CN104244598B - Method and device for controlling impedance continuity of transmission line on PCB (printed circuit board) - Google Patents
Method and device for controlling impedance continuity of transmission line on PCB (printed circuit board) Download PDFInfo
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- CN104244598B CN104244598B CN201410494864.3A CN201410494864A CN104244598B CN 104244598 B CN104244598 B CN 104244598B CN 201410494864 A CN201410494864 A CN 201410494864A CN 104244598 B CN104244598 B CN 104244598B
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Abstract
The invention discloses a method and a device for controlling impedance continuity of a transmission line on a PCB (printed circuit board). The method includes: for the transmission line, composed of a wide portion and a narrow portion, on the PCB, determining thickness of a first insulating layer between a PCB layer where the transmission line is positioned and a first reference layer according to predetermined corresponding impedance standard of the transmission line; determining thickness of a second insulating layer between the first reference layer and the second reference layer according to the impedance standard, predetermined impedance deviation standard and the thickness of the first insulating layer; setting a portion, corresponding to vertical projection of the wide portion of the transmission line on the first reference layer, of the first reference layer to be a hollow area. By the technical scheme, adjusting of impedance of the narrow portion and the wide portion of the transmission line under the circumstance that line width of the transmission line changes to meet the impedance deviation standard is realized, so that sudden change of impedance of the transmission line is avoided.
Description
Technical field
The present invention relates to printed circuit board (PCB) (PCB) designing technique, in espespecially a kind of PCB design, controls transmission line on PCB
The method and apparatus of impedance continuity.
Background technology
In PCB design, such situation during PCB layout, is frequently encountered, for PCB top layers and the transmission line on bottom
I.e. microstrip line, when by certain wiring space limited region, in order to improve the wiring space utilization rate in the region, needs contracting
The width of little transmission line.That is, in PCB layout, it is sometimes necessary to change the width of transmission line.
The change of transmission line width result in the discontinuous of the impedance of transmission line, that is to say, that transmission line narrow portion and biography
The impedance of defeated live width part is inconsistent, and the situation in this area by the impedance rate of change of transmission line beyond impedance deviation standard is referred to as
Change in the instantaneous impedance, wherein, impedance deviation standard requires that impedance rate of change is less than 10%.Assume change before and after impedance be respectively Z1 and
Z2, then impedance rate of change is represented by less than 10%：|Z2-Z1|/Z1<10%, understand that by the formula span of Z2 is：
0.9Z1<Z2<1.1Z1.That is, impedance deviation standard requires that the scope of Z2 is [0.9Z1,1.1Z1].
The different impedance standard of different types of transmission line correspondence, for example, the corresponding impedance standard of single-ended transmission line is 50
Ω positive and negative 10%, i.e. impedance ranges are [45 Ω, 55 Ω], and the corresponding impedance standard of difference transmission lines is 85 Ω positive and negative 10%, i.e.,
Impedance ranges are [76.5 Ω, 93.5 Ω].The calculating of the impedance Z of the transmission line of microstrip line type, is the known of those skilled in the art
Shown in technology, such as formula (1),
In formula (1), e is that, with the natural truth of a matter, Er is dielectric constant, and live widths of the W for transmission line, T are the copper of transmission line
Skin thickness, H are the distance between transmission line place PCB layer and reference layer, and Er is the dielectric constant of pcb board material.
In order to preferably understand formula (1), it should be noted that PCB is made up of multiple PCB layers.Material according to PCB layer is entered
Row classification, PCB layer can be divided into layers of copper or insulating barrier.There is layers of copper to include signals layer, ground plane and power supply layer, wherein, signal
The PCB layer that layer is located for transmission line, ground plane are the PCB layer for ground connection, and power supply layer is the PCB layer for power supply.Insulating barrier
Have between layers of copper positioned at two.
From formula (1), when W and T is fixed value, Z and H direct proportionalities, wherein, for microstrip line type
Transmission line, reference layer are the ground plane closest with transmission line place PCB layer.Due to transmission line place PCB layer and reference layer
Between be insulating barrier, therefore H can be understood as the thickness of the insulating barrier between above-mentioned two-layer.
