CN102264188A - Printed circuit board - Google Patents

Printed circuit board Download PDF

Info

Publication number
CN102264188A
CN102264188A CN2010101810169A CN201010181016A CN102264188A CN 102264188 A CN102264188 A CN 102264188A CN 2010101810169 A CN2010101810169 A CN 2010101810169A CN 201010181016 A CN201010181016 A CN 201010181016A CN 102264188 A CN102264188 A CN 102264188A
Authority
CN
China
Prior art keywords
layer
circuit board
printed circuit
signal transmission
signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN2010101810169A
Other languages
Chinese (zh)
Other versions
CN102264188B (en
Inventor
赖盈佐
陈永杰
陈俊仁
周玮洁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN2010101810169A priority Critical patent/CN102264188B/en
Publication of CN102264188A publication Critical patent/CN102264188A/en
Application granted granted Critical
Publication of CN102264188B publication Critical patent/CN102264188B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Abstract

The invention relates to a printed circuit board. The printed circuit board comprises a signal layer, a dielectric layer and a signal reference layer, wherein the dielectric layer is positioned between the signal layer and the signal reference layer; the signal layer is provided with a pair of differential signal transmission lines; a hollow area is formed on a part between two projections of the differential signal transmission lines on the signal reference layer; and parts which are a certain distance away from both sides of the two projections on the signal reference layer are provided with a hollow area respectively. The printed circuit board can improve the quality of signals transmitted on the differential signal transmission lines.

Description

Printed circuit board (PCB)
Technical field
The present invention relates to a kind of printed circuit board (PCB), particularly a kind of printed circuit board (PCB) that improves the quality of the signal that transmits on the differential signal transmission.
Background technology
At present, a lot of electronic products all carry out the signal transmission by differential signal transmission, for example two data wires on the USB interface carry out the signal transmission by a pair of differential signal transmission, as shown in Figure 1, when a pair of differential signal transmission 112 on the signals layer 110 on the printed circuit board (PCB) 100 and 114 is carried out transmission signals, described differential signal transmission 112 and 114 Electric Field Distribution are not fully perpendicular to the signal reference layer 130 (referring to the indicated zone of the arrow in the dielectric layer 120) of its below, therefore if near the signal reference layer 120 described differential signal transmission 112 and 114 has noise to produce, then interfere with the quality of the signal of transmission on described differential signal transmission 112 and 114 easily along this electric field approach.
Summary of the invention
In view of foregoing, be necessary to provide a kind of printed circuit board (PCB), can effectively improve the quality of the signal of the online transmission of differential transfer.
A kind of printed circuit board (PCB), comprise a signals layer, a dielectric layer and a signal reference layer, described dielectric layer is between described signals layer and described signal reference layer, described signals layer is provided with a pair of differential signal transmission, part between two projections of described the above differential signal transmission of signal reference layer is offered an area of knockout, and has also offered an area of knockout respectively at the certain distance of the above two projection both sides of described signal reference layer.
Compare known techniques, described printed circuit board (PCB) is by to carrying out the above-mentioned processing that hollows out on the signal reference layer, the Electric Field Distribution that makes described differential signal transmission is fully perpendicular to the signal reference layer of its below, and then reduced on the signal reference layer noise to the interference of the online signal of described differential signal transmission.
Description of drawings
In conjunction with better embodiment the present invention is described in further detail with reference to the accompanying drawings:
Fig. 1 is the generalized section of existing a kind of printed circuit board (PCB).
Fig. 2 is the generalized section of the better embodiment of printed circuit board (PCB) of the present invention.
Fig. 3 is the emulation comparison chart during differential signal transmission on the printed circuit board (PCB) among printed circuit board (PCB) and Fig. 2 among Fig. 1.
The main element symbol description
Printed circuit board (PCB) 100,200
Signals layer 110,210
Dielectric layer 220
Signal reference layer 130,230
Differential signal transmission 112,114,212,214
Area of knockout 232,234
Embodiment
Please refer to Fig. 2, the better embodiment of printed circuit board (PCB) 200 of the present invention comprises a signals layer 210, a dielectric layer 220 and a signal reference layer 230, and described dielectric layer 220 is between described signals layer 210 and described signal reference layer 230.Described signals layer 210 is provided with a pair of differential signal transmission 212 and 214, in order to transmit a pair of differential signal.
For preventing that the noise near the signal reference layer 230 described differential signal transmission 212 and 214 from interfering with on described differential signal transmission 212 and 214 quality of the signal of transmission along the electric field approach, the present invention has carried out excavating processing (also can be modes such as etching) with the part of described differential signal transmission 212 and 214 between two projections on the described signal reference layer 230, form area of knockout 232, and the sub-fraction of described two projection both sides distance carried out excavating processing, form area of knockout 234.Wherein, the width d1 of area of knockout 232 equals the vertical range between described differential signal transmission 212 and 214, and the width d2 of area of knockout 234 can determine best width according to the mode of experiment simulation.Through after the above-mentioned processing, described differential signal transmission 212 and 214 Electric Field Distribution are then fully perpendicular to the signal reference layer 230 (referring to the indicated zone of the arrow in the dielectric layer 220) of its below, so reduced the radiation areas of electric field, and then reduced on the signal reference layer noise to the interference of the online signal of described differential signal transmission.
Described printed circuit board (PCB) 200 can be applicable to contain the printed circuit board (PCB) of USB interface, and the pairing signal reference layer of a pair of differential signal transmission that is about to connect two data pin of USB interface is done the above-mentioned processing of excavating, and then can improve the quality of usb signal transmission.
Please refer to Fig. 3, the A curve is differential signal transmission 112 and 114 signal simulation figure on Fig. 1 printed circuit board (PCB) 100 among the figure, the B curve is differential signal transmission 212 and 214 signal simulation figure on Fig. 2 printed circuit board (PCB) 200, as can be seen from Figure 3, the quality through the signal of transmission on the differential signal transmission 112 and 114 on the printed circuit board (PCB) 100 that the quality of the signal of transmission on the differential signal transmission 212 and 214 on the signal reference layer 230 improved printed circuit board (PCB)s 200 is not more transformed is significantly improved.

