CN107094349B - Printed circuit board and preparation method thereof - Google Patents
Printed circuit board and preparation method thereof Download PDFInfo
- Publication number
- CN107094349B CN107094349B CN201710470840.8A CN201710470840A CN107094349B CN 107094349 B CN107094349 B CN 107094349B CN 201710470840 A CN201710470840 A CN 201710470840A CN 107094349 B CN107094349 B CN 107094349B
- Authority
- CN
- China
- Prior art keywords
- impedance
- circuit board
- printed circuit
- layer
- parameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0776—Resistance and impedance
- H05K2201/0784—Uniform resistance, i.e. equalizing the resistance of a number of conductors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a kind of printed circuit boards and preparation method thereof, the production method of the printed circuit board is the following steps are included: stepped construction designs, impedance design, sawing sheet and optimization impedance design, make internal layer circuit and post-processing forms the printed circuit board of Multilayer Structure.Described printed circuit board and preparation method thereof, by the way that the factor for influencing impedance value is monitored and is adjusted in sawing sheet and the production process of production internal layer circuit, it can solve the problems, such as that printed circuit board causes interior layer impedance to be difficult to control because of factor each in production process, the interior layer impedance for steadily controlling printed circuit board meets high-precision requirement, improve the high speed transmission of signals performance of printed circuit board, and then it can be improved the impedance qualification rate of printed circuit board, reduce impedance scrappage, production cost is reduced, is reduced because handing over phase tardy problem caused by the bad problem of impedance.
Description
Technical field
The present invention relates to printed circuit board technology fields more particularly to a kind of printed circuit board and preparation method thereof.
Background technique
As PCB (Printed Circuit Board, printed circuit board) tends to high speed and high frequency direction is developed,
It is higher and higher for the impedance control precision of PCB.The impedance control precision of PCB product is generally ± 10%, also has part high-end
Product requirement impedance control can reach higher precision, as impedance control precision reaches ± 7% or ± 5%, and such product quantity
It is more and more.
Traditional, when carrying out impedance design to PCB, it will usually be simulated using some impedance computation softwares to impedance
Prediction produces then according to a set of suitable control program of the selection such as requirement such as laminated construction, line width, thickness of dielectric layers of client
With regard to carrying out the impedance that production allows the impedance of product to meet the requirements of the customers according to control program when designing when product make.But by
It is more in the factor for influencing PCB impedance, and PCB production process is relatively complicated, the product obtained using conventional method is especially had
There is the product of high-precision impedance control demand, impedance qualification rate is poor, and then causes product rejection rate height, cost of manufacture high,
There is friendship phase tardy problem in product.
Summary of the invention
Based on this, it is necessary to provide a kind of printed circuit board and preparation method thereof, the printed circuit board and preparation method thereof
It can be improved the impedance qualification rate of product, reduce production cost, reduce because handing over phase tardy problem caused by the bad problem of impedance.
Its technical solution is as follows:
A kind of production method of printed circuit board, comprising the following steps:
S1, stepped construction design: laminated construction design is carried out according to the design requirement of printed circuit board, obtains printed circuit
The initial medium thickness degree and initial dielectric constant of each dielectric layer of plate obtain the initial copper thickness value of each layer of printed circuit board,
Wherein, the initial medium layer of layer where the impedance line of printed circuit board is with a thickness of H0, initial dielectric constant be Er0, initial copper thickness value
For T0, the initial medium layer of the shielded layer as the impedance line is with a thickness of H0', initial dielectric constant be Er0′；
S2, impedance design: requiring according to the impedance control of printed circuit board, carries out impedance using impedance design software and sets
Meter, obtains the initial impedance design parameter of the impedance line of printed circuit board；
S3, sawing sheet and optimization impedance design: core plate and prepreg are carried out by sawing sheet according to PCB layout size, choosing should
The core plate and prepreg of same batch after sawing sheet are tested, the practical core thickness H of layer where obtaining impedance line1And reality
Core plate dielectric constant Er1, obtain the practical prepreg thickness H of the shielded layer as the impedance line2With practical prepreg dielectric
Constant Er2, respectively by H1、H2、Er1、Er2With corresponding H0、H0′、Er0、Er0' compare, if H1、H2With H0、H0' difference
In preset thickness control tolerance, Er1、Er2With Er0、Er0' difference default dielectric constant control tolerance in, then still select
The initial impedance design parameter obtained in step S2 is as new impedance design parameter；If H1、H2With H0、H0' difference default
Other than thickness control tolerance, Er1、Er2With Er0、Er0' difference default dielectric constant control tolerance other than, then by H1、H2、
Er1、Er2It brings impedance design software into and optimizes impedance design, and the first impedance design parameter after output adjustment is as new
Impedance design parameter；
S4, production internal layer circuit: carrying out internal layer circuit production to the core plate of layer where the impedance line after step S3,
The practical copper thickness value T that the core plate of layer where obtaining impedance line is tested after development, before etching, by (T-T ') and T0It compares, if
(T-T ') and T0Difference in default copper thickness control tolerance, then the new impedance design parameter conduct that is obtained in optional step S3
Newest impedance design parameter；(if T-T ') and T0Difference default copper thickness control tolerance other than, then bring T into impedance design
Software optimizes impedance design, and the second impedance design parameter after output adjustment is as newest impedance design parameter,
In, T ' expression brownification influence value；
Production FA plate is etched, and the practical impedance design parameter of the FA plate is tested after etching, and practical impedance is designed
Parameter is compared with newest impedance design parameter, if the two difference can carry out in default impedance parameter control tolerance
Subsequent batch production；If the two difference controls other than tolerance in default impedance parameter, the manufacturing parameter of etching is adjusted, is made again
Make FA plate and test etching after impedance design parameter, until difference default impedance parameter control tolerance in, then with adjust after
The manufacturing parameter of etching produced in batches；
S5, post-processing form the printed circuit board of Multilayer Structure.