From formula (1), shown in the calculating such as formula (2) of the distance between transmission line place PCB layer and reference layer,
As the signal transmitted on transmission line will produce reflecting background at change in the instantaneous impedance, therefore change in the instantaneous impedance reduces biography
The quality of the signal transmitted on defeated line.In this area, the impact of change in the instantaneous impedance is reduced at present by the method for double change in the instantaneous impedance.
Specifically, when transmission line is by the limited region of wiring space, transmission line width is reduced, when behind the region, then
The width of transmission line is returned to by the width before the region.
The method of this double change in the instantaneous impedance, make use of a part of reflecting background produced at change in the instantaneous impedance twice can phase
The principle mutually offset, reduces the impact of change in the instantaneous impedance.However, this method is due to offsetting a part of reflecting background, because
This cannot effectively reduce the impact of change in the instantaneous impedance.Especially, when the data transfer rate of the signal transmitted on transmission line is further improved, example
Such as, when data transfer rate brings up to 20Gpbs, reflecting background significantly affects the quality of signal, or even causes what signal can not be stable to connect
Receive.
The content of the invention
In order to solve above-mentioned technical problem, the invention provides on a kind of control PCB the impedance continuity of transmission line side
Method, can adjust transmission line narrow portion in the case of the line width variation of transmission line and the impedance of wide portion meets impedance deviation mark
Standard, so as to avoid transmission line impedance from being mutated.
In order to reach the object of the invention, the invention discloses on a kind of control PCB the impedance continuity of transmission line method,
Including：
A transmission line being made up of transmission line wide portion and transmission line narrow portion upper for PCB, it is corresponding according to transmission line
Impedance standard, determine the thickness of the first insulating barrier between transmission line place PCB layer and the first reference layer；Wherein, the first reference
Impedance corresponding reference layer of the layer for transmission line narrow portion；
According to the thickness of impedance standard, impedance deviation standard and the first insulating barrier, the first reference layer and the second reference are determined
The thickness of the second insulating barrier between layer；Wherein, impedance corresponding reference layer of second reference layer for transmission line wide portion, the second ginseng
The distance between layer and transmission line place PCB layer are examined more than the distance between the first reference layer and transmission line place PCB layer；
The part of upright projection of the transmission line wide portion on the first reference layer corresponding first reference layer is set to dig
Dummy section.
The thickness for determining the first insulating barrier includes：
According to the impedance ranges that the impedance standard shows, transmission line place PCB layer is calculated relative to described first
First distance range of reference layer；
According to the first distance range, the thickness of first insulating barrier is determined；Wherein, the thickness position of first insulating barrier
In the first distance range.
The thickness for determining the second insulating barrier includes：
The first impedance of transmission line narrow portion according to the THICKNESS CALCULATION of first insulating barrier；
According to the impedance standard and impedance deviation standard, the first impedance for calculating, the transmission line wide portion is determined
Impedance ranges；
According to the impedance ranges determined, reality of the transmission line place PCB layer relative to second reference layer is calculated
Border distance range；
The thickness of the thickness and first reference layer of first insulating barrier is individually subtracted in actual range scope, is obtained
To second distance scope；
According to the second distance scope for obtaining, the second insulation between first reference layer and second reference layer is determined
The thickness of layer；Wherein, the thickness of the second insulating barrier is located in second distance scope.
The impedance ranges for determining the transmission line wide portion include：
According to first impedance and the impedance deviation standard, the corresponding impedance ranges of impedance deviation standard are determined；
Determine the coincidence scope of the impedance ranges that the corresponding impedance ranges of impedance deviation standard and the impedance standard show,
And using the coincidence scope determined as the transmission line wide portion impedance ranges.
The invention also discloses on a kind of control PCB the impedance continuity of transmission line device, including first thickness calculate
Unit, second thickness computing unit and area of knockout determining unit, wherein,
First thickness computing unit, is made up of transmission line wide portion and transmission line narrow portion for upper for PCB one
Transmission line, according to the corresponding impedance standard of transmission line, determines the first insulating barrier between transmission line place PCB layer and the first reference layer
Thickness；Wherein, impedance corresponding reference layer of first reference layer for transmission line narrow portion；
Second thickness computing unit, for according to impedance standard, impedance deviation standard and from first thickness computing unit
The first insulating barrier thickness, determine the thickness of the second insulating barrier between the first reference layer and the second reference layer；Wherein, the second ginseng
The corresponding reference layer of impedance that layer is transmission line wide portion is examined, the second reference layer is big with the distance between transmission line place PCB layer
In the distance between the first reference layer and transmission line place PCB layer；
Area of knockout determining unit, for the upright projection corresponding first by transmission line wide portion on the first reference layer
The part of reference layer is set to area of knockout.
