CN113135054B - PCB manufacturing method and device, storage medium and PCB - Google Patents
PCB manufacturing method and device, storage medium and PCB Download PDFInfo
- Publication number
- CN113135054B CN113135054B CN202110315111.1A CN202110315111A CN113135054B CN 113135054 B CN113135054 B CN 113135054B CN 202110315111 A CN202110315111 A CN 202110315111A CN 113135054 B CN113135054 B CN 113135054B
- Authority
- CN
- China
- Prior art keywords
- signal
- screen
- oven
- sending
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/26—Printing on other surfaces than ordinary paper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M7/00—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Screen Printers (AREA)
- Record Information Processing For Printing (AREA)
Abstract
The application discloses a PCB manufacturing method, a device, a storage medium and a PCB, wherein the method comprises the following steps: sending a configuration signal to a screen printer to configure the printed character specification of the screen printer; acquiring a first state signal from the screen printing machine; judging whether the first state signal is in a ready state, if so, sending a first control signal to the screen printer so that the screen printer prints characters on the PCB by using a 25um water film screen printing plate; acquiring a second status signal from the oven; and judging whether the second state signal is in a ready state, if so, sending a second control signal to the oven so as to cure the PCB by the oven. According to the scheme provided by the embodiment of the application, the 25-um water film screen printing plate is adopted, the minimum specification of the printed characters is 20mil high and 4mil thick, and the processing capacity of the printed characters of the PCB can be effectively improved; the screen printer and the oven are controlled in real time, and effective operation of printing font work can be guaranteed.
Description
Technical Field
The invention relates to the technical field of PCBs, in particular to a PCB manufacturing method and device, a storage medium and a PCB.
Background
The PCB board is various according to the difference of used material, number of layers, size, technology category etc. and adopts the silk screen printing machine to print the character on the PCB board, and at present, the process capability of printing the character of PCB board is weaker, can not satisfy different production needs.
Disclosure of Invention
The following is a summary of the subject matter described in detail herein. This summary is not intended to limit the scope of the claims.
The application provides a PCB manufacturing method and device, a storage medium and a PCB, which can improve the processing capacity of printed characters of the PCB.
In a first aspect, an embodiment of the present application provides a method for manufacturing a PCB, which is applied to a PCB manufacturing apparatus, and includes: sending a configuration signal to a screen printer to configure the printing character specification of the screen printer, wherein the minimum specification of the printing character specification is 20mil high and 4mil thick; acquiring a first state signal from the screen printer; judging whether the first state signal is in a ready state, if so, sending a first control signal to the screen printer so that the screen printer prints characters on the PCB by using a 25um water film screen printing plate; acquiring a second status signal from the oven; and judging whether the second state signal is in a ready state, if so, sending a second control signal to the oven so as to cure the PCB by the oven.
Further, before the sending a configuration signal to a screen printer to configure the printed character specification of the screen printer, where the minimum specification of the printed character specification is 20mil high and 4mil thick, the method further includes: acquiring a first initialization signal; and sending the first initialization signal to a screen printer to set a working mode of the screen printer.
Further, before the determining whether the second status signal is ready status, and if so, sending a second control signal to the oven to cure the PCB, the method further includes: acquiring a second initialization signal; and sending the second initialization signal to an oven to set the operating mode of the oven.
Further, before the step of judging whether the first state signal is in a ready state, and if so, sending a first control signal to the screen printer to enable the screen printer to use a 25um hydrophenan screen to screen print characters on a PCB, the method further comprises: acquiring printing content; and obtaining a first control signal according to the printing content.
Further, after the acquiring the printed content, the method further comprises: obtaining a simulated printing image according to the printing content; and sending the simulated printing image to a display screen so that the display screen displays the simulated printing image.
