CN107454736B - A kind of circuit board and its cabling impedance adjustment - Google Patents
A kind of circuit board and its cabling impedance adjustment Download PDFInfo
- Publication number
- CN107454736B CN107454736B CN201710501753.4A CN201710501753A CN107454736B CN 107454736 B CN107454736 B CN 107454736B CN 201710501753 A CN201710501753 A CN 201710501753A CN 107454736 B CN107454736 B CN 107454736B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- layer
- impedance
- routing
- line width
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
Abstract
The invention discloses a kind of circuit board trace impedance adjustments, the circuit board includes routing layer and reference layer, comprising steps of referring to the corresponding routing layer position of layer region according to the type of reference layer region and impedance target call in the type, designing corresponding routing line width.The invention also discloses a kind of circuit boards, the circuit board includes reference layer and routing layer, the reference layer includes a variety of with reference to layer region, and cabling is provided on the routing layer, and the line width of the cabling is designed according to the corresponding type with reference to layer region and impedance target call.The present invention relates to printed circuit board fields, a kind of circuit board and its cabling impedance adjustment, the line width of circuit board trace layer upward wiring is designed according to the corresponding type with reference to layer region and impedance target call, keep the impedance waveform of circuit board product more steady, circuit board making qualification rate is improved, to save cost of manufacture.
Description
Technical field
The present invention relates to printed circuit board field more particularly to a kind of circuit boards and its cabling impedance adjustment.
Background technique
EMI:Electro Magnetic Interference, electromagnetic interference.
Flexible circuit board (FPC, Flexible Printed Circuit board) is also known as soft board, it can be freely curved
Bent, winding folds, and can require any arrangement according to space layout, and arbitrarily moves and flexible in three-dimensional space, to reach
The integration that components and parts assembling is connected with conducting wire.The volume of electronic product can be substantially reduced using FPC, be applicable in electronic product to
The needs that high density, miniaturization, highly reliable direction are developed.Therefore, FPC is in space flight, military affairs, mobile communication, computer, digital camera
It is widely used on equal fields or product.
In production circuit boards, circuit board walks line impedence by covering film thickness, routing line width, reference layer class
The influence of the factors such as type, reference layer sizing grid, and the board design of early period is all that a kind of circuit board corresponds to a kind of cabling line
Width design, the design of such routing line width, during making circuit board, circuit board because impedance value is unqualified scrap it is general
Rate is very high, and circuit board product qualified rate is low, so that the cost of manufacture of circuit board is high.
Summary of the invention
In order to solve the above-mentioned technical problem, the object of the present invention is to provide a kind of raising circuit board making qualification rates, cost
Low circuit board trace impedance adjustment.
The technical scheme adopted by the invention is that: a kind of circuit board trace impedance adjustment, the circuit board include walking
Line layer and reference layer, comprising steps of
According to the type of reference layer region and impedance target call, the corresponding routing layer position of layer region is referred in the type
It sets, designs corresponding routing line width.
Further, the reference layer region of same type corresponds to same routing line width.
Further, the reference layer area type respectively includes grid regions, single layer area and the area Shi Tong.
Further, the impedance target call specifically: so that the impedance waveform of circuit board is steady.
Further, the circuit board is FPC plate.
A kind of circuit board, the circuit board include reference layer and routing layer, and the reference layer includes a variety of with reference to layer region,
Cabling is provided on the routing layer, the line width of the cabling is set according to the corresponding type with reference to layer region and impedance target call
Meter.
Further, the reference layer area type respectively includes grid regions, single layer area and the area Shi Tong.
Further, the impedance target call specifically: so that the impedance waveform of circuit board is steady.
Further, it is 60 μm that the grid regions, which correspond to the routing line width of routing layer position, and the single layer area corresponds to cabling
The routing line width of layer position is 70 μm, and the routing line width that the area Shi Tong corresponds to routing layer position is 50 μm.
Further, the circuit board is FPC plate.
