CN105916303A - PCB and method for producing same - Google Patents
PCB and method for producing same Download PDFInfo
- Publication number
- CN105916303A CN105916303A CN201610327638.5A CN201610327638A CN105916303A CN 105916303 A CN105916303 A CN 105916303A CN 201610327638 A CN201610327638 A CN 201610327638A CN 105916303 A CN105916303 A CN 105916303A
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- signal
- pcb board
- generated
- parameter
- eye pattern
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention provides a PCB and a method for producing the same. The method comprises the steps of: determining signal quality requirements of a signal in a signal line of the PCB to be produced in advance; determining line parameters of the signal line in a signal layer provided with the signal line in the PCB to be produced; determining dielectric parameters of a dielectric between the signal layer and a reference plane of the PCB to be produced; determining signal parameters of the signal in the signal line; determining optimization thickness, satisfying the signal quality requirements, of the dielectric between the signal layer and the reference plane according to the line parameters, the dielectric parameters and the signal parameters; and producing the PCB to be produced according to the optimization thickness. The PCB and the method for producing the same provided by the invention can reduce cost of the PCB.
Description
Technical field
The present invention relates to electronic technology field, generate PCB (Printed Circuit particularly to one
Board, printed circuit board) method of plate and a kind of pcb board.
Background technology
Along with the arrival in cloud computing epoch, server quickly grow emergence, design at server master board
In, signal rate is more and more higher, and the demand of signal integrity is also constantly being promoted by high speed signal.At PCB
In the high-speed line design of plate, dielectric thickness between high speed signal line length live width line-spacing, holding wire to reference plane,
The unit for electrical property parameters of sheet material, the roughness etc. of Copper Foil all can affect the loss of signal.How Appropriate application this
A little factors so that signal quality meets design requirement, become the direction that research and development engineer endeavours to optimize always.
In the design of existing pcb board, in order to meet the requirement to signal quality, it will usually by more
Change the sheet material of pcb board, use the more preferable sheet material of performance to realize the requirement to signal quality.
Visible by foregoing description, in existing technical scheme, expired by the more preferable sheet material of serviceability
The foot requirement to signal quality, such that the cost of pcb board is substantially improved.
Summary of the invention
Embodiments provide a kind of method generating pcb board and a kind of pcb board, it is possible to reduce
The cost of pcb board.
First aspect, embodiments provides a kind of method generating pcb board, including:
S0: the demand on signal quality of the signal in the holding wire of predetermined pcb board to be generated；
S1: determine the line of holding wire in the signals layer being provided with holding wire in described pcb board to be generated
Parameter；
S2: determine the medium of medium between the reference plane of described signals layer and described pcb board to be generated
Parameter；
S3: determine the signal parameter of signal in described holding wire；
S4: according to described line parameter, described medium parameter and described signal parameter, determine and meet described letter
The optimization thickness of the medium between described signals layer and the described reference plane of number prescription；
S5: generate described pcb board to be generated according to described optimization thickness.
Further, the requiring to include of described signal quality: the requirement of eye pattern；
Described S4, including:
According to described line parameter, described medium parameter and described signal parameter, to described pcb board to be generated
Emulate, adjust the thickness of medium between described signals layer and described reference plane, generate each thickness
The eye pattern that degree is corresponding；
According to the eye pattern generated, determine the optimization thickness of the requirement meeting described eye pattern.
Further, described signal parameter includes: described signal is SAS (Serial Attached SCSI)
Signal；
Requiring to include of described eye pattern: the height of eye pattern is more than or equal to 75mV, and the width of eye pattern is more than
Equal to 25pS.
Further, described described pcb board to be generated is emulated, including:
Utilize Advanced Design System ADS that described pcb board to be generated is emulated.
Further, described line parameter includes: the length of described holding wire, and/or, the impedance of holding wire.
Further, described medium parameter includes: the dielectric constant of described medium.
Further, described signal parameter includes: the type of described signal.
Further, described S5, including:
Described optimization thickness is imported in layout design and the PCB making of described pcb board to be generated.
Further, described S0, including:
Determine the signal type of signal in the holding wire of described pcb board to be generated；
Determine the requirement of the eye pattern needing to meet that described signal type is corresponding.