Further, after judging whether the first state signal is in a ready state, and if so, sending a first control signal to the screen printer to enable the screen printer to use a 25um hydrophin screen to screen print characters on the PCB, the method further includes: acquiring an abnormal signal of the screen printing machine; and sending a first exception processing signal to the screen printing machine according to the exception signal of the screen printing machine so as to stop the screen printing machine.
Further, after determining whether the second status signal is ready, and if so, sending a second control signal to the oven to cure the PCB board, the method further includes: acquiring an abnormal signal of the oven; and sending a second abnormal processing signal to the oven according to the abnormal signal of the oven so as to stop the oven.
In a second aspect, an embodiment of the present application further provides a PCB manufacturing apparatus, including: a memory, a processor and a computer program stored on the memory and executable on the processor, the processor implementing the PCB board manufacturing method according to the first aspect when executing the computer program.
In a third aspect, the present application provides a computer-readable storage medium storing computer-executable instructions for causing a computer to perform the PCB board manufacturing method as described above.
In a fourth aspect, the present application provides a PCB manufactured by the above-mentioned PCB manufacturing method.
One or more technical schemes provided in the embodiment of the application have at least the following beneficial effects: the embodiment of the application comprises the following steps: sending a configuration signal to a screen printer to configure the printing character specification of the screen printer, wherein the minimum specification of the printing character specification is 20mil high and 4mil thick; acquiring a first state signal from the screen printer; judging whether the first state signal is in a ready state, if so, sending a first control signal to the screen printer so that the screen printer prints characters on the PCB by using a 25um water film screen printing plate; acquiring a second status signal from the oven; and judging whether the second state signal is in a ready state, if so, sending a second control signal to the oven so as to cure the PCB by the oven. According to the scheme provided by the embodiment of the application, the 25-um water film screen printing plate is adopted, the minimum specification of the printed characters is 20mil high and 4mil thick, and the processing capacity of the printed characters of the PCB can be effectively improved; the screen printer and the oven are controlled in real time, and effective operation of printing font work can be guaranteed.
Additional features and advantages of the application will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the application. The objectives and other advantages of the application may be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the example serve to explain the principles of the invention and not to limit the invention.
FIG. 1 is a flow chart of a PCB manufacturing method provided by an embodiment of the present application;
FIG. 2 is a flowchart of a detailed method before step S110 in FIG. 1;
FIG. 3 is a flowchart of a specific method before step S150 in FIG. 1;
FIG. 4 is a flowchart of a specific method before step S130 in FIG. 1;
FIG. 5 is a flowchart of a detailed method after step S410 in FIG. 4;
FIG. 6 is a flowchart of a detailed method after step S130 in FIG. 1;
FIG. 7 is a flowchart of a detailed method after step S150 in FIG. 1;
fig. 8 is an apparatus diagram of a PCB manufacturing apparatus according to another embodiment of the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
It should be noted that although functional blocks are partitioned in a schematic diagram of an apparatus and a logical order is shown in a flowchart, in some cases, the steps shown or described may be performed in a different order than the partitioning of blocks in the apparatus or the order in the flowchart. The terms first, second and the like in the description and in the claims, and the drawings described above, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein is for the purpose of describing embodiments of the invention only and is not intended to be limiting of the invention.
The application provides a PCB manufacturing method, a device, a storage medium and a PCB, wherein the PCB manufacturing method comprises the following steps: sending a configuration signal to a screen printing machine to configure the printed character specification of the screen printing machine, wherein the minimum specification of the printed character specification is 20mil high and 4mil thick; acquiring a first state signal from the screen printer; judging whether the first state signal is in a ready state, if so, sending a first control signal to the screen printer so that the screen printer prints characters on the PCB by using a 25um water film screen printing plate; acquiring a second status signal from the oven; and judging whether the second state signal is in a ready state, if so, sending a second control signal to the oven so as to cure the PCB by the oven. According to the scheme provided by the embodiment of the application, the 25-um water film screen printing plate is adopted, the minimum specification of the printed characters is 20mil high and 4mil thick, and the processing capacity of the printed characters of the PCB can be effectively improved; the screen printer and the oven are controlled in real time, and effective operation of printing font work can be guaranteed.
