CN114398850B - Method and device for preventing PCB screen printing from influencing impedance change of high-speed signal - Google Patents
Method and device for preventing PCB screen printing from influencing impedance change of high-speed signal Download PDFInfo
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- 238000007650 screen-printing Methods 0.000 title claims abstract description 117
- 238000000034 method Methods 0.000 title claims abstract description 42
- 230000008859 change Effects 0.000 title claims abstract description 22
- 229910000679 solder Inorganic materials 0.000 claims abstract description 53
- 238000003860 storage Methods 0.000 claims abstract description 19
- 239000011248 coating agent Substances 0.000 claims abstract description 14
- 238000000576 coating method Methods 0.000 claims abstract description 14
- 238000004519 manufacturing process Methods 0.000 claims abstract description 12
- 238000005530 etching Methods 0.000 claims abstract description 11
- 239000003086 colorant Substances 0.000 claims description 7
- 238000004590 computer program Methods 0.000 claims description 7
- 238000013461 design Methods 0.000 abstract description 22
- 230000005540 biological transmission Effects 0.000 abstract description 9
- 238000010586 diagram Methods 0.000 description 13
- 239000003990 capacitor Substances 0.000 description 8
- 238000004806 packaging method and process Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 230000008054 signal transmission Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000012938 design process Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 230000035772 mutation Effects 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/394—Routing
- G06F30/3953—Routing detailed
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2115/00—Details relating to the type of the circuit
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Abstract
The invention provides a method, a system, equipment and a storage medium for preventing PCB silk screen printing from influencing impedance change of high-speed signals, wherein the method comprises the following steps: setting the size of the silk-screen font into a uniform size format; arranging an ink solder mask on the PCB; manufacturing the silk-screen layer into a windowing graph, covering the windowing graph on a PCB (printed circuit board), and etching to remove the first solder resist ink at the silk-screen position; and covering the screen printing layer windowing graph on the PCB, and coating second screen printing ink at the screen printing position to enable the second screen printing ink to fill the area for removing the first solder resist ink. The invention can effectively solve the problem of the silk-screen design of the PCB, so that the PCB is more beautiful and neat. The PCB board card is more convenient to miniaturize and design in high density, the miniaturized design of electronic products is ensured, the transmission quality of high-speed signals is ensured, and the integrity of the high-speed signals is improved.
Description
Technical Field
The present invention relates to the field of printed circuit boards, and more particularly, to a method, system, device and storage medium for preventing PCB screen printing from affecting high-speed signal impedance changes.
Background
With the rapid development of current social information technology, electronic products are developing towards higher performance, so that the signal transmission rate on a Printed Circuit Board (PCB) in the electronic products is faster and faster, and any detail in the PCB design process may change the transmission impedance of a high-speed signal, thereby affecting the transmission quality of the high-speed signal and further causing problems in the whole PCB. Silk screen is the essential data on the PCB board, which represents the device position and other PCB information. At present because the cost control of enterprise and electronic product tend to the miniaturization, thereby the PCB area is littleer and more to lead to on the PCB device and walk the line, if want to move PCB silk screen printing the top layer and walk the line region and be impossible completely.
According to the microstrip line calculation formula, when other parameters are unchanged, the larger the relative dielectric constant epsilon, the smaller the impedance. When the high-speed microstrip lines are pressed on the PCB by silk screen printing, the relative dielectric constant of the PCB is increased, so that the impedance of the high-speed lines is reduced, the impedance of high-speed signal transmission is discontinuous, and the quality of signals transmitted by the high-speed lines is poor. In the conventional PCB design, manual adjustment is needed in order to prevent high-speed wiring of screen printing voltage, or device PCB packaging is improved, the mode is time-consuming and labor-consuming, device packaging is disordered, and the difficulty of PCB inspection is increased due to the fact that the same device material and different packaging are adopted; part of silk-screen high-density areas have to be reduced in silk-screen, so that after PCB production and processing, the silk-screen identification degree is low, and inconvenience is brought to board card debugging and assembling; in addition, after high-speed wiring is avoided by silk-screen printing, the PCB is difficult to be orderly and orderly, and the attractiveness of the PCB is reduced.
