CN112654158B - Control method for improving impedance precision - Google Patents
Control method for improving impedance precision Download PDFInfo
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- CN112654158B CN112654158B CN202011427896.3A CN202011427896A CN112654158B CN 112654158 B CN112654158 B CN 112654158B CN 202011427896 A CN202011427896 A CN 202011427896A CN 112654158 B CN112654158 B CN 112654158B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Abstract
The invention discloses a control method for improving impedance precision, which comprises the following steps: estimating the residual copper rate to obtain a production residual copper rate estimated value; calculating the thickness of a dielectric layer based on a predicted value of the copper residue rate in production, and further calculating impedance and differential loss; calculating an actual value of the production residual copper rate; and calculating a difference m between the actual value of the production residual copper rate and the predicted value of the production residual copper rate, comparing the magnitude of m with 10%, if m is less than 10%, meeting the impedance precision, if m is more than 10%, updating the predicted value of the production residual copper rate by using the actual value of the production residual copper rate, and recalculating the thickness and the impedance of the dielectric layer until the difference m between the actual value of the production residual copper rate and the predicted value of the production residual copper rate is less than 10%. According to the method, the residual copper rate of the PCB unit boards of different types is analyzed, the difference between the production residual copper rate estimated value and the production residual copper rate actual value is compared, differential analysis and a correction design mode are carried out in the accurate processing process, the difference in the actual process is reduced, and therefore the impedance precision requirement is improved.
Description
Technical Field
The invention relates to the field of PCB processing, in particular to a control method for improving impedance precision.
Background
Along with the development of 5G, high-frequency and high-speed circuit application, the PCB requires that the impedance control and the differential loss requirement are gradually improved in precision, the control deviation is increasingly strict, various researches and actual production show that the main factor influencing the impedance and the differential loss is the thickness of a dielectric layer, wherein the important factor mainly influencing the thickness of the dielectric layer is the residual copper rate in the actual production of the PCB; when a PCB factory is processed, generally, materials are prepared according to the impedance and difference loss requirements required by customers (namely, main materials of the substrate, PP and copper foil during production), the most basic consideration influencing the material selection is the impedance and difference loss requirements of the customers, the key indexes influencing the material selection are the medium thicknesses of the substrate and PP, and the medium thicknesses are mainly the residual copper ratios of all graphs in the PCB processing process and are mainly determined by the graph ratios of typesetting processing in the PCB delivery unit processing process; the key of the high-precision impedance control and the differential loss requirement is the precise control of the thickness of the dielectric layer and the precision of the residual copper rate in the processes from design to finished product processing, which is a very important research subject at present.
Disclosure of Invention
The invention aims to avoid the defects in the prior art and provide a control method for improving impedance precision, which utilizes the combination of the prior production residual copper rate estimated value and the final accurate correction of how fast the residual copper rate in a unit board is processed in PCB processing, and can calculate the thickness of a medium according to the residual copper rate of an actual graph and achieve the consistency of effective control impedance and difference design and actual processing production by accurately designing impedance and difference loss in PCB processing.
The purpose of the invention is realized by the following technical scheme: a control method for improving impedance accuracy comprises the following steps:
estimating the residual copper rate to obtain a production residual copper rate estimated value;
calculating the thickness of a dielectric layer based on a predicted value of the copper residue rate in production, and further calculating impedance and differential loss;
calculating an actual value of the production residual copper rate;
calculating a difference m between the actual value of the production residual copper rate and the predicted value of the production residual copper rate;
comparing the size of m to 10%; if m is less than 10%, the impedance precision is met, if m is more than 10%, the actual value of the production residual copper rate is adopted to update the predicted value of the production residual copper rate, and the dielectric layer thickness and the impedance are recalculated until the difference m between the actual value of the production residual copper rate and the predicted value of the production residual copper rate is less than 10%.
Optionally, the estimating of the residual copper rate to obtain a production residual copper rate estimated value comprises;
acquiring residual copper rate data of the unit board;
calculating a production residual copper rate estimated value based on the unit board residual copper rate data and according to a first equation, wherein the first equation is as follows: the predicted value of the residual copper rate in production = the residual copper rate of the cell board + X, where X is a variable, and the size of X depends on the size of the residual copper rate of the cell board, and the first equation is based on that the inner layer copper thickness is less than or equal to 2OZ, if the inner layer copper thickness is greater than 2OZ, the etching loss of the production line is also considered, and the calculated actual value of the residual copper rate in production is subtracted from the etching loss of the production line.
