CN111295040A - PCB (printed circuit board), layout method and device thereof and storage medium - Google Patents
PCB (printed circuit board), layout method and device thereof and storage medium Download PDFInfo
- Publication number
- CN111295040A CN111295040A CN202010132384.8A CN202010132384A CN111295040A CN 111295040 A CN111295040 A CN 111295040A CN 202010132384 A CN202010132384 A CN 202010132384A CN 111295040 A CN111295040 A CN 111295040A
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- Prior art keywords
- layer
- pcb
- power supply
- area
- milling
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- 238000000034 method Methods 0.000 title claims abstract description 19
- 239000010410 layer Substances 0.000 claims abstract description 121
- 238000003801 milling Methods 0.000 claims abstract description 43
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 30
- 239000010949 copper Substances 0.000 claims abstract description 30
- 229910052802 copper Inorganic materials 0.000 claims abstract description 30
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 27
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 20
- 239000010959 steel Substances 0.000 claims abstract description 20
- 230000005540 biological transmission Effects 0.000 claims abstract description 15
- 239000002344 surface layer Substances 0.000 claims abstract description 14
- 238000012545 processing Methods 0.000 claims abstract description 7
- 238000007650 screen-printing Methods 0.000 claims abstract description 7
- 230000008719 thickening Effects 0.000 claims abstract description 4
- 238000007747 plating Methods 0.000 claims description 6
- 238000013461 design Methods 0.000 description 4
- 238000006467 substitution reaction Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
- H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to a PCB (printed Circuit Board) and a layout method, a layout device and a storage medium thereof, wherein the method comprises the following steps: s1: in the bottleneck area of the power transmission plane, laying a copper sheet on the surface layer of the PCB along the current transmission direction; then, arranging a windowing area and a steel mesh area on the surface copper sheet; setting silk-screen marks by taking the surface copper sheet as a center; laying a wiring prohibition area on an adjacent layer between the secondary outer layer and the power supply layer; s2: during PCB processing, marking areas by silk screen printing, and milling grooves by using a milling cutter, wherein the depth of the milled grooves only drills through the power supply layer with low voltage and large current without touching the next layer of the power supply plane; s3: and finally, when the PCB is subjected to surface mounting, local thickening treatment is carried out on the steel mesh area at the milling groove, the tin feeding amount in the milling groove is increased, and finally the groove hole is filled with tin.
Description
Technical Field
The invention belongs to the technical field of PCB design, and particularly relates to a PCB, a layout method and a layout device thereof, and a storage medium.
Background
With the development of electronic information, the functions of electronic products are more and more, the power consumption of corresponding electronic components is gradually increased, and the electronic products are developed towards low voltage and high current.
In the process of designing the PCB, the power design is also a major difficulty, especially for low voltage and large current circuits. If the current carrying of the circuit in the PCB design cannot meet the maximum current amount required by the system, the entire circuit system will be unstable. As electronic products are increasingly miniaturized, the area of the PCB board is gradually reduced.
In the prior art, when a PCB is designed and a low-voltage and high-current circuit is encountered, in order to meet the current carrying capacity of the circuit, a PCB board layer is usually increased or the area of the PCB is increased, so that the power plane of the power circuit is widened, but both solutions increase the cost of the PCB and are not beneficial to product miniaturization. This is a drawback and deficiency in the prior art.
In view of the above, the present invention provides a PCB board, and a method, an apparatus and a storage medium for laying out the PCB board; it is very necessary to solve the above-mentioned defects existing in the prior art.
Disclosure of Invention
In view of the above-mentioned shortcomings in the prior art, the present invention provides a PCB board, a method and an apparatus for laying the PCB board, and a storage medium, so as to solve the above-mentioned technical problems.
In order to achieve the purpose, the invention provides the following technical scheme:
in a first aspect, the present invention provides a PCB board comprising:
the PCB comprises a PCB body, wherein an inner layer power supply layer is arranged in the PCB body, a top layer power supply layer is arranged on the top layer of the PCB body, and copper sheets are arranged on the inner layer power supply layer and the top layer power supply layer; the PCB is provided with a milling slot hole, a tin layer is plated in the milling slot hole, the bottom end of the tin layer is communicated to the inner layer power supply layer, the top end of the tin layer is communicated to the top layer power supply layer, and each signal layer between the inner layer power supply layer and the top layer power supply layer and the tin layer are in a cut-off state.
