CN116528484A - PCB resin hole plugging process - Google Patents
PCB resin hole plugging process Download PDFInfo
- Publication number
- CN116528484A CN116528484A CN202310701968.6A CN202310701968A CN116528484A CN 116528484 A CN116528484 A CN 116528484A CN 202310701968 A CN202310701968 A CN 202310701968A CN 116528484 A CN116528484 A CN 116528484A
- Authority
- CN
- China
- Prior art keywords
- resin
- pcb
- plug
- plate
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 title claims abstract description 46
- 229920005989 resin Polymers 0.000 title claims abstract description 46
- 238000000034 method Methods 0.000 title claims abstract description 33
- 238000009713 electroplating Methods 0.000 claims abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 6
- 229910052782 aluminium Inorganic materials 0.000 abstract description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 5
- 239000004744 fabric Substances 0.000 abstract description 2
- 230000001360 synchronised effect Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
Abstract
The invention discloses a PCB resin hole plugging process, which relates to the technical field of printed circuit boards and sequentially comprises electroplating, resin hole plugging, baking, grinding and secondary electroplating; the plug hole plate adopted in the PCB resin plug hole process is a film plate. Compared with the traditional process that an aluminum sheet is used as the plug board, the water film screen board screen can break bubbles in holes, the self-sticking of screen cloth is avoided, the synchronous characteristic of resin ink is accurate, therefore, perfect plug holes can be manufactured, the situation that the PCB circuit board is exploded when passing through a tin furnace is effectively avoided, the situation that the plug holes are concave is improved, and the operation intensity of operators is reduced.
Description
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to a PCB resin hole plugging process.
Background
The circuit board uses resin plug holes because BGA parts, because traditional BGA can make VIA to the back to go between Pad and Pad, but if BGA is too dense to lead to VIA to go, it can directly go from Pad drilling to VIA to other layer to go, fill up copper with hole resin to change Pad, if only make VIA on Pad and not plug holes with resin, it can cause tin leakage to lead to back short circuit and front empty soldering easily. .
The existing resin plugging process generally adopts an aluminum sheet for plugging, and if the aluminum sheet is not plugged, bubbles are formed in the holes. Because the bubbles are easy to absorb moisture, the PCB circuit board can be exploded when passing through the tin furnace. Meanwhile, if bubbles exist in the hole plugging process, the bubbles can squeeze out the resin during baking, so that the situation that the resin is concave and convex is caused, and the resin is baked, as shown in fig. 1 and 2.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a PCB resin hole plugging process.
In order to solve the technical problems, the technical scheme of the invention is as follows:
a PCB resin hole plugging process sequentially comprises electroplating, resin hole plugging, baking, grinding and secondary electroplating;
the plug hole plate adopted in the PCB resin plug hole process is a film plate.
As a preferable scheme of the PCB resin plugging process, the invention comprises the following steps: the film plate is a water film screen plate.
As a preferable scheme of the PCB resin plugging process, the invention comprises the following steps: the resin plug hole includes: the resin was placed on a film plate and scraped into the mesh of the film plate using a doctor blade.
As a preferable scheme of the PCB resin plugging process, the invention comprises the following steps: the scraper moves from one end of the film plate to the other end of the film plate.
As a preferable scheme of the PCB resin plugging process, the invention comprises the following steps: the baking temperature is 105-125 ℃, and the baking time is 45-60min.
The beneficial effects of the invention are as follows:
compared with the traditional process that an aluminum sheet is used as the plug board, the water film screen board screen can break bubbles in holes, the self-sticking of screen cloth is avoided, the synchronous characteristic of resin ink is accurate, therefore, perfect plug holes can be manufactured, the situation that the PCB circuit board is exploded when passing through a tin furnace is effectively avoided, the situation that the plug holes are concave is improved, and the operation intensity of operators is reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIGS. 1 and 2 are schematic diagrams showing the prior art defective hole plugging recesses;
fig. 3 is a schematic diagram of a hole plugging process of a PCB resin according to the present invention.
Detailed Description
In order that the invention may be more readily understood, a more particular description thereof will be rendered by reference to specific embodiments that are illustrated in the appended drawings.
The embodiment of the application provides a PCB resin hole plugging process. The process sequentially comprises the following steps: electroplating, resin plugging, baking, grinding, and secondary electroplating. Wherein, the plughole plate adopted in the PCB resin plughole process is a film plate.
