CN102264188B - Printed circuit board - Google Patents

Printed circuit board Download PDF

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Publication number
CN102264188B
CN102264188B CN2010101810169A CN201010181016A CN102264188B CN 102264188 B CN102264188 B CN 102264188B CN 2010101810169 A CN2010101810169 A CN 2010101810169A CN 201010181016 A CN201010181016 A CN 201010181016A CN 102264188 B CN102264188 B CN 102264188B
Authority
CN
China
Prior art keywords
layer
circuit board
printed circuit
signal transmission
differential signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010101810169A
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Chinese (zh)
Other versions
CN102264188A (en
Inventor
赖盈佐
陈永杰
陈俊仁
周玮洁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN2010101810169A priority Critical patent/CN102264188B/en
Publication of CN102264188A publication Critical patent/CN102264188A/en
Application granted granted Critical
Publication of CN102264188B publication Critical patent/CN102264188B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The invention relates to a printed circuit board. The printed circuit board comprises a signal layer, a dielectric layer and a signal reference layer, wherein the dielectric layer is positioned between the signal layer and the signal reference layer; the signal layer is provided with a pair of differential signal transmission lines; a hollow area is formed on a part between two projections of the differential signal transmission lines on the signal reference layer; and parts which are a certain distance away from both sides of the two projections on the signal reference layer are provided with a hollow area respectively. The printed circuit board can improve the quality of signals transmitted on the differential signal transmission lines.

Description

Printed circuit board (PCB)
Technical field
The present invention relates to a kind of printed circuit board (PCB), particularly a kind of printed circuit board (PCB) that improves the quality of the signal transmitted on differential signal transmission.
Background technology
At present, a lot of electronic products all carry out the signal transmission by differential signal transmission, for example two data wires on USB interface carry out the signal transmission by a pair of differential signal transmission, as shown in Figure 1, when a pair of differential signal transmission 112 on the signals layer 110 on a printed circuit board (PCB) 100 and 114 is carried out signal transmission, described differential signal transmission 112 and 114 Electric Field Distribution are not fully perpendicular to the signal reference layer 130(zone indicated referring to the arrow in dielectric layer 120 of its below), if therefore near the signal reference layer 120 described differential signal transmission 112 and 114 has noise to produce, easily along this electric field approach, interfere with the quality of the signal of transmission on described differential signal transmission 112 and 114.
Summary of the invention
In view of foregoing, be necessary to provide a kind of printed circuit board (PCB), can effectively improve the quality of the signal of the online transmission of differential transfer.
A kind of printed circuit board (PCB), comprise a signals layer, a dielectric layer and a signal reference layer, described dielectric layer is between described signals layer and described signal reference layer, described signals layer is provided with a pair of differential signal transmission, part between two projections of described the above differential signal transmission of signal reference layer is offered an area of knockout, and has also offered respectively an area of knockout at the certain distance of the above two projection both sides of described signal reference layer.
Compare known techniques, described printed circuit board (PCB) is by carrying out the above-mentioned processing that hollows out on the signal reference layer, make the Electric Field Distribution of described differential signal transmission fully perpendicular to the signal reference layer below it, and then reduced the interference of noise to the online signal of described differential signal transmission on the signal reference layer.
The accompanying drawing explanation
In conjunction with better embodiment, the present invention is described in further detail with reference to the accompanying drawings:
Fig. 1 is the generalized section of existing a kind of printed circuit board (PCB).
The generalized section of the better embodiment that Fig. 2 is printed circuit board (PCB) of the present invention.
Fig. 3 is emulation comparison chart during differential signal transmission on printed circuit board (PCB) in printed circuit board (PCB) and Fig. 2 in Fig. 1.
The main element symbol description
Printed circuit board (PCB) 100,200
Signals layer 110,210
Dielectric layer 220
Signal reference layer 130,230
Differential signal transmission 112,114,212,214
Area of knockout 232,234
Embodiment
Please refer to Fig. 2, the better embodiment of printed circuit board (PCB) 200 of the present invention comprises a signals layer 210, a dielectric layer 220 and a signal reference layer 230, and described dielectric layer 220 is between described signals layer 210 and described signal reference layer 230.Described signals layer 210 is provided with a pair of differential signal transmission 212 and 214, in order to transmit a pair of differential signal.
For preventing that the noise near the signal reference layer 230 described differential signal transmission 212 and 214 from interfering with on described differential signal transmission 212 and 214 quality of the signal of transmission along the electric field approach, the present invention by described differential signal transmission 212 and 214 part between two projections on described signal reference layer 230 carried out excavating processing (can be also the modes such as etching), form area of knockout 232, and the sub-fraction of described two projection both sides distance has been carried out excavating processing, form area of knockout 234.Wherein, the width d1 of area of knockout 232 equals the vertical range between described differential signal transmission 212 and 214, the width d2 of area of knockout 234 can determine best width according to the mode of experiment simulation, and described area of knockout 232 and described area of knockout 234 all are not positioned in two projections of described differential signal transmission 212 and 214 on described signal reference layer 230.After above-mentioned processing, described differential signal transmission 212 and 214 Electric Field Distribution are fully perpendicular to the signal reference layer 230(zone indicated referring to the arrow in dielectric layer 220 of its below), therefore reduced the radiation areas of electric field, and then reduced the interference of noise to the online signal of described differential signal transmission on the signal reference layer.
Described printed circuit board (PCB) 200 can be applicable to the printed circuit board (PCB) that contains USB interface, and the corresponding signal reference layer of a pair of differential signal transmission that is about to connect two data pin of USB interface is done the above-mentioned processing of excavating, and then can improve the quality of usb signal transmission.
Please refer to Fig. 3, in figure, the A curve is differential signal transmission 112 and 114 signal simulation figure on Fig. 1 printed circuit board (PCB) 100, the B curve is differential signal transmission 212 and 214 signal simulation figure on Fig. 2 printed circuit board (PCB) 200, as can be seen from Figure 3, on the differential signal transmission 112 and 114 on the printed circuit board (PCB) 100 of more not transforming through the quality to the signal of transmission on the differential signal transmission 212 and 214 on the improved printed circuit board (PCB) 200 of signal reference layer 230, the quality of the signal of transmission is significantly improved.