Optionally, the calculating the actual value of the production residual copper rate comprises;
manufacturing engineering data, namely manufacturing the engineering data by using the thickness, the impedance and the differential loss data of the medium layer;
and outputting the actual value of the copper residue rate of production by an automatic script after the engineering data is manufactured.
Optionally, the step of calculating the thickness of the dielectric layer based on the estimated value of the copper residue rate in production, and further calculating the calculated impedance in the impedance and the difference loss is to perform analog calculation on the impedance through impedance calculation software.
Optionally, the impedance calculation software may select the calculation software Polar SI8000K to control the impedance fast solver to perform analog calculation to obtain the impedance value.
According to the scheme, the invention has the following beneficial effects: the invention provides a control method for improving impedance precision, which comprises the steps of firstly calculating a production residual copper rate estimated value, then calculating to obtain medium layer thickness, impedance and difference loss data according to the production residual copper rate estimated value, then obtaining a production residual copper rate actual value, carrying out difference analysis on the production residual copper rate actual value and the production residual copper rate estimated value, further carrying out correction design on the production residual copper rate estimated value, updating the production residual copper rate estimated value by adopting the production residual copper rate actual value, calculating the impedance and the medium layer thickness according to the production residual copper rate actual value until a difference value between the production residual copper rate actual value and the production residual copper rate estimated value meets a preset condition, calculating the medium layer thickness according to the production residual copper rate actual value, and achieving effective control of impedance and difference loss design and actual processing production consistency, thereby improving the impedance precision.
Drawings
The invention is further illustrated by means of the attached drawings, but the embodiments in the drawings do not constitute any limitation to the invention, and for a person skilled in the art, other drawings can be obtained on the basis of the following drawings without inventive effort.
Fig. 1 is a schematic flow chart of a control method for improving impedance accuracy according to the present invention.
Detailed Description
In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1, the control method for improving the impedance accuracy of the embodiment includes the following steps:
s100, estimating the residual copper rate to obtain a production residual copper rate estimated value;
step S101, calculating the thickness of a dielectric layer based on a production residual copper rate estimated value, and further calculating impedance and differential loss;
step S102, calculating an actual value of the production residual copper rate;
step S103, calculating a difference m between the actual value of the production residual copper rate and the predicted value of the production residual copper rate;
step S104, comparing the sizes of m and 10%;
if m is less than 10%, the impedance precision is met, if m is more than 10%, the actual value of the production residual copper rate is adopted to update the predicted value of the production residual copper rate, and the dielectric layer thickness and the impedance are recalculated until the difference m between the actual value of the production residual copper rate and the predicted value of the production residual copper rate is less than 10%.
According to the control method for improving the impedance precision, the residual copper rate estimated value of actual production and the residual copper rate of actual production are analyzed according to the residual copper rate in the PCB unit boards of different types, the residual copper rate of actual production and the theoretical difference are analyzed and the design mode is corrected in the precise machining process, the design value and the actual consistency are good, and the difference in the actual process is reduced.
The difference m between the actual value of the production residual copper rate and the predicted value of the production residual copper rate can be subjected to difference analysis by using automatic analysis software to produce the actual value of the production residual copper rate and predict the theoretical residual copper rate.
In this embodiment, the estimating of the residual copper rate to obtain the predicted value of the production residual copper rate includes;
acquiring residual copper rate data of the unit plate, wherein the residual copper rate refers to the ratio of the area of copper on the plane of the plate to the area of the whole plate;
calculating a production residual copper rate estimated value based on the unit board residual copper rate data and according to a first equation, wherein the first equation is as follows: the predicted value of the residual copper rate in production = the residual copper rate of the cell board + X, where X is a variable, and the size of X depends on the size of the residual copper rate of the cell board, and the first equation is based on that the inner layer copper thickness is less than or equal to 2OZ, if the inner layer copper thickness is greater than 2OZ, the etching loss of the production line is also considered, and the calculated actual value of the residual copper rate in production is subtracted from the etching loss of the production line.
The first equation production residual copper rate estimated value = the relationship between the unit board residual copper rate and X in the unit board residual copper rate + X satisfies the following:
if the residual copper rate of the cell plate is less than or equal to 20%, X = 15%; if 20% < the unit board residual copper rate ≦ 30%, X = 10%; if the unit board residual copper rate is 30% < 40%, X = 5%; x =0 if 40% < the cell plate residual copper ratio ≦ 60%; if the unit board copper residue rate is less than or equal to 60% and less than or equal to 70%, X = -2%; if the unit board copper residue rate is 70% < 80%, X = -4%; if 80% < the residual copper rate of the cell plate is less than or equal to 90%, X = -6%; if the copper remaining rate of the cell plate is 90% < X = -10%.