In one of the embodiments, before step S1, the production method of the printed circuit board is further comprised the steps of:
S0, file optimization design: after the completion of PCB routing, in the spacious area of the graphic designs of printed circuit board
And/or isolated line region is laid with balance copper point.
In one of the embodiments, in the step S1: at the beginning of the core plate of layer where the impedance line of printed circuit board
100 μm of beginning thickness of dielectric layers >, and/or, the initial medium thickness degree > 100 of the prepreg of the shielded layer as the impedance line
μm。
In one of the embodiments, in the step S1: the initial copper of layer is thick where the impedance line of printed circuit board
Value is 8 μm, 12 μm or 18 μm, and the initial copper thickness value of the shielded layer as the impedance line is 8 μm, 12 μm or 18 μm.
In one of the embodiments, in the step S1: each dielectric layer of printed circuit board is low-k
Elastomeric material.
In one of the embodiments, the step S5 specifically includes the following steps:
S51, brownification, pressing: the core plate of layer where impedance line is subjected to brownification processing and obtains brownification layer, and using after sawing sheet
The prepreg of same batch overlapped so that prepreg between core plate, forms laminated plate, passes through heat pressing process pair
Superimposed sheet carries out pressing and forms multi-layer board；
S52, drilling, plating, outer-layer circuit etching, welding resistance: drilled, be electroplated to multi-layer board, outer-layer circuit etching with
And welding resistance production, form the printed circuit board of complete Multilayer Structure.
In one of the embodiments, in the step S51: when carrying out heat pressing process, the pressing program of material is adjusted,
The dosage of padded coaming when adjusting lamination, so that the heating rate of material lowers 0.2 DEG C/min~0.5 DEG C/min.
In one of the embodiments, in the step S4, batch is being carried out with the manufacturing parameter of etching adjusted
After production stage, further comprises the steps of: and carry out taking a sample test inspection in batch production process, the impedance line of product after test etching
Whether impedance design parameter is in default impedance parameter control tolerance, if continuing to produce in batches；If not existing, root
It is adjusted according to manufacturing parameter of the test result to etching.
In one of the embodiments, after step s 5, the production method of the printed circuit board further includes following step
It is rapid:
S6, testing impedance: using the impedance value of the printed circuit board after the test batch production of TDR equipment, and according to impedance
It controls tolerance and determines whether the interior layer impedance of printed circuit board is qualified.
A kind of printed circuit board makes to obtain using the production method of printed circuit board as described above.
The beneficial effects of the present invention are:
The production method of the printed circuit board successively carries out stepped construction design according to customer demand first and impedance is set
Meter, obtains each initial parameter of each dielectric layer of printed circuit board, and then obtain in printed circuit board by impedance design software
Impedance line initial impedance design parameter, then after sawing sheet according to the material actual parameter after practical sawing sheet to initial impedance
Design parameter is adjusted amendment, and is influenced according to actual production factor to new resistance during making internal layer circuit
Anti- design parameter is adjusted amendment, is adjusted to the manufacturing parameter of etching, obtains the printed circuit board of Multilayer Structure.Institute
The production method for stating printed circuit board, by sawing sheet and make internal layer circuit production process in influence impedance value factor into
Row monitoring and adjustment, can solve the problems, such as printed circuit board because factor each in production process cause interior layer impedance be difficult to control, surely
Surely the interior layer impedance for controlling printed circuit board meets high-precision requirement, improves the high speed transmission of signals of printed circuit board
Can, and then can be improved the impedance qualification rate of printed circuit board, impedance scrappage is reduced, production cost is reduced, is reduced because of impedance
Phase tardy problem is handed over caused by bad problem.
The printed circuit board makes to obtain using the production method of above-mentioned printed circuit board, and the impedance of product is qualified
Rate is high, production cost is low, is less prone to the bad problem of impedance.
Detailed description of the invention
Fig. 1 is the flowage structure schematic diagram one of the production method of printed circuit board described in the embodiment of the present invention；
Fig. 2 is the flowage structure schematic diagram two of the production method of printed circuit board described in the embodiment of the present invention；
Fig. 3 is the exemplary construction schematic diagram of printed circuit board described in the embodiment of the present invention.
Description of symbols:
100, prepreg, 200, core plate, 300, single-ended impedance line, 400, differential impedance line.
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing
Give better embodiment of the invention.But the invention can be realized in many different forms, however it is not limited to herein
Described embodiment.On the contrary, the purpose of providing these embodiments is that making to understand more the disclosure
Add thorough and comprehensive.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.On the contrary, when element is referred to as " directly existing " another element "upper",
There is no intermediary elements.Term as used herein "vertical", "horizontal", "left" and "right" and similar statement are
For illustrative purposes, it is not meant to be the only embodiment.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more
Any and all combinations of relevant listed item.Term as used herein " first ", " second " etc. are used herein
In differentiation object, but these objects should not be limited by these terms.
As shown in Figure 1, a kind of production method of printed circuit board, comprising the following steps:
S1, stepped construction design: laminated construction design is carried out according to the design requirement of printed circuit board, obtains printed circuit
The initial medium thickness degree and initial dielectric constant of each dielectric layer of plate obtain the initial copper thickness value of each layer of printed circuit board,
Wherein, the initial medium layer of layer where the impedance line of printed circuit board is with a thickness of H0, initial dielectric constant be Er0, initial copper thickness value
For T0, the initial medium layer of the shielded layer as the impedance line is with a thickness of H0', initial dielectric constant be Er0′.It specifically, can root
According to customer demand, according to signal frequency, the signal rate on the design requirement of the plate thickness, bus plane, stratum of PCB etc. and PCB
Deng selection suitable material carry out laminated construction design, and obtain each dielectric layer initial medium thickness degree and initial dielectric it is normal
Number, obtains the initial copper thickness value of each layer of printed circuit board.
