CN105007682A - PCB and circuit board - Google Patents
PCB and circuit board Download PDFInfo
- Publication number
- CN105007682A CN105007682A CN201510363481.7A CN201510363481A CN105007682A CN 105007682 A CN105007682 A CN 105007682A CN 201510363481 A CN201510363481 A CN 201510363481A CN 105007682 A CN105007682 A CN 105007682A
- Authority
- CN
- China
- Prior art keywords
- via hole
- coiling
- pcb
- compensation
- cabling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
- H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention provides a PCB and a circuit board. The PCB comprises a via hole, and a compensation winding wire and a routing wire which are connected with the via hole, wherein the at least one via hole of the PCB is provided with the compensation winding wire surrounding the via hole; the compensation winding wire has no adjacent reference layer; and one end of the routing wire is connected to any position on the compensation winding wire. Through the technical scheme of the PCB and the circuit board, the impedance mismatching problem of the via hole of the PCB can be solved, and thus the signal quality is improved.
Description
Technical field
The present invention relates to technical field of circuit design, particularly a kind of PCB (PrintedCircuitBoard, printed circuit board) and a kind of circuit board.
Background technology
At present, Server (server) product many employings high speed many boards cascaded design mode.Thus, high speed wiring path there will be the interconnection situation of one or more Connector (connector) for each board or board and Cable (cable), the via hole that the pin of Connector is corresponding on each board connects that signal is transmitted between each board, wherein, the connected mode of each board high speed cabling and via hole is that high speed cabling is directly drawn from via hole.
But, when high speed cabling is through Connector, the via hole place capacitance corresponding because of Connector pin is comparatively large, causes characteristic impedance value herein on the low side, characteristic impedance value may be caused to exceed impedance management and control scope, i.e. impedance mismatching, like this, in high speed transmission of signals process, make because of impedance mismatching signal reflex energy increase, and then cause signal edge Jitter (shake) to increase, the signal error rate that signal receiving end is collected improves, and signal quality declines.
Summary of the invention
In view of this, the invention provides a kind of printing board PCB and a kind of circuit board, can promotion signal quality.
First aspect, the invention provides a kind of PCB, comprising:
Via hole, the compensation coiling be connected with described via hole, cabling;
At least one via hole place of printing board PCB is provided with the compensation coiling around described via hole;
Described compensation coiling is without neighboring reference layer;
One end of described cabling is connected to any position in described compensation coiling.
Further, the cabling rule of described compensation coiling is for carry out annular cabling around described via hole.
Further, the length range of described compensation coiling is 1/2c-3/4c; Wherein, c represents the girth of described via hole.
Further, the length of described compensation coiling is 0.5c, and wherein, c represents the girth of described via hole.
Further, also comprise: insulating barrier, the spacing of described insulating barrier and described via hole outer shroud is 4mil.
Further, the live width of described compensation coiling is 2-4mil.
Further, the live width of described cabling is identical with the live width of described compensation coiling.
Further, the scope of the distance of the outer shroud of described compensation coiling and described via hole is: be greater than 0 and be less than 0.5mil.
Further, the distance of the outer shroud of described compensation coiling and described via hole is 0.2mil.
Second aspect, the present invention proposes a kind of circuit board, comprising:
As PCB, connector Connector as described in arbitrary in claim 1-9;
At least one pin of described Connector is inserted in being provided with in the via hole compensating coiling of described PCB.
By a kind of PCB of the present invention, on PCB, at least one via hole place is provided with the compensation coiling without neighboring reference layer around described via hole, increase the inductance value at described via hole place to balance the high capacitance excessively at via hole place, replace from compensating the mode that coiling draws the mode that former cabling directly draws from via hole with cabling, when high speed signal is when the via hole transmission of this PCB version, via hole place can be avoided to occur the impedance mismatch problem that change in the instantaneous impedance causes, and then improve signal quality.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is a kind of PCB structural representation that one embodiment of the invention provides;
Fig. 2 is the another kind of PCB structural representation that one embodiment of the invention provides.
Wherein, the numbering occurred in each accompanying drawing is corresponding respectively: 1 represents that the first cabling, 2 represents that compensating coiling, 3 represents that via hole, 4 represents that the second cabling, 5 represents via hole outer shroud.
Embodiment
For making the object of the embodiment of the present invention, technical scheme and advantage clearly; below in conjunction with the accompanying drawing in the embodiment of the present invention; technical scheme in the embodiment of the present invention is clearly and completely described; obviously; described embodiment is the present invention's part embodiment, instead of whole embodiments, based on the embodiment in the present invention; the every other embodiment that those of ordinary skill in the art obtain under the prerequisite not making creative work, all belongs to the scope of protection of the invention.
As shown in Figure 1, embodiments provide a kind of PCB, comprising:
Cabling 1, the compensation coiling 2 be connected with described via hole, via hole 3;
At least one via hole 3 place of printing board PCB is provided with the compensation coiling 2 around described via hole 3;
Described compensation coiling 2 is without neighboring reference layer;
One end of described cabling 1 is connected to any position in described compensation coiling 2.
A kind of PCB of the embodiment of the present invention, on PCB, at least one via hole place is provided with the compensation coiling without neighboring reference layer around described via hole, increase the inductance value at described via hole place to balance the high capacitance excessively at via hole place, replace from compensating the mode that coiling draws the mode that former cabling directly draws from via hole with cabling, when high speed signal is when the via hole transmission of this PCB version, via hole place can be avoided to occur the impedance mismatch problem that change in the instantaneous impedance causes, and then improve signal quality.
In technique scheme, preferably, the cabling rule of described compensation coiling 2 is for carry out annular cabling around described via hole 3.
A kind of PCB of the embodiment of the present invention, the cabling rule compensating coiling includes but not limited to carry out annular cabling around described via hole, such as, can also comprise and carry out spirality cabling or right angle cabling etc. around described via hole; According to feature resistance computational methods, when capacitive value is larger, constant for ensureing characteristic impedance value, perception value must be increased compensate, therefore, arrange the compensation coiling around described via hole at via hole place, object is that the perception value increasing described via hole is too high to balance via hole place capacitive value; By utilizing three-dimensional HFSS (High Frequency Structure Simulator, high-frequency structure emulates) software emulation modeling analysis, demonstrate the feature resistance that described winding mode can optimize via hole place preferably.
In technique scheme, preferably, the length range of described compensation coiling 2 is 1/2c-3/4c; Wherein, c represents the girth of described via hole 3.
In technique scheme, preferably, the length of described compensation coiling 2 is 0.5c, and wherein, c represents the girth of described via hole 3.
A kind of PCB of the embodiment of the present invention, to compensate the length range of coiling be it around via hole girth 1/2 to 3/4 between, such as, the length value compensating coiling can be 0.5c, 0.75c, 0.25c, wherein c represents the girth of described via hole, so, and can under the prerequisite increasing described via hole girth, the connection jaws at Appropriate application existing PCB version via hole place, cabling can be drawn from existing connection jaws.
In technique scheme, preferably, also comprise: insulating barrier, the outer ring spacing of described insulating barrier and described via hole 3 is 4mil.
A kind of PCB of the embodiment of the present invention, can be set to 4mil by the gap between via hole outer shroud and insulating barrier, and carrying out wiring for compensation coiling around via hole provides necessary guarantee.
In technique scheme, preferably, the live width of described compensation coiling 2 is 2-4mil.
A kind of PCB of the embodiment of the present invention, can according to the impedance management and control scope appropriate design live width of Signal transmissions actual demand.
In technique scheme, preferably, the live width of described cabling 1 is identical with the live width of described compensation coiling 2.
A kind of PCB of the embodiment of the present invention, the live width of cabling is identical with the live width compensating coiling, can avoid occurring in signals transmission that change in the instantaneous impedance causes impedance mismatch phenomenon to produce.
In technique scheme, preferably, described compensation coiling 2 with the scope of the distance of the outer shroud of described via hole 3 is: be greater than 0 and be less than or equal to 0.5mil.
In technique scheme, preferably, described compensation coiling 2 is 0.2mil with the distance of the outer shroud of described via hole 3.
A kind of PCB of the embodiment of the present invention, the outer shroud distance range compensating coiling and via hole is: be greater than 0 and be less than or equal to 0.5mil, the distance of the outer shroud of design compensation coiling and via hole according to the actual requirements, such as, the distance compensating coiling and via hole is set to 0.01mil, 0.2mil, 0.4mil or 0.5mil.
For making the object, technical solutions and advantages of the present invention clearly, below in conjunction with drawings and the specific embodiments, the present invention is described in further detail.
As shown in Figure 2, the another kind of PCB that the embodiment of the present invention provides, comprising:
First cabling 1, compensation coiling 2, via hole 3, second cabling 4, via hole outer shroud 5;
The first end compensating coiling 2 is connected with via hole 3;
At least one via hole 3 of PCB is provided with the compensation coiling 2 around described via hole 3;
The live width compensating coiling 2 is 3.5mil, and compensates coiling 2 without neighboring reference layer, compensates coiling 2 and carries out annular cabling around via hole 3;
The live width of the first cabling 1 is 3.5mil, and one end of the first cabling 1 is connected to the second end compensating coiling;
The live width of the second cabling 4 is 3.5mil, and one end of the second cabling 4 is connected to second segment end 2/3 distance compensating compensated distance coiling in coiling;
Via hole outer shroud 5 is 4mil with the gap of PCB insulating barrier.
Embodiments provide a kind of circuit board, comprise arbitrary described PCB, connector Connector in above-described embodiment;
At least one pin of described Connector is inserted in being provided with in the via hole compensating coiling of described PCB.
A kind of circuit board of the embodiment of the present invention, described circuit board comprises the PCB described in above-mentioned any embodiment, and therefore, described circuit board has the advantage of the PCB described in above-mentioned any embodiment, repeats no more here.
The embodiment of the present invention has following technique effect:
A kind of PCB of the embodiment of the present invention and a kind of server, on PCB, at least one via hole place is provided with the compensation coiling without neighboring reference layer around described via hole, increase the inductance value at described via hole place to balance the high capacitance excessively at via hole place, replace from compensating the mode that coiling draws the mode that former cabling directly draws from via hole with cabling, when high speed signal is when the via hole transmission of this PCB version, via hole place can be avoided to occur the impedance mismatch problem that change in the instantaneous impedance causes, and then improve signal quality.
It should be noted that, in this article, the relational terms of such as first and second and so on is only used for an entity or operation to separate with another entity or operating space, and not necessarily requires or imply the relation that there is any this reality between these entities or operation or sequentially.And, term " comprises ", " comprising " or its any other variant are intended to contain comprising of nonexcludability, thus make to comprise the process of a series of key element, method, article or equipment and not only comprise those key elements, but also comprise other key elements clearly do not listed, or also comprise by the intrinsic key element of this process, method, article or equipment.When not more restrictions, the key element " being comprised " limited by statement, and be not precluded within process, method, article or the equipment comprising described key element and also there is other identical factor.
Finally it should be noted that: the foregoing is only preferred embodiment of the present invention, only for illustration of technical scheme of the present invention, be not intended to limit protection scope of the present invention.All any amendments done within the spirit and principles in the present invention, equivalent replacement, improvement etc., be all included in protection scope of the present invention.
Claims (10)
1. a PCB, is characterized in that, comprising:
Via hole, the compensation coiling be connected with described via hole, cabling;
At least one via hole place of printing board PCB is provided with the compensation coiling around described via hole;
Described compensation coiling is without neighboring reference layer;
One end of described cabling is connected to any position in described compensation coiling.
2. PCB according to claim 1, is characterized in that,
The cabling rule of described compensation coiling is for carry out annular cabling around described via hole.
3. PCB according to claim 1, is characterized in that,
The length range of described compensation coiling is 1/2c-3/4c; Wherein, c represents the girth of described via hole.
4. PCB according to claim 3, is characterized in that,
The length of described compensation coiling is 0.5c, and wherein, c represents the girth of described via hole.
5. PCB according to claim 1, is characterized in that, also comprises:
Insulating barrier, the spacing of described insulating barrier and described via hole outer shroud is 4mil.
6. PCB according to claim 1, is characterized in that,
The live width of described compensation coiling is 2-4mil.
7. PCB according to claim 1, is characterized in that,
The live width of described cabling is identical with the live width of described compensation coiling.
8. PCB according to claim 1, is characterized in that, the scope of the distance of the outer shroud of described compensation coiling and described via hole is: be greater than 0 and be less than or equal to 0.5mil.
9. PCB according to claim 1, is characterized in that,
The distance of the outer shroud of described compensation coiling and described via hole is 0.2mil.
10. a circuit board, is characterized in that, comprising:
As PCB, connector Connector as described in arbitrary in claim 1-9;
At least one pin of described Connector is inserted in being provided with in the via hole compensating coiling of described PCB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510363481.7A CN105007682A (en) | 2015-06-26 | 2015-06-26 | PCB and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510363481.7A CN105007682A (en) | 2015-06-26 | 2015-06-26 | PCB and circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105007682A true CN105007682A (en) | 2015-10-28 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510363481.7A Pending CN105007682A (en) | 2015-06-26 | 2015-06-26 | PCB and circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105007682A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105517327A (en) * | 2015-12-18 | 2016-04-20 | 山东海量信息技术研究院 | Method for realizing via impedance matching through blind buried hole process |
| CN107072056A (en) * | 2017-05-31 | 2017-08-18 | 郑州云海信息技术有限公司 | A kind of design method of optimization PCIE connector area signal qualitys |
| CN107864561A (en) * | 2017-11-10 | 2018-03-30 | 郑州云海信息技术有限公司 | A kind of method that coiling compensates in new via through holes |
| CN112004307A (en) * | 2020-07-30 | 2020-11-27 | 北京浪潮数据技术有限公司 | Differential line wiring structure and differential line wiring structure generation method |
| CN113128170A (en) * | 2021-04-07 | 2021-07-16 | 山东英信计算机技术有限公司 | Via hole structure implementation method and device for effectively compensating capacitive sudden change |
| TWI747757B (en) * | 2021-03-04 | 2021-11-21 | 宏達國際電子股份有限公司 | Circuit board structure and layout structure thereof |
| US11419205B1 (en) | 2021-03-04 | 2022-08-16 | Htc Corporation | Circuit board structure and layout structure thereof |
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| CN1568131A (en) * | 2003-06-18 | 2005-01-19 | 华为技术有限公司 | Method for compensating characteristic impedance of meter adhibitted bonding pad and printed circuit board employing same method |
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| CN1568131A (en) * | 2003-06-18 | 2005-01-19 | 华为技术有限公司 | Method for compensating characteristic impedance of meter adhibitted bonding pad and printed circuit board employing same method |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105517327A (en) * | 2015-12-18 | 2016-04-20 | 山东海量信息技术研究院 | Method for realizing via impedance matching through blind buried hole process |
| CN107072056A (en) * | 2017-05-31 | 2017-08-18 | 郑州云海信息技术有限公司 | A kind of design method of optimization PCIE connector area signal qualitys |
| CN107072056B (en) * | 2017-05-31 | 2019-09-27 | 郑州云海信息技术有限公司 | A kind of design method optimizing PCIE connector area signal quality |
| CN107864561A (en) * | 2017-11-10 | 2018-03-30 | 郑州云海信息技术有限公司 | A kind of method that coiling compensates in new via through holes |
| CN107864561B (en) * | 2017-11-10 | 2020-01-31 | 苏州浪潮智能科技有限公司 | Method for compensating winding in via through holes |
| CN112004307A (en) * | 2020-07-30 | 2020-11-27 | 北京浪潮数据技术有限公司 | Differential line wiring structure and differential line wiring structure generation method |
| TWI747757B (en) * | 2021-03-04 | 2021-11-21 | 宏達國際電子股份有限公司 | Circuit board structure and layout structure thereof |
| US11419205B1 (en) | 2021-03-04 | 2022-08-16 | Htc Corporation | Circuit board structure and layout structure thereof |
| CN113128170A (en) * | 2021-04-07 | 2021-07-16 | 山东英信计算机技术有限公司 | Via hole structure implementation method and device for effectively compensating capacitive sudden change |
| CN113128170B (en) * | 2021-04-07 | 2023-02-28 | 山东英信计算机技术有限公司 | Via hole structure implementation method and device for effectively compensating capacitive sudden change |
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