Disclosure of Invention
In view of this, an object of the embodiments of the present invention is to provide a method, a system, a computer device, and a computer readable storage medium for preventing a screen printing of a PCB from affecting a change in impedance of a high-speed signal. The PCB board card is more convenient to miniaturize and design with high density, and the miniaturization design of electronic products is ensured. The high-speed signal wiring is printed by silk screen, so that the impedance of the high-speed signal wiring is not suddenly changed, the transmission quality of the high-speed signal is ensured, and the integrity of the high-speed signal is improved.
Based on the above purpose, an aspect of the embodiments of the present invention provides a method for preventing a PCB screen printing from affecting impedance changes of high-speed signals, including the following steps: setting the size of the silk-screen font into a uniform size format; arranging an ink solder mask on the PCB; manufacturing the silk-screen layer into a windowing graph, covering the windowing graph on a PCB (printed circuit board), and etching to remove the first solder resist ink at the silk-screen position; and covering the PCB by using the screen printing layer windowing pattern, coating the second screen printing ink at the screen printing position, and filling the area for removing the first solder resist ink with the second screen printing ink.
In some embodiments, the applying a second screen-printing ink at the screen-printing location comprises: and keeping the thickness of the second silk-screen printing ink consistent with the thickness of the first solder resist ink.
In some embodiments, the setting the size of the silk-screen font to a uniform size format includes: and keeping the width of the silk-screen lines to be larger than or equal to a first preset length, and keeping the distance between the silk-screen lines to be larger than or equal to a second preset length.
In some embodiments, the method further comprises: and setting the first solder resist ink and the second silk-screen printing ink into different colors.
In another aspect of the embodiments of the present invention, a system for preventing a PCB screen printing from affecting impedance change of a high-speed signal is provided, including: the format module is configured to set the size of the silk-screen font into a uniform size format; the solder mask module is configured for arranging an ink solder mask layer on the PCB board; the etching module is configured to make the silk-screen layer into a windowing pattern, cover the windowing pattern on the PCB, and etch and remove the first solder resist ink at the silk-screen position; and the coating module is configured to use a silk-screen layer windowing pattern to cover the PCB, and coat second silk-screen printing ink at the silk-screen position, so that the second silk-screen printing ink fills the area for removing the first solder resist ink.
In some embodiments, the coating module is configured to: and keeping the thickness of the second silk-screen printing ink consistent with that of the first solder resist ink.
In some embodiments, the format module is configured to: and keeping the width of the silk-screen lines to be larger than or equal to a first preset length, and keeping the distance between the silk-screen lines to be larger than or equal to a second preset length.
In some embodiments, the system further comprises an identification module configured to: and setting the first solder resist ink and the second silk-screen printing ink into different colors.
In another aspect of the embodiments of the present invention, there is also provided a computer device, including: at least one processor; and a memory storing computer instructions executable on the processor, the instructions when executed by the processor implementing the steps of the method as above.
In a further aspect of the embodiments of the present invention, a computer-readable storage medium is also provided, in which a computer program for implementing the above method steps is stored when the computer program is executed by a processor.
The invention has the following beneficial technical effects: the design of PCB integrated circuit board silk screen printing can be effectively solved for the PCB integrated circuit board is more pleasing to the eye carefully and neatly done. The PCB board card is more convenient to miniaturize and design with high density, and the miniaturization design of electronic products is ensured. The high-speed signal wiring is printed by silk screen, so that the impedance of the high-speed signal wiring is not changed suddenly, the transmission quality of the high-speed signal is ensured, and the integrity of the high-speed signal is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other embodiments can be obtained by using the drawings without creative efforts.
FIG. 1 is a schematic diagram of an embodiment of a method for preventing PCB screen printing from affecting high-speed signal impedance change according to the present invention;
FIG. 2 is a schematic diagram of a conventional 0402 capacitor package design;
FIG. 3 is a schematic diagram of a conventional high-speed trace serial capacitor PCB design;
FIG. 4 is a schematic diagram of a high-speed trace PCB design after capacitor packaging improvement;
FIG. 5 is a schematic diagram of a high speed trace connector PCB design;
FIG. 6 is a schematic diagram of a conventional high-speed routing area PCB screen printing design;
fig. 7 is a schematic diagram of a PCB board rip cut designed according to an embodiment of the present invention;
FIG. 8 is a schematic diagram of an embodiment of a system for preventing PCB screen printing from affecting high-speed signal impedance changes according to the present invention;
FIG. 9 is a schematic diagram of a hardware structure of an embodiment of the computer apparatus for preventing PCB screen printing from affecting impedance change of high-speed signals according to the present invention;
FIG. 10 is a schematic diagram of an embodiment of a computer storage medium for preventing PCB screen printing from affecting high-speed signal impedance changes according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the following embodiments of the present invention are described in further detail with reference to the accompanying drawings.