Optionally, in step sl, the initial medium thickness degree > 100 of the core plate of layer where the impedance line of printed circuit board
μm, and/or, 100 μm of > of the initial medium thickness degree of the prepreg of the shielded layer as the impedance line.In turn, impedance line institute
Initial medium thickness degree in the core plate of layer, the shielded layer as the impedance line prepreg initial medium thickness degree compared with
Thickness, uniformity is more preferable, and impedance design parameter can be controlled preferably when carrying out impedance design.Optionally, the resistance of printed circuit board
The initial copper thickness value of layer where anti-line is 8 μm, 12 μm or 18 μm, the initial copper thickness value of the shielded layer as the impedance line is 8 μm,
12 μm or 18 μm.In turn, copper thickness value is thicker, and copper thickness uniformity is more preferable, carry out impedance design when impedance design parameter can be more preferable
Control, impedance control difficulty reduce.Optionally, each dielectric layer of printed circuit board is low-k elastomeric material, can
Further decrease impedance control difficulty.Specifically, low-k elastomeric material refers to material of the dielectric constant Er less than 4.0.
S2, impedance design: requiring according to the impedance control of printed circuit board, and according to each data obtained in step S1,
Impedance design is carried out using impedance design software, obtains the initial impedance design parameter of the impedance line of printed circuit board.Specifically,
When the impedance line is single-ended impedance line, the initial impedance design parameter is initial upper line width values W10With initial lower line width values
W20；When the impedance line is differential impedance line, the initial impedance design parameter is initial upper line width values W10, it is initial offline
Width values W20With initial lower line width values W20/ initial line is away from value S0。
S3, sawing sheet and optimization impedance design: core plate and prepreg are carried out by sawing sheet according to PCB layout size, choosing should
The core plate and prepreg of same batch after sawing sheet are tested, the practical core thickness H of layer where obtaining impedance line1And reality
Core plate dielectric constant Er1, obtain the practical prepreg thickness H of the shielded layer as the impedance line2With practical prepreg dielectric
Constant Er2, respectively by H1、H2、Er1、Er2With corresponding H0、H0′、Er0、Er0' compare, if H1、H2With H0、H0' difference
In preset thickness control tolerance, Er1、Er2With Er0、Er0' difference default dielectric constant control tolerance in, then still select
The initial impedance design parameter obtained in step S2 is as new impedance design parameter；If H1、H2With H0、H0' difference default
Other than thickness control tolerance, Er1、Er2With Er0、Er0' difference default dielectric constant control tolerance other than, then by H1、H2、
Er1、Er2It brings impedance design software into and optimizes impedance design, and the first impedance design parameter after output adjustment is as new
Impedance design parameter.
Since the thickness of dielectric layers of different batches PCB material, dielectric constant etc. have certain fluctuation, this fluctuation is for normal
The impedance control of rule impedance product (impedance control accuracy tolerance >=± 10%) have it is certain influence but less big, and for high-precision
The influence of impedance product (impedance control accuracy tolerance < ± 10% such as ± 7% or ± 5%) can not be ignored, and be easy to cause this most
The impedance control of whole high-precision product is exceeded.The step S3, by choosing the core plate and semi-solid preparation with batch after sawing sheet
Piece retests to obtain the H after sawing sheet1、H2、Er1、Er2Value, then by H1With H0、H2With H0′、Er1With Er0、Er2With Er0' point
It does not compare, tolerance is controlled according to preset thickness and default dielectric constant control tolerance adjusts accordingly amendment, is obtained new
Impedance design parameter, and then impedance control is adjusted to according to actual production factor, printed circuit board can be solved because of life
The problem that production factor causes interior layer impedance uncontrollable, improves the impedance qualification rate of product.
Optionally, 9 method tests can be used, calculate the thickness value for obtaining core plate and prepreg, Resonant-cavity Method can be used
Test obtains the dielectric constant values of core plate and prepreg.It, can when the core plate and prepreg of the same batch after choosing the sawing sheet
It chooses 1~3 core plate and 1~3 prepreg is tested respectively, be then averaged and obtain corresponding thickness value and dielectric
Constant value, test is more accurate, also more accurate to impedance control.Optionally, preset thickness control tolerance can be ± 1%,
Refer to≤± 1% in preset thickness control tolerance, is controlled in preset thickness and refer to > ± 1% other than tolerance.Default dielectric is normal
Number control tolerance can be ± 0.1, refer to≤± 0.1 in default dielectric constant control tolerance, control in default dielectric constant
Refer to > ± 0.1 other than tolerance.In turn, the control precision of internal layer impedance is high, can meet actual demand.
S4, production internal layer circuit: carrying out internal layer circuit production to the core plate of layer where the impedance line after step S3,
The practical copper thickness value T that the core plate of layer where obtaining impedance line is tested after development, before etching, by (T-T ') and T0It compares, if
(T-T ') and T0Difference in default copper thickness control tolerance, then the new impedance design parameter conduct that is obtained in optional step S3
Newest impedance design parameter；(if T-T ') and T0Difference default copper thickness control tolerance other than, then bring T into impedance design
Software optimizes impedance design, and the second impedance design parameter after output adjustment is as newest impedance design parameter,
In, T ' expression brownification influence value；Production FA plate is etched, and the practical impedance design parameter of the FA plate is tested after etching, and will
Practical impedance design parameter is compared with newest impedance design parameter, if the two difference controls tolerance in default impedance parameter
It is interior, then it can carry out subsequent batch production；If the two difference controls other than tolerance in default impedance parameter, the production of etching is adjusted
Parameter remakes FA plate and tests the impedance design parameter after etching, until difference controls in tolerance in default impedance parameter,
Then produced in batches with the manufacturing parameter of etching adjusted.
