CN110337174A - A kind of pcb board and a kind of preparation method of pcb board - Google Patents
A kind of pcb board and a kind of preparation method of pcb board Download PDFInfo
- Publication number
- CN110337174A CN110337174A CN201910384819.5A CN201910384819A CN110337174A CN 110337174 A CN110337174 A CN 110337174A CN 201910384819 A CN201910384819 A CN 201910384819A CN 110337174 A CN110337174 A CN 110337174A
- Authority
- CN
- China
- Prior art keywords
- pcb board
- substrate surface
- dimensional code
- electronic component
- location information
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a kind of pcb boards, and the white space of substrate surface is provided with two dimensional code, and the address location information that the electronic component in need that substrate surface in pcb board is arranged in is located at the substrate surface is stored in the corresponding database of the two dimensional code.The identification information that the silk-screen printing near pad corresponds to electronic component is not needed then in a substrate accordingly, only need to be arranged a two dimensional code, so as to avoiding near pad silk-screen printing from corresponding to the identification information of electronic component, can prevent since user's identification caused by silk-screen density is excessively high is too low；And silk-screen is reduced it is possible to prevente effectively from influence of the wire printing material to link impedance in pcb board.During preparing pcb board, then need according to the corresponding address location information setting electronic component of two dimensional code.The present invention also provides a kind of preparation methods of pcb board, equally have above-mentioned beneficial effect.
Description
Technical field
The present invention relates to technical field of PCB board, more particularly to a kind of pcb board and a kind of preparation method of PCB plate.
Background technique
As the continuous progress of science and technology, the structure and manufacture craft of PCB (printed circuit board) have been achieved in recent years
Greatly development.
At this stage, in order to facilitate the installation of electronic component in pcb board, it will usually corresponding in the substrate surface of PCB plate
The information such as the identification information of the position silk-screen printing of a certain electronic component electronic component, such as number are set, thus just
The installation of electronic component in pcb board.But with the rapid advances of technology and development, for the cabling of various high-speed channels
It is required that more and more harsh, influence of the material of silk-screen printing to impedance is increasingly taken seriously, so how to reduce silk-screen printing
Influence is those skilled in the art's urgent problem caused by pcb board.
Summary of the invention
The object of the present invention is to provide a kind of pcb boards, can influence caused by pcb board to avoid silk-screen printing；The present invention
A kind of preparation method of pcb board is also provided, can be influenced caused by pcb board to avoid silk-screen printing.
In order to solve the above technical problems, the present invention provides a kind of pcb board, comprising:
Substrate；
Positioned at the electronic component of the substrate surface；
Positioned at the two dimensional code of the substrate surface white space；Wherein, it is stored in the corresponding database of the two dimensional code
The electronic component is located at the address location information of the substrate surface.
Optionally, the substrate surface white space is pasted with paster, and the paster surface is provided with the two dimensional code.
Optionally, the substrate surface is printed with the printing layer to form the pattern in 2 D code.
Optionally, the printing layer is ink layer.
Optionally, the two dimensional code is QR code code.
Optionally, the illustraton of model of the pcb board is stored in the database, the illustraton of model includes the corresponding electronics
The device model figure of component, and the address location information of the corresponding device model figure.
The present invention also provides a kind of preparation methods of pcb board, comprising:
Scanning is located at the two dimensional code of substrate surface white space, to access the database of the corresponding two dimensional code, obtains electricity
Sub- component is located at the address location information of the substrate surface；
The electronic component is set to the substrate surface according to the address location information, the PCB is made
Plate.
Optionally, described that the electronic component is set to by the pcb board surface packet according to the address location information
It includes:
The electronic component is conformed to by the substrate surface by solder according to the address location information；
The electronic component is soldered to the substrate surface by reflow soldering process.
Optionally, the scanning is located at the two dimensional code of substrate surface white space, to be connected to the corresponding two dimensional code
Database includes:
Scanning is located at the QR code code of substrate surface white space, to be connected to the data of the corresponding QR code code
Library.
Optionally, the scanning is located at the two dimensional code of substrate surface white space, to be connected to the corresponding two dimensional code
Database, the address location information that acquisition electronic component is located at the substrate surface include:
Scanning is located at the two dimensional code of substrate surface white space, to be connected to the database of the corresponding two dimensional code, obtains
The illustraton of model of the pcb board；The illustraton of model includes the device model figure of the corresponding electronic component, and the corresponding device
The address location information of part illustraton of model.