The embodiments of the present invention will be further explained with reference to the drawings.
As shown in fig. 1, fig. 1 is a PCB manufacturing method according to an embodiment of the present application, applied to a PCB manufacturing apparatus, including but not limited to step S110, step S120, step S130, step S140, and step S150.
Step S110, sending a configuration signal to a screen printer to configure the printing character specification of the screen printer, wherein the minimum specification of the printing character specification is 20mil high and 4mil thick;
it should be noted that the configuration signal is used for configuring the printing character specification of the screen printer, the minimum specification of the character indicates the printing capability of the screen printer, the smaller the specification of the character is, the stronger the process capability of the printing character of the screen printer is, and the application can clearly print the characters with the height of 20mil and the thickness of 4mil, so that the minimum specification of the printing character specification is configured to be the height of 20mil and the thickness of 4 mil; in production, a height of 22mil may be used. Printed characters include, but are not limited to, '0' - '9', 'a' - 'Z'.
It should be noted that the user can configure the typographical character specification to have a word height greater than 20 mils and a word size greater than 4 mils, depending on the actual requirements.
Step S120, acquiring a first state signal from the screen printing machine;
it should be noted that the screen printer continuously sends a first status signal, where the first status signal includes status information of the screen printer, and when the PCB is placed in place in the screen printer and the screen printer determines that each preparation is completed, the screen printer is in a ready state, and the first status signal includes the ready status information of the screen printer, where the preparation includes, but is not limited to, determining whether the printing screen is placed in place, and determining whether the printing ink is sufficient.
Step S130, judging whether the first state signal is in a ready state, if so, sending a first control signal to the screen printing machine so as to enable the screen printing machine to screen print characters on the PCB by using a 25um hydrophin screen;
it can be understood that the use of 25um hydrophenan screen can improve the process capability of printing characters.
It should be noted that the 25um hydrophenan screen is made of 140T screen, and the PCB is made of 0.5Z or 10Z base copper.
Step S140, acquiring a second state signal from the oven;
it should be noted that the oven continuously sends a second status signal, the second status signal contains status information of the oven, when the PCB is placed in place in the oven, and the oven determines that each preparation is completed, the oven is in a ready state, and the second status signal contains the ready status information of the oven, and the preparation includes, but is not limited to, determining whether the oven door is in a closed state.
And S150, judging whether the second state signal is in a ready state, and if so, sending a second control signal to the oven so as to cure the PCB by the oven.
It should be noted that, the printed effect of the characters can be ensured by curing the PCB board with an oven.
In addition, referring to fig. 2, in an embodiment, before the step S110, the following steps are further included, but not limited to:
step S210, acquiring a first initialization signal;
it should be noted that the first initialization signal can be obtained through an input device, which includes but is not limited to a touch screen.
Step S220, the first initialization signal is sent to a screen printer to set the working mode of the screen printer.
It should be noted that the first initialization signal is used to set a working mode of the screen printing machine, and the working mode includes, but is not limited to, setting a printing speed of the screen printing machine and setting a usage amount of ink.
In addition, referring to fig. 3, in an embodiment, before the step S150, the following steps are further included, but not limited to:
step S310, acquiring a second initialization signal;
it should be noted that the second initialization signal can be obtained through an input device, which includes but is not limited to a touch screen.
And step S320, sending the second initialization signal to an oven so as to set the operating mode of the oven.
It should be noted that the second initialization signal is used to set the operating mode of the oven, and the operating mode includes, but is not limited to, setting the operating temperature of the oven and setting the operating time of the oven.
In addition, referring to fig. 4, in an embodiment, before the step S130, the following steps are further included, but not limited to:
step S410, acquiring printing content;
the external device has a print editing function and a storage function, and the print can be edited and acquired by the external device or acquired by the print stored in the external device.
