CN104185362A - Flexible printed circuit board trace impedance and delay control method - Google Patents
Flexible printed circuit board trace impedance and delay control method Download PDFInfo
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- CN104185362A CN104185362A CN201410408918.XA CN201410408918A CN104185362A CN 104185362 A CN104185362 A CN 104185362A CN 201410408918 A CN201410408918 A CN 201410408918A CN 104185362 A CN104185362 A CN 104185362A
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- cabling
- copper
- printed circuit
- control method
- circuit board
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Abstract
The invention discloses a flexible printed circuit board trace impedance and delay control method. A flexible printed circuit board comprises a wiring layer and a reference layer. The reference layer is made of mesh copper. The method includes the following step that the regions over wires on the wiring layer or the regions over and under the wires on the wiring layer are made of solid copper. Due to the fact that the solid copper is arranged below the wires of the wiring layer or over and under the wires of the wiring layer, the condition that the reference height is increased due to the gap portions of the mesh copper is avoided, impedance control and transmission delay are improved, and meanwhile, the mesh copper of other portions is not changed, and flexibility, heat dissipation and the like of the flexible printed circuit board are guaranteed. The flexible printed circuit board trace impedance and delay control method can be widely applied to the field of printed circuit boards.
Description
Technical field
The present invention relates to printed circuit board field, especially a kind of soft board is walked line impedence and delay control method.
Background technology
Flexible PCB (FPC, Flexible Printed Circuit board) claim again soft board, it can free bend, coiling, folding, can require to arrange arbitrarily according to space layout, and mobile and flexible arbitrarily at three dimensions, thereby reach integrated that components and parts assembling is connected with wire.Utilize FPC can greatly dwindle the volume of electronic product, be suitable for the needs of electronic product to high density, miniaturization, highly reliable future development.Therefore, FPC is widely used on the fields such as space flight, military affairs, mobile communication, laptop computer, computer peripheral equipment, PDA, digital camera or product.Structurally base material+transparent adhesive tape+Copper Foil+protection mould, in order to reach flexible, reel, to fold.What copper all adopted is grid copper, but impedance and the time delay of grid copper on cabling has impact.Because when grid copper production, factory can do the grid of 10 mil * 10 mil conventionally, and as shown in Figure 1, twill part is copper, and white portion is space.
If cabling is taking this grid copper as the plane of reference, and when the plane of reference of cabling be the gap of grid copper, that in fact reference layer be lower layer of material, instead of copper, plane of reference height becomes large like this, impedance meeting sudden change, different also with reference to copper of transmission delay, it is large that transmission delay can become; If the plane of reference is not in gap, when in the wider situation of line, its impedance also can, because the plane of reference is large not, also can be affected.In the time that cabling is difference cabling, wherein in differential lines or a pair of plane of reference person are in gap, and impedance at this moment and time delay are also different.
Summary of the invention
In order to solve the problems of the technologies described above, the object of the invention is: a kind of soft board cabling control method that can improve impedance and time delay is provided.
The technical solution adopted in the present invention is: a kind of soft board is walked line impedence and delay control method, and described soft board includes routing layer and reference layer, and described reference layer is grid copper, includes following steps:
By under the cabling on routing layer or the region division of positive upper and lower part (directly over and under be reference layer) be real copper.
Further, the cabling on described soft board routing layer is single-ended cabling, under described single-ended cabling or the real copper width of the positive upper and lower part setting 2.5-3.5 that is single-ended trace width doubly.
Further, the cabling on described soft board routing layer is difference cabling, under described difference cabling or the real copper width of positive upper and lower part setting be difference cabling the width of two holding wires with the 1.5-2.5 of two holding wire spacing width sums times.
The invention has the beneficial effects as follows: the inventive method by below cabling or positive upper and lower real copper is set, avoid the plane of reference height that cause the gap of grid copper to become large, so just avoid impedance to become large, time delay is elongated, therefore control and the transmission delay of impedance have been improved, do not change the grid copper of other parts, ensured pliability, the thermal diffusivity etc. of soft board simultaneously.
Brief description of the drawings
Fig. 1 is grid copper schematic diagram;
Fig. 2 is the specific embodiment of single-ended cabling in the present invention;
Fig. 3 is the specific embodiment of difference cabling in the present invention;
Fig. 4 is the impedance contrast figure of single-ended cabling in the present invention;
Fig. 5 is the time delay comparison diagram of single-ended cabling in the present invention;
Fig. 6 is the impedance contrast figure of difference cabling in the present invention;
Fig. 7 is the time delay comparison diagram of difference cabling in the present invention.
Embodiment
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described further:
With reference to Fig. 2, the present invention's the first specific embodiment:
On its routing layer, be single-ended cabling (the twill part of intersecting in figure represents single-ended cabling), the real copper width L that under described single-ended cabling, part arranges
1for 2.5-3.5 times of single-ended trace width.
With reference to Fig. 4, the reference layer of single-ended cabling is impedance curve b and reference layer cabling cabling impedance curve a in space of real copper, and Fig. 5, the reference layer of single-ended cabling is that space and cabling reference layer are that real copper time delay is subtracted each other in part, obtain delay inequality, wherein m1 place frequency is 5GHz, and delay inequality is 2.023 × 10
-11s, m2 place frequency is 2.29GHz, delay inequality is 2.066 × 10
-11s.Can obviously find out from Fig. 4 and Fig. 5, the impedance that the reference layer of cabling is real copper is the 50ohm left and right of design, and plane of reference part is large in the impedance of gap.The reference layer of cabling is the large 20ps of the time delay left and right in space in part, and this is because the effective dielectric constant that cabling is space is large.