The first thickness calculate specifically for：
According to the impedance ranges that the impedance standard shows, transmission line place PCB layer is calculated relative to described first
First distance range of reference layer；
According to the first distance range, the thickness of first insulating barrier is determined；Wherein, the thickness position of first insulating barrier
In the first distance range.
The second thickness computing unit specifically for：
The first impedance of transmission line narrow portion according to the THICKNESS CALCULATION of first insulating barrier；
According to the impedance standard and impedance deviation standard, the first impedance for calculating, the transmission line wide portion is determined
Impedance ranges；
According to the impedance ranges determined, reality of the transmission line place PCB layer relative to second reference layer is calculated
Border distance range；
The thickness of the thickness and first reference layer of first insulating barrier is individually subtracted in actual range scope, is obtained
To second distance scope；
According to the second distance scope for obtaining, the second insulation between first reference layer and second reference layer is determined
The thickness of layer；Wherein, the thickness of the second insulating barrier is located in second distance scope.
The second thickness computing unit, when the first impedance of the transmission line narrow portion is calculated, specifically for：
According to first impedance and the impedance deviation standard, the corresponding impedance ranges of impedance deviation standard are determined；
Determine the coincidence scope of the impedance ranges that the corresponding impedance ranges of impedance deviation standard and the impedance standard show,
And using the coincidence scope determined as the transmission line wide portion impedance ranges.
Compared with prior art, technical scheme includes：One upper for PCB by transmission line wide portion and transmission
The transmission line that line narrow portion is constituted, according to the corresponding impedance standard of transmission line, determines transmission line place PCB layer and the first reference layer
Between the first insulating barrier thickness；Wherein, impedance corresponding reference layer of first reference layer for transmission line narrow portion；According to impedance
The thickness of standard, impedance deviation standard and the first insulating barrier, determines the second insulating barrier between the first reference layer and the second reference layer
Thickness；Wherein, impedance corresponding reference layer of second reference layer for transmission line wide portion, the second reference layer are located with transmission line
The distance between PCB layer is more than the distance between the first reference layer and transmission line place PCB layer；By transmission line wide portion first
The part of corresponding first reference layer of upright projection on reference layer is set to area of knockout.The technical side provided by the present invention
Case, the layers of copper of the area of knockout by hollowing out setting so that the corresponding reference layer of impedance of transmission line wide portion is by the first reference
Layer is changed into the second reference layer；And by the thickness of the first insulating barrier and the second insulating barrier is arranged according to the thickness for determining, make transmission
The impedance of line narrow portion and wide portion meets corresponding impedance standard, while so that impedance rate of change meets impedance deviation standard,
That is effective control transmission line impedance changes in the range of impedance deviation standard shows, therefore avoids transmission line and hinder
Mutation, the impact of signal quality of the line width variation of transmission line to transmitting on transmission line so as to effective control.
Other features and advantages of the present invention will be illustrated in the following description, also, partly be become from description
Obtain it is clear that or being understood by implementing the present invention.The purpose of the present invention and other advantages can be by description, rights
In claim and accompanying drawing, specifically noted structure is realizing and obtain.
Description of the drawings
Accompanying drawing is used for providing further understanding technical solution of the present invention, and constitutes a part for description, with this
The embodiment of application for explaining technical scheme, does not constitute the restriction to technical solution of the present invention together.
Fig. 1 is the flow chart of the method for the impedance continuity of transmission line on present invention control PCB；
Flow charts of the Fig. 2 for the thickness of the second insulating barrier is determined in the inventive method；
Fig. 3 is the composition structural representation of the device of the impedance continuity of transmission line on present invention control PCB.
Specific embodiment
To make the object, technical solutions and advantages of the present invention become more apparent, below in conjunction with accompanying drawing to the present invention
Embodiment process describe in detail.It should be noted that in the case where not conflicting, in the embodiment and embodiment in the application
Feature can mutual combination in any.