In a second aspect, the present invention provides a method for laying out a PCB, comprising the following steps:
s1: copper sheets are laid on the surface layer of the PCB in the bottleneck area of the power transmission plane along the current transmission direction; then, arranging a windowing area and a steel mesh area on the surface copper sheet; setting silk-screen marks by taking the surface copper sheet as a center; laying a wiring prohibition area on an adjacent layer between the secondary outer layer and the power supply layer;
s2: during PCB processing, marking areas by silk screen printing, and milling grooves by using a milling cutter, wherein the depth of the milled grooves only drills through the power supply layer with low voltage and large current without touching the next layer of the power supply plane;
s3: and finally, when the PCB is subjected to surface mounting, local thickening treatment is carried out on the steel mesh area at the milling groove, the tin feeding amount in the milling groove is increased, and finally the groove hole is filled with tin.
Preferably, in step S1, the width of the copper sheet is at least 0.5 mm.
Preferably, the width of the windowed area is 0.4 mm;
preferably, the width of the steel mesh area is 0.5 mm;
preferably, the width of the silk-screen label is 0.2 mm;
preferably, the width of the wiring inhibited region is 0.5 mm. The wiring is reasonable, current carrying can be met, the PCB wiring is convenient, and the PCB is fully utilized.
In a third aspect, the present invention provides a layout apparatus for PCB boards, comprising:
a module is laid on the surface layer of the PCB,
in a bottleneck area of a power transmission plane, paving a copper sheet with the width of at least 0.5mm on the surface layer of the PCB along the current transmission direction; then, arranging a windowing area and a steel mesh area on the surface copper sheet; setting silk-screen marks by taking the surface copper sheet as a center; laying a wiring prohibition area on an adjacent layer between the secondary outer layer and the power supply layer;
a groove milling module is arranged on the upper surface of the groove milling module,
during PCB processing, marking areas by silk screen printing, and milling grooves by using a milling cutter, wherein the depth of the milled grooves only drills through the power supply layer with low voltage and large current without touching the next layer of the power supply plane;
the tin-plating module is provided with a tin-plating module,
when the PCB is pasted with the sheet, the steel mesh area at the milling groove is locally thickened, so that the tin feeding amount in the milling groove is increased, and finally the groove hole is filled with tin.
Preferably, in the PCB surface layer laying module, the width of the windowing area is 0.4 mm; the width of the steel mesh area is 0.5 mm; the width of the silk-screen label is 0.2 mm; the width of the wiring inhibited region was 0.5 mm.
In a fourth aspect, there is provided a computer storage medium having stored therein instructions that, when run on a computer, cause the computer to perform the method of the second aspect described above.
The invention has the advantages that the low-voltage heavy-current circuit is arranged in the bottleneck area of the power plane, the current carrying capacity of the power transmission path is greatly increased by means of the soldering tin and the copper sheet in the slotted hole for transmitting current, meanwhile, the wiring area of the power area can be saved, and other signal wiring is facilitated. Meanwhile, the half slot hole does not occupy the wiring of the other half signal layer of the PCB, and the wiring area of the signal layer is further saved. In addition, the invention has reliable design principle, simple structure and very wide application prospect.
Drawings
In order to more clearly illustrate the embodiments or technical solutions in the prior art of the present invention, the drawings used in the description of the embodiments or prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.
Fig. 1 is a schematic view of a processed product layer of a PCB in embodiment 1 of the present invention.
FIG. 2 is a schematic diagram of a PCB slot soldered according to embodiment 1 of the present invention.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the drawings in the embodiment of the present invention, and it is obvious that the described embodiment is only a part of the embodiment of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1:
as shown in fig. 1 and 2, the present embodiment provides a PCB board including:
the PCB comprises a PCB body, wherein an inner layer power supply layer is arranged in the PCB body, a top layer power supply layer is arranged on the top layer of the PCB body, and copper sheets are arranged on the inner layer power supply layer and the top layer power supply layer; the PCB is provided with a milling slot hole, a tin layer is plated in the milling slot hole, the bottom end of the tin layer is communicated to the inner layer power supply layer, the top end of the tin layer is communicated to the top layer power supply layer, and each signal layer between the inner layer power supply layer and the top layer power supply layer and the tin layer are in a cut-off state.
Example 2:
as shown in fig. 1 and 2, the layout method of the PCB provided in this embodiment includes the following steps:
s1: in a bottleneck area of a power transmission plane, paving a copper sheet with the width of at least 0.5mm on the surface layer of the PCB along the current transmission direction; then, arranging a windowing area and a steel mesh area on the surface copper sheet; setting silk-screen marks by taking the surface copper sheet as a center; laying a wiring prohibition area on an adjacent layer between the secondary outer layer and the power supply layer; the width of the windowing region is 0.4 mm; the width of the steel mesh area is 0.5 mm; the width of the silk-screen label is 0.2 mm; the width of the wiring inhibited region was 0.5 mm.
