CN104244598A - Method and device for controlling impedance continuity of transmission line on PCB (printed circuit board) - Google Patents
Method and device for controlling impedance continuity of transmission line on PCB (printed circuit board) Download PDFInfo
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- CN104244598A CN104244598A CN201410494864.3A CN201410494864A CN104244598A CN 104244598 A CN104244598 A CN 104244598A CN 201410494864 A CN201410494864 A CN 201410494864A CN 104244598 A CN104244598 A CN 104244598A
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Abstract
The invention discloses a method and a device for controlling impedance continuity of a transmission line on a PCB (printed circuit board). The method includes: for the transmission line, composed of a wide portion and a narrow portion, on the PCB, determining thickness of a first insulating layer between a PCB layer where the transmission line is positioned and a first reference layer according to predetermined corresponding impedance standard of the transmission line; determining thickness of a second insulating layer between the first reference layer and the second reference layer according to the impedance standard, predetermined impedance deviation standard and the thickness of the first insulating layer; setting a portion, corresponding to vertical projection of the wide portion of the transmission line on the first reference layer, of the first reference layer to be a hollow area. By the technical scheme, adjusting of impedance of the narrow portion and the wide portion of the transmission line under the circumstance that line width of the transmission line changes to meet the impedance deviation standard is realized, so that sudden change of impedance of the transmission line is avoided.
Description
Technical field
The present invention relates to printed circuit board (PCB) (PCB) designing technique, in espespecially a kind of PCB design, the method and apparatus of the impedance continuity of transmission line on control PCB.
Background technology
In PCB design; often such situation can be run into, for the transmission line on PCB top layer and bottom and microstrip line, when the region limited by certain wiring space during PCB layout; in order to improve the wiring space utilance in this region, need the width reducing transmission line.That is, when PCB layout, sometimes need the width changing transmission line.
The change of transmission line width result in the discontinuous of the impedance of transmission line, that is, transmission line narrow portion is divided and to transmit the impedance of live width part inconsistent, the situation in this area, the impedance rate of change of transmission line being exceeded impedance deviation standard is called change in the instantaneous impedance, wherein, impedance deviation standard-required impedance rate of change is less than 10%.Suppose that the impedance before and after changing is respectively Z1 and Z2, so impedance rate of change is less than 10% and can be expressed as: | Z2-Z1|/Z1<10%, by the span of the known Z2 of this formula is: 0.9Z1<Z2<1.1Z1.That is, the scope of impedance deviation standard-required Z2 is [0.9Z1,1.1Z1].
The impedance standard that dissimilar transmission line is corresponding different, such as, the corresponding impedance standard of single-ended transmission line is 50 Ω positive and negative 10%, namely impedance ranges is [45 Ω, 55 Ω], and the corresponding impedance standard of difference transmission lines is 85 Ω positive and negative 10%, namely impedance ranges is [76.5 Ω, 93.5 Ω].The calculating of the impedance Z of the transmission line of microstrip line type is the known technology of those skilled in the art, as shown in formula (1),
In formula (1), e is with the natural truth of a matter, and Er is dielectric constant, and W is the live width of transmission line, and T is the copper sheet thickness of transmission line, and H is the distance between transmission line place PCB layer and reference layer, and Er is the dielectric constant of pcb board material.
In order to better understand formula (1), it should be noted that, PCB is made up of multiple PCB layer.Classify according to the material of PCB layer, PCB layer can be divided into layers of copper or insulating barrier.Have layers of copper to comprise signals layer, ground plane and power supply layer, wherein, signals layer is the PCB layer at transmission line place, and ground plane is the PCB layer for ground connection, and power supply layer is the PCB layer for powering.Insulating barrier has between layers of copper at two.
From formula (1), when W and T is fixed value, Z and H direct proportionality, wherein, for the transmission line of microstrip line type, reference layer is the ground plane nearest with transmission line place PCB layer.Owing to being insulating barrier between transmission line place PCB layer and reference layer, therefore H can be understood as above-mentioned two-layer between the thickness of insulating barrier.