With reference to Fig. 3, the present invention's the second specific embodiment:
On its routing layer, be difference cabling (the twill part of intersecting in figure represents two holding wires of difference cabling), the real copper width L that under described difference cabling, part arranges
2for the width of two holding wires of difference cabling and the 1.5-2.5 of two holding wire spacing width sums doubly.
With reference to Fig. 6, the reference layer of difference cabling is impedance curve d and reference layer cabling cabling impedance curve c in space of real copper, and Fig. 7, the reference layer of difference cabling is that space and cabling reference layer are that real copper time delay is subtracted each other in part, obtain delay inequality, in Fig. 7, m1 place frequency is 5GHz, and delay inequality is 2.338 × 10
-11s, m1 place frequency is 2.29GHz, delay inequality is 2.066 × 10
-11s.Similarly can obviously find out from Fig. 4 and Fig. 5, the impedance that plane of reference part is real copper at the reference layer of the impedance ratio cabling of gap is large, the large 20ps of the time delay left and right that the reference layer part of cabling is space, this is that the speed of transmission is slow because the effective dielectric constant that the reference layer of cabling is space is large.
More than that better enforcement of the present invention is illustrated, but the invention is not limited to described embodiment, those of ordinary skill in the art can also make all equivalents or replacement under the prerequisite without prejudice to spirit of the present invention, and the distortion that these are equal to or replacement are all included in the application's claim limited range.
Claims (3)
1. soft board is walked line impedence and a delay control method, and described soft board includes routing layer and reference layer, and described reference layer is grid copper, it is characterized in that: include following steps:
By under the cabling on routing layer or the region division of positive upper and lower part be real copper.
2. a kind of soft board according to claim 1 is walked line impedence and delay control method, it is characterized in that: the cabling on described soft board routing layer is single-ended cabling, under described single-ended cabling or the real copper width of the positive upper and lower part setting 2.5-3.5 that is single-ended trace width doubly.
3. a kind of soft board according to claim 1 is walked line impedence and delay control method, it is characterized in that: the cabling on described soft board routing layer is difference cabling, under described difference cabling or the real copper width of positive upper and lower part setting be difference cabling the width of two holding wires with the 1.5-2.5 of two holding wire spacing width sums times.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410408918.XA CN104185362B (en) | 2014-08-19 | 2014-08-19 | A kind of soft board walks line impedence and delay control method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410408918.XA CN104185362B (en) | 2014-08-19 | 2014-08-19 | A kind of soft board walks line impedence and delay control method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104185362A true CN104185362A (en) | 2014-12-03 |
| CN104185362B CN104185362B (en) | 2017-10-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410408918.XA Active CN104185362B (en) | 2014-08-19 | 2014-08-19 | A kind of soft board walks line impedence and delay control method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105682340A (en) * | 2016-02-25 | 2016-06-15 | 广东欧珀移动通信有限公司 | Rigid-flex board and mobile terminal applying same |
| CN107454736A (en) * | 2017-06-27 | 2017-12-08 | 上达电子（深圳）股份有限公司 | A kind of circuit board and its cabling impedance adjustment |
| CN114786328A (en) * | 2022-05-23 | 2022-07-22 | 西安易朴通讯技术有限公司 | Multilayer printed circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007150000A (en) * | 2005-11-29 | 2007-06-14 | Canon Inc | Printed circuit board |
| US20090044968A1 (en) * | 2007-08-17 | 2009-02-19 | Hon Hai Precision Industry Co., Ltd. | Flexible printed circuit board |
| CN101861050A (en) * | 2009-04-13 | 2010-10-13 | 鸿富锦精密工业（深圳）有限公司 | Flexible printed circuit board |
-
2014
- 2014-08-19 CN CN201410408918.XA patent/CN104185362B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007150000A (en) * | 2005-11-29 | 2007-06-14 | Canon Inc | Printed circuit board |
| US20090044968A1 (en) * | 2007-08-17 | 2009-02-19 | Hon Hai Precision Industry Co., Ltd. | Flexible printed circuit board |
| CN101861050A (en) * | 2009-04-13 | 2010-10-13 | 鸿富锦精密工业（深圳）有限公司 | Flexible printed circuit board |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105682340A (en) * | 2016-02-25 | 2016-06-15 | 广东欧珀移动通信有限公司 | Rigid-flex board and mobile terminal applying same |
| CN105682340B (en) * | 2016-02-25 | 2018-11-27 | 广东欧珀移动通信有限公司 | The mobile terminal of Rigid Flex and the application Rigid Flex |
| CN107454736A (en) * | 2017-06-27 | 2017-12-08 | 上达电子（深圳）股份有限公司 | A kind of circuit board and its cabling impedance adjustment |
| CN107454736B (en) * | 2017-06-27 | 2019-08-27 | 上达电子（深圳）股份有限公司 | A kind of circuit board and its cabling impedance adjustment |
| CN114786328A (en) * | 2022-05-23 | 2022-07-22 | 西安易朴通讯技术有限公司 | Multilayer printed circuit board |
| CN114786328B (en) * | 2022-05-23 | 2024-04-30 | 西安易朴通讯技术有限公司 | Multilayer printed circuit board |
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| Publication number | Publication date |
|---|---|
| CN104185362B (en) | 2017-10-13 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Flexible printed circuit board trace impedance and delay control method Effective date of registration: 20200313 Granted publication date: 20171013 Pledgee: Shenzhen hi tech investment small loan Co., Ltd Pledgor: SHENZHEN FASTPRINT CIRCUIT TECH Co.,Ltd. Registration number: Y2020980000703 |
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