The step S4, the core plate of the impedance line place layer by testing after developing when making internal layer circuit, before etching
Practical copper thickness value T, and by (T-T ') and T0Compare, so according to default copper thickness control tolerance to impedance design parameter into
Row further adjustment amendment, obtains newest impedance design parameter, to the shadow of impedance when then producing further according to practical etching
Sound is adjusted amendment to the manufacturing parameter of etching, can effectively solve printed circuit board because the factor of production causes interior layer impedance to be difficult to
The problem of control, improves the impedance qualification rate of product.In addition, during the comparison process, also fully consider that subsequent brownification influences, it is right
Impedance control is more accurate, can effectively improve the impedance qualification rate of product.
In the present embodiment, the specific step of internal layer circuit production is carried out to the core plate of layer where the impedance line after step S3
Suddenly are as follows: core plate table copper is roughened, is cleaned using chemical micro etching method, then pad pasting, and figure is carried out using LDI exposure machine
Transfer.Copper thickness measuring instrument can be used and test practical copper thickness value T.Likewise, when above-mentioned core plate and prepreg are 1~3,
It can be tested respectively, then be averaged and obtain corresponding copper thickness value, be tested more accurate.Optionally, the control of copper thickness is preset
Tolerance can be ± 1 μm, refer to≤± 1 μm in preset thickness control tolerance, control in preset thickness and refer to > other than tolerance
It is ± 1 μm, high to impedance control precision.Optionally, the T ' is 0.5 μm, and meeting practical brownification influences.
Further, in the step S4, with the manufacturing parameter of etching adjusted carry out batch production step it
Afterwards, it further comprises the steps of: and carries out taking a sample test inspection in batch production process, the impedance design ginseng of the impedance line of product after test etching
Whether number is in default impedance parameter control tolerance, if continuing to produce in batches；If not existing, according to test result
The manufacturing parameter of etching is adjusted.By carrying out taking a sample test inspection, etching parameter can be finely tuned in real time according to test result, into
The interior layer impedance of one step control internal layer circuit effectively mentions so that the interior layer impedance of multilayer printed circuit board meets high-precision requirement
High impedance qualification rate.
S5, post-processing form the printed circuit board of Multilayer Structure.
The production method of the printed circuit board successively carries out stepped construction design according to customer demand first and impedance is set
Meter, obtains each initial parameter of each dielectric layer of printed circuit board, and then obtain in printed circuit board by impedance design software
Impedance line initial impedance design parameter, then after sawing sheet according to the material actual parameter after practical sawing sheet to initial impedance
Design parameter is adjusted amendment, and is influenced according to actual production factor to new resistance during making internal layer circuit
Anti- design parameter is adjusted amendment, is adjusted to the manufacturing parameter of etching, obtains the printed circuit board of Multilayer Structure.
Generally, the factor for influencing PCB impedance mainly has line width, thickness of dielectric layers, copper thickness, dielectric constant, welding resistance thickness
Degree etc..The impedance control of outer layer impedance line is more difficult than internal layer, and line loss of outer layer microstrip line etc. is also more band-like than internal layer
Line is bigger, thus the high-speed impedance line of High-Speed PCB product is typically located at the internal layer of PCB.The production side of the printed circuit board
Method, it is possible to provide the production method of the multilayer printed circuit board of layer impedance in a kind of high-precision passes through sawing sheet and production internal layer circuit
Manufacturing process in influence impedance value factor correct, printed circuit board can be solved because factor each in production process causes
The uncontrollable problem of interior layer impedance, the interior layer impedance for steadily controlling printed circuit board meet high-precision requirement, improve print
The high speed transmission of signals performance of circuit board processed, and then can be improved the impedance qualification rate of printed circuit board, impedance scrappage is reduced,
Production cost is reduced, reduces because handing over phase tardy problem caused by the bad problem of impedance, is particularly suitable for high-precision impedance product
The production of (internal layer impedance control precision is less than ± 10%, for example ± 7%, ± 5% tolerance), can be effectively improved high-precision impedance
The low problem of the impedance qualification rate of product.
Further, as shown in Figure 1 and Figure 2, before step S1, the production method of the printed circuit board further includes step
It is rapid:
S0, file optimization design: after the completion of PCB routing, in the spacious area of the graphic designs of printed circuit board
And/or isolated line region is laid with balance copper point.It is laid with and is balanced by regions such as the spacious area of the graphic designs in PCB, isolated lines
Copper point, is able to ascend the residual copper distributing homogeneity of figure, and then reaches the requirement of high-precision impedance control.In the present embodiment, put down
Weighing apparatus copper point can be laid with according to the actual situation, suitably be optimized to PCB file, on the basis for not influencing PCB electric property
On, reach the requirement of high-precision impedance control.Optionally, the balance copper point can be laid in certain size, spacing square or
Circle, size, spacing can be determined according to the residual copper ratio of graphics field, guarantee the residual copper ratio in the balance copper point region being laid with
It is suitable with graphics field.
Further, the step S5 specifically includes the following steps:
S51, brownification, pressing: the core plate of layer where impedance line is subjected to brownification processing and obtains brownification layer, and using after sawing sheet
The prepreg of same batch overlapped so that prepreg between core plate, forms laminated plate, passes through heat pressing process pair
Superimposed sheet carries out pressing and forms multi-layer board；
S52, drilling, plating, outer-layer circuit etching, welding resistance: drilled, be electroplated to multi-layer board, outer-layer circuit etching with
And welding resistance production, form the printed circuit board of complete Multilayer Structure.Specifically, conventional impedance control can be used in step S52
The printed circuit board manufacture craft of precision processed is made.
By using above-mentioned steps, subsequent processing can be carried out to the product of the batch production after the control of S4 step, into
And obtain the printed circuit board of Multilayer Structure.