Second aspect, embodiments provides a kind of pcb board, including:
The pcb board generated according to described method arbitrary in first aspect.
In embodiments of the present invention, according to the line parameter of holding wire, Jie of the pcb board to be generated determined
Matter parameter and signal parameter, determine the medium meeting between the signals layer of demand on signal quality and reference plane
Optimization thickness, improve signal quality by adjusting the thickness of medium of pcb board to be generated, it is not necessary to make
Also pcb board can be made to disclosure satisfy that demand on signal quality with the more preferable sheet material of performance, reduce pcb board
Cost.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to reality
Execute the required accompanying drawing used in example or description of the prior art to be briefly described, it should be apparent that below,
Accompanying drawing in description is some embodiments of the present invention, for those of ordinary skill in the art, not
On the premise of paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the flow chart of a kind of method generating pcb board that one embodiment of the invention provides；
Fig. 2 is the flow chart of the another kind of method generating pcb board that one embodiment of the invention provides.
Detailed description of the invention
For making the purpose of the embodiment of the present invention, technical scheme and advantage clearer, below in conjunction with this
Accompanying drawing in bright embodiment, is clearly and completely described the technical scheme in the embodiment of the present invention,
Obviously, described embodiment is a part of embodiment of the present invention rather than whole embodiments, based on
Embodiment in the present invention, those of ordinary skill in the art are institute on the premise of not making creative work
The every other embodiment obtained, broadly falls into the scope of protection of the invention.
As it is shown in figure 1, embodiments provide a kind of method generating pcb board, the method is permissible
Comprise the following steps:
S0: the demand on signal quality of the signal in the holding wire of predetermined pcb board to be generated；
S1: determine the line of holding wire in the signals layer being provided with holding wire in described pcb board to be generated
Parameter；
S2: determine the medium of medium between the reference plane of described signals layer and described pcb board to be generated
Parameter；
S3: determine the signal parameter of signal in described holding wire；
S4: according to described line parameter, described medium parameter and described signal parameter, determine and meet described letter
The optimization thickness of the medium between described signals layer and the described reference plane of number prescription；
S5: generate described pcb board to be generated according to described optimization thickness.
In embodiments of the present invention, according to the line parameter of holding wire, Jie of the pcb board to be generated determined
Matter parameter and signal parameter, determine the medium meeting between the signals layer of demand on signal quality and reference plane
Optimization thickness, improve signal quality by adjusting the thickness of medium of pcb board to be generated, it is not necessary to make
Also pcb board can be made to disclosure satisfy that demand on signal quality with the more preferable sheet material of performance, reduce pcb board
Cost.
In an embodiment of the present invention, the requiring to include of described signal quality: the requirement of eye pattern；
Described S4, including:
According to described line parameter, described medium parameter and described signal parameter, to described pcb board to be generated
Emulate, adjust the thickness of medium between described signals layer and described reference plane, generate each thickness
The eye pattern that degree is corresponding；
According to the eye pattern generated, determine the optimization thickness of the requirement meeting described eye pattern.
In embodiments of the present invention, by the requirement of eye pattern is realized the demand on signal quality to signal.
Specifically, can be by the height of eye pattern and the requirement of width be realized.In embodiments of the present invention,
Line parameter, medium parameter and the signal parameter being determined by out, emulates pcb board to be generated, logical
The thickness of the medium between toning entire signal layer and reference plane adjusts the quality of the signal on holding wire,
Until being met the thickness of the requirement of eye pattern.
In general, the signal type on holding wire is different, and the requirement of eye pattern is the most different.Implement in one
In example, described signal parameter includes: described signal is SAS signal；
Requiring to include of described eye pattern: the height of eye pattern is more than or equal to 75mV, and the width of eye pattern is more than
Equal to 25pS.
In an embodiment of the present invention, described described pcb board to be generated is emulated, including:
Utilize ADS that described pcb board to be generated is emulated.
In embodiments of the present invention, ADS can be Angilen ADS software.Specifically can pass through
Angilen ADS software carries out active emulation to pcb board to be generated.
In an embodiment of the present invention, described line parameter includes: the length of described holding wire, and/or, letter
The impedance of number line.