The calculation of the production residual copper rate pre-estimated value can be carried out by an automatic program, the calculation process is to summarize the residual copper rate of the board of the actual delivery unit of the customer according to the product category, and the production residual copper rate pre-estimated value of the actual processing is analyzed according to the production capacity of each PCB processing factory.
Optionally, the calculating the actual value of the production residual copper rate comprises;
manufacturing engineering data, namely manufacturing the engineering data by using the thickness, the impedance and the differential loss data of the medium layer;
and outputting the actual value of the residual copper rate by an automatic script after the engineering data is manufactured.
Optionally, the dielectric layer thickness is calculated based on the estimated production residual copper rate value, and then the calculated impedance in the impedance and the difference loss is calculated by performing analog calculation on the impedance through impedance calculation software, further, the impedance calculation software may select calculation software Polar SI8000K to control an impedance fast solver to perform analog calculation to obtain an impedance value, and the calculation software Polar SI8000K has the characteristic of higher calculation accuracy.
The control method for improving the impedance accuracy provided by the embodiment comprises the following steps: analyzing the processing capacity of each factory according to the type of each PCB production and processing product to make a product category to set a production residual copper rate estimated value of each factory, according to the production residual copper rate estimated value, engineering designers preliminarily calculate related data such as the thickness of a medium layer, impedance, difference loss and the like for manufacturing engineering data, after the manufacturing of all the engineering data is completed, an automatic script outputs an actual value of the production residual copper rate and compares the actual value with the production residual copper rate estimated value, and when the difference value exceeds the requirements of the factory specifications, the related data such as the thickness of the medium layer, the impedance, the difference loss and the like are recalculated according to the actual residual copper rate before the PCB production and processing, so that the actual production error is corrected before the PCB is processed, and the impedance and the difference loss in the processing process are improved.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the protection scope of the present invention, although the present invention is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.
Claims (6)
1. A control method for improving impedance accuracy is characterized by comprising the following steps:
estimating the residual copper rate to obtain a production residual copper rate estimated value;
calculating the thickness of a dielectric layer based on a predicted value of the copper residue rate in production, and further calculating impedance and differential loss;
calculating an actual value of the production residual copper rate;
calculating a difference m between the actual value of the production residual copper rate and the predicted value of the production residual copper rate;
comparing the size of m to 10%; if m is less than 10%, the impedance precision is met, if m is more than 10%, the actual value of the production residual copper rate is adopted to update the predicted value of the production residual copper rate, and the dielectric layer thickness and the impedance are recalculated until the difference m between the actual value of the production residual copper rate and the predicted value of the production residual copper rate is less than 10%.
2. The control method for improving impedance accuracy according to claim 1, wherein: estimating the residual copper rate to obtain a production residual copper rate estimated value;
acquiring residual copper rate data of the unit board;
calculating a production residual copper rate estimated value based on the unit board residual copper rate data and according to a first equation, wherein the first equation is as follows: and (3) a production residual copper rate estimated value is the unit plate residual copper rate + X, wherein X is a variable, and the size of X depends on the size of the unit plate residual copper rate.
3. The control method for improving impedance accuracy according to claim 1, wherein: calculating actual values of the residual copper rate of production;
manufacturing engineering data, namely manufacturing the engineering data by using the thickness, the impedance and the differential loss data of the medium layer;
and outputting the actual value of the residual copper rate by an automatic script after the engineering data is manufactured.
4. The control method for improving impedance accuracy according to claim 2, wherein: the first equation is based on the premise that the inner layer copper thickness is less than or equal to 2OZ, if the inner layer copper thickness is greater than 2OZ, the etching loss of a production line is also considered, and the etching loss of the production line is subtracted from the calculated actual value of the production residual copper rate; the calculation process of the actual value of the production residual copper rate comprises the following steps: manufacturing engineering data, namely manufacturing the engineering data by using the thickness, the impedance and the differential loss data of the medium layer; and outputting the actual value of the copper residue rate of production by an automatic script after the engineering data is manufactured.
5. The control method for improving impedance accuracy according to claim 1, wherein: and calculating the thickness of the dielectric layer based on the estimated value of the copper residue rate in production, and further calculating the calculated impedance in the impedance and the difference loss by performing analog calculation on the impedance through impedance calculation software.
6. The control method for improving impedance accuracy according to claim 5, wherein: and the impedance calculation software selects calculation software Polar SI8000K to control the impedance fast solver to perform analog calculation to obtain an impedance value.
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