Claims (2)

1. a printed circuit board (PCB), comprise a signals layer, one dielectric layer and a signal reference layer, described dielectric layer is between described signals layer and described signal reference layer, described signals layer is provided with a pair of differential signal transmission, its improvement is: the part between two projections of described the above differential signal transmission of signal reference layer is offered one first area of knockout, and the certain distance in the above two projection both sides of described signal reference layer has also been offered respectively two the second area of knockouts, wherein said the first area of knockout and the second area of knockout all are not positioned in two projections of described differential signal transmission.
2. printed circuit board (PCB) as claimed in claim 1, it is characterized in that: described differential signal transmission connects respectively two data pin of a USB interface.
CN2010101810169A 2010-05-24 2010-05-24 Printed circuit board Expired - Fee Related CN102264188B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010101810169A CN102264188B (en) 2010-05-24 2010-05-24 Printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010101810169A CN102264188B (en) 2010-05-24 2010-05-24 Printed circuit board

Publications (2)

Publication Number Publication Date
CN102264188A CN102264188A (en) 2011-11-30
CN102264188B true CN102264188B (en) 2013-12-11

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010101810169A Expired - Fee Related CN102264188B (en) 2010-05-24 2010-05-24 Printed circuit board

Country Status (1)

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CN (1) CN102264188B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105682342B (en) * 2016-02-25 2018-12-11 广东欧珀移动通信有限公司 Circuit board and terminal
CN115023026B (en) * 2021-10-27 2023-04-14 荣耀终端有限公司 Circuit board and electronic device
CN116209136B (en) * 2021-11-30 2023-12-01 荣耀终端有限公司 Signal transmission structure, electronic equipment and PCB

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101370351A (en) * 2007-08-17 2009-02-18 鸿富锦精密工业(深圳)有限公司 Flexible circuit board

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7110263B2 (en) * 2004-03-09 2006-09-19 Intel Corporation Reference slots for signal traces
JP2007150000A (en) * 2005-11-29 2007-06-14 Canon Inc Printed circuit board

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101370351A (en) * 2007-08-17 2009-02-18 鸿富锦精密工业(深圳)有限公司 Flexible circuit board

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开2007-150000A 2007.06.14

Also Published As

Publication number Publication date
CN102264188A (en) 2011-11-30

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Granted publication date: 20131211

Termination date: 20140524