The beneficial effects of the present invention are:
The line width of a kind of circuit board trace impedance adjustment, circuit board trace layer upward wiring refers to layer region according to corresponding
Type and impedance target call design, keep the impedance waveform of circuit board product more steady, improve circuit board making qualification rate,
To save cost of manufacture.
A kind of circuit board, the line width of circuit board trace layer upward wiring is according to the corresponding type and impedance target for referring to layer region
It is required that design, keeps the impedance waveform of circuit board product more steady, circuit board making qualification rate is improved, is fabricated to save
This.
Detailed description of the invention
Specific embodiments of the present invention will be further explained with reference to the accompanying drawing:
A kind of circuit board trace impedance adjustment flow chart of Fig. 1 present invention；
Fig. 2 is a kind of structural schematic diagram of circuit board reference layer specific embodiment routing layer and reference layer of the present invention；
Fig. 3 a is the impedance waveform diagram of the single circuit board finished product of the prior art；
Fig. 3 b is the impedance waveform diagram of single circuit board finished product of the invention；
Fig. 4 a is the impedance waveform diagram of prior art multiple groups circuit board finished product；
Fig. 4 b is the impedance waveform diagram of multiple groups circuit board finished product of the present invention.
Specific embodiment
It should be noted that in the absence of conflict, the features in the embodiments and the embodiments of the present application can phase
Mutually combination.
A kind of circuit board trace impedance adjustment flow chart of Fig. 1 present invention, a kind of circuit board trace impedance adjustment,
The circuit board includes routing layer and reference layer, comprising steps of
According to the type of reference layer region and impedance target call, the corresponding routing layer position of layer region is referred in the type
It sets, designs corresponding routing line width.
Further, the reference layer region of same type corresponds to same routing line width.
Further, the reference layer area type respectively includes grid regions, single layer area and the area Shi Tong.
Further, the impedance target call specifically: so that the impedance waveform of circuit board is steady.
Further, the circuit board is FPC plate.
The line width of a kind of circuit board trace impedance adjustment, circuit board trace layer upward wiring refers to layer region according to corresponding
Type and impedance target call design, keep the impedance waveform of circuit board product more steady, improve circuit board making qualification rate,
To save cost of manufacture.
A kind of circuit board, the circuit board include reference layer and routing layer, and the reference layer includes a plurality of types of references
Layer region is provided with cabling on the routing layer, and the line width of the cabling is according to the corresponding type and impedance mesh for referring to layer region
Mark requires design, and the circuit board front is reference layer, the back side is routing layer.
In the present embodiment, circuit board is FPC plate.
If circuit board has EMI (electromagnetic interference), control is required, and can be required by increasing shielding construction to realize, generally
, shielding construction can be solid copper sheet, copper sheet grid or silver paste grid etc., is controlled and is required according to the EMI of circuit board, will be electric
Road plate reference layer is divided into multiple types with reference to layer region, includes with copper sheet grid shielding construction or having hard with reference to layer region
The grid regions of part grid shielding construction, the single layer area for not having shielding construction and the area Shi Tong with solid copper sheet shielding construction
Deng, since circuit board needs to be bending or folding in practical applications, at this time, it may be necessary to circuit board has certain flexibility, and
Compared with real copper region, amount of copper tails off for grid regions, so that the flexible of grid regions improves, and single layer area is directly then cabling, single layer
Area surface does not cover shielding construction, flexible higher.Therefore, circuit board reference layer determines according to actual needs refers to layer region class
Type.
Fig. 2 is a kind of structural schematic diagram of circuit board reference layer specific embodiment routing layer and reference layer of the present invention, such as Fig. 2
It is shown, it is controlled and is required according to the EMI of circuit board, circuit board reference layer includes grid regions, single layer area 2, the area Shi Tong 3, circuit board ginseng
It examines floor and is followed successively by grid regions 11, single layer area 2, the area Shi Tong 3 and lower grid regions 12, the routing layer upward wiring of circuit board from top to bottom
Line width designed according to the corresponding type with reference to layer region and impedance target call.In the present embodiment, the reference layer of same type
Region corresponds to same routing line width, and 01 line width of the first cabling of the corresponding routing layer position in upper grid regions 11 and lower grid regions 12 is set
Evaluation and 04 line width design value of the 4th cabling are 60 μm, 02 line width of the second cabling design of the corresponding routing layer position in single layer area 2
Value is 70 μm, and the 03 line width design value of third cabling of the corresponding routing layer position in the area Shi Tong 3 is 50 μm.
Fig. 3 a is the impedance waveform diagram of the single circuit board finished product of the prior art, and Fig. 3 b is single circuit board finished product of the invention
Impedance waveform diagram, in conjunction with shown in Fig. 3 a and Fig. 3 b, when whole circuit board is designed only with a kind of routing line width, the impedance of circuit board
Value is fluctuated in 110 Ω between 140 Ω；When the routing line width of whole circuit board routing layer is set according to different reference layer area segmentations
The impedance value of timing, circuit board is fluctuated in 135 Ω between 145 Ω.
Fig. 4 a is the impedance waveform diagram of prior art multiple groups circuit board finished product, and Fig. 4 b is multiple groups circuit board finished product of the present invention
Impedance waveform diagram, target impedance value range is 90 Ω to 110 Ω, in conjunction with shown in Fig. 4 a and Fig. 4 b, it is assumed that target impedance value range
For 90 Ω to 110 Ω, when the entire routing layer of circuit board is designed only with a kind of routing line width, the impedance value of circuit board is in 90 Ω
It is fluctuated between 115 Ω, exceeds 110 Ω of the impedance upper limit, when the routing line width of whole circuit board divides according to different with reference to layer region
When section design, the impedance value of circuit board is fluctuated in 95 Ω between 110 Ω, i.e., fluctuates in target impedance value range.According to difference
Reference layer area segmentation design reference layer region corresponds to the routing line width of routing layer position, makes the impedance waveform of circuit board product more
Add steady, raising circuit board making qualification rate, to save cost of manufacture.
A kind of circuit board, the line width of circuit board trace layer upward wiring is according to the corresponding type and impedance target for referring to layer region
It is required that design, keeps the impedance waveform of circuit board product more steady, circuit board making qualification rate is improved, is fabricated to save
This.
It is to be illustrated to preferable implementation of the invention, but the invention is not limited to the implementation above
Example, those skilled in the art can also make various equivalent variations on the premise of without prejudice to spirit of the invention or replace
It changes, these equivalent deformations or replacement are all included in the scope defined by the claims of the present application.
Claims (8)
1. a kind of circuit board trace impedance adjustment, the circuit board include routing layer and reference layer, which is characterized in that it is wrapped
Include step:
According to the type of reference layer region and impedance target call, the corresponding routing layer position of layer region is referred in the type, if
Corresponding routing line width is counted, the type with reference to layer region is respectively included with copper sheet grid shielding construction or hardware grid
The grid regions of shielding construction, the single layer area for not having shielding construction and the area Shi Tong with solid copper sheet shielding construction.
2. a kind of circuit board trace impedance adjustment according to claim 1, which is characterized in that the reference layer of same type
Region corresponds to same routing line width.
3. a kind of circuit board trace impedance adjustment according to claim 2, which is characterized in that the impedance target is wanted
It asks specifically: so that the impedance waveform of circuit board is steady.
4. a kind of circuit board trace impedance adjustment according to any one of claims 1 to 3, which is characterized in that described
Circuit board is FPC plate.
5. a kind of circuit board, which is characterized in that the circuit board includes reference layer and routing layer, and the reference layer includes a variety of ginsengs
Layer region is examined, cabling is provided on the routing layer, the line width of the cabling is according to the corresponding type and impedance for referring to layer region
Target call design, the type with reference to layer region respectively include shielding with copper sheet grid shielding construction or hardware grid
The grid regions of structure, the single layer area for not having shielding construction and the area Shi Tong with solid copper sheet shielding construction.
6. a kind of circuit board according to claim 5, which is characterized in that the impedance target call specifically: so that electricity
The impedance waveform of road plate is steady.
7. a kind of circuit board according to claim 6, which is characterized in that the grid regions correspond to the cabling of routing layer position
Line width is 60 μm, and the routing line width that the single layer area corresponds to routing layer position is 70 μm, and the area Shi Tong corresponds to routing layer position
Routing line width be 50 μm.
8. according to a kind of described in any item circuit boards of claim 5 to 7, which is characterized in that the circuit board is FPC plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710501753.4A CN107454736B (en) | 2017-06-27 | 2017-06-27 | A kind of circuit board and its cabling impedance adjustment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710501753.4A CN107454736B (en) | 2017-06-27 | 2017-06-27 | A kind of circuit board and its cabling impedance adjustment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107454736A CN107454736A (en) | 2017-12-08 |
| CN107454736B true CN107454736B (en) | 2019-08-27 |
Family
ID=60487078
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710501753.4A Expired - Fee Related CN107454736B (en) | 2017-06-27 | 2017-06-27 | A kind of circuit board and its cabling impedance adjustment |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108535535B (en) * | 2018-04-02 | 2021-02-09 | 苏州浪潮智能科技有限公司 | Current detection method and system for integrated chip |
| CN114786349B (en) * | 2022-05-05 | 2024-03-12 | 博敏电子股份有限公司 | Manufacturing method of asymmetric impedance product |
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| CN104185362A (en) * | 2014-08-19 | 2014-12-03 | 深圳市兴森快捷电路科技股份有限公司 | Flexible printed circuit board trace impedance and delay control method |
| CN104244598A (en) * | 2014-09-24 | 2014-12-24 | 浪潮(北京)电子信息产业有限公司 | Method and device for controlling impedance continuity of transmission line on PCB (printed circuit board) |
| CN204291567U (en) * | 2014-12-09 | 2015-04-22 | 上海天马微电子有限公司 | A kind of wiring board, display module and electronic equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US7259968B2 (en) * | 2003-05-14 | 2007-08-21 | Hewlett-Packard Development Company, L.P. | Tailoring impedances of conductive traces in a circuit board |
| US20110061898A1 (en) * | 2009-09-15 | 2011-03-17 | International Business Machines Corporation | Reducing cross-talk in high speed ceramic packages using selectively-widened mesh |
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2017
- 2017-06-27 CN CN201710501753.4A patent/CN107454736B/en not_active Expired - Fee Related
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0340482A (en) * | 1989-07-06 | 1991-02-21 | Fujitsu Ltd | Printed wiring board |
| JPH07326829A (en) * | 1994-06-02 | 1995-12-12 | Nitto Denko Corp | Printed circuit board |
| CN203616552U (en) * | 2013-12-13 | 2014-05-28 | Tcl显示科技（惠州）有限公司 | Liquid crystal display module and double-layer flexible circuit board structure used for transmitting signals of liquid crystal display module |
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| CN104185362A (en) * | 2014-08-19 | 2014-12-03 | 深圳市兴森快捷电路科技股份有限公司 | Flexible printed circuit board trace impedance and delay control method |
| CN104244598A (en) * | 2014-09-24 | 2014-12-24 | 浪潮(北京)电子信息产业有限公司 | Method and device for controlling impedance continuity of transmission line on PCB (printed circuit board) |
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| Publication number | Publication date |
|---|---|
| CN107454736A (en) | 2017-12-08 |
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Effective date of registration: 20200601 Address after: Room 318, floor 3, central auxiliary area, A5 reservoir area, No. 530, Zhengding Road, free trade Experimental Zone, Pudong New Area, Shanghai Patentee after: Rongwubao International Financial Leasing Co.,Ltd. Address before: 518104 1-4 floors and 2-3 floors of Building A, Huangpu Run and Industrial Park, South Ring Road, Huangpu Community, Shajing Street, Baoan District, Shenzhen City, Guangdong Province Patentee before: LEADER-TECH ELECTRONICS (SHENZHEN) Inc. |
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Granted publication date: 20190827 |