S2: during PCB processing, marking areas by silk screen printing, and milling grooves by using a milling cutter, wherein the depth of the milled grooves only drills through the power supply layer with low voltage and large current without touching the next layer of the power supply plane;
s3: finally, when the PCB is pasted with the sheet, local thickening treatment is carried out on the steel mesh area at the milling groove, the tin loading amount in the milling groove is increased, and finally the groove hole is filled with tin; as shown in fig. 2.
In this embodiment, taking 10 layers of a PCB as an example, the power supply layers are the 5 th layer and the 6 th layer, and copper sheets of the same power supply network are laid on TOP layers of the whole PCB, so that wiring-prohibited areas with a width of 0.5mm need to be arranged on all the 2 nd to 4 th layers. The length of all settings depends on the length of the bottleneck region of the actual power plane.
The power supply layers are the 5 th layer and the 6 th layer, copper sheets of a large-current circuit are paved on the two power supply layers and the TOP layer, a milling cutter is adopted to mill a milling groove with the width of 0.2mm according to a silk-screen marking area, the depth of the milling groove is from the TOP layer to the 6 th layer, and insulation media from the 6 th layer to the 7 th layer cannot be milled. Then, electroplating copper to interconnect the inner power supply layer in the PCB with the surface layer of the PCB through the slot; as shown in fig. 1.
Example 3: the present embodiment provides a layout device for a PCB, including:
a module is laid on the surface layer of the PCB,
in a bottleneck area of a power transmission plane, paving a copper sheet with the width of at least 0.5mm on the surface layer of the PCB along the current transmission direction; then, arranging a windowing area and a steel mesh area on the surface copper sheet; setting silk-screen marks by taking the surface copper sheet as a center; laying a wiring prohibition area on an adjacent layer between the secondary outer layer and the power supply layer;
a groove milling module is arranged on the upper surface of the groove milling module,
during PCB processing, marking areas by silk screen printing, and milling grooves by using a milling cutter, wherein the depth of the milled grooves only drills through the power supply layer with low voltage and large current without touching the next layer of the power supply plane;
the tin-plating module is provided with a tin-plating module,
when the PCB is pasted with the sheet, the steel mesh area at the milling groove is locally thickened, so that the tin feeding amount in the milling groove is increased, and finally the groove hole is filled with tin.
In the PCB surface layer laying module, the width of the windowing area is 0.4 mm; the width of the steel mesh area is 0.5 mm; the width of the silk-screen label is 0.2 mm; the width of the wiring inhibited region was 0.5 mm.
Example 4:
the present embodiment provides a computer storage medium having stored therein instructions that, when run on a computer, cause the computer to perform the method of embodiment 2 described above.
Although the present invention has been described in detail by referring to the drawings in connection with the preferred embodiments, the present invention is not limited thereto. Various equivalent modifications or substitutions can be made on the embodiments of the present invention by those skilled in the art without departing from the spirit and scope of the present invention, and these modifications or substitutions are within the scope of the present invention/any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A PCB board, comprising:
the PCB comprises a PCB body, wherein an inner layer power supply layer is arranged in the PCB body, a top layer power supply layer is arranged on the top layer of the PCB body, and copper sheets are arranged on the inner layer power supply layer and the top layer power supply layer; the PCB is provided with a milling slot hole, a tin layer is plated in the milling slot hole, the bottom end of the tin layer is communicated to the inner layer power supply layer, the top end of the tin layer is communicated to the top layer power supply layer, and each signal layer between the inner layer power supply layer and the top layer power supply layer and the tin layer are in a cut-off state.
2. A layout method for preparing the PCB board of claim 1, comprising the steps of:
s1: copper sheets are laid on the surface layer of the PCB in the bottleneck area of the power transmission plane along the current transmission direction; then, arranging a windowing area and a steel mesh area on the surface copper sheet; setting silk-screen marks by taking the surface copper sheet as a center; laying a wiring prohibition area on an adjacent layer between the secondary outer layer and the power supply layer;
s2: during PCB processing, marking areas by silk screen printing, and milling grooves by using a milling cutter, wherein the depth of the milled grooves only drills through the power supply layer with low voltage and large current without touching the next layer of the power supply plane;
s3: and finally, when the PCB is subjected to surface mounting, local thickening treatment is carried out on the steel mesh area at the milling groove, the tin feeding amount in the milling groove is increased, and finally the groove hole is filled with tin.