In an embodiment of the present invention, described medium parameter includes: the dielectric constant of described medium.Wherein,
Medium may include that the material that glass cloth strengthens, the material strengthened without glass cloth.
In an embodiment of the present invention, described signal parameter includes: the type of described signal.For example,
Signal is SAS signal.
In an embodiment of the present invention, described S5, including:
Described optimization thickness is imported in layout design and the PCB making of described pcb board to be generated.
Specifically, thickness will be optimized as the medium between the signals layer and reference plane of pcb board to be generated
Thickness, import to pcb board to be generated layout design and PCB make in.
Signal in the holding wire of pcb board is usually constant, in an embodiment of the present invention, and described S0,
Including:
Determine the signal type of signal in the holding wire of described pcb board to be generated；
Determine the requirement of the eye pattern needing to meet that described signal type is corresponding.
In embodiments of the present invention, therefore, it can the design according to pcb board to be generated require, needed
The function etc. become determines the signal type of signal in holding wire, determines wanting of eye pattern according to signal type
Ask.When transmitting multi-signal in holding wire, the requirement of this eye pattern is for meeting all types of signal
The requirement of eye pattern.For example, the requirement of the eye pattern of signal A is: the height of eye pattern is more than or equal to
75mV, and the width of eye pattern is more than or equal to 25pS；The requirement of the eye pattern of signal B is: the height of eye pattern
More than or equal to 80mV, and the width of eye pattern is more than or equal to 20pS.So, the requirement of this eye pattern is: eye
The height of figure is more than or equal to 80mV, and the width of eye pattern is more than or equal to 25pS.
It addition, the requirement of the eye pattern corresponding to every kind of signal can be determined by spec protocol specification.
As in figure 2 it is shown, a kind of method generating pcb board that the embodiment of the present invention provides, the method includes:
Step 201: determine the signal type of signal in the holding wire of pcb board to be generated.
For example, signal type is SAS signal type.
Step 202: determine the requirement of the eye pattern needing to meet that described signal type is corresponding.
For SAS signal, be can determine that by spec protocol specification the requirement of eye pattern is: eye pattern
Highly more than or equal to 75mV, and the width of eye pattern is more than or equal to 25pS.
Step 203: determine holding wire in the signals layer being provided with holding wire in pcb board to be generated
Line parameter.
Wherein, line parameter can be the impedance of the length of holding wire, holding wire.For example, holding wire
Impedance be 100ohm.Here holding wire can be difference cabling.
Step 204: determine that the medium of the medium between the reference plane of signals layer and pcb board to be generated is joined
Number.
This medium parameter can be the dielectric constant of this medium.
Step 205: determine the signal parameter of signal in holding wire.
This signal parameter can be the type of signal, such as: determine that this signal is SAS signal.This letter
Number parameter can also include: the frequency of signal.
Step 206: according to line parameter, medium parameter and signal parameter, utilizes ADS to PCB to be generated
Plate emulates, the thickness of the medium between adjustment signals layer and reference plane, generates each thickness corresponding
Eye pattern.
In embodiments of the present invention, after line parameter, medium parameter, signal parameter all determine, by adjusting
The thickness of the medium between entire signal layer and reference plane adjusts eye pattern in simulation result.When the eye obtained
When figure meets the requirement of eye pattern, it is determined that this thickness is the optimization thickness of pcb board to be generated, it is,
Pcb board to be generated is made according to this optimization thickness.In simulation process, at pcb board to be generated
In the case of other conditions are constant, the thickness of the medium between regulation signals layer and reference plane.Such as:
Successively the thickness of the medium between signals layer and reference plane is set to 4mil, 5mil, 6mil, works as thickness
Degree is 6mil, and the eye pattern obtained meets the requirement of eye pattern, specifically, when thickness is 6mil, and the eye obtained
The height of figure is 89mV, and more than or equal to 75mV, and width is 27pS, more than or equal to 25pS.6mil
Can be as optimizing thickness.
Step 207: according to the eye pattern generated, determine the optimization thickness of the requirement meeting eye pattern.
In general, along with the increase of the thickness of medium between holding wire to reference plane, insertion loss value with
Reduction, height and the width of receiving end signal eye pattern increase the most therewith, and signal quality is obviously improved.
But, in order to reduce cost, will not infinitely increase this thickness, as long as meeting the requirement of eye pattern.
Step 208: generate pcb board to be generated according to optimizing thickness.
Specifically, optimization thickness is imported to layout design and the PCB system of described pcb board to be generated
In work.
For high speed signal, when Design PCB plate, or crosstalk long at holding wire is relatively big, causes letter
Number loss is serious, the situation that eye diagram results not up to requires, in embodiments of the present invention, can set at lamination
In meter, by the thickness of the medium between the signals layer at regulation holding wire place to reference plane, reduce letter
Number loss, improves signal quality, avoids using the cost that brings of high-quality sheet material to raise simultaneously.
Contrast simulation result shows, along with the increase of dielectric thickness, loss of signal reduces, and in eye pattern, eye is high
Wide with eye also have significantly increase, and signal quality is significantly improved.The method is easy to use simultaneously, can
Strong operability, it is adaptable to all boards design, it is easy to realize in the design.
Embodiments provide a kind of pcb board, including: according to embodiments of the present invention arbitrary described
Method generate pcb board.
For example, the signal in the holding wire of this pcb board is SAS signal, and the impedance of holding wire is
100ohm, the thickness of the medium between the reference plane of signals layer and pcb board to be generated is 6mil.
The embodiment of the present invention at least has the advantages that
1, in embodiments of the present invention, according to the line parameter of the holding wire of the pcb board to be generated determined,
Medium parameter and signal parameter, determine Jie meeting between the signals layer of demand on signal quality and reference plane
The optimization thickness of matter, improves signal quality by adjusting the thickness of the medium of pcb board to be generated, it is not necessary to
The more preferable sheet material of serviceability also can make pcb board disclosure satisfy that demand on signal quality, reduces PCB
The cost of plate.
2, when Design PCB plate, or crosstalk long at holding wire is relatively big, causes loss of signal serious,
The situation that eye diagram results not up to requires, in embodiments of the present invention, in stack-design, by regulation
The signals layer at holding wire place, to the thickness of the medium between reference plane, reduces loss of signal, improves letter
Number quality, it is to avoid the cost using high-quality sheet material to bring raises.
It should be noted that in this article, the relational terms of such as first and second etc be used merely to by
One entity or operation separate with another entity or operating space, and not necessarily require or imply this
Relation or the order of any this reality is there is between a little entities or operation.And, term " includes ",
" comprise " or its any other variant is intended to comprising of nonexcludability, so that include that one is
The process of row key element, method, article or equipment not only include those key elements, but also include the brightest
Other key elements really listed, or also include intrinsic for this process, method, article or equipment
Key element.In the case of there is no more restriction, statement " including ... " limit
Key element, it is not excluded that there is also another in including the process of described key element, method, article or equipment
Outer same factor.
One of ordinary skill in the art will appreciate that: realize all or part of step of said method embodiment
Can be completed by the hardware that programmed instruction is relevant, aforesaid program can be stored in embodied on computer readable
Storage medium in, this program upon execution, performs to include the step of said method embodiment；And it is aforementioned
Storage medium include: various Jie that can store program code such as ROM, RAM, magnetic disc or CD
In matter.
Last it should be understood that the foregoing is only presently preferred embodiments of the present invention, it is merely to illustrate this
The technical scheme of invention, is not intended to limit protection scope of the present invention.All spirit in the present invention and former
Any modification, equivalent substitution and improvement etc. done within then, are all contained in protection scope of the present invention.
Claims (10)
1. the method generating printing board PCB plate, it is characterised in that including:
S0: the demand on signal quality of the signal in the holding wire of predetermined pcb board to be generated；
S1: determine the line of holding wire in the signals layer being provided with holding wire in described pcb board to be generated
Parameter；
S2: determine the medium of medium between the reference plane of described signals layer and described pcb board to be generated
Parameter；
S3: determine the signal parameter of signal in described holding wire；
S4: according to described line parameter, described medium parameter and described signal parameter, determine and meet described letter
The optimization thickness of the medium between described signals layer and the described reference plane of number prescription；
S5: generate described pcb board to be generated according to described optimization thickness.