Further, in step s 51: when carrying out heat pressing process, adjusting the pressing program of material, buffered when adjusting lamination
The dosage of material, so that the heating rate of material lowers 0.2 DEG C/min~0.5 DEG C/min.Specifically, the heating rate phase of material
0.2 DEG C/min~0.5 DEG C/min is lowered for conventional production parameter.In turn, Jie can be improved in the case where guaranteeing the good situation of filler
The thickness uniformity of matter layer further decreases impedance control difficulty, improves the impedance qualification rate of product.Further, in step
Between S51 and S52, core plate not can be carried out reworked processing, in order to avoid influence impedance control.
In the present embodiment, after step s 5, the production method of the printed circuit board is further comprising the steps of:
S6, testing impedance: using the impedance value of the printed circuit board after the test batch production of TDR equipment, and according to impedance
It controls tolerance and determines whether the interior layer impedance of printed circuit board is qualified.In turn, the product after production can be detected, is judged
Whether the interior layer impedance of product is qualified, easy to operate.In the present embodiment, can be used the rise time less than 35ps TDR equipment
It is tested, the impedance value of the printed circuit board of layer impedance in high-precision can be tested.
The production method of printed circuit board described in the present embodiment, by printed circuit board carry out file optimization design,
Laminated construction design, impedance design etc. are monitored each factor for influencing impedance value and adjust in real time, energy in process of production
Enough solve the problems, such as that printed circuit board because the factors such as design and producing cause interior layer impedance to be difficult to control, can steadily control multilayer
The interior layer impedance of printed circuit board meets high-precision requirement, and is remarkably improved different zones signal wire in the big plate of same
Impedance uniformity avoids PCB high speed signal wire from causing the signal integrities such as signal reflex and distortion because of impedance mismatch problem
Property problem, to improve the high speed transmission of signals performance of printed circuit board, the impedance for being obviously improved high-precision impedance PCB is qualified
Rate reduces impedance scrappage and its bring and hands over phase tardy problem etc., with strong operability, works well, is effectively promoted
The advantages that impedance qualification rate.
A kind of printed circuit board makes to obtain using the production method of printed circuit board as described above.Specifically, this reality
The printed circuit board for applying example is Multilayer Structure comprising multiple core plates and prepreg, the core plate form route through production
Figure, multiple core plates are combined with prepreg, and obtain multilayer printed circuit board through pressing.Also, the biography of the printed circuit board
Defeated line has the requirement of internal layer impedance control, and internal layer impedance control precision is the high-precision of such as ± 7%, ± 5% tolerance less than ± 10%
Degree control requires.The printed circuit board makes to obtain using the production method of above-mentioned printed circuit board, and the impedance of product is closed
Lattice rate is high, production cost is low, is less prone to the bad problem of impedance.
In order to more fully understand the present embodiment printed circuit board production method, below with reference to a specific example to the system
It describes in detail and illustrates as method:
As shown in figure 3, the printed circuit board that need to be made is 8 layers of structure, the arrangement difference of each layer is as follows: ART01 layers are
SIG01 layers, ART02 layers are GND01 layers, and ART03 layers are SIG02 layers, and ART04 layers are GND02 layers, and ART05 layers are POWER layers,
ART06 layers are SIG03 layers, and ART07 layers are GND03 layers, and ART08 layers are SIG04 layers.Wherein, SIG02 layers, SIG03 layers are high speed
The wiring layer of the impedance line of signal, wherein every layer is arranged with single-ended impedance line 300 and differential impedance line 400, the resistance of impedance line
Anti- required precision is stringent, and impedance control tolerance is within ± 5%.Production for the printed circuit board of layer impedance in this high-precision
Method it is corresponding the following steps are included:
S0, file optimization design: suitably optimizing PCB file, in the inner figure spaciousness area, isolated of PCB layout
The regions such as line are laid with balance copper point, promote the residual copper distributing homogeneity of figure, wherein balance copper point can be laid in circle, circle
Diameter can be 1.25mm, and the center of adjacent circle up and down is away from can be 2mm.
S1, laminated construction design: according to signal on the design requirement of the plate thickness, bus plane, stratum of PCB etc. and PCB
The requirement such as frequency, rate selects the modification FR4 material of Low Dk/Low Loss to carry out laminated construction design.It wherein, can basis
Experience Design obtains SIG01 layers to GND01 layers of dielectric layer (prepreg 100), GND01 layers to SIG02 layers of dielectric layer (core
Plate 200), SIG02 layers to GND02 layers of dielectric layer (prepreg 100), GND02 layers to POWER layers of dielectric layer (core plate
200), POWER layers to SIG03 layers of dielectric layer (prepreg 100), SIG03 layers to GND03 layers of dielectric layer (core plate 200),
The initial medium thickness degree and initial dielectric constant of GND03 layers to SIG04 layers of dielectric layer (prepreg 100).And it is designed
Initial copper thickness value to SIG01 layers, GND01 layers, GND03 layers and SIG04 layers is 18 μm, SIG02 layers, SIG03 layers, GND02
Layer and POWER layers of initial copper thickness value are 12 μm.VLP type may be selected in copper foil type.
S2, impedance design: it after the completion of laminated construction design, according to data obtained in impedance control requirement and S1, uses
Impedance design software carries out corresponding impedance design, obtains the initial impedance design parameter of each impedance line of printed circuit board.?