A kind of pcb board provided by the present invention is provided with two dimensional code in the white space of substrate surface, and the two dimensional code is corresponding
Database in store the address location that the electronic component in need that substrate surface in pcb board is arranged in is located at the substrate surface
Information.Do not need the identification information that the silk-screen printing near pad corresponds to electronic component then in a substrate accordingly, it is only necessary to
One two dimensional code is set, so as to reduce the programming time that engineer edits silk-screen printing, shortens the design of PCB plate
Process；It avoids near pad silk-screen printing to correspond to the identification information of electronic component simultaneously, can prevent due to silk-screen density
User's identification caused by excessively high is too low；And silk-screen is reduced it is possible to prevente effectively from wire printing material is to link impedance in pcb board
It influences, that is, avoids silk-screen printing influence caused by pcb board.During preparing pcb board, then need according to two dimensional code pair
The address location information setting electronic component answered.
The present invention also provides a kind of preparation methods of pcb board, equally have above-mentioned beneficial effect, no longer go to live in the household of one's in-laws on getting married herein
It states.
Detailed description of the invention
It, below will be to embodiment or existing for the clearer technical solution for illustrating the embodiment of the present invention or the prior art
Attached drawing needed in technical description is briefly described, it should be apparent that, the accompanying drawings in the following description is only this hair
Bright some embodiments for those of ordinary skill in the art without creative efforts, can be with root
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is the structural schematic diagram of pcb board in the prior art；
Fig. 2 is a kind of structural schematic diagram of pcb board provided by the embodiment of the present invention；
Fig. 3 is a kind of flow chart of pcb board preparation method provided by the embodiment of the present invention；
Fig. 4 is a kind of flow chart of specific pcb board preparation method provided by the embodiment of the present invention；
Fig. 5 is the flow chart of the specific pcb board preparation method of another kind provided by the embodiment of the present invention.
Specific embodiment
Core of the invention is to provide a kind of pcb board.It is the structural representation of pcb board in the prior art referring to Fig. 1, Fig. 1
Figure.In the prior art, in order to facilitate the installation of electronic component in pcb board, it will usually in the pad of the substrate surface of pcb board
Near zone silk-screen printing needs to be arranged in the identification information of the electronic component of the pad region.But with pcb board
The raising of middle device and link density causes silk-screen density to be also continuously improved, so that the identification that will lead to user is beaten greatly
Discount；Excessive wire printing material, which is arranged, in substrate surface will affect the impedance of link in pcb board；And edit the figure of silk-screen printing
Case can greatly waste the time of engineer, i.e., silk-screen can cause many adverse effects to pcb board in the prior art.
And a kind of pcb board provided by the present invention, the white space of substrate surface is provided with two dimensional code, the two dimensional code pair
Stored in the database answered the electronic component in need that substrate surface in pcb board is set be located at the substrate surface address it is fixed
Position information.It does not need the identification information that the silk-screen printing near pad corresponds to electronic component then in a substrate accordingly, only needs
One two dimensional code is set, so as to reduce the programming time that engineer edits silk-screen printing, shortens setting for pcb board
Count process；It avoids near pad silk-screen printing to correspond to the identification information of electronic component simultaneously, can prevent since silk-screen is close
It is too low to spend user's identification caused by height；And silk-screen is reduced it is possible to prevente effectively from wire printing material is to link impedance in pcb board
Influence, that is, avoid silk-screen printing influence caused by pcb board.During preparing pcb board, then need according to two dimensional code
Electronic component is arranged in corresponding address location information.
In order to enable those skilled in the art to better understand the solution of the present invention, with reference to the accompanying drawings and detailed description
The present invention is described in further detail.Obviously, described embodiments are only a part of the embodiments of the present invention, rather than
Whole embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creative work premise
Under every other embodiment obtained, shall fall within the protection scope of the present invention.
Referring to FIG. 2, Fig. 2 is a kind of structural schematic diagram of pcb board provided by the embodiment of the present invention.
Referring to fig. 2, in embodiments of the present invention, the pcb board may include substrate；Positioned at the electronics of the substrate surface
Component；Positioned at the two dimensional code of the substrate surface white space；Wherein, it is stored in the corresponding database of the two dimensional code
State the address location information that electronic component is located at the substrate surface.