It should be noted that all expressions using "first" and "second" in the embodiments of the present invention are used for distinguishing two entities with the same name but different names or different parameters, and it should be noted that "first" and "second" are merely for convenience of description and should not be construed as limitations of the embodiments of the present invention, and they are not described in any more detail in the following embodiments.
In a first aspect of the embodiments of the present invention, an embodiment of a method for preventing a PCB screen printing from affecting a high-speed signal impedance change is provided. Fig. 1 is a schematic diagram illustrating an embodiment of a method for preventing PCB screen printing from affecting impedance change of high-speed signals according to the present invention. As shown in fig. 1, the embodiment of the present invention includes the following steps:
s1, setting the size of the silk-screen font into a uniform size format;
s2, arranging an ink solder mask on the PCB board card;
s3, making the silk-screen layer into a windowing pattern, covering the windowing pattern on the PCB, and etching to remove the first solder resist ink at the silk-screen position; and
and S4, covering the PCB by using a screen printing layer windowing pattern, and coating the second screen printing ink at the screen printing position to enable the second screen printing ink to fill the area for removing the first solder resist ink.
During high-speed differential routing, the TX routing of the transmission signal needs to be connected in series with the 0402 capacitor to play a role of isolating direct communication, and the package of the 0402 capacitor device has a peripheral screen printing frame, as shown in fig. 2. This package design, fan out regardless of TX high speed traces, results in 0402 peripheral screen on traces, as shown in fig. 3. Therefore, the packaging of the series capacitor of the high-speed wiring needs to be improved and designed separately, the series capacitor packaging of the high-speed wiring is designed separately, the silk screen printing on the narrow side of the 0402 packaging is removed, and the long-side silk screen printing is reserved. After the packaging is improved, the high-speed traces are not pressed by the device screen printing when the high-speed traces pass through the 0402 capacitor, as shown in fig. 4. This method is merely an example of a device connected by a common high-speed trace, and is also applicable to a general IO connector package form of a high-speed trace, such as the package shown in fig. 5.
The general high-speed BUS that walks is the group and walks the line, walks the regional spaciousness that is comparatively open, very easily adjusts the silk screen printing to spacious district when adjusting the silk screen printing in PCB design later stage, causes the silk screen printing high-speed to walk the line. In this case, it is difficult for the PCB designer to find and it takes time and effort to check the problem as the PCB devices become more and more dense. Firstly, whether a silk screen is adjusted to a high-speed wiring is checked, if the silk screen is adjusted to the high-speed wiring, the silk screen position is finely adjusted and moved to be placed between two pairs of high-speed wirings, as shown in A in figure 6; if the silk screen can not be finely adjusted between the two pairs of high-speed wires, the position number of the silk screen is reduced by one character number, and then the silk screen is continuously finely adjusted and placed between the two pairs of high-speed wires, as shown in a position B in figure 6; if the screen printing still cannot be adjusted between two pairs of high speed traces, the DRC is reported, as shown at C in FIG. 6. The PCB designer then manually adjusts the screen printing to be outside the high-speed routing according to the reported DRC position.
The embodiment of the invention provides a novel screen printing design and a novel production method from the perspective of PCB design and PCB production, and on the premise of not influencing the screen printing design and production printing of the PCB, the problem that the high-speed signal transmission impedance changes due to screen printing pressing on a high-speed signal transmission line, so that the high-speed signal transmission quality is influenced, is avoided.
And setting the size of the silk-screen font into a uniform size format.
In some embodiments, the setting the size of the silk-screen font to a uniform size format includes: and keeping the width of the silk-screen lines to be larger than or equal to a first preset length, and keeping the distance between the silk-screen lines to be larger than or equal to a second preset length. The size of the silk-screen font is set to be in a uniform size format in the PCB design process, the width of the silk-screen line is at least 0.15mm, the distance between the silk-screen lines is at least 0.1778mm, and otherwise, the silk-screen font is difficult to process and manufacture subsequently. Meanwhile, in the process of screen printing adjustment and movement, the screen printing is adjusted to a far position or the screen printing font is reduced without avoiding high-speed signal wiring, the position of the high-speed signal wiring is not considered, the screen printing can be adjusted neatly and uniformly, and the attractiveness of the screen printing is ensured, and the screen printing is clear and easy to identify.