Step S420, obtaining a first control signal according to the printing content.
It should be noted that the first control signal includes information of a printing content, and the screen printer can perform corresponding printing on the PCB according to the printing content through the first control signal.
In addition, referring to fig. 5, in an embodiment, after the step S410, the following steps are further included, but not limited to:
step S510, obtaining a simulated printing image according to the printing content;
it should be noted that, according to the printing content, the finished product image on the PCB board is obtained through simulation, i.e. the simulated printing image is obtained.
Step S520, sending the analog printing image to a display screen, so that the display screen displays the analog printing image.
It should be noted that, the display screen is used for displaying the simulated printing image, so that the intuition can be increased, and a user can quickly judge the reasonability of the layout of the characters of the PCB board through the simulated printing image, thereby improving the working efficiency.
In addition, referring to fig. 6, in an embodiment, after the step S130, the following steps are included, but not limited to:
step S610, acquiring an abnormal signal of the screen printer;
it should be noted that, when the screen printer works abnormally, an abnormal signal is sent out.
And step S620, sending a first exception processing signal to the screen printer according to the exception signal of the screen printer so as to stop the screen printer.
It should be noted that, after the abnormal signal of the screen printer is obtained, the first abnormal processing signal is sent to the screen printer in time, and the screen printer stops working, so that the screen printer can be prevented from being further damaged.
In addition, referring to fig. 7, in an embodiment, after the step S150, the following steps are included, but not limited to:
step S710, acquiring an abnormal signal of the oven;
it should be noted that, when the oven is abnormally operated, an abnormal signal is sent out.
Step S720, according to the abnormal signal of the oven, sending a second abnormal processing signal to the oven to stop the oven.
It should be noted that, after acquiring the abnormal signal of the oven, the first abnormal processing signal is sent to the oven in time, and the oven stops working, so that the oven can be prevented from being further damaged.
In addition, referring to fig. 8, an embodiment of the present invention further provides a PCB manufacturing apparatus 800 including: memory 810, processor 820, and a computer program stored on memory 810 and executable on processor 820.
The processor 820 and memory 810 may be connected by a bus or other means.
It should be noted that the non-transitory software program and instructions required for implementing the PCB manufacturing method of the above embodiment are stored in the memory 810, and when executed by the processor 820, the PCB manufacturing method of the above embodiment is executed, for example, the method steps S110 to S150 in fig. 1, the method steps S210 to S220 in fig. 2, the method steps S310 to S320 in fig. 3, the method steps S410 to S420 in fig. 4, the method steps S510 to S520 in fig. 5, the method steps S610 to S620 in fig. 6, and the method steps S710 to S720 in fig. 7 described above are executed.
The above-described embodiments of the apparatus are merely illustrative, wherein the units illustrated as separate components may or may not be physically separate, i.e. may be located in one place, or may also be distributed over a plurality of network elements. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment.
Furthermore, an embodiment of the present invention further provides a computer-readable storage medium, which stores computer-executable instructions, which are executed by a processor or a controller, for example, by a processor in the above-mentioned apparatus embodiment, and can enable the processor to execute the PCB manufacturing method in the above-mentioned embodiment, for example, execute the above-mentioned method steps S110 to S150 in fig. 1, method steps S210 to S220 in fig. 2, method steps S310 to S320 in fig. 3, method steps S410 to S420 in fig. 4, method steps S510 to S520 in fig. 5, method steps S610 to S620 in fig. 6, and method steps S710 to S720 in fig. 7.
In addition, the embodiment of the invention also provides a PCB which is manufactured by adopting the manufacturing method of the PCB.