Because the adopted plugboard is a water film screen board, compared with the traditional PCB resin plughole process, the resin plughole process of the embodiment does not need to drill holes. The resin plugging step specifically comprises the following steps: the resin was placed on a film plate and scraped into the mesh of the film plate using a doctor blade.
The moving direction of the scraper is from one end of the film plate to the other end of the film plate. In this embodiment, the doctor blade is moved from the front end to the rear end of the film plate.
After plugging the holes by resin, the baking process parameters are as follows: the baking temperature is 105-125 deg.C, and the baking time is 45-60min.
In this embodiment, the PCB resin plugging process adopts the water film screen as the plugging plate, and compared with the traditional process adopting the aluminum sheet as the plugging plate, the water film screen can break bubbles in the holes, and also avoids the sticking of the mesh itself, and the synchronization characteristic of the resin ink is accurate, so that a perfect plug hole can be manufactured, see fig. 3. The situation that the PCB circuit board is exploded when passing through the tin furnace is effectively avoided, the situation that the hole plugging is concave is improved, and the operation intensity of operators is reduced.
The comparison of the conventional aluminum sheet screen plug holes with the technical scheme provided in this example is shown in the following table:
as can be seen from the table, the PCB resin hole plugging process provided by the embodiment not only improves the bad situation of hole plugging concave, improves the quality of hole plugging, but also has low manufacturing cost and reduces the operation intensity of operators.
In addition to the above embodiments, the present invention may have other embodiments; all technical schemes formed by equivalent substitution or equivalent transformation fall within the protection scope of the invention.
Claims (5)
1. A PCB resin hole plugging process is characterized in that: the method sequentially comprises electroplating, resin hole plugging, baking, grinding and secondary electroplating;
the plug hole plate adopted in the PCB resin plug hole process is a film plate.
2. The PCB resin plug hole process of claim 1, wherein: the film plate is a water film screen plate.
3. The PCB resin plug hole process of claim 1, wherein: the resin plug hole includes: the resin was placed on a film plate and scraped into the mesh of the film plate using a doctor blade.
4. A PCB resin plug hole process according to claim 3, wherein: the scraper moves from one end of the film plate to the other end of the film plate.
5. The PCB resin plug hole process of claim 1, wherein: the baking temperature is 105-125 ℃, and the baking time is 45-60min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310701968.6A CN116528484A (en) | 2023-06-14 | 2023-06-14 | PCB resin hole plugging process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310701968.6A CN116528484A (en) | 2023-06-14 | 2023-06-14 | PCB resin hole plugging process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116528484A true CN116528484A (en) | 2023-08-01 |
Family
ID=87408480
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310701968.6A Pending CN116528484A (en) | 2023-06-14 | 2023-06-14 | PCB resin hole plugging process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116528484A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101854778A (en) * | 2010-04-30 | 2010-10-06 | 深圳崇达多层线路板有限公司 | Manufacturing process for plugging conductive holes of circuit board with resin |
| CN102036510A (en) * | 2010-12-28 | 2011-04-27 | 东莞生益电子有限公司 | Depth-controlled hole plugging method for printed circuit board (PCB) |
| CN113135054A (en) * | 2021-03-24 | 2021-07-20 | 江门市奔力达电路有限公司 | PCB manufacturing method and device, storage medium and PCB |
-
2023
- 2023-06-14 CN CN202310701968.6A patent/CN116528484A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101854778A (en) * | 2010-04-30 | 2010-10-06 | 深圳崇达多层线路板有限公司 | Manufacturing process for plugging conductive holes of circuit board with resin |
| CN102036510A (en) * | 2010-12-28 | 2011-04-27 | 东莞生益电子有限公司 | Depth-controlled hole plugging method for printed circuit board (PCB) |
| CN113135054A (en) * | 2021-03-24 | 2021-07-20 | 江门市奔力达电路有限公司 | PCB manufacturing method and device, storage medium and PCB |
Non-Patent Citations (2)
| Title |
|---|
| 叶非华: "干膜法在选择性树脂塞孔工艺中的应用研究", 印制电路信息, no. 2014, pages 15 - 19 * |
| 唐宏华等: "盘中孑L板黑孔及焊点脱落改善探讨", 印制电路信息, no. 2010, pages 107 - 110 * |
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