From formula (1), the calculating of the distance between transmission line place PCB layer and reference layer as shown in formula (2),
Because the signal that transmission line transmits will produce reflecting background at change in the instantaneous impedance place, therefore change in the instantaneous impedance reduces the quality of the signal that transmission line transmits.In this area, reduced the impact of change in the instantaneous impedance at present by the method for two change in the instantaneous impedances.Specifically, when transmission line is by the limited region of wiring space, transmission line width is reduced, when by behind this region, then the width of transmission line is returned to by the width before this region.
The method of this two change in the instantaneous impedances, the principle that a part of reflecting background that make use of twice change in the instantaneous impedance place generation can be cancelled out each other, decreases the impact of change in the instantaneous impedance.But this method, owing to can only offset a part of reflecting background, therefore effectively cannot reduce the impact of change in the instantaneous impedance.Especially, when the data transfer rate of the signal that transmission line transmits improves further, such as, when data transfer rate brings up to 20Gpbs, reflecting background obviously has influence on the quality of signal, even causes the reception that signal can not be stable.
Summary of the invention
In order to solve the problems of the technologies described above, the invention provides the method for the impedance continuity of transmission line on a kind of control PCB, transmission line narrow portion can be adjusted divide and meet impedance deviation standard when the line width variation of transmission line with the impedance of wide part, thus avoid transmission line impedance to suddenly change.
In order to reach the object of the invention, the invention discloses the method for the impedance continuity of transmission line on a kind of control PCB, comprising:
Divide by transmission live width part and transmission line narrow portion the transmission line formed for upper one of PCB, according to the corresponding impedance standard of transmission line, determine the thickness of the first insulating barrier between transmission line place PCB layer and the first reference layer; Wherein, the first reference layer is reference layer corresponding to impedance that transmission line narrow portion is divided;
According to the thickness of impedance standard, impedance deviation standard and the first insulating barrier, determine the thickness of the second insulating barrier between the first reference layer and the second reference layer; Wherein, the second reference layer is reference layer corresponding to the impedance of transmission live width part, and the distance between the second reference layer and transmission line place PCB layer is greater than the distance between the first reference layer and transmission line place PCB layer;
The part of the first corresponding for the upright projection of transmission live width part on the first reference layer reference layer is set to area of knockout.
Describedly determine that the thickness of the first insulating barrier comprises:
According to the impedance ranges that described impedance standard shows, calculate first distance range of described transmission line place PCB layer relative to described first reference layer;
According to the first distance range, determine the thickness of described first insulating barrier; Wherein, the thickness of described first insulating barrier is arranged in the first distance range.
Describedly determine that the thickness of the second insulating barrier comprises:
The first impedance that transmission line narrow portion is divided according to the THICKNESS CALCULATION of described first insulating barrier;
According to described impedance standard and impedance deviation standard, the first impedance of calculating, determine the impedance ranges of described transmission live width part;
According to the impedance ranges determined, calculate the actual range scope of described transmission line place PCB layer relative to described second reference layer;
Actual range scope deducts the thickness of described first insulating barrier and the thickness of described first reference layer respectively, obtains second distance scope;
According to the second distance scope obtained, determine the thickness of the second insulating barrier between described first reference layer and described second reference layer; Wherein, the thickness of the second insulating barrier is arranged in second distance scope.
Describedly determine that the impedance ranges of described transmission live width part comprises:
According to described first impedance and described impedance deviation standard, determine the corresponding impedance ranges of impedance deviation standard;
Determine the coincidence scope of impedance ranges of the corresponding impedance ranges of impedance deviation standard and the display of described impedance standard, and using the coincidence scope the determined impedance ranges as described transmission live width part.
The invention also discloses the device of the impedance continuity of transmission line on a kind of control PCB, comprise the first thickness calculation unit, the second thickness calculation unit and area of knockout determining unit, wherein,
First thickness calculation unit, for on PCB one by transmission live width part and transmission line narrow portion divide the transmission line formed, according to the corresponding impedance standard of transmission line, determine the thickness of the first insulating barrier between transmission line place PCB layer and the first reference layer; Wherein, the first reference layer is reference layer corresponding to impedance that transmission line narrow portion is divided;
Second thickness calculation unit, for the thickness according to impedance standard, impedance deviation standard and the first insulating barrier from the first thickness calculation unit, determines the thickness of the second insulating barrier between the first reference layer and the second reference layer; Wherein, the second reference layer is reference layer corresponding to the impedance of transmission live width part, and the distance between the second reference layer and transmission line place PCB layer is greater than the distance between the first reference layer and transmission line place PCB layer;
Area of knockout determining unit, for being set to area of knockout by the part of the first corresponding for the upright projection of transmission live width part on the first reference layer reference layer.
Described first THICKNESS CALCULATION specifically for:
According to the impedance ranges that described impedance standard shows, calculate first distance range of described transmission line place PCB layer relative to described first reference layer;
According to the first distance range, determine the thickness of described first insulating barrier; Wherein, the thickness of described first insulating barrier is arranged in the first distance range.
Described second thickness calculation unit specifically for:
The first impedance that transmission line narrow portion is divided according to the THICKNESS CALCULATION of described first insulating barrier;
According to described impedance standard and impedance deviation standard, the first impedance of calculating, determine the impedance ranges of described transmission live width part;
According to the impedance ranges determined, calculate the actual range scope of described transmission line place PCB layer relative to described second reference layer;
Actual range scope deducts the thickness of described first insulating barrier and the thickness of described first reference layer respectively, obtains second distance scope;
According to the second distance scope obtained, determine the thickness of the second insulating barrier between described first reference layer and described second reference layer; Wherein, the thickness of the second insulating barrier is arranged in second distance scope.
Described second thickness calculation unit, when calculating the first impedance that described transmission line narrow portion is divided, specifically for:
According to described first impedance and described impedance deviation standard, determine the corresponding impedance ranges of impedance deviation standard;
Determine the coincidence scope of impedance ranges of the corresponding impedance ranges of impedance deviation standard and the display of described impedance standard, and using the coincidence scope the determined impedance ranges as described transmission live width part.
Compared with prior art, technical scheme of the present invention comprises: divide by transmission live width part and transmission line narrow portion the transmission line formed for upper one of PCB, according to the corresponding impedance standard of transmission line, determine the thickness of the first insulating barrier between transmission line place PCB layer and the first reference layer; Wherein, the first reference layer is reference layer corresponding to impedance that transmission line narrow portion is divided; According to the thickness of impedance standard, impedance deviation standard and the first insulating barrier, determine the thickness of the second insulating barrier between the first reference layer and the second reference layer; Wherein, the second reference layer is reference layer corresponding to the impedance of transmission live width part, and the distance between the second reference layer and transmission line place PCB layer is greater than the distance between the first reference layer and transmission line place PCB layer; The part of the first corresponding for the upright projection of transmission live width part on the first reference layer reference layer is set to area of knockout.By technical scheme provided by the invention, by hollowing out the layers of copper of the area of knockout of setting, reference layer corresponding to the impedance of transmission live width part is made to become the second reference layer from the first reference layer; And by arranging the thickness of the first insulating barrier and the second insulating barrier according to the thickness determined, transmission line narrow portion is divided and meets corresponding impedance standard with the impedance of wide part, make impedance rate of change meet impedance deviation standard simultaneously, that is transmission line impedance change is effectively controlled in the scope of impedance deviation standard display, therefore avoid transmission line impedance sudden change, thus the line width variation effectively controlling transmission line is on the impact of the signal quality that transmission line transmits.
Other features and advantages of the present invention will be set forth in the following description, and, partly become apparent from specification, or understand by implementing the present invention.Object of the present invention and other advantages realize by structure specifically noted in specification, claims and accompanying drawing and obtain.
Accompanying drawing explanation
Accompanying drawing is used to provide the further understanding to technical solution of the present invention, and forms a part for specification, is used from and explains technical scheme of the present invention, do not form the restriction to technical solution of the present invention with the embodiment one of the application.
Fig. 1 is the flow chart of the method for the impedance continuity of transmission line on the present invention's control PCB;
Fig. 2 is the flow chart of the thickness determining the second insulating barrier in the inventive method;
Fig. 3 is the composition structural representation of the device of the impedance continuity of transmission line on the present invention's control PCB.
Embodiment
For making the object, technical solutions and advantages of the present invention clearly understand, hereinafter will describe in detail embodiments of the invention process by reference to the accompanying drawings.It should be noted that, when not conflicting, the embodiment in the application and the feature in embodiment can combination in any mutually.
Can perform in the computer system of such as one group of computer executable instructions in the step shown in the flow chart of accompanying drawing.Further, although show logical order in flow charts, in some cases, can be different from the step shown or described by order execution herein.
Impedance standard herein, when not having additional description, all refers to the corresponding impedance standard of transmission line.Transmission line herein, when not having additional description, all refers to divide by transmission live width part and transmission line narrow portion the transmission line formed.
The present invention is applicable to the impedance continuity of the transmission line of microstrip line type on control PCB.
Fig. 1 is the flow chart of the method for the impedance continuity of transmission line on the present invention's control PCB, as shown in Figure 1, comprises the steps:
Step 101: divide by transmission live width part and transmission line narrow portion the transmission line formed for upper one of PCB, according to the corresponding impedance standard of transmission line, determine the thickness of the first insulating barrier between transmission line place PCB layer and the first reference layer.
Wherein, the first reference layer is reference layer corresponding to impedance that transmission line narrow portion is divided.
Determine in this step that the thickness of the first insulating barrier comprises:
First, according to the impedance ranges of impedance standard display, calculate first distance range of transmission line place PCB layer relative to the first reference layer.
In this step, the first distance range can be calculated according to formula (2).In formula (2), the live width W of dielectric constant Er, transmission line and copper sheet thickness T, when PCB specification is determined, is fixed value, and the impedance ranges of bringing impedance standard display into can calculate the first distance range.
Then, according to the first distance range, determine the thickness of the first insulating barrier.
Wherein, the thickness of the first insulating barrier determined is arranged in the first distance range.
Preferably, the numerical value of the thickness of the first insulating barrier, close to the median in the first scope, like this, ensure that transmission line narrow portion divides impedance relative to the first reference layer close to the median in the impedance ranges of transmission line corresponding impedance standard display.
In embodiment 1, transmission line is single-ended transmission line, and the scope of the impedance standard display of its correspondence is [45 Ω, 55 Ω], select the thickness of the first insulating barrier according to above-mentioned optimal way, the impedance that transmission line narrow portion is divided is 49 Ω, close to median 50 Ω of [45 Ω, 55 Ω].
Step 102: according to the thickness of impedance standard, impedance deviation standard and the first insulating barrier, determine the thickness of the second insulating barrier between the first reference layer and the second reference layer.
Wherein, the second reference layer is reference layer corresponding to the impedance of transmission live width part.
Wherein, the distance between the second reference layer and transmission line place PCB layer is greater than the distance between the first reference layer and transmission line place PCB layer.From formula (1), because the impedance of transmission line and live width W are inversely proportional to, be directly proportional to the distance H between transmission line place PCB layer and reference layer.When H is fixed value, the W that the W of transmission live width part divides than transmission line narrow portion is large, and the impedance that the impedance ratio transmission line narrow portion therefore transmitting live width part is divided is little.When the reference layer transmitting live width part becomes the second reference layer, corresponding H increases, the impedance transmitting live width part is increased, like this when adjustment H is desired value, the impedance that the impedance transmitting live width part can divide close to transmission line narrow portion, when ensure that the live width of transmission line changes, the continuity of the impedance that transmission live width part and narrow portion are divided, avoids change in the instantaneous impedance.
Fig. 2 is the flow chart of the thickness determining the second insulating barrier in this step, as shown in Figure 2, comprising:
Step 201: the first impedance divided according to the THICKNESS CALCULATION transmission line narrow portion of the first insulating barrier.
In this step, first impedance that can divide according to formula (1) calculating transmission line narrow portion, also can adopt the general impedance computation software of those skilled in the art to calculate the first impedance.From step 101, the first impedance is arranged in the impedance ranges of impedance standard display.In embodiment 1, the first impedance is 49 Ω.
Step 202: according to impedance standard and impedance deviation standard, the first impedance of calculating, determine the impedance ranges transmitting live width part.
This step specifically comprises:
First, according to the first impedance and impedance deviation standard, determine the corresponding impedance ranges of impedance deviation standard.
From the analysis in background technology, impedance deviation standard-required: 0.9Z1<Z2<1.1Z1, wherein Z1 and Z2 is respectively the impedance before and after change, corresponds respectively to transmission line narrow portion in this article and divides the impedance with wide part.In embodiment 1, the first impedance Z 1 is 49 Ω, can be obtained by formula above, and the corresponding impedance ranges of impedance deviation standard is [44.1 Ω, 53.9 Ω].
Then, determine the coincidence scope of impedance ranges of the corresponding impedance ranges of impedance deviation standard and impedance standard display, and using the coincidence scope the determined impedance ranges as transmission live width part.
In embodiment 1, the impedance ranges [45 Ω, 55 Ω] of impedance standard display, and the corresponding impedance ranges of impedance deviation standard is [44.1 Ω, 53.9 Ω], the coincidence scope of above-mentioned two scopes determined like this is [45 Ω, 53.9 Ω].
Step 203: according to the impedance ranges determined, calculates the actual range scope of transmission line place PCB layer relative to the second reference layer.
Similarly, actual range scope can be calculated according to formula (2).
Step 204: deduct the thickness of the first insulating barrier and the thickness of the first reference layer respectively in actual range scope, obtain second distance scope.
Step 205: according to the second distance scope obtained, determine the thickness of the second insulating barrier between the first reference layer and the second reference layer.
Wherein, the thickness of the second insulating barrier determined is arranged in second distance scope.
Preferably, the thickness of the second insulating barrier is close to the median in second distance scope.
In embodiment 1, select the thickness of the second insulating barrier according to above-mentioned optimal way, the impedance of transmission live width part is 48.5 Ω, close to median 49 Ω of [44.1 Ω, 53.9 Ω].
In embodiment 1, the impedance that transmission line narrow portion is divided is 49 Ω, and the impedance of transmission live width part is 48.5 Ω, such impedance rate of change | 48.5-49|/49=1.02%, the impedance rate of change meeting impedance deviation standard-required is less than the requirement of 10%.Further, according to optimal way, select the thickness of the first insulating barrier and the second insulating barrier, impedance rate of change can be made to meet impedance deviation standard-required, reduce impedance rate of change simultaneously as far as possible.
Step 103: the part of the first corresponding for the upright projection of transmission live width part on the first reference layer reference layer is set to area of knockout.
In certain embodiments, suitably increase the width of upright projection, such as width increases by 5%, effectively can guarantee that area of knockout is by the effect after hollowing out like this.
After the inventive method, in PCB production process, the thickness of the first insulating barrier and the second insulating barrier is set according to the thickness of the first insulating barrier determined and the second insulating barrier, according to the area of knockout arranged, the layers of copper of area of knockout display on the first reference layer is dug up.
Fig. 3 is the composition structural representation of the device of the impedance continuity of transmission line on the present invention's control PCB, as shown in Figure 3, comprises the first thickness calculation unit, the second thickness calculation unit and area of knockout determining unit, wherein,
First thickness calculation unit, for on PCB one by transmission live width part and transmission line narrow portion divide the transmission line formed, according to the corresponding impedance standard of transmission line, determine the thickness of the first insulating barrier between transmission line place PCB layer and the first reference layer.Wherein, the first reference layer is reference layer corresponding to impedance that transmission line narrow portion is divided.
Second thickness calculation unit, for the thickness according to impedance standard, impedance deviation standard and the first insulating barrier from the first thickness calculation unit, determines the thickness of the second insulating barrier between the first reference layer and the second reference layer.Wherein, the second reference layer is reference layer corresponding to the impedance of transmission live width part, and the distance between the second reference layer and transmission line place PCB layer is greater than the distance between the first reference layer and transmission line place PCB layer.
Area of knockout determining unit, for being set to area of knockout by the part of the first corresponding for the upright projection of transmission live width part on the first reference layer reference layer.
First THICKNESS CALCULATION specifically for:
According to the impedance ranges of impedance standard display, calculate first distance range of transmission line place PCB layer relative to the first reference layer;
According to the first distance range, determine the thickness of the first insulating barrier; Wherein, the thickness of the first insulating barrier is arranged in the first distance range.