In the example, SIG02 layers and SIG03 layers of impedance line has impedance control requirement, and SIG02 layers and SIG03 layers of impedance line is
High-speed signal transmission lines, impedance control tolerance are ± 5%, and the single-ended impedance required value of each impedance layer is 50ohm, difference resistance
Anti- required value is 100ohm.SIG02 layers of reference shielded layer is GND01 layers and GND02 layers, SIG03 layers of reference shielded layer
For POWER layers and GND03 layers.The initial of the single-ended impedance line for meeting above-mentioned process conditions can be calculated by impedance design software
Impedance design parameter i.e. initially upper line width values W10With initial lower line width values W20, the initial impedance design parameter of differential impedance line is
Initially upper line width values W10, initial lower line width values W20With initial lower line width values W20/ initial line is away from value S0。
S3, sawing sheet and optimization impedance design: the core plate of specified material and prepreg are cut into according to PCB layout size
Certain size.By taking SIG02 layers of single-ended impedance line 300 as an example, the core plate 3 that selection can be used for ART02 layers and ART03 layers is opened, and is used
9 methods, which test the thickness of every piece of core plate and calculate mean value, obtains H1, choose the prepreg that can be used for ART03 layers He ART04 layers
3 are pressed into plate respectively, test its thickness and calculate mean value obtaining H with 9 methods2, solid using Resonant-cavity Method actual measurement core plate and half
The dielectric constant for changing piece distinguishes Er1And Er2, respectively by H1、H2、Er1、Er2With corresponding H0、H0′、Er0、Er0' compare, it obtains
To the new impedance design parameter of SIG02 layers of single-ended impedance lines.Likewise, differential impedance line, SIG03 for SIG02 layers
The single-ended impedance line and SIG03 layers of differential impedance line of layer can be used previous step and obtain corresponding new impedance design ginseng
Number.
S4, production internal layer circuit: core plate table copper is roughened, is cleaned using chemical micro etching method, then pastes 25 μm
The LDI dry film of thickness, and pattern transfer is carried out using LDI exposure machine.After development, it is tested before etching using copper thickness measuring instrument
The practical copper thickness value of ART03 layers and ART06 layers of core plate is respectively T1And T2, by (T1- 0.5) the initial copper thickness value with ART03 layers
It compares, by (T2- 0.5) the initial copper thickness value with ART06 layers compares, and obtains the newest impedance of the impedance line of each layer
Design parameter.Further, ART02 is selected, as FA plate, to use with ART03 layers, ART06 and each one piece of ART07 layers of core plate
The etching speed of 4.2m/min makes first plate, the impedance for using wire width measuring instrument to test ART03 layers and ART06 layers after the completion of etching
Then the practical impedance design parameter of line is compared with impedance design parameter newest in previous step respectively, determination is with this
Manufacturing parameter when etching produce or is adjusted to manufacturing parameter, until with etching adjusted after meeting condition
Manufacturing parameter is produced in batches.Every 10 pieces of core plates take a sample test one piece of progress practical impedance design parameter inspection in batch production process
It surveys, finely tunes etching manufacturing parameter in real time according to test result.
S51, brownification, pressing: the qualified core plate of above-mentioned line width control is subjected to brownification processing line and obtains brownification layer, and is used
It is aforementioned tested thickness, the same batch prepreg of dielectric constant is followed closely to form superimposed sheet through bonding, riveter, prepreg is located at core
Between plate, and pressing is carried out to superimposed sheet by heat pressing process and forms multi-layer board.Further, optimizing and revising when pressing will press
The temperature programming section time extends 3min, and the dosage of brown paper is consistent with conventional upper plate when lamination, so that surveying the heating of material
Rate drops to 2.8 DEG C/min compared to 3.2 DEG C/min of normal parameter.
S52, drilling, plating, outer-layer circuit etching, welding resistance etc.: the routinely printed circuit board production of impedance control precision
The production such as technique drilled, is electroplated, outer-layer circuit etching, welding resistance, form the printed circuit of 8 veneer structures of structural integrity
Plate；
S6, testing impedance: the rise time is used to test the printing of 8 veneer structure for the vector network analyzer of 22.3ps
The impedance value of circuit board, judges whether each impedance value is all satisfied the requirement of ± 5% tolerance, judges whether product is qualified.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of production method of printed circuit board, which comprises the following steps:
S1, stepped construction design: laminated construction design is carried out according to the design requirement of printed circuit board, obtains printed circuit board
The initial medium thickness degree and initial dielectric constant of each dielectric layer obtain the initial copper thickness value of each layer of printed circuit board, wherein
The initial medium layer of layer is where the impedance line of printed circuit board with a thickness of H0, initial dielectric constant be Er0, initial copper thickness value be T0,
The initial medium layer of shielded layer as the impedance line is with a thickness of H0', initial dielectric constant be Er0′；
S2, impedance design: requiring according to the impedance control of printed circuit board, carries out impedance design using impedance design software, obtains
Obtain the initial impedance design parameter of the impedance line of printed circuit board；
S3, sawing sheet and optimization impedance design: core plate and prepreg are carried out by sawing sheet according to PCB layout size, choose the sawing sheet
The core plate and prepreg of same batch afterwards are tested, the practical core thickness H of layer where obtaining impedance line1With practical core plate
Dielectric constant Er1, obtain the practical prepreg thickness H of the shielded layer as the impedance line2With practical prepreg dielectric constant
Er2, respectively by H1、H2、Er1、Er2With corresponding H0、H0′、Er0、Er0' compare, if H1、H2With H0、H0' difference pre-
If in thickness control tolerance, Er1、Er2With Er0、Er0' difference in default dielectric constant control tolerance, then still optional step
The initial impedance design parameter obtained in S2 is as new impedance design parameter；If H1、H2With H0、H0' difference in preset thickness
It controls other than tolerance, Er1、Er2With Er0、Er0' difference default dielectric constant control tolerance other than, then by H1、H2、Er1、Er2
It brings impedance design software into and optimizes impedance design, and the first impedance design parameter after output adjustment is set as new impedance
Count parameter；
S4, production internal layer circuit: internal layer circuit production is carried out to the core plate of layer where the impedance line after step S3, is being developed
Afterwards, the practical copper thickness value T of the core plate of layer where test obtains impedance line before etching, by (T-T ') and T0It compares, if (T-
T ') and T0Difference in default copper thickness control tolerance, then the new impedance design parameter obtained in optional step S3 is as most
New impedance design parameter；(if T-T ') and T0Difference default copper thickness control tolerance other than, then it is soft to bring T into impedance design
Part optimizes impedance design, and the second impedance design parameter after output adjustment is as newest impedance design parameter, wherein
T ' expression brownification influence value；
Production FA plate is etched, and tests the practical impedance design parameter of the FA plate after etching, and by practical impedance design parameter
It is compared with newest impedance design parameter, if the two difference can carry out subsequent in default impedance parameter control tolerance
Batch production；If the two difference controls other than tolerance in default impedance parameter, the manufacturing parameter of etching is adjusted, FA is remake
Plate simultaneously tests the impedance design parameter after etching, until difference controls in tolerance in default impedance parameter, then with erosion adjusted
The manufacturing parameter at quarter is produced in batches；
S5, post-processing form the printed circuit board of Multilayer Structure.
2. the production method of printed circuit board according to claim 1, which is characterized in that before step S1, further include
Step:
S0, file optimization design: after the completion of PCB routing, the graphic designs of printed circuit board spacious area and/or
Isolated line region is laid with balance copper point.
3. the production method of printed circuit board according to claim 1, which is characterized in that in the step S1: printing
100 μm of > of initial medium thickness degree of the core plate of layer where the impedance line of circuit board, and/or, the shielded layer as the impedance line
100 μm of > of initial medium thickness degree of prepreg.
4. the production method of printed circuit board according to claim 1, which is characterized in that in the step S1: printing
The initial copper thickness value of layer where the impedance line of circuit board is 8 μm, 12 μm or 18 μm, the initial copper of the shielded layer as the impedance line
Thickness value is 8 μm, 12 μm or 18 μm.
5. the production method of printed circuit board according to claim 1, which is characterized in that in the step S1: printing
Each dielectric layer of circuit board is low-k elastomeric material.
6. the production method of printed circuit board according to claim 1, which is characterized in that the step S5 specifically include with
Lower step:
S51, brownification, pressing: the core plate of layer where impedance line is subjected to brownification processing and obtains brownification layer, and using same after sawing sheet
The prepreg of batch is overlapped, so that prepreg between core plate, forms laminated plate, by heat pressing process to overlapping
Plate carries out pressing and forms multi-layer board；
S52, drilling, plating, outer-layer circuit etching, welding resistance: it drilled, be electroplated to multi-layer board, outer-layer circuit etches and resistance
It is welded work, forms the printed circuit board of complete Multilayer Structure.
7. the production method of printed circuit board according to claim 6, which is characterized in that in the step S51: carrying out
When heat pressing process, the pressing program of material is adjusted, the dosage of padded coaming when adjusting lamination, so that the heating rate of material is lowered
0.2 DEG C/min~0.5 DEG C/min.
8. the production method of printed circuit board according to claim 1, which is characterized in that in the step S4, with
After the manufacturing parameter of etching adjusted carries out batch production step, further comprises the steps of: and taken out in batch production process
It surveys and examines, whether the impedance design parameter of the impedance line of product is in default impedance parameter control tolerance after test etching, if
Continuing to produce in batches；If not existing, it is adjusted according to manufacturing parameter of the test result to etching.
9. the production method of printed circuit board according to claim 1-8, which is characterized in that step S5 it
Afterwards, further comprising the steps of:
S6, testing impedance: using the impedance value of the printed circuit board after the test batch production of TDR equipment, and according to impedance control
Tolerance determines whether the interior layer impedance of printed circuit board is qualified.
10. a kind of printed circuit board, which is characterized in that using the system such as the described in any item printed circuit boards of claim 1-9
It makes to obtain as method.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710470840.8A CN107094349B (en) | 2017-06-20 | 2017-06-20 | Printed circuit board and preparation method thereof |
| PCT/CN2017/120093 WO2018233271A1 (en) | 2017-06-20 | 2017-12-29 | Printed circuit board and fabrication method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710470840.8A CN107094349B (en) | 2017-06-20 | 2017-06-20 | Printed circuit board and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107094349A CN107094349A (en) | 2017-08-25 |
| CN107094349B true CN107094349B (en) | 2019-08-27 |
Family
ID=59640254
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710470840.8A Active CN107094349B (en) | 2017-06-20 | 2017-06-20 | Printed circuit board and preparation method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN107094349B (en) |
| WO (1) | WO2018233271A1 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107094349B (en) * | 2017-06-20 | 2019-08-27 | 广州兴森快捷电路科技有限公司 | Printed circuit board and preparation method thereof |
| CN107872921B (en) * | 2017-08-30 | 2019-10-29 | 奥士康精密电路（惠州）有限公司 | A kind of design method of characteristic impedance |
| CN109815609B (en) * | 2019-01-31 | 2023-05-23 | 生益电子股份有限公司 | Automatic analysis and optimization method and system for impedance big data |
| CN109870641B (en) * | 2019-02-26 | 2021-11-09 | 广州兴森快捷电路科技有限公司 | Printed circuit board production method and semi-finished product impedance detection method thereof |
| CN110493980A (en) * | 2019-09-26 | 2019-11-22 | 恩达电路(深圳)有限公司 | The production method of multilayer impedance flexible circuit board |
| TWI719704B (en) * | 2019-11-05 | 2021-02-21 | 新加坡商鴻運科股份有限公司 | Device and method for setting pcb layout parameters and storage medium |
| CN112654158B (en) * | 2020-12-09 | 2022-05-17 | 广州广合科技股份有限公司 | Control method for improving impedance precision |
| CN112580290A (en) * | 2020-12-25 | 2021-03-30 | 广州兴森快捷电路科技有限公司 | PCB manufacturing method, PCB manufacturing device and storage medium |
| CN114501823B (en) * | 2022-04-15 | 2022-07-01 | 成都万创科技股份有限公司 | PCB lamination optimization method and PCB |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4560962A (en) * | 1983-08-30 | 1985-12-24 | Burroughs Corporation | Multilayered printed circuit board with controlled 100 ohm impedance |
| CN104470266A (en) * | 2014-12-09 | 2015-03-25 | 深圳怡化电脑股份有限公司 | Method for controlling high-speed PCB signal impedance |
| CN104470212A (en) * | 2013-09-25 | 2015-03-25 | 珠海方正科技高密电子有限公司 | Circuit board impedance line compensation method and device |
| CN105653752A (en) * | 2014-12-05 | 2016-06-08 | 王丽香 | Digital signal impedance match circuit designing method |
| CN105916303A (en) * | 2016-05-16 | 2016-08-31 | 浪潮电子信息产业股份有限公司 | PCB and method for producing same |
| CN106341948A (en) * | 2016-09-09 | 2017-01-18 | 郑州云海信息技术有限公司 | PCB design method and PCB |
| CN106604550A (en) * | 2016-12-16 | 2017-04-26 | 郑州云海信息技术有限公司 | Line impedance adjusting method and system |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09246729A (en) * | 1996-03-08 | 1997-09-19 | Hitachi Aic Inc | Printed wiring board and manufacture thereof |
| JP4547958B2 (en) * | 2004-03-26 | 2010-09-22 | 凸版印刷株式会社 | Manufacturing method of multilayer wiring board |
| CN101227800B (en) * | 2008-02-03 | 2011-05-04 | 华为终端有限公司 | Apparatus and method for implementing high-precision buried resistance |
| JP2015204309A (en) * | 2014-04-10 | 2015-11-16 | 凸版印刷株式会社 | Printed wiring board and method of manufacturing the same |
| CN105813374B (en) * | 2016-04-11 | 2018-09-25 | 广州兴森快捷电路科技有限公司 | A kind of management-control method of outer layer impedance |
| CN107094349B (en) * | 2017-06-20 | 2019-08-27 | 广州兴森快捷电路科技有限公司 | Printed circuit board and preparation method thereof |
-
2017
- 2017-06-20 CN CN201710470840.8A patent/CN107094349B/en active Active
- 2017-12-29 WO PCT/CN2017/120093 patent/WO2018233271A1/en active Application Filing
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4560962A (en) * | 1983-08-30 | 1985-12-24 | Burroughs Corporation | Multilayered printed circuit board with controlled 100 ohm impedance |
| CN104470212A (en) * | 2013-09-25 | 2015-03-25 | 珠海方正科技高密电子有限公司 | Circuit board impedance line compensation method and device |
| CN105653752A (en) * | 2014-12-05 | 2016-06-08 | 王丽香 | Digital signal impedance match circuit designing method |
| CN104470266A (en) * | 2014-12-09 | 2015-03-25 | 深圳怡化电脑股份有限公司 | Method for controlling high-speed PCB signal impedance |
| CN105916303A (en) * | 2016-05-16 | 2016-08-31 | 浪潮电子信息产业股份有限公司 | PCB and method for producing same |
| CN106341948A (en) * | 2016-09-09 | 2017-01-18 | 郑州云海信息技术有限公司 | PCB design method and PCB |
| CN106604550A (en) * | 2016-12-16 | 2017-04-26 | 郑州云海信息技术有限公司 | Line impedance adjusting method and system |
Non-Patent Citations (1)
| Title |
|---|
| 高频PCB基材介电常数与介电损耗的特性与改性进展;杨盟辉;《印制电路信息》;20091231(第4期);27-31 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107094349A (en) | 2017-08-25 |
| WO2018233271A1 (en) | 2018-12-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107094349B (en) | Printed circuit board and preparation method thereof | |
| CN104023486B (en) | Soft and hard multiple-layer circuit board and method for forming electrical testing locating hole thereof | |
| CN104470265B (en) | A kind of preparation method of multilayer circuit board | |
| CN111556660B (en) | Manufacturing method of thick copper circuit board and thick copper circuit board | |
| CN104470266A (en) | Method for controlling high-speed PCB signal impedance | |
| CN111741618B (en) | Processing method for depositing nickel and gold on bottom of PCB step groove | |
| CN107770974B (en) | Manufacturing method of interlayer alignment detection module | |
| CN111642071B (en) | Circuit board and method for improving board explosion and copper sheet foaming of circuit board | |
| CN100534271C (en) | Method for producing printing-circuit board conducting hole | |
| CN110839319A (en) | Method for manufacturing high-precision impedance circuit | |
| CN114245565A (en) | Method for manufacturing rigid-flex board electromagnetic shielding film inner paste | |
| CN105527559B (en) | Measurement circuit plate, its production method, test method and test macro | |
| CN108668470A (en) | Processing method, system of processing, computer storage media and the equipment of mixed-compression board | |
| US20090160474A1 (en) | Printed circuit board and impedance guarantee method of printed circuit board | |
| CN105120595B (en) | The production indicating means and system of a kind of wiring board | |
| CN111315141B (en) | Method for manufacturing explosion-proof plate of thick plate and thick copper plate, thick plate and thick copper plate | |
| CN113033140B (en) | Simulation method for accurately obtaining dielectric constant difference of upper and lower layers of PCB wiring | |
| CN110139492A (en) | A method of resistance is made using electrically conductive ink silk-screen | |
| JP5911824B2 (en) | Multiple printed wiring board, method for manufacturing the same, and coil pattern inspection method | |
| CN113133226B (en) | Circuit board high-precision back drilling method and circuit board | |
| US6647311B1 (en) | Coupler array to measure conductor layer misalignment | |
| Marin et al. | Systematic approach to PCB interconnects analysis to measurement validation | |
| US10374280B2 (en) | Quadrature coupler | |
| CN115551203A (en) | Circuit board manufacturing method and circuit board | |
| CN106413293A (en) | Use method for adhesive sheet |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |