CN104182554A - Wiring structure and wiring method for power supply pins of power amplifiers - Google Patents
Wiring structure and wiring method for power supply pins of power amplifiers Download PDFInfo
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- CN104182554A CN104182554A CN201310188601.5A CN201310188601A CN104182554A CN 104182554 A CN104182554 A CN 104182554A CN 201310188601 A CN201310188601 A CN 201310188601A CN 104182554 A CN104182554 A CN 104182554A
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- power pin
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Abstract
The invention relates to a wiring structure for power supply pins of power amplifiers. The wiring structure comprises at least two stages of power amplifiers, wherein each stage of power amplifier comprises at least one power supply pin; the wiring structure also comprises branch power cords and a main power cord; the number of the branch power cords is equal to that of the power supply pins; the lengths of the branch power cords are larger than or equal to 200 mils; the branch power cords are in one-to-one correspondence to the power supply pins and enable the corresponding power supply pins to be electrically connected to the main power cord; the main power cord is electrically connected with all the branch power cords. The invention also relates to a wiring method for the power supply pins of the power amplifiers. According to the wiring structure and the wiring method disclosed by the invention, circuit noises are required to propagate along the branch power cords and the main power cord; the impedance of the power cords is far larger than plane impedance, so that the propagation of the noises is effectively hindered, and the noise jamming is reduced.
Description
Technical field
The present invention relates to power amplifier, particularly relate to a kind of wire structures of power pin of power amplifier, also relate to a kind of wiring method of power pin of power amplifier.
Background technology
For multi-layer PCB board Digital Design, taking four laminates (signal/ground/power supply/signal) as example, in the time that an integrated circuit has the power pin of multiple identical networks and each power pin to have decoupling capacitor, the wire laying mode that normally adopts the face of paving, links together the pin of all identical networks.The complexity that so not only can reduce wiring, can also reduce the impedance of electric power network.
But for power amplifier (PA), if adopt identical method, just may cause index to decline.Reason is that power amplifier inside generally has 2 to 3 grades of amplifying circuits, if the connection of power pin is to adopt plane to connect, when rear one-level amplifying circuit work, noise will propagate into previous stage amplifying circuit by power plane, noise is exaggerated, causes power amplifier properties to decline.
Summary of the invention
Based on this, adopt the excessive problem of power amplifier noise of plane routing mode in order to solve tradition, while being necessary to provide one to carry out printed circuit board wiring, the wire structures of the power pin of power amplifier.
A kind of wire structures of power pin of power amplifier, comprise at least two stage power amplifier, every grade of described power amplifier comprises at least one power pin, also comprise: tributary power lead, quantity equates with described power pin, length is more than or equal to 200 mils, corresponding and corresponding described power pin is electrically connected on the power lead of master stream one by one with described power pin; Master stream power lead, is electrically connected with all described tributary power leads.
In an embodiment, each described tributary power lead is linear section structure therein.
In an embodiment, between the power lead of each described tributary, be parallel to each other therein.
In an embodiment, the spacing of two adjacent tributary power leads is more than or equal to 100 mils therein.
Therein in an embodiment, between described tributary power lead and master stream power lead, it is vertical connection.
In an embodiment, also comprise the decoupling capacitor coordinating with described power pin therein, described decoupling capacitor quantity equates with described power pin, and correspondence is arranged at by corresponding power pin one by one.
In an embodiment, the width of described master stream power lead is greater than the width of described tributary power lead therein.
Also be necessary the wiring method of the power pin that a kind of power amplifier is provided.
A wiring method for the power pin of power amplifier, comprises the following steps: to arrange the power pin of power amplifier, and described power amplifier is two-stage at least; Tributary power lead is set; Described tributary number of power lines equates with described power pin, and length is more than or equal to 200 mils, corresponding one by one with described power pin; Master stream power lead is set; Described master stream power lead is electrically connected with all described tributary power leads.
In an embodiment, the spacing of two adjacent tributary power leads is more than or equal to 100 mils therein, and the width of described master stream power lead is greater than the width of described tributary power lead.
In an embodiment, be also included in the other step that the decoupling capacitor coordinating with described power pin is set of described power pin therein, described decoupling capacitor quantity equates with described power pin and is corresponding one by one with described power pin.
The wire structures of the power pin of above-mentioned power amplifier and wiring method, increased path and impedance between each power pin.Traditional plane wire laying mode, the path of noise is exactly the span (bee-line) between each power pin, and the impedance on path is exactly the impedance of power plane.And adopt above-mentioned wiring, noise to propagate along tributary power lead and master stream power lead, and because the impedance of power lead is far longer than plane impedance, so just effectively hinder the sonic propagation of making an uproar, reduce noise.
Brief description of the drawings
Fig. 1 is the schematic diagram of the wire structures of the power pin of an embodiment intermediate power amplifier;
Fig. 2 is the process flow diagram of the wiring method of the power pin of an embodiment intermediate power amplifier;
Fig. 3 is that an integrated circuit adopts noise that traditional plane wire laying mode records and the relation curve of frequency;
Fig. 4 is the noise that records after the wire structures wiring of the integrated circuit identical with Fig. 3 power pin that adopts power amplifier of the present invention and the relation curve of frequency.
Embodiment
For object of the present invention, feature and advantage can more be become apparent, below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in detail.
Fig. 1 is the schematic diagram of the wire structures of the power pin of an embodiment intermediate power amplifier, the decoupling capacitor 20, tributary power lead 110 and the master stream power lead 120 that comprise power pin 10, coordinate with each power pin 10.
This circuit comprises at least two stage power amplifier, and every stage power amplifier comprises at least one power pin 10, and each power pin 10 is in consolidated network.Decoupling capacitor 20 quantity equate with power pin 10, and correspondence is arranged at corresponding power pin 10 sides one by one, is used to corresponding power pin 10 that the function of decoupling is provided.
The quantity of tributary power lead 110 equates with power pin 10, and corresponding one by one with power pin 10, and it is electrically connected to corresponding power pin 10 on master stream power lead 20.In order to obtain enough good noise attentuation effect, the necessary long enough of tributary power lead 110, in the present embodiment for being more than or equal to 200 mils (mil).
In the present embodiment, each tributary power lead 110 is linear section structure and is parallel to each other, and forms the electric power network of finger-type.The bearing of trend of tributary power lead 110 is mutually vertical with the bearing of trend of master stream power lead 120.Understandable, described is not in the specification and claims to be vertically strictly defined as 90 degree, in actual design operation, can have certain skew.In other embodiments, according to concrete circuit trace demand, tributary power lead 110 can be also the Wiring structure of bending, and 110 of each tributary power leads also can not parallelly arrange, and the angle between tributary power lead 110 and master stream power lead 120 can be also other angle.
Master stream power lead 120 is electrically connected with all tributary power leads 110.Because the electric current of flowing through on master stream power lead 120 can be regarded as gathering of current flowing on the power lead 110 of all tributaries, therefore, in order to meet the demand of larger electric current, its width should be greater than the width of tributary power lead 110 in the present embodiment.
The wire structures of the power pin of above-mentioned power amplifier, the electric power network structure of employing finger-type, has increased path and impedance between each power pin 10.Traditional plane wire laying mode, the path of noise is exactly the span (bee-line) between each power pin, and the impedance on path is exactly the impedance of power plane.And adopting above-mentioned finger-type wiring, noise must be propagated along tributary power lead 110 and master stream power lead 120, because the impedance of power lead is far longer than plane impedance, has so just effectively hindered the sonic propagation of making an uproar, and has reduced noise.The wire structures of the power pin of above-mentioned power amplifier is particularly useful for not designing the circuit of corresponding isolation structure in circuit theory diagrams.
The width of tributary power lead 110 should be thin as much as possible under the condition that meets electric current demand, is 20mil left and right therein in an embodiment.
In an embodiment, the spacing of two adjacent tributary power leads 110 is more than or equal to 100 mils therein.
Fig. 3 is that an integrated circuit adopts noise that traditional plane wire laying mode records and the relation curve of frequency, and Fig. 4 is the noise that records after the wire structures wiring of the same integrated circuit power pin that adopts power amplifier of the present invention and the relation curve of frequency.Wherein noise is more negative, represents to disturb less.Can see that in Fig. 4 noise attentuation obtains faster (with respect to Fig. 3), interference value at full frequency band (1G-5G) all lower than plane wire laying mode.
The present invention also provides a kind of wiring method of power pin of power amplifier, and Fig. 2 is the process flow diagram of the wiring method of the power pin of an embodiment intermediate power amplifier, comprises the following steps:
S210, arranges the power pin of power amplifier.
In circuit, have two stage power amplifier at least, every stage power amplifier comprises at least one power pin.
S220, arranges the decoupling capacitor coordinating with power pin.
At the other decoupling capacitor being mated that arranges of power pin, decoupling capacitor quantity equates with power pin and is corresponding one by one with power pin.
S230, arranges tributary power lead.
Tributary number of power lines is equal and corresponding one by one with power pin with power pin, and length is more than or equal to 200 mils.Tributary power lead is for being electrically connected to master stream power lead by corresponding power pin.
In order to obtain enough good noise attentuation effect, the necessary long enough of tributary power lead 110, in the present embodiment for being more than or equal to 200mil.
In the present embodiment, each tributary power lead is linear section structure and is parallel to each other, and forms the electric power network of finger-type, and the spacing of two adjacent tributary power leads 110 is more than or equal to 100 mils.The bearing of trend of tributary power lead is mutually vertical with the bearing of trend of master stream power lead.
The width of tributary power lead 110 should be thin as much as possible under the condition that meets electric current demand, is 20mil in the present embodiment.
S240, arranges master stream power lead.
Master stream power lead is electrically connected with all tributary power leads.Because the electric current of flowing through on the power lead of master stream can be regarded as gathering of current flowing on the power lead of all tributaries, therefore, in order to meet the demand of larger electric current, its width should be greater than the width of tributary power lead in the present embodiment.
The above embodiment has only expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (10)
1. a wire structures for the power pin of power amplifier, comprises at least two stage power amplifier, and every grade of described power amplifier comprises at least one power pin, it is characterized in that, also comprises:
Tributary power lead, quantity equates with described power pin, length is more than or equal to 200 mils, corresponding and corresponding described power pin is electrically connected on the power lead of master stream one by one with described power pin;
Master stream power lead, is electrically connected with all described tributary power leads.
2. the wire structures of the power pin of power amplifier according to claim 1, is characterized in that, each described tributary power lead is linear section structure.
3. the wire structures of the power pin of power amplifier according to claim 2, is characterized in that, between the power lead of each described tributary, is parallel to each other.
4. the wire structures of the power pin of power amplifier according to claim 1, is characterized in that, the spacing of two adjacent tributary power leads is more than or equal to 100 mils.
5. the wire structures of the power pin of power amplifier according to claim 1, is characterized in that, is vertical connection between described tributary power lead and master stream power lead.
6. the wire structures of the power pin of power amplifier according to claim 1, it is characterized in that, also comprise the decoupling capacitor coordinating with described power pin, described decoupling capacitor quantity equates with described power pin, and correspondence is arranged at by corresponding power pin one by one.
7. according to the wire structures of the power pin of the power amplifier described in any one in claim 1-6, it is characterized in that, the width of described master stream power lead is greater than the width of described tributary power lead.
8. a wiring method for the power pin of power amplifier, comprises the following steps:
The power pin of power amplifier is set, and described power amplifier is two-stage at least;
Tributary power lead is set; Described tributary number of power lines equates with described power pin, and length is more than or equal to 200 mils, corresponding one by one with described power pin;
Master stream power lead is set; Described master stream power lead is electrically connected with all described tributary power leads.
9. the wiring method of the power pin of power amplifier according to claim 8, is characterized in that, the spacing of two adjacent tributary power leads is more than or equal to 100 mils, and the width of described master stream power lead is greater than the width of described tributary power lead.
10. the wiring method of the power pin of power amplifier according to claim 8, it is characterized in that, also be included in the other step that the decoupling capacitor coordinating with described power pin is set of described power pin, described decoupling capacitor quantity equates with described power pin and is corresponding one by one with described power pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310188601.5A CN104182554B (en) | 2013-05-20 | 2013-05-20 | The wire structures and wiring method of the power pin of power amplifier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310188601.5A CN104182554B (en) | 2013-05-20 | 2013-05-20 | The wire structures and wiring method of the power pin of power amplifier |
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| Publication Number | Publication Date |
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| CN104182554A true CN104182554A (en) | 2014-12-03 |
| CN104182554B CN104182554B (en) | 2018-08-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310188601.5A Expired - Fee Related CN104182554B (en) | 2013-05-20 | 2013-05-20 | The wire structures and wiring method of the power pin of power amplifier |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109301808A (en) * | 2018-11-29 | 2019-02-01 | 郑州云海信息技术有限公司 | A kind of network interface anti-surge circuit layout method and device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110364506B (en) * | 2019-07-04 | 2022-01-28 | 武汉理工大学 | Bionic integrated circuit with high stability |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1469545A (en) * | 2002-06-11 | 2004-01-21 | Nec东金株式会社 | Transmitting line type noise filter |
| CN1531775A (en) * | 2001-07-23 | 2004-09-22 | 新泻精密株式会社 | Multistage amplifier and integrated circuit |
| CN1599236A (en) * | 2003-09-19 | 2005-03-23 | 夏普株式会社 | Integrated circuit and optical pickup device |
| CN1622097A (en) * | 2003-11-26 | 2005-06-01 | 松下电器产业株式会社 | Method for analyzing power supply noise of semiconductor integrated circuit |
| US20060244539A1 (en) * | 2005-04-27 | 2006-11-02 | Nec Electronics Corporation | Output circuit for amplifying and outputting an input signal |
-
2013
- 2013-05-20 CN CN201310188601.5A patent/CN104182554B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1531775A (en) * | 2001-07-23 | 2004-09-22 | 新泻精密株式会社 | Multistage amplifier and integrated circuit |
| CN1469545A (en) * | 2002-06-11 | 2004-01-21 | Nec东金株式会社 | Transmitting line type noise filter |
| CN1599236A (en) * | 2003-09-19 | 2005-03-23 | 夏普株式会社 | Integrated circuit and optical pickup device |
| CN1622097A (en) * | 2003-11-26 | 2005-06-01 | 松下电器产业株式会社 | Method for analyzing power supply noise of semiconductor integrated circuit |
| US20060244539A1 (en) * | 2005-04-27 | 2006-11-02 | Nec Electronics Corporation | Output circuit for amplifying and outputting an input signal |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109301808A (en) * | 2018-11-29 | 2019-02-01 | 郑州云海信息技术有限公司 | A kind of network interface anti-surge circuit layout method and device |
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| CN104182554B (en) | 2018-08-03 |
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