Second thickness calculation unit specifically for:
According to the first impedance that the THICKNESS CALCULATION transmission line narrow portion of the first insulating barrier is divided;
According to impedance standard and impedance deviation standard, the first impedance of calculating, determine the impedance ranges transmitting live width part;
According to the impedance ranges determined, calculate the actual range scope of transmission line place PCB layer relative to the second reference layer;
Actual range scope deducts the thickness of the first insulating barrier and the thickness of the first reference layer respectively, obtains second distance scope;
According to the second distance scope obtained, determine the thickness of the second insulating barrier between the first reference layer and the second reference layer; Wherein, the thickness of the second insulating barrier is arranged in second distance scope.
Second thickness calculation unit, when calculating the first impedance that transmission line narrow portion is divided, specifically for:
According to the first impedance and impedance deviation standard, determine the corresponding impedance ranges of impedance deviation standard;
Determine the coincidence scope of impedance ranges of the corresponding impedance ranges of impedance deviation standard and impedance standard display, and using the coincidence scope the determined impedance ranges as transmission live width part.
Although the execution mode disclosed by the present invention is as above, the execution mode that described content only adopts for ease of understanding the present invention, and be not used to limit the present invention.Those of skill in the art belonging to any the present invention; under the prerequisite not departing from the spirit and scope disclosed by the present invention; can any amendment of process and change in the form implemented and details; but scope of patent protection of the present invention, the scope that still must define with appending claims is as the criterion.
Claims (8)
1. the method for the impedance continuity of transmission line on control PCB, is characterized in that, comprising:
Divide by transmission live width part and transmission line narrow portion the transmission line formed for upper one of PCB, according to the corresponding impedance standard of transmission line, determine the thickness of the first insulating barrier between transmission line place PCB layer and the first reference layer; Wherein, the first reference layer is reference layer corresponding to impedance that transmission line narrow portion is divided;
According to the thickness of impedance standard, impedance deviation standard and the first insulating barrier, determine the thickness of the second insulating barrier between the first reference layer and the second reference layer; Wherein, the second reference layer is reference layer corresponding to the impedance of transmission live width part, and the distance between the second reference layer and transmission line place PCB layer is greater than the distance between the first reference layer and transmission line place PCB layer;
The part of the first corresponding for the upright projection of transmission live width part on the first reference layer reference layer is set to area of knockout.
2. method according to claim 1, is characterized in that, describedly determines that the thickness of the first insulating barrier comprises:
According to the impedance ranges that described impedance standard shows, calculate first distance range of described transmission line place PCB layer relative to described first reference layer;
According to the first distance range, determine the thickness of described first insulating barrier; Wherein, the thickness of described first insulating barrier is arranged in the first distance range.
3. method according to claim 2, is characterized in that, describedly determines that the thickness of the second insulating barrier comprises:
The first impedance that transmission line narrow portion is divided according to the THICKNESS CALCULATION of described first insulating barrier;
According to described impedance standard and impedance deviation standard, the first impedance of calculating, determine the impedance ranges of described transmission live width part;
According to the impedance ranges determined, calculate the actual range scope of described transmission line place PCB layer relative to described second reference layer;
Actual range scope deducts the thickness of described first insulating barrier and the thickness of described first reference layer respectively, obtains second distance scope;
According to the second distance scope obtained, determine the thickness of the second insulating barrier between described first reference layer and described second reference layer; Wherein, the thickness of the second insulating barrier is arranged in second distance scope.
4. method according to claim 3, is characterized in that, describedly determines that the impedance ranges of described transmission live width part comprises:
According to described first impedance and described impedance deviation standard, determine the corresponding impedance ranges of impedance deviation standard;
Determine the coincidence scope of impedance ranges of the corresponding impedance ranges of impedance deviation standard and the display of described impedance standard, and using the coincidence scope the determined impedance ranges as described transmission live width part.
5. the device of the impedance continuity of transmission line on control PCB, is characterized in that, comprise the first thickness calculation unit, the second thickness calculation unit and area of knockout determining unit, wherein,
First thickness calculation unit, for on PCB one by transmission live width part and transmission line narrow portion divide the transmission line formed, according to the corresponding impedance standard of transmission line, determine the thickness of the first insulating barrier between transmission line place PCB layer and the first reference layer; Wherein, the first reference layer is reference layer corresponding to impedance that transmission line narrow portion is divided;
Second thickness calculation unit, for the thickness according to impedance standard, impedance deviation standard and the first insulating barrier from the first thickness calculation unit, determines the thickness of the second insulating barrier between the first reference layer and the second reference layer; Wherein, the second reference layer is reference layer corresponding to the impedance of transmission live width part, and the distance between the second reference layer and transmission line place PCB layer is greater than the distance between the first reference layer and transmission line place PCB layer;
Area of knockout determining unit, for being set to area of knockout by the part of the first corresponding for the upright projection of transmission live width part on the first reference layer reference layer.
6. device according to claim 5, is characterized in that, described first THICKNESS CALCULATION specifically for:
According to the impedance ranges that described impedance standard shows, calculate first distance range of described transmission line place PCB layer relative to described first reference layer;
According to the first distance range, determine the thickness of described first insulating barrier; Wherein, the thickness of described first insulating barrier is arranged in the first distance range.
7. device according to claim 6, is characterized in that, described second thickness calculation unit specifically for:
The first impedance that transmission line narrow portion is divided according to the THICKNESS CALCULATION of described first insulating barrier;
According to described impedance standard and impedance deviation standard, the first impedance of calculating, determine the impedance ranges of described transmission live width part;
According to the impedance ranges determined, calculate the actual range scope of described transmission line place PCB layer relative to described second reference layer;
Actual range scope deducts the thickness of described first insulating barrier and the thickness of described first reference layer respectively, obtains second distance scope;
According to the second distance scope obtained, determine the thickness of the second insulating barrier between described first reference layer and described second reference layer; Wherein, the thickness of the second insulating barrier is arranged in second distance scope.
8. device according to claim 7, is characterized in that, described second thickness calculation unit, when calculating the first impedance that described transmission line narrow portion is divided, specifically for:
According to described first impedance and described impedance deviation standard, determine the corresponding impedance ranges of impedance deviation standard;
Determine the coincidence scope of impedance ranges of the corresponding impedance ranges of impedance deviation standard and the display of described impedance standard, and using the coincidence scope the determined impedance ranges as described transmission live width part.
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Cited By (4)
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| CN104797078A (en) * | 2015-04-10 | 2015-07-22 | 福州瑞芯微电子有限公司 | Method for reducing impedance mismatching degree under condition of discontinuous returning path |
| CN104797079A (en) * | 2015-04-10 | 2015-07-22 | 福州瑞芯微电子有限公司 | Method for reducing impedance mismatching on package and PCB (printed circuit board) |
| CN107454736A (en) * | 2017-06-27 | 2017-12-08 | 上达电子（深圳）股份有限公司 | A kind of circuit board and its cabling impedance adjustment |
| WO2022021855A1 (en) * | 2020-07-30 | 2022-02-03 | 苏州浪潮智能科技有限公司 | Impedance matching apparatus and method for pcb wiring of solid state drive, device and medium |
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| CN102056401A (en) * | 2009-10-28 | 2011-05-11 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board |
| CN102291951A (en) * | 2011-06-20 | 2011-12-21 | 华为终端有限公司 | Impedance control method and structure of FPC (Flexible Printed Circuit) |
| CN203206579U (en) * | 2013-04-15 | 2013-09-18 | 杭州华三通信技术有限公司 | Device for improving impedance continuity of signal line |
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| CN104797078A (en) * | 2015-04-10 | 2015-07-22 | 福州瑞芯微电子有限公司 | Method for reducing impedance mismatching degree under condition of discontinuous returning path |
| CN104797079A (en) * | 2015-04-10 | 2015-07-22 | 福州瑞芯微电子有限公司 | Method for reducing impedance mismatching on package and PCB (printed circuit board) |
| CN107454736A (en) * | 2017-06-27 | 2017-12-08 | 上达电子（深圳）股份有限公司 | A kind of circuit board and its cabling impedance adjustment |
| CN107454736B (en) * | 2017-06-27 | 2019-08-27 | 上达电子（深圳）股份有限公司 | A kind of circuit board and its cabling impedance adjustment |
| WO2022021855A1 (en) * | 2020-07-30 | 2022-02-03 | 苏州浪潮智能科技有限公司 | Impedance matching apparatus and method for pcb wiring of solid state drive, device and medium |
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