Can be in the such as computer system of one group of computer executable instructions the step of the flow process of accompanying drawing is illustrated
Perform.And, although show logical order in flow charts, but in some cases, can be with suitable different from herein
Sequence performs shown or described step.
Impedance standard herein, during no additional description, refers both to the corresponding impedance standard of transmission line.Transmission herein
Line, during no additional description, refers both to the transmission line being made up of transmission line wide portion and transmission line narrow portion.
The present invention is applied to the impedance continuity of the transmission line of microstrip line type on control PCB.
Fig. 1 is the flow chart of the method for the impedance continuity of transmission line on present invention control PCB, as shown in figure 1, including such as
Lower step：
Step 101：A transmission line being made up of transmission line wide portion and transmission line narrow portion upper for PCB, according to biography
The corresponding impedance standard of defeated line, determines the thickness of the first insulating barrier between transmission line place PCB layer and the first reference layer.
Wherein, impedance corresponding reference layer of first reference layer for transmission line narrow portion.
Determine in this step that the thickness of the first insulating barrier includes：
First, the impedance ranges for being shown according to impedance standard, calculate transmission line place PCB layer relative to the first reference layer
First distance range.
In this step, the first distance range can be calculated according to formula (2).In formula (2), dielectric constant Er, transmission
Live width W and copper sheet thickness T of line, when PCB specifications determine, is fixed value, and bringing impedance ranges that impedance standard shows into can
To calculate the first distance range.
Then, according to the first distance range, determine the thickness of the first insulating barrier.
Wherein it is determined that the first insulating barrier thickness be located at the first distance range in.
Preferably, the numerical value of the thickness of the first insulating barrier is close to the intermediate value in the first scope, this way it is ensured that transmission
Line narrow portion is relative in the impedance ranges that show close to the corresponding impedance standard of transmission line of impedance of the first reference layer
Between be worth.
In embodiment 1, transmission line be single-ended transmission line, the scope that its corresponding impedance standard shows be [45 Ω, 55
Ω], the thickness of the first insulating barrier is selected according to above-mentioned optimal way, the impedance of transmission line narrow portion is 49 Ω, close to [45
Ω, 55 Ω] 50 Ω of intermediate value.
Step 102：According to the thickness of impedance standard, impedance deviation standard and the first insulating barrier, determine the first reference layer and
The thickness of the second insulating barrier between second reference layer.
Wherein, impedance corresponding reference layer of second reference layer for transmission line wide portion.
Wherein, the distance between the second reference layer and transmission line place PCB layer are located with transmission line more than the first reference layer
The distance between PCB layer.From formula (1), as impedance and live width W of transmission line are inversely proportional to, with transmission line place PCB layer
It is directly proportional with the distance between reference layer H.When H is fixed value, the W of transmission line wide portion is bigger than the W of transmission line narrow portion, because
The impedance of the impedance ratio transmission line narrow portion of this transmission line wide portion is little.When the reference layer of transmission line wide portion is changed into the second reference
During layer, corresponding H increases so that the impedance of transmission line wide portion increases, and so when it is desired value to adjust H, transmits live width portion
Point impedance can be close to the impedance of transmission line narrow portion, it is ensured that when the live width of transmission line changes, transmission line wide portion and
The seriality of the impedance of narrow portion, it is to avoid change in the instantaneous impedance.
Fig. 2 is the flow chart of the thickness that the second insulating barrier is determined in this step, as shown in Fig. 2 including：
Step 201：According to the first impedance of the THICKNESS CALCULATION transmission line narrow portion of the first insulating barrier.
In this step, first impedance of transmission line narrow portion can be calculated according to formula (1), it would however also be possible to employ this area skill
General the first impedance of impedance computation computed in software of art personnel.From step 101, the first impedance is located at what impedance standard showed
In impedance ranges.In embodiment 1, the first impedance is 49 Ω.
Step 202：According to impedance standard and impedance deviation standard, the first impedance for calculating, transmission line wide portion is determined
Impedance ranges.
This step is specifically included：
First, according to the first impedance and impedance deviation standard, the corresponding impedance ranges of impedance deviation standard are determined.