And arranging an ink solder mask on the PCB card.
And manufacturing the silk screen layer into a windowing graph, covering the windowing graph on the PCB, and etching to remove the first solder resist ink at the silk screen position. And manufacturing the screen printing layer into a windowing pattern, covering the windowing pattern on the PCB, and etching to remove the printing ink at the screen printing position, so that the windowing position exposes copper or leaks the base material.
And covering the PCB by using a silk-screen layer windowing pattern, and coating second silk-screen printing ink at the silk-screen position so that the second silk-screen printing ink fills the area for removing the first solder resist ink. And (4) using the silk-screen layer windowing graph again to cover the PCB, and coating second silk-screen printing ink at the silk-screen position, so that the second silk-screen printing ink fills the first solder resist ink area removed in the earlier stage, and the addition of the second silk-screen is completed.
In some embodiments, the method further comprises: and setting the first solder resist ink and the second silk-screen printing ink into different colors. In this embodiment, the first solder resist ink is green, and the second screen printing ink is white, that is, the screen printing layer windowing pattern is reused to cover the PCB board, and the white screen printing ink is coated at the screen printing position, so that the green solder resist ink area removed at the earlier stage is filled with the white screen printing ink, thereby completing the addition of the white screen printing.
In some embodiments, the applying a second screen-printing ink at the screen-printing location comprises: and keeping the thickness of the second silk-screen printing ink consistent with the thickness of the first solder resist ink. In the conventional PCB production and processing, the thickness of green solder resist ink is 12.7-17.78 um, the thickness of white screen printing ink is 10.16-15.24 um, the relative dielectric constant epsilon of the green solder resist ink and the white screen printing ink is the same, so the thickness of the green solder resist ink is consistent with the thickness of the white screen printing ink, a high-speed signal below the white screen printing ink is consistent with the transmission impedance of a high-speed signal below the green solder resist ink, the transmission impedance mutation can not be caused, and the thickness of the filled white screen printing ink is strictly controlled in the processing process and is consistent with the thickness of the green solder resist ink around the white screen printing ink. Fig. 7 is a longitudinal cutting view of the PCB board after the board processing is completed. As shown in fig. 7, the processed PCB board includes polypropylene (pp) 1, high-speed traces 2, green solder resist ink 3, and white screen printing ink 4.
The embodiment of the invention can effectively solve the problem of the silk-screen design of the PCB, so that the PCB is more beautiful and neat. The PCB board card is more convenient to miniaturize and design with high density, and the miniaturization design of electronic products is ensured. The high-speed signal wiring is printed by silk screen, so that the impedance of the high-speed signal wiring is not suddenly changed, the transmission quality of the high-speed signal is ensured, and the integrity of the high-speed signal is improved.
It should be particularly noted that, the steps in the embodiments of the method for preventing the PCB screen printing from affecting the impedance change of the high-speed signal may be mutually intersected, replaced, added, or deleted, so that these methods for preventing the PCB screen printing from affecting the impedance change of the high-speed signal through reasonable permutation and combination transformation also belong to the protection scope of the present invention, and the protection scope of the present invention should not be limited to the embodiments.
In view of the above, a second aspect of the embodiments of the present invention provides a system for preventing PCB screen printing from affecting impedance change of high-speed signals. As shown in fig. 8, the system 200 includes the following modules: the format module is configured for setting the size of the silk-screen fonts into a uniform size format; the solder mask module is configured for arranging an ink solder mask layer on the PCB board; the etching module is configured to make the silk-screen layer into a windowing pattern, cover the windowing pattern on the PCB, and etch and remove the first solder resist ink at the silk-screen position; and the coating module is configured for covering the PCB by using a screen printing layer windowing pattern and coating the second screen printing ink at the screen printing position so that the second screen printing ink fills the area for removing the first solder resist ink.
In some embodiments, the coating module is configured to: and keeping the thickness of the second silk-screen printing ink consistent with the thickness of the first solder resist ink.
In some embodiments, the format module is configured to: and keeping the width of the silk-screen lines to be larger than or equal to a first preset length, and keeping the distance between the silk-screen lines to be larger than or equal to a second preset length.
In some embodiments, the system further comprises an identification module configured to: and setting the first solder resist ink and the second silk-screen printing ink into different colors.
In view of the above object, a third aspect of the embodiments of the present invention provides a computer device, including: at least one processor; and a memory storing computer instructions executable on the processor, the instructions being executable by the processor to perform the steps of: s1, setting the size of the silk-screen font into a uniform size format; s2, arranging an ink solder mask on the PCB board card; s3, making the silk-screen layer into a windowing pattern, covering the windowing pattern on the PCB, and etching to remove the first solder resist ink at the silk-screen position; and S4, covering the PCB by using a silk-screen layer windowing pattern, and coating the second silk-screen printing ink at the silk-screen position to enable the second silk-screen printing ink to fill the area for removing the first solder resist ink.
In some embodiments, the applying a second screen-printing ink at the screen-printing location comprises: and keeping the thickness of the second silk-screen printing ink consistent with the thickness of the first solder resist ink.
In some embodiments, the setting the size of the silk-screen font to a uniform size format includes: and keeping the width of the silk-screen lines to be larger than or equal to a first preset length, and keeping the distance between the silk-screen lines to be larger than or equal to a second preset length.
In some embodiments, the steps further comprise: and setting the first solder resist ink and the second silk-screen printing ink into different colors.
Fig. 9 is a schematic diagram of a hardware structure of an embodiment of the computer device for preventing PCB screen printing from affecting impedance change of high-speed signals according to the present invention.
Taking the apparatus shown in fig. 9 as an example, the apparatus includes a processor 301 and a memory 302.
The processor 301 and the memory 302 may be connected by a bus or other means, and fig. 9 illustrates the connection by a bus as an example.
The memory 302 is used as a non-volatile computer-readable storage medium, and may be used to store non-volatile software programs, non-volatile computer-executable programs, and modules, such as program instructions/modules corresponding to the method for preventing PCB screen printing from affecting high-speed signal impedance change in the embodiment of the present application. The processor 301 executes various functional applications and data processing of the server by running the nonvolatile software program, instructions and modules stored in the memory 302, that is, implements a method for preventing PCB screen printing from affecting high-speed signal impedance changes.
The memory 302 may include a storage program area and a storage data area, wherein the storage program area may store an operating system, an application program required for at least one function; the storage data area may store data created according to use of a method of preventing PCB screen printing from affecting the impedance change of the high-speed signal, and the like. Further, the memory 302 may include high speed random access memory, and may also include non-volatile memory, such as at least one magnetic disk storage device, flash memory device, or other non-volatile solid state storage device. In some embodiments, memory 302 may optionally include memory located remotely from processor 301, which may be connected to local modules over a network. Examples of such networks include, but are not limited to, the internet, intranets, local area networks, mobile communication networks, and combinations thereof.
One or more computer instructions 303 corresponding to the method for preventing PCB screen printing from affecting the impedance change of the high-speed signal are stored in the memory 302, and when being executed by the processor 301, the method for preventing PCB screen printing from affecting the impedance change of the high-speed signal in any of the above-mentioned method embodiments is executed.
Any embodiment of the computer device executing the method for preventing PCB screen printing from influencing impedance change of high-speed signals can achieve the same or similar effects as any corresponding method embodiment.
The present invention also provides a computer readable storage medium storing a computer program which, when executed by a processor, performs a method of preventing PCB screen printing from affecting high-speed signal impedance changes.
Fig. 10 is a schematic diagram of an embodiment of the computer storage medium for preventing PCB screen printing from affecting high-speed signal impedance change according to the present invention. Taking the computer storage medium as shown in fig. 10 as an example, the computer readable storage medium 401 stores a computer program 402 which, when executed by a processor, performs the method as described above.
Finally, it should be noted that, as those skilled in the art can understand that all or part of the processes in the methods of the above embodiments can be implemented by instructing relevant hardware through a computer program, a program of the method for preventing PCB screen printing from affecting high-speed signal impedance changes can be stored in a computer readable storage medium, and when executed, the program can include the processes of the embodiments of the methods described above. The storage medium of the program may be a magnetic disk, an optical disk, a Read Only Memory (ROM), a Random Access Memory (RAM), or the like. The embodiments of the computer program may achieve the same or similar effects as any of the above-described method embodiments.
The foregoing is an exemplary embodiment of the present disclosure, but it should be noted that various changes and modifications could be made herein without departing from the scope of the present disclosure as defined by the appended claims. The functions, steps and/or actions of the method claims in accordance with the disclosed embodiments described herein need not be performed in any particular order. Furthermore, although elements of the embodiments of the invention may be described or claimed in the singular, the plural is contemplated unless limitation to the singular is explicitly stated.
It should be understood that, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly supports the exception. It should also be understood that "and/or" as used herein is meant to include any and all possible combinations of one or more of the associated listed items.
The numbers of the embodiments disclosed in the embodiments of the present invention are merely for description, and do not represent the merits of the embodiments.
It will be understood by those skilled in the art that all or part of the steps for implementing the above embodiments may be implemented by hardware, or may be implemented by a program instructing relevant hardware, and the program may be stored in a computer-readable storage medium, and the above-mentioned storage medium may be a read-only memory, a magnetic disk or an optical disk, etc.
Those of ordinary skill in the art will understand that: the discussion of any embodiment above is meant only to be exemplary, and is not intended to intimate that the scope of the disclosure, including the claims, is limited to these examples; within the idea of an embodiment of the invention, also technical features in the above embodiment or in different embodiments may be combined and there are many other variations of the different aspects of the embodiments of the invention as described above, which are not provided in detail for the sake of brevity. Therefore, any omissions, modifications, substitutions, improvements, and the like that may be made without departing from the spirit and principles of the embodiments of the present invention are intended to be included within the scope of the embodiments of the present invention.
Claims (8)
1. A method for preventing PCB silk screen printing from influencing high-speed signal impedance change is characterized by comprising the following steps:
setting the size of the silk-screen font into a uniform size format;
arranging an ink solder mask on the PCB;
manufacturing the silk-screen layer into a windowing graph, covering the windowing graph on a PCB (printed circuit board), and etching to remove the first solder resist ink at the silk-screen position; and
covering the PCB card with a silk-screen layer windowing pattern, coating second silk-screen printing ink at the silk-screen position to enable the second silk-screen printing ink to fill the area for removing the first solder resist ink,
wherein said applying a second screen printing ink at said screen printing position comprises: and keeping the thickness of the second silk-screen printing ink consistent with the thickness of the first solder resist ink.
2. The method of claim 1, wherein the setting the size of the silk-screen font to a uniform size format comprises:
and keeping the width of the silk-screen lines to be larger than or equal to a first preset length, and keeping the distance between the silk-screen lines to be larger than or equal to a second preset length.
3. The method of claim 1, further comprising:
and setting the first solder resist ink and the second silk-screen printing ink into different colors.
4. The utility model provides a prevent that PCB silk screen printing from influencing high-speed signal impedance change's system which characterized in that includes:
the format module is configured to set the size of the silk-screen font into a uniform size format;
the solder mask module is configured for arranging an ink solder mask layer on the PCB board;
the etching module is configured for manufacturing the silk-screen layer into a windowing pattern, covering the windowing pattern on the PCB board card, and etching to remove the first solder resist ink at the silk-screen position; and
a coating module configured to use a silk-screen layer windowing pattern to cover the PCB, coat a second silk-screen printing ink at the silk-screen position, so that the second silk-screen printing ink fills the area where the first solder resist ink is removed,
wherein the coating module is configured to: and keeping the thickness of the second silk-screen printing ink consistent with the thickness of the first solder resist ink.
5. The system of claim 4, wherein the format module is configured to:
and keeping the width of the silk-screen lines to be larger than or equal to a first preset length, and keeping the distance between the silk-screen lines to be larger than or equal to a second preset length.
6. The system of claim 4, further comprising an identification module configured to:
and setting the first solder resist ink and the second silk-screen printing ink into different colors.
7. A computer device, comprising:
at least one processor; and
a memory storing computer instructions executable on the processor, the instructions when executed by the processor implementing the steps of the method of any one of claims 1 to 3.
8. A computer-readable storage medium, in which a computer program is stored which, when being executed by a processor, carries out the steps of the method according to any one of claims 1 to 3.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210298601.XA CN114398850B (en) | 2022-03-25 | 2022-03-25 | Method and device for preventing PCB screen printing from influencing impedance change of high-speed signal |
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| CN202210298601.XA CN114398850B (en) | 2022-03-25 | 2022-03-25 | Method and device for preventing PCB screen printing from influencing impedance change of high-speed signal |
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