One of ordinary skill in the art will appreciate that all or some of the steps, systems, and methods disclosed above may be implemented as software, firmware, hardware, and suitable combinations thereof. Some or all of the physical components may be implemented as software executed by a processor, such as a central processing unit, digital signal processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application specific integrated circuit. Such software may be distributed on computer readable media, which may include computer storage media (or non-transitory media) and communication media (or transitory media). The term computer storage media includes volatile and nonvolatile, removable and non-removable media implemented in any method or technology for storage of information such as computer readable instructions, data structures, program modules or other data, as is well known to those of ordinary skill in the art. Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, Digital Versatile Disks (DVD) or other optical disk storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other medium which can be used to store the desired information and which can accessed by a computer. In addition, communication media typically embodies computer readable instructions, data structures, program modules or other data in a modulated data signal such as a carrier wave or other transport mechanism and includes any information delivery media as known to those skilled in the art.
While the preferred embodiments of the present invention have been described in detail, it will be understood by those skilled in the art that the foregoing and various other changes, omissions and deviations in the form and detail thereof may be made without departing from the scope of this invention.
Claims (9)
1. A PCB board manufacturing method is applied to a PCB board manufacturing device and is characterized by comprising the following steps:
sending a configuration signal to a screen printing machine to configure the printed character specification of the screen printing machine, wherein the minimum specification of the printed character specification is 20mil high and 4mil thick;
acquiring a first state signal from the screen printer;
judging whether the first state signal is in a ready state, if so, sending a first control signal to the screen printer so that the screen printer prints characters on the PCB by using a 25um water film screen printing plate;
acquiring a second status signal from the oven;
judging whether the second state signal is in a ready state, if so, sending a second control signal to the oven so that the oven solidifies the PCB;
before the sending of the configuration signal to the screen printer to configure the printed character specification of the screen printer, where the minimum specification of the printed character specification is 20mil high and 4mil thick, the method further includes:
acquiring a first initialization signal;
and sending the first initialization signal to a screen printer to set a working mode of the screen printer.
2. The method of claim 1, wherein before the determining whether the second status signal is ready, and if so, sending a second control signal to the oven to cure the PCB, the method further comprises:
acquiring a second initialization signal;
and sending the second initialization signal to an oven to set the operating mode of the oven.
3. The method as claimed in claim 1, wherein before the determining whether the first status signal is ready status, and if so, sending a first control signal to the screen printer to make the screen printer use a 25um hydrophenan screen to screen print characters on the PCB, the method further comprises:
acquiring printing content;
and obtaining a first control signal according to the printing content.
4. The method of claim 3, wherein after the obtaining printed content, the method further comprises:
obtaining a simulated printing image according to the printing content;
and sending the simulated printing image to a display screen so that the display screen displays the simulated printing image.
5. The method of claim 1, wherein after the determining whether the first status signal is ready status, and if so, sending a first control signal to the screen printer to make the screen printer print the characters on the PCB board by using the 25um hydrophenan screen, the method further comprises:
acquiring an abnormal signal of the screen printing machine;
and sending a first exception processing signal to the screen printing machine according to the exception signal of the screen printing machine so as to stop the screen printing machine.
6. The method of claim 1, wherein after determining whether the second status signal is a ready status, and if so, sending a second control signal to the oven to cure the PCB board, the method further comprises:
acquiring an abnormal signal of the oven;
and sending a second abnormal processing signal to the oven according to the abnormal signal of the oven so as to stop the oven.
7. A PCB board making devices, its characterized in that includes: a memory, a processor and a computer program stored on the memory and executable on the processor, the processor implementing the PCB board manufacturing method according to any one of claims 1 to 6 when executing the computer program.
8. A computer-readable storage medium storing computer-executable instructions for performing the PCB board manufacturing method according to any one of claims 1 to 6.