From the analysis in background technology, impedance deviation standard is required：0.9Z1<Z2<1.1Z1, wherein Z1 and Z2 distinguish
For the impedance before and after change, the impedance of transmission line narrow portion and wide portion is corresponded respectively to herein.In embodiment 1,
One impedance Z 1 is 49 Ω, can be obtained by above formula, the corresponding impedance ranges of impedance deviation standard for [44.1 Ω, 53.9
Ω]。
Then, it is determined that the coincidence model of impedance ranges that the corresponding impedance ranges of impedance deviation standard and impedance standard show
Enclose, and using the coincidence scope determined as transmission line wide portion impedance ranges.
In embodiment 1, the impedance ranges [45 Ω, 55 Ω] that impedance standard shows, and impedance deviation standard hinders accordingly
Anti- scope is [44.1 Ω, 53.9 Ω], and the coincidence scope of the above-mentioned two scope for so determining is [45 Ω, 53.9 Ω].
Step 203：According to the impedance ranges determined, reality of the transmission line place PCB layer relative to the second reference layer is calculated
Border distance range.
It is likewise possible to calculate actual range scope according to formula (2).
Step 204：The thickness of the thickness and the first reference layer of the first insulating barrier is individually subtracted in actual range scope, is obtained
To second distance scope.
Step 205：According to the second distance scope for obtaining, the second insulation between the first reference layer and the second reference layer is determined
The thickness of layer.
Wherein it is determined that the second insulating barrier thickness be located at second distance scope in.
Preferably, the thickness of the second insulating barrier is close to the intermediate value in second distance scope.
In embodiment 1, according to the thickness of above-mentioned optimal way the second insulating barrier of selection, the impedance of transmission line wide portion is
48.5 Ω, close to 49 Ω of intermediate value of [44.1 Ω, 53.9 Ω].
In embodiment 1, the impedance of transmission line narrow portion is 49 Ω, and the impedance of transmission line wide portion is 48.5 Ω, so
Impedance rate of change | 48.5-49 |/49=1.02%, meets the impedance rate of change of impedance deviation standard requirement wanting less than 10%
Ask.Also, according to optimal way, the thickness of the first insulating barrier and the second insulating barrier is selected, impedance rate of change can be caused to meet
Impedance deviation standard is required, while reduce impedance rate of change as far as possible.
Step 103：By the part of upright projection of the transmission line wide portion on the first reference layer corresponding first reference layer
It is set to area of knockout.
In certain embodiments, the appropriate width for increasing upright projection, such as width increase by 5%, so can be effectively true
The effect protected after area of knockout is hollowed out.
After the inventive method, in PCB production processes, set according to the thickness of the first insulating barrier and the second insulating barrier that determine
The thickness of the first insulating barrier and the second insulating barrier is put, according to the area of knockout for arranging, area of knockout on the first reference layer is shown
Layers of copper dig up.
Fig. 3 is the composition structural representation of the device of the impedance continuity of transmission line on present invention control PCB, such as Fig. 3 institutes
Show, including first thickness computing unit, second thickness computing unit and area of knockout determining unit, wherein,
First thickness computing unit, is made up of transmission line wide portion and transmission line narrow portion for upper for PCB one
Transmission line, according to the corresponding impedance standard of transmission line, determines the first insulating barrier between transmission line place PCB layer and the first reference layer
Thickness.Wherein, impedance corresponding reference layer of first reference layer for transmission line narrow portion.
Second thickness computing unit, for according to impedance standard, impedance deviation standard and from first thickness computing unit
The first insulating barrier thickness, determine the thickness of the second insulating barrier between the first reference layer and the second reference layer.Wherein, the second ginseng
The corresponding reference layer of impedance that layer is transmission line wide portion is examined, the second reference layer is big with the distance between transmission line place PCB layer
In the distance between the first reference layer and transmission line place PCB layer.
Area of knockout determining unit, for the upright projection corresponding first by transmission line wide portion on the first reference layer
The part of reference layer is set to area of knockout.
First thickness calculate specifically for：
According to the impedance ranges that impedance standard shows, transmission line place PCB layer is calculated relative to the first of the first reference layer
Distance range；
According to the first distance range, the thickness of the first insulating barrier is determined；Wherein, the thickness of the first insulating barrier positioned at first away from
In scope.
Second thickness computing unit specifically for：
According to the first impedance of the THICKNESS CALCULATION transmission line narrow portion of the first insulating barrier；
According to impedance standard and impedance deviation standard, the first impedance for calculating, the impedance model of transmission line wide portion is determined
Enclose；
According to the impedance ranges determined, actual range model of the transmission line place PCB layer relative to the second reference layer is calculated
Enclose；
The thickness of the thickness and the first reference layer of the first insulating barrier is individually subtracted in actual range scope, obtain second away from
From scope；
According to the second distance scope for obtaining, the thickness of the second insulating barrier between the first reference layer and the second reference layer is determined
Degree；Wherein, the thickness of the second insulating barrier is located in second distance scope.
Second thickness computing unit, when the first impedance of transmission line narrow portion is calculated, specifically for：
According to the first impedance and impedance deviation standard, the corresponding impedance ranges of impedance deviation standard are determined；
Determine the coincidence scope of the impedance ranges that the corresponding impedance ranges of impedance deviation standard and impedance standard show, and will
Impedance ranges of the coincidence scope determined as transmission line wide portion.
Although disclosed herein embodiment as above, described content is only to readily appreciate the present invention and adopt
Embodiment, is not limited to the present invention.Technical staff in any art of the present invention, is being taken off without departing from the present invention
On the premise of the spirit and scope of dew, can implement form and details on any modification of process with change, but the present invention
Scope of patent protection, still must be defined by the scope of which is defined in the appended claims.
Claims (4)
1. on a kind of control PCB the impedance continuity of transmission line method, it is characterised in that include：
A transmission line being made up of transmission line wide portion and transmission line narrow portion upper for PCB, hinders accordingly according to transmission line
Anti- standard, determines the thickness of the first insulating barrier between transmission line place PCB layer and the first reference layer；Wherein, the first reference layer is
The corresponding reference layer of impedance of transmission line narrow portion；
According to the thickness of impedance standard, impedance deviation standard and the first insulating barrier, determine the first reference layer and the second reference layer it
Between the second insulating barrier thickness；Wherein, impedance corresponding reference layer of second reference layer for transmission line wide portion, the second reference layer
With the distance between transmission line place PCB layer more than the distance between the first reference layer and transmission line place PCB layer；
The part of upright projection of the transmission line wide portion on the first reference layer corresponding first reference layer is set to hollow out area
Domain；
The thickness for determining the first insulating barrier includes：
According to the impedance ranges that the impedance standard shows, transmission line place PCB layer is calculated relative to the described first reference
First distance range of layer；
According to the first distance range, the thickness of first insulating barrier is determined；Wherein, the thickness of first insulating barrier is located at the
In one distance range；
The thickness for determining the second insulating barrier includes：
The first impedance of transmission line narrow portion according to the THICKNESS CALCULATION of first insulating barrier；
According to the impedance standard and impedance deviation standard, the first impedance for calculating, the resistance of the transmission line wide portion is determined
Anti- scope；
According to the impedance ranges determined, calculate transmission line place PCB layer relative to second reference layer it is actual away from
From scope；
The thickness of the thickness and first reference layer of first insulating barrier is individually subtracted in actual range scope, is obtained
Two distance ranges；
According to the second distance scope for obtaining, the second insulating barrier between first reference layer and second reference layer is determined
Thickness；Wherein, the thickness of the second insulating barrier is located in second distance scope.
2. method according to claim 1, it is characterised in that the impedance ranges bag of the determination transmission line wide portion
Include：
According to first impedance and the impedance deviation standard, the corresponding impedance ranges of impedance deviation standard are determined；
Determine the coincidence scope of the impedance ranges that the corresponding impedance ranges of impedance deviation standard and the impedance standard show, and will
Impedance ranges of the coincidence scope determined as the transmission line wide portion.
3. on a kind of control PCB the impedance continuity of transmission line device, it is characterised in that including first thickness computing unit,
Second thickness computing unit and area of knockout determining unit, wherein,
First thickness computing unit, for a transmission being made up of transmission line wide portion and transmission line narrow portion upper for PCB
Line, according to the corresponding