Claims (2)

1. printed circuit board (PCB), comprise a signals layer, a dielectric layer and a signal reference layer, described dielectric layer is between described signals layer and described signal reference layer, described signals layer is provided with a pair of differential signal transmission, its improvement is: the part between two projections of described the above differential signal transmission of signal reference layer is offered an area of knockout, and has also offered an area of knockout respectively at the certain distance of the above two projection both sides of described signal reference layer.
2. printed circuit board (PCB) as claimed in claim 1 is characterized in that: described differential signal transmission connects two data pin of a USB interface respectively.
CN2010101810169A 2010-05-24 2010-05-24 Printed circuit board Expired - Fee Related CN102264188B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010101810169A CN102264188B (en) 2010-05-24 2010-05-24 Printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010101810169A CN102264188B (en) 2010-05-24 2010-05-24 Printed circuit board

Publications (2)

Publication Number Publication Date
CN102264188A true CN102264188A (en) 2011-11-30
CN102264188B CN102264188B (en) 2013-12-11

Family

ID=45010570

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010101810169A Expired - Fee Related CN102264188B (en) 2010-05-24 2010-05-24 Printed circuit board

Country Status (1)

Country Link
CN (1) CN102264188B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105682342A (en) * 2016-02-25 2016-06-15 广东欧珀移动通信有限公司 Circuit board and terminal
CN115023026A (en) * 2021-10-27 2022-09-06 荣耀终端有限公司 Circuit board and electronic device
CN116209136A (en) * 2021-11-30 2023-06-02 荣耀终端有限公司 Signal transmission structure, electronic equipment and PCB

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050201072A1 (en) * 2004-03-09 2005-09-15 Jiangqi He Reference slots for signal traces
JP2007150000A (en) * 2005-11-29 2007-06-14 Canon Inc Printed circuit board
CN101370351A (en) * 2007-08-17 2009-02-18 鸿富锦精密工业(深圳)有限公司 Flexible circuit board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050201072A1 (en) * 2004-03-09 2005-09-15 Jiangqi He Reference slots for signal traces
JP2007150000A (en) * 2005-11-29 2007-06-14 Canon Inc Printed circuit board
CN101370351A (en) * 2007-08-17 2009-02-18 鸿富锦精密工业(深圳)有限公司 Flexible circuit board

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105682342A (en) * 2016-02-25 2016-06-15 广东欧珀移动通信有限公司 Circuit board and terminal
CN105682342B (en) * 2016-02-25 2018-12-11 广东欧珀移动通信有限公司 Circuit board and terminal
CN115023026A (en) * 2021-10-27 2022-09-06 荣耀终端有限公司 Circuit board and electronic device
CN116209136A (en) * 2021-11-30 2023-06-02 荣耀终端有限公司 Signal transmission structure, electronic equipment and PCB
WO2023098172A1 (en) * 2021-11-30 2023-06-08 荣耀终端有限公司 Signal transmission structure, electronic device and pcb
CN116209136B (en) * 2021-11-30 2023-12-01 荣耀终端有限公司 Signal transmission structure, electronic equipment and PCB

Also Published As

Publication number Publication date
CN102264188B (en) 2013-12-11

Similar Documents

Publication Publication Date Title
CN204216326U (en) Connector structure with grounding conductor
EP2538499A1 (en) Receptacle, printed circuit board, and electronic device
US9554455B2 (en) Method and apparatus for reducing far-end crosstalk in electrical connectors
CN104348040B (en) Electric connector
CN102110920A (en) High-speed connector package and packaging method
CN204179278U (en) Connector construction
CN101568225B (en) Flexible circuit board
JP6107672B2 (en) Cable with connector
JP4638960B1 (en) Receptacle, printed wiring board, and electronic equipment
CN102264188B (en) Printed circuit board
TWI419620B (en) Printed circuit board
CN102378476A (en) Printed circuit board
TWI581528B (en) Socket electrical connector
CN108112162A (en) Signal transmssion line and its design method, flexible printed circuit board
CN104936373A (en) Circuit board, distribution method of surface-layer difference lines and communication equipment
WO2017006553A1 (en) Printed wiring board
EP2378613A1 (en) Receptacle, printed circuit board, and electronic device
EP3609044A1 (en) Charging circuit and charging method thereof
CN104619116B (en) through hole layout structure, circuit board and electronic assembly
CN202797485U (en) Grounding structure of shielding housing and circuit board of electric connector
JP5873682B2 (en) Redriver IC, semiconductor device, and manufacturing method thereof
EP4009751A1 (en) Circuit board and communication device
EP3399848A1 (en) Flexible circuit board wiring structure and mobile terminal
CN202712610U (en) Shielding shell of electric connector and circuit board grounding structure
CN103794851B (en) The making method of a kind of NFC antenna, mobile terminal and antenna

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20131211

Termination date: 20140524