9. A PCB board manufactured by the method for manufacturing the PCB board as claimed in any one of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110315111.1A CN113135054B (en) | 2021-03-24 | 2021-03-24 | PCB manufacturing method and device, storage medium and PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110315111.1A CN113135054B (en) | 2021-03-24 | 2021-03-24 | PCB manufacturing method and device, storage medium and PCB |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113135054A CN113135054A (en) | 2021-07-20 |
| CN113135054B true CN113135054B (en) | 2022-08-23 |
Family
ID=76810026
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110315111.1A Active CN113135054B (en) | 2021-03-24 | 2021-03-24 | PCB manufacturing method and device, storage medium and PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113135054B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116528484A (en) * | 2023-06-14 | 2023-08-01 | 江苏博敏电子有限公司 | PCB resin hole plugging process |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5553538A (en) * | 1995-01-30 | 1996-09-10 | Motorola, Inc. | Method and apparatus for stencil printing printed circuit boards |
| CN106982512A (en) * | 2017-05-22 | 2017-07-25 | 博敏电子股份有限公司 | A kind of bad reworking method of circuit board finished product welding resistance consent |
| CN109656491A (en) * | 2018-11-28 | 2019-04-19 | 武汉精立电子技术有限公司 | A kind of setting method, device and the electronic design system of PCB whole plate silk-screen word font |
| CN110126458B (en) * | 2019-04-01 | 2021-01-05 | 桂林市朗谷科技有限公司 | Automatic PCB screen printing adjusting method and device and storage medium |
| CN110239206A (en) * | 2019-06-14 | 2019-09-17 | 广州兴森快捷电路科技有限公司 | PCB character silk-screen production system and method |
| CN110341328B (en) * | 2019-07-17 | 2020-11-10 | 深圳市汉森软件有限公司 | Multi-PCB character splicing printing method and device, medium and flat printing equipment |
| CN112238681B (en) * | 2020-11-03 | 2024-06-25 | 变革智能装备(中山)有限公司 | Solder resist character processing equipment applied to PCB printing |
-
2021
- 2021-03-24 CN CN202110315111.1A patent/CN113135054B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN113135054A (en) | 2021-07-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN113135054B (en) | PCB manufacturing method and device, storage medium and PCB | |
| DE102013103293A1 (en) | Server rack and method for simultaneously updating the basic data exchange systems | |
| CN113211795B (en) | Three-dimensional object printing method, printing device and storage medium | |
| DE10232955A1 (en) | Flexible printing system | |
| CN106843755A (en) | For the data balancing method and device of server cluster | |
| CN114789555A (en) | Method and device for 3D printer, 3D printer and storage medium | |
| CN103914213A (en) | Method and device for eliminating page dithering | |
| EP3493047A1 (en) | 3d printer capable of multiple sub-printing actions, and sub-printing method for using the same | |
| CN103543901A (en) | Method and device for generating menus | |
| CN106408783A (en) | Status analysis method of self-service printing device and related device | |
| JP5942663B2 (en) | Printing system and template editing method | |
| CN110456999A (en) | Program creation method, device, electronic equipment and computer readable storage medium | |
| CN110908684B (en) | Method and device for updating silk-screen information of configuration page memory | |
| CN112506453A (en) | Method, device, processor and non-volatile storage medium for printing nameplate | |
| CN105522826B (en) | Check value production method, consumable chip and the consumption material box including the consumable chip | |
| CN112306424B (en) | Method for printing Web graphic format file | |
| CN105511820A (en) | Free typesetting printing method | |
| CN110007879A (en) | A kind of Intelligent printing apparatus control method | |
| CN113260153B (en) | Design method, system, device and storage medium of circuit board mirror image circuit | |
| CN115756443B (en) | Script generation method and device, electronic equipment and readable storage medium | |
| US11704075B2 (en) | Print management device and computer readable medium | |
| CN110874524B (en) | Method, system and device for changing visual effect of document | |
| JPS6158838B2 (en) | ||
| US20220009256A1 (en) | Apparatus and method for printing on an article | |
| JP4894799B2 (en) | Printing device, printing method and control program |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |