direction of Fig. 4；
Fig. 6 is the second structural representation of the substrate of the utility model；
Fig. 7 is the schematic diagram of the section structure of the horizontal direction of Fig. 6；
Fig. 8 is described in the utility model for pressing the operation schematic diagram of the spontaneous heating runner plate of wiring board；
Fig. 9 is described in the utility model for pressing the second structural representation of the spontaneous heating runner plate of wiring board；
Figure 10 is described in the utility model for pressing the third structural representation of the spontaneous heating runner plate of wiring board；
Figure 11 is described in the utility model for pressing the four of the structural schematic diagram of the spontaneous heating runner plate of wiring board；
Figure 12 is the structural schematic diagram of the conductive layer of the utility model.
In figure: 10, substrate；11, substrate body；12, inner insulating layer；13, uncoated end portion；20, conductive layer；30, external insulation
Layer；40, conducting block；50, end is marked.
Specific embodiment
The following describes the utility model in further detail with reference to the accompanying drawings, to enable those skilled in the art referring to explanation
Book text can be implemented accordingly.
As shown in Figures 2 and 3, the utility model provides a kind of for pressing the spontaneous heating runner plate of wiring board, comprising: base
Material 10；The conductive layer 20 being coated on the substrate 10；And it is coated on the external insulation layer 30 on the conductive layer 20；Wherein,
A disconnecting unit for making the conductive layer 20 obtain both ends, as shown in figure 12, the conduction are provided on the conductive layer 20
Layer 20 include one be coated on 10 top end face of substrate the first plane, one be coated on 10 bottom face of substrate second
It plane and one is coated on 10 side of substrate for connecting the third that first plane and second plane is connected
Plane, the top end face and bottom face of the substrate 10 are the long place the X wide plane of the substrate 10, and the side is the substrate
Plane in 10 short transverse, the disconnecting unit are region M, are provided with one and the disconnecting unit phase on the external insulation layer 30
Pair notch section, the both ends of the conductive layer 20 each extend over out the notch section of the external insulation layer 30 be powered when formed
The positive and negative anodes that the conductive layer 20 is electrically connected.
As an embodiment of this programme, the substrate 10 includes substrate body 11, is coated on completely or non-fully described
Inner insulating layer 12 in substrate body 11；There are two types of the modes of cladding for the inner insulating layer 12 tool: one kind is complete clad type, another
Kind is non-fully clad type, and attached drawing 4 and attached drawing 5 are the structural schematic diagram when inner insulating layer 12 takes complete clad type, when
When the inner insulating layer 12 takes complete clad type, the substrate body 11 is coated on completely inside the inner insulating layer 12；
Attached drawing 6 and attached drawing 7 are the structural schematic diagram when inner insulating layer 12 takes non-fully clad type, when the inner insulating layer 12 is adopted
When negated complete clad type, a pair of the substrate body 11 is respectively provided at least one uncoated end portion 13 on opposite side, with
So that the inner insulating layer 12 can not envelope the substrate body 11 completely, the substrate body 11 has length and width and height, institute
The side for stating substrate body 11 is the plane at high place.The effect of the uncoated end portion 13 is: coming as conductiving point to the base
Material main body 11 carries out electrochemicial oxidation, can be coated with the inner insulating layer 12 on 11 surface of substrate body.It is described
Development length of the uncoated end portion 13 in side is preferably 0.1~10mm.Here development length refers to prolonging perpendicular to high side
Upward length distance.Development length should be restricted, if development length is less than 0.1mm, coat the inner insulating layer 12
When, stable supporting point can not be provided for electrode, to easily cause the cladding of the inner insulating layer 12 uneven, influenced for pressing
Close the flatness of the spontaneous heating runner plate of wiring board；If development length is greater than 10mm, it is excessive to will lead to exposed part, long
Phase easily causes corrosion after, while causing to bear to the substrate body 11 of periphery and the bond strength of the inner insulating layer 12
Face is rung.
As an embodiment of this programme, the substrate 10 with a thickness of 0.1~2.0mm.
As an embodiment of this programme, the thickness of the inner insulating layer 12 and the external insulation layer 30 is 10~150 μ
m。
As an embodiment of this programme, the conductive layer 20 with a thickness of 0.1~200 μm.
As an embodiment of this programme, the material of the substrate body 11 either conductor is also possible to insulator,
As long as the intensity and hardness of the selection of material meet requirement.The inner insulating layer 12 and the external insulation layer 30 select heavily fortified point
Hard insulating materials is made.
As an embodiment of this programme, the one end part of the conductive layer 20 on the top end face of the substrate 10, it is another
For one end part on the bottom face of the substrate 10, the conductive layer 20 as much as possible need to envelope the substrate 10 so that institute
It is uniform to state runner plate fever.
As an embodiment of this programme, the conductive layer 20 in "" or "" type, the conductive layer 20 it is upper and lower
The one side wall of both ends and the substrate 10 is respectively present gap T and H, specifically, the upper/lower terminal portion of the conductive layer 20 with
There are between the complete exposed side in the disconnecting unit following several positional relationships on the substrate 10, it is above-mentioned completely exposed
Side in the disconnecting unit is opposite with the third plane and sets, as shown in Figures 2 and 3, the conductive layer 20 it is upper and lower
Both ends flush setting, i.e. gap T=H=0 with the side of the substrate 10；Or the as shown in figure 9, conductive layer 20
Both ends and the substrate 10 the side between there are the identical gap a of gap width, i.e. gap T=H=a；And or such as
Shown in Figure 10, there are a gap b, the other end and the bases between one end of the conductive layer 20 and the side of the substrate 10
The side of material 10 flushes setting, i.e. T=b and H=0；Again or, as shown in figure 11, one end of the conductive layer 20 with it is described
There are there are a gap c, i.e. T=between the side of a gap b, the other end and the substrate 10 between the side of substrate 10
B and H=c.
As an embodiment of this programme, it is described for press wiring board spontaneous heating runner plate length be 800~
1400mm, width are 500~850mm.Length and width for pressing the spontaneous heating runner plate of wiring board should be limited, when being used for
Press when the growing and being wider than big of spontaneous heating runner plate of wiring board, the bond strength of the substrate body 11 and the inner insulating layer 12
Not enough uniformly, this will lead to the spontaneous heating runner plate for pressing wiring board it is cooling after hot pressing when, the excessive temperature difference is by shape
Easily cause at huge surface shrinkage stress, after long-time service the inner insulating layer 12, the conductive layer 20 and it is described it is outer absolutely
The damage of edge layer 30；And when the spontaneous heating runner plate for pressing wiring board is when growing and being wider than small, and single hot pressing line can be reduced
The quantity of road plate, in a disguised form improve production cost, the spontaneous heating runner plate for being used in pressing wiring board loses actual answer
Use ability.
As an embodiment of this programme, as shown in Fig. 2, described for pressing the external insulation of the spontaneous heating runner plate of wiring board
30 surface of layer are equipped with label end 50, and the label end 50 has identification, mark and traceable function, it can be achieved that for pressing line
The real-time tracing of the spontaneous heating runner plate of road plate and supervision.
Attached drawing 8 is that this is used to press the schematic diagram of the spontaneous heating runner plate of wiring board in the operating condition, and the black in figure is thick
Lines be electric current guiding path, when pressing wiring board 03, a conducting block 40 need to be set between adjacent two pieces of runner plates so that
The electrical connection of conductive layer 20 of upper and lower two pieces of runner plates is to form the current conducting path of alternative copper foil in figure.
Although the embodiments of the present invention have been disclosed as above, it is not limited in institute in specification and embodiments
Column use, it can be applied to various fields suitable for the present invention completely, for those skilled in the art, can
Easily realize other modification, therefore without departing from the general concept defined in the claims and the equivalent scope, this is practical
It is novel to be not limited to specific details and legend shown and described herein.