The material of the substrate is the material of conventional pcb board substrate, is usually made of glass cloth and resin.Related substrate
Specific material in embodiments of the present invention and be not specifically limited, it is depending on the circumstances.Correspondingly, the thickness of aforesaid substrate
Equal design parameters are equally not specifically limited in embodiments of the present invention, depending on the circumstances.
The predeterminable area on aforesaid substrate surface is provided with electronic component.Specifically, being usually provided in substrate surface more
A pad, and above-mentioned electronic component then passes through the pad and is electrically connected with the conducting wire in substrate, so that electronics member device
It is electrically connected to each other between part.Specific type in relation to electronic component in embodiments of the present invention and is not specifically limited, the electricity
Sub- component can be inductance, capacitor, chip etc..
Under normal conditions, it is generally also provided with other than having and needing to be arranged the region of electronic component in substrate surface
The white space of setting electronic component is not needed.And in embodiments of the present invention, it can be arranged in the white space of substrate surface
Two dimensional code, the corresponding database of the two dimensional code, when scanning the two dimensional code, the accessible database, is deposited in the database
Contain the address location information that above-mentioned electronic component is located at substrate surface.It, can i.e. when electronic component is arranged in substrate surface
To determine a certain electronic component in the specific position of substrate surface according to the address location information.Related address above mentioned positioning letter
The specific format and content of breath in embodiments of the present invention and are not specifically limited, as long as can be true according to the address location information
Electronic component is determined in the specific position of substrate surface.
Above-mentioned two dimensional code can be specially QR code code in embodiments of the present invention.Certainly, in embodiments of the present invention may be used
To select other kinds of two dimensional code, the specific type in relation to two dimensional code in embodiments of the present invention and is not specifically limited.
Specifically, specifically providing the set-up mode of two kinds of two dimensional codes in embodiments of the present invention.The first, the substrate table
Face white space is pasted with paster, and the paster surface is provided with the two dimensional code.I.e. above-mentioned pattern in 2 D code can print first
System on paster surface, then by paster applying substrate surface white space, with the white space of substrate surface be arranged two dimension
Code.Above-mentioned paster is usually to pass through double-sided adhesive to be fitted in substrate surface.
Second, the substrate surface is printed with the printing layer to form the pattern in 2 D code.I.e. above-mentioned two dimensional code is specific
It is the two dimensional code for being printed on substrate surface white space, which is the printing by being printed on substrate surface white space
Layer is constituted, material, that is, existing printing material of the printing layer.Specific material in relation to printing layer can refer to the prior art,
This is no longer repeated.Under normal conditions, the material of above-mentioned printing layer is ink, i.e. the printing layer is usually ink layer.
Specifically, in embodiments of the present invention, it is described according to the illustraton of model that can store the pcb board in library, the mould
Type figure includes the device model figure of the corresponding electronic component, and the address location letter of the corresponding device model figure
Breath.
I.e. in embodiments of the present invention, the address location information stored in the corresponding database of above-mentioned two dimensional code is specifically
It is shown by way of picture, so that the structure of pcb board more intuitive can be presented in face of user.Specifically,
The illustraton of model stored in the database corresponds to pcb board provided by the embodiment of the present invention, the device model for including in the illustraton of model
Figure in requisition for the electronic component that pcb board surface is arranged in, and above-mentioned device model figure and the illustraton of model of corresponding PCB plate it
Between positional relationship embody address above mentioned location information.Certainly, the data as storage in the database, in above-mentioned correspondence
The particular content that address above mentioned location information can be specifically added in the illustraton of model of pcb board, so that in the embodiment of the present invention
The address location information stored in the corresponding database of two dimensional code is more intuitive.Particular content and shape in relation to above-mentioned illustraton of model
Formula can be not specifically limited herein determines according to actual conditions.
A kind of pcb board provided by the embodiment of the present invention is provided with two dimensional code in the white space of substrate surface, the two dimension
The ground that the electronic component in need that substrate surface in pcb board is arranged in is located at the substrate surface is stored in the corresponding database of code
Location location information.Do not need the identification information that the silk-screen printing near pad corresponds to electronic component then in a substrate accordingly,
It only needs to be arranged a two dimensional code and shortens pcb board so as to reduce the programming time that engineer edits silk-screen printing
Design cycle；It avoids near pad silk-screen printing to correspond to the identification information of electronic component simultaneously, can prevent due to silk-screen
User's identification caused by density is excessively high is too low；And silk-screen is reduced it is possible to prevente effectively from wire printing material is to chain roadlock in pcb board
Anti- influence avoids silk-screen printing influence caused by pcb board.During preparing pcb board, then need according to two dimension
Electronic component is arranged in the corresponding address location information of code.
A kind of preparation method of pcb board provided by the present invention is introduced below, preparation method described below with
The structure of the pcb board of foregoing description can correspond to each other reference.
Referring to FIG. 3, Fig. 3 is a kind of flow chart of pcb board preparation method provided by the embodiment of the present invention.
Referring to Fig. 3, in embodiments of the present invention, the preparation method of the pcb board may include:
S101: scanning is located at the two dimensional code of substrate surface white space, to access the database of corresponding two dimensional code, obtains electricity
Sub- component is located at the address location information of substrate surface.
In embodiments of the present invention, the substrate surface white space of pcb board is provided with two dimensional code.Related substrate and two dimension
The particular content of code is described in detail in foregoing invention embodiment, is no longer repeated herein.
In this step, it will usually above-mentioned two dimensional code is scanned by camera, to access the corresponding database of the two dimensional code,
And address location information is obtained from the database, it is a certain to be determined in the next steps according to the address location information
Electronic component is in the specific position of substrate surface.Particular content in relation to address location information is in foregoing invention embodiment
It is described in detail, is no longer repeated herein.
Specifically, this step can be specially the QR code code that scanning is located at substrate surface white space, to be connected to pair
Answer the database of the QR code code.I.e. above-mentioned two dimensional code can be specially QR code code in embodiments of the present invention.Certainly,
Other kinds of two dimensional code can be selected in embodiments of the present invention, and the specific type in relation to two dimensional code is in embodiments of the present invention
And it is not specifically limited.
S102: electronic component is set to by substrate surface according to address location information, pcb board is made.
In this step, substrate surface can be arranged in electronic component according to the address location information obtained in S101
Corresponding position, to be finally made pcb board.Specific steps in relation to electronic component is arranged will be done in detail in following inventive embodiments
It is thin to introduce, it is no longer repeated herein.
A kind of preparation method of pcb board provided by the embodiment of the present invention is provided with two in the white space of substrate surface
Code is tieed up, the electronic component in need that substrate surface in pcb board is set is stored in the corresponding database of the two dimensional code and is located at this
The address location information of substrate surface.It does not need the silk-screen printing near pad then when making substrate accordingly and corresponds to electronics member
The identification information of device, it is only necessary to which a two dimensional code is set, so as to reduce the layout that engineer edits silk-screen printing
Time shortens the design cycle of pcb board；Near pad silk-screen printing is avoided to correspond to the identification information of electronic component simultaneously,
It can prevent since the excessively high caused user's identification of silk-screen density is too low；And silk-screen is reduced it is possible to prevente effectively from wire printing material
Influence to link impedance in pcb board avoids silk-screen printing influence caused by pcb board.In the process for preparing PCB plate
In, then it needs according to the corresponding address location information setting electronic component of two dimensional code.
It will be done in following inventive embodiments in detail in relation to a kind of particular content of pcb board preparation method provided by the present invention
It is thin to introduce.
Referring to FIG. 4, Fig. 4 is a kind of flow chart of specific pcb board preparation method provided by the embodiment of the present invention.
Referring to fig. 4, in embodiments of the present invention, the preparation method of the pcb board may include:
S201: scanning is located at the two dimensional code of substrate surface white space, to access the database of corresponding two dimensional code, obtains electricity
Sub- component is located at the address location information of substrate surface.
This step and S101 in foregoing invention embodiment are almost the same, and detailed content please refers to foregoing invention embodiment,
This is no longer repeated.
S202: electronic component is conformed to by solder by substrate surface according to address location information.
In this step, only electronic component can be fitted in substrate according to the address location information obtained in S201
The corresponding position on surface, is bonded to each other between electronic component and substrate especially by solder at this time.Related address location information
Particular content be described in detail in foregoing invention embodiment, no longer repeated herein.
S203: the electronic component is soldered to by the substrate surface by reflow soldering process.
In this step, it specifically can melt solder by reflow soldering process, electronic component is soldered to pcb board table
Face, so that electronic component is fixedly connected with substrate.When can be significantly reduced the preparation of pcb board especially by reflow soldering process
Between, the cost of manufacture of pcb board is reduced, while the production of pcb board can be made more to automate.In relation to the specific of reflow soldering process
Content can refer to the prior art, no longer be repeated herein.
It will be done in following inventive embodiments in detail in relation to a kind of particular content of pcb board preparation method provided by the present invention
It is thin to introduce.
Referring to FIG. 5, Fig. 5 is the flow chart of the specific pcb board preparation method of another kind provided by the embodiment of the present invention.
Referring to Fig. 5, in embodiments of the present invention, the preparation method of the pcb board may include:
S301: scanning is located at the two dimensional code of substrate surface white space, to be connected to the database of corresponding two dimensional code, obtains
The illustraton of model of pcb board.
In embodiments of the present invention, the illustraton of model includes the device model figure of the corresponding electronic component and right
Answer the address location information of the device model figure.
In this step, the PCB being finally made by method provided by database or the corresponding embodiment of the present invention of acquisition
The illustraton of model of plate, due to including address location information in the illustraton of model, this step can be by obtaining the illustraton of model to obtain
Address above mentioned location information.Particular content in relation to illustraton of model can refer to foregoing invention embodiment, no longer be repeated herein.
Above-mentioned illustraton of model can make address location information more intuitive.
S302: electronic component is set to by substrate surface according to address location information, pcb board is made.
This step and S102 in foregoing invention embodiment are almost the same, and detailed content please refers to foregoing invention embodiment,
This is no longer repeated.
A kind of preparation method of pcb board provided by the embodiment of the present invention shows address location by way of illustraton of model
Information can make address location information more intuitive.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with it is other
The difference of embodiment, same or similar part may refer to each other between each embodiment.For being filled disclosed in embodiment
For setting, since it is corresponded to the methods disclosed in the examples, so being described relatively simple, related place is referring to method part
Explanation.
Professional further appreciates that, unit described in conjunction with the examples disclosed in the embodiments of the present disclosure
And algorithm steps, can be realized with electronic hardware, computer software, or a combination of the two, in order to clearly demonstrate hardware and
The interchangeability of software generally describes each exemplary composition and step according to function in the above description.These
Function is implemented in hardware or software actually, the specific application and design constraint depending on technical solution.Profession
Technical staff can use different methods to achieve the described function each specific application, but this realization is not answered
Think beyond the scope of this invention.
The step of method described in conjunction with the examples disclosed in this document or algorithm, can directly be held with hardware, processor
The combination of capable software module or the two is implemented.Software module can be placed in random access memory (RAM), memory, read-only deposit
Reservoir (ROM), electrically programmable ROM, electrically erasable ROM, register, hard disk, moveable magnetic disc, CD-ROM or technology
In any other form of storage medium well known in field.
Finally, it is to be noted that, herein, relational terms such as first and second and the like be used merely to by
One entity or operation are distinguished with another entity or operation, without necessarily requiring or implying these entities or operation
Between there are any actual relationship or orders.Moreover, the terms "include", "comprise" or its any other variant meaning
Covering non-exclusive inclusion, so that the process, method, article or equipment for including a series of elements not only includes that
A little elements, but also including other elements that are not explicitly listed, or further include for this process, method, article or
The intrinsic element of equipment.In the absence of more restrictions, the element limited by sentence "including a ...", is not arranged
Except there is also other identical elements in the process, method, article or apparatus that includes the element.
A kind of pcb board provided by the present invention and a kind of preparation method of pcb board are described in detail above.Herein
In apply that a specific example illustrates the principle and implementation of the invention, the explanation of above example is only intended to sides
Assistant solves method and its core concept of the invention.It should be pointed out that for those skilled in the art, not
, can be with several improvements and modifications are made to the present invention under the premise of being detached from the principle of the invention, these improvement and modification are also fallen into
In the protection scope of the claims in the present invention.
Claims (10)
1. a kind of pcb board characterized by comprising
Substrate；
Positioned at the electronic component of the substrate surface；
Positioned at the two dimensional code of the substrate surface white space；Wherein, it is stored in the corresponding database of the two dimensional code described
Electronic component is located at the address location information of the substrate surface.
2. pcb board according to claim 1, which is characterized in that the substrate surface white space is pasted with paster, described
Paster surface is provided with the two dimensional code.
3. pcb board according to claim 1, which is characterized in that the substrate surface is printed with to form the two dimensional code figure
The printing layer of case.
4. pcb board according to claim 3, which is characterized in that the printing layer is ink layer.
5. pcb board according to claim 1, which is characterized in that the two dimensional code is QR code code.
6. according to claim 1 to pcb board described in any one of 5 claims, which is characterized in that be stored in the database
The illustraton of model of the pcb board, the illustraton of model include the device model figure of the corresponding electronic component, and the corresponding device
The address location information of part illustraton of model.
7. a kind of preparation method of pcb board characterized by comprising
Scanning is located at the two dimensional code of substrate surface white space, to access the database of the corresponding two dimensional code, obtains electronics member
Device is located at the address location information of the substrate surface；
The electronic component is set to the substrate surface according to the address location information, the pcb board is made.
8. the method according to the description of claim 7 is characterized in that described according to the address location information that the electronics is first
Device is set to the pcb board surface
The electronic component is conformed to by the substrate surface by solder according to the address location information；
The electronic component is soldered to the substrate surface by reflow soldering process.
9. the method according to the description of claim 7 is characterized in that the scanning is located at the two dimension of substrate surface white space
Yard, include: to be connected to the database of the corresponding two dimensional code
Scanning is located at the QR code code of substrate surface white space, to be connected to the database of the corresponding QR code code.
10. according to method described in any one of claim 7 to 9 claim, which is characterized in that the scanning is located at substrate table
The two dimensional code of face white space obtains electronic component and is located at the substrate to be connected to the database of the corresponding two dimensional code
The address location information on surface includes:
Scanning is located at the two dimensional code of substrate surface white space, to be connected to the database of the corresponding two dimensional code, described in acquisition
The illustraton of model of pcb board；The illustraton of model includes the device model figure of the corresponding electronic component, and the corresponding device mould
The address location information of type figure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910384819.5A CN110337174A (en) | 2019-05-09 | 2019-05-09 | A kind of pcb board and a kind of preparation method of pcb board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910384819.5A CN110337174A (en) | 2019-05-09 | 2019-05-09 | A kind of pcb board and a kind of preparation method of pcb board |
Publications (1)
| Publication Number | Publication Date |
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| CN110337174A true CN110337174A (en) | 2019-10-15 |
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| CN201910384819.5A Pending CN110337174A (en) | 2019-05-09 | 2019-05-09 | A kind of pcb board and a kind of preparation method of pcb board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114819025A (en) * | 2022-06-28 | 2022-07-29 | 深圳市国人光速科技有限公司 | Ink jet image generating method, device and computer containing multiple variable information |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007281121A (en) * | 2006-04-05 | 2007-10-25 | Yamagata Casio Co Ltd | Component mounter |
| JP2009231380A (en) * | 2008-03-19 | 2009-10-08 | Toyota Industries Corp | Printed wiring board |
| CN205912316U (en) * | 2016-06-06 | 2017-01-25 | 胜华电子（惠阳）有限公司 | PCB (Printed circuit board) convenient for recognition |
-
2019
- 2019-05-09 CN CN201910384819.5A patent/CN110337174A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007281121A (en) * | 2006-04-05 | 2007-10-25 | Yamagata Casio Co Ltd | Component mounter |
| JP2009231380A (en) * | 2008-03-19 | 2009-10-08 | Toyota Industries Corp | Printed wiring board |
| CN205912316U (en) * | 2016-06-06 | 2017-01-25 | 胜华电子（惠阳）有限公司 | PCB (Printed circuit board) convenient for recognition |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114819025A (en) * | 2022-06-28 | 2022-07-29 | 深圳市国人光速科技有限公司 | Ink jet image generating method, device and computer containing multiple variable information |
| CN114819025B (en) * | 2022-06-28 | 2022-09-13 | 深圳市国人光速科技有限公司 | Ink jet image generating method and device containing multiple variable information and computer |
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