Method the most according to claim 1, it is characterised in that
Requiring to include of described signal quality: the requirement of eye pattern；
Described S4, including:
According to described line parameter, described medium parameter and described signal parameter, to described pcb board to be generated
Emulate, adjust the thickness of medium between described signals layer and described reference plane, generate each thickness
The eye pattern that degree is corresponding；
According to the eye pattern generated, determine the optimization thickness of the requirement meeting described eye pattern.
Method the most according to claim 2, it is characterised in that
Described signal parameter includes: described signal is SAS signal；
Requiring to include of described eye pattern: the height of eye pattern is more than or equal to 75mV, and the width of eye pattern is more than
Equal to 25pS.
Method the most according to claim 2, it is characterised in that
Described described pcb board to be generated is emulated, including:
Utilize Advanced Design System ADS that described pcb board to be generated is emulated.
Method the most according to claim 1, it is characterised in that
Described line parameter includes: the length of described holding wire, and/or, the impedance of holding wire.
Method the most according to claim 1, it is characterised in that
Described medium parameter includes: the dielectric constant of described medium.
Method the most according to claim 1, it is characterised in that
Described signal parameter includes: the type of described signal.
Method the most according to claim 1, it is characterised in that described S5, including:
Described optimization thickness is imported in layout design and the PCB making of described pcb board to be generated.
9. according to described method arbitrary in claim 1-8, it is characterised in that described S0, including:
Determine the signal type of signal in the holding wire of described pcb board to be generated；
Determine the requirement of the eye pattern needing to meet that described signal type is corresponding.
10. a printing board PCB plate, it is characterised in that including:
The pcb board generated according to described method arbitrary in claim 1-9.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610327638.5A CN105916303A (en) | 2016-05-16 | 2016-05-16 | PCB and method for producing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610327638.5A CN105916303A (en) | 2016-05-16 | 2016-05-16 | PCB and method for producing same |
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Family
ID=56749313
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| CN201610327638.5A Pending CN105916303A (en) | 2016-05-16 | 2016-05-16 | PCB and method for producing same |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107094349A (en) * | 2017-06-20 | 2017-08-25 | 广州兴森快捷电路科技有限公司 | Printed circuit board and preparation method thereof |
| CN110290637A (en) * | 2019-07-30 | 2019-09-27 | 广东浪潮大数据研究有限公司 | A kind of method, system and associated component reducing pcb board signal cross-talk |
| CN112131823A (en) * | 2020-09-29 | 2020-12-25 | 浪潮电子信息产业股份有限公司 | Method, device, equipment and medium for determining thickness of signal layer in PCB |
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| CN101820259A (en) * | 2010-02-08 | 2010-09-01 | 成都市华为赛门铁克科技有限公司 | Method and device for adjusting signal amplitude |
| CN102333413A (en) * | 2010-07-12 | 2012-01-25 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board |
| CN104538720A (en) * | 2014-09-26 | 2015-04-22 | 中国人民解放军总参谋部第六十三研究所 | Stripline 90-degree hybrid joint |
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| US20060061432A1 (en) * | 2004-09-22 | 2006-03-23 | Hon Hai Precision Industry Co., Ltd. | Two-layer PCB with impedence control and method of providing the same |
| CN101820259A (en) * | 2010-02-08 | 2010-09-01 | 成都市华为赛门铁克科技有限公司 | Method and device for adjusting signal amplitude |
| CN102333413A (en) * | 2010-07-12 | 2012-01-25 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107094349A (en) * | 2017-06-20 | 2017-08-25 | 广州兴森快捷电路科技有限公司 | Printed circuit board and preparation method thereof |
| CN107094349B (en) * | 2017-06-20 | 2019-08-27 | 广州兴森快捷电路科技有限公司 | Printed circuit board and preparation method thereof |
| CN110290637A (en) * | 2019-07-30 | 2019-09-27 | 广东浪潮大数据研究有限公司 | A kind of method, system and associated component reducing pcb board signal cross-talk |
| CN112131823A (en) * | 2020-09-29 | 2020-12-25 | 浪潮电子信息产业股份有限公司 | Method, device, equipment and medium for determining thickness of signal layer in PCB |
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