Claims (10)
1. a kind of for pressing the spontaneous heating runner plate of wiring board characterized by comprising
Substrate (10) comprising substrate body (11) and be coated on completely or non-fully on the substrate body (11) it is interior absolutely
Edge layer (12)；
The conductive layer (20) being coated on the substrate (10) is provided with one on the conductive layer (20) and makes the conductive layer
(20) disconnecting unit at both ends is obtained, the both ends of the conductive layer (20) form the positive and negative of the conductive layer (20) when being powered
Pole.
2. as described in claim 1 for pressing the spontaneous heating runner plate of wiring board, which is characterized in that further include be coated on it is described
External insulation layer (30) on conductive layer (20).
3. as claimed in claim 2 for pressing the spontaneous heating runner plate of wiring board, which is characterized in that the external insulation layer (30)
On be provided with a notch section opposite with the disconnecting unit, the both ends of the conductive layer (20) each extend over out the external insulation
The notch section of layer (30) is to form the positive and negative anodes of the conductive layer (20) when being powered.
4. as described in claim 1 for pressing the spontaneous heating runner plate of wiring board, which is characterized in that the inner insulating layer (12)
For complete clad type, it is internal that the substrate body (11) is coated on the inner insulating layer (12) completely.
5. as described in claim 1 for pressing the spontaneous heating runner plate of wiring board, which is characterized in that the inner insulating layer (12)
For non-fully clad type, a pair of the substrate body (11) is respectively provided at least one uncoated end portion (13) on opposite side,
So that the inner insulating layer (12) can not envelope the substrate body (11) completely.
6. as described in claim 1 for pressing the spontaneous heating runner plate of wiring board, which is characterized in that the thickness of the substrate (10)
Degree is 0.1~2.0mm.
7. as claimed in claim 2 for pressing the spontaneous heating runner plate of wiring board, which is characterized in that the inner insulating layer (12)
Thickness with the external insulation layer (30) is 10~150 μm.
8. as described in claim 1 for pressing the spontaneous heating runner plate of wiring board, which is characterized in that the conductive layer (20)
With a thickness of 0.1~200 μm.
9. as described in claim 1 for pressing the spontaneous heating runner plate of wiring board, which is characterized in that the conductive layer (20) is inOrType.
10. as described in claim 1 for pressing the spontaneous heating runner plate of wiring board, which is characterized in that the conductive layer (20)
Upper/lower terminal portion and the one side wall of the substrate (10) be respectively present gap T and H.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821589124.8U CN209402843U (en) | 2018-09-27 | 2018-09-27 | It is a kind of for pressing the spontaneous heating runner plate of wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821589124.8U CN209402843U (en) | 2018-09-27 | 2018-09-27 | It is a kind of for pressing the spontaneous heating runner plate of wiring board |
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| Publication Number | Publication Date |
|---|---|
| CN209402843U true CN209402843U (en) | 2019-09-17 |
Family
ID=67877018
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821589124.8U Active CN209402843U (en) | 2018-09-27 | 2018-09-27 | It is a kind of for pressing the spontaneous heating runner plate of wiring board |
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| CN (1) | CN209402843U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109068489A (en) * | 2018-09-27 | 2018-12-21 | 盐城嘉腾机电有限公司 | It is a kind of for pressing the spontaneous heating runner plate of wiring board |
-
2018
- 2018-09-27 CN CN201821589124.8U patent/CN209402843U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109068489A (en) * | 2018-09-27 | 2018-12-21 | 盐城嘉腾机电有限公司 | It is a kind of for pressing the spontaneous heating runner plate of wiring board |
| CN109068489B (en) * | 2018-09-27 | 2024-04-26 | 盐城嘉腾机电有限公司 | Self-heating mirror plate for laminating circuit board |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220104 Address after: 215000 Hengtang Youth Industrial Park, Suzhou High-tech Zone, Jiangsu Province Patentee after: SUZHOU JIAMING MACHINERY MANUFACTURING Co.,Ltd. Address before: 224322 group 5, shengliqiao village, CHANGDANG Town, Sheyang County, Yancheng City, Jiangsu Province (in shengliqiao private entrepreneurship Park) Patentee before: YANCHENG JIATENG ELECTROMECHANICAL Co.,Ltd. |