3. The method as claimed in claim 2, wherein in the step S1, the width of the copper sheet is at least 0.5 mm.
4. A method as claimed in claim 2 or 3, wherein the width of the windowed area is 0.4 mm.
5. The PCB layout method of claim 4, wherein the width of the steel mesh area is 0.5 mm.
6. The method as claimed in claim 5, wherein the width of the silk-screen mark is 0.2 mm.
7. The layout method of the PCB as claimed in claim 6, wherein the width of the wiring forbidden area is 0.5 mm.
8. The invention provides a PCB layout device, which is characterized by comprising:
a module is laid on the surface layer of the PCB,
in a bottleneck area of a power transmission plane, paving a copper sheet with the width of at least 0.5mm on the surface layer of the PCB along the current transmission direction; then, arranging a windowing area and a steel mesh area on the surface copper sheet; setting silk-screen marks by taking the surface copper sheet as a center; laying a wiring prohibition area on an adjacent layer between the secondary outer layer and the power supply layer;
a groove milling module is arranged on the upper surface of the groove milling module,
during PCB processing, marking areas by silk screen printing, and milling grooves by using a milling cutter, wherein the depth of the milled grooves only drills through the power supply layer with low voltage and large current without touching the next layer of the power supply plane;
the tin-plating module is provided with a tin-plating module,
when the PCB is pasted with the sheet, the steel mesh area at the milling groove is locally thickened, so that the tin feeding amount in the milling groove is increased, and finally the groove hole is filled with tin.
9. The PCB layout device of claim 8, wherein in the PCB surface layer laying module, the width of the windowing region is 0.4 mm; the width of the steel mesh area is 0.5 mm; the width of the silk-screen label is 0.2 mm; the width of the wiring inhibited region was 0.5 mm.
10. A computer storage medium having stored therein instructions which, when run on a computer, cause the computer to perform the method of any of claims 2 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010132384.8A CN111295040B (en) | 2020-02-29 | 2020-02-29 | PCB (printed circuit board), layout method and device thereof and storage medium |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010132384.8A CN111295040B (en) | 2020-02-29 | 2020-02-29 | PCB (printed circuit board), layout method and device thereof and storage medium |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111295040A true CN111295040A (en) | 2020-06-16 |
| CN111295040B CN111295040B (en) | 2022-06-14 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010132384.8A Active CN111295040B (en) | 2020-02-29 | 2020-02-29 | PCB (printed circuit board), layout method and device thereof and storage medium |
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| Country | Link |
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| CN (1) | CN111295040B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114398850A (en) * | 2022-03-25 | 2022-04-26 | 苏州浪潮智能科技有限公司 | Method and device for preventing PCB screen printing from influencing impedance change of high-speed signal |
| WO2022140909A1 (en) * | 2020-12-28 | 2022-07-07 | 深圳市雅信宏达电子科技有限公司 | Circuit board manufacturing process, system, and micro diameter end mill |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060243478A1 (en) * | 2004-02-04 | 2006-11-02 | Ibiden Co., Ltd | Multilayer printed wiring board |
| CN101631433A (en) * | 2009-07-31 | 2010-01-20 | 田先平 | Implementation method of printing thick copper foil in PCB |
| CN102361539A (en) * | 2011-10-18 | 2012-02-22 | 沪士电子股份有限公司 | Method for manufacturing groove-type printed wiring board |
| CN105307390A (en) * | 2015-11-13 | 2016-02-03 | 唐水 | PCB structure |
| CN107949190A (en) * | 2017-10-20 | 2018-04-20 | 江门崇达电路技术有限公司 | A kind of manufacture craft of high drop ladder wiring board |
-
2020
- 2020-02-29 CN CN202010132384.8A patent/CN111295040B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060243478A1 (en) * | 2004-02-04 | 2006-11-02 | Ibiden Co., Ltd | Multilayer printed wiring board |
| CN101631433A (en) * | 2009-07-31 | 2010-01-20 | 田先平 | Implementation method of printing thick copper foil in PCB |
| CN102361539A (en) * | 2011-10-18 | 2012-02-22 | 沪士电子股份有限公司 | Method for manufacturing groove-type printed wiring board |
| CN105307390A (en) * | 2015-11-13 | 2016-02-03 | 唐水 | PCB structure |
| CN107949190A (en) * | 2017-10-20 | 2018-04-20 | 江门崇达电路技术有限公司 | A kind of manufacture craft of high drop ladder wiring board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022140909A1 (en) * | 2020-12-28 | 2022-07-07 | 深圳市雅信宏达电子科技有限公司 | Circuit board manufacturing process, system, and micro diameter end mill |
| CN114398850A (en) * | 2022-03-25 | 2022-04-26 | 苏州浪潮智能科技有限公司 | Method and device for preventing PCB screen printing from influencing impedance change of high-speed signal |
| CN114398850B (en) * | 2022-03-25 | 2022-06-03 | 苏州浪潮智能科技有限公司 | Method and device for preventing PCB screen printing from influencing impedance change of high-speed signal |
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| Publication number | Publication date |
|---|---|
| CN111295040B (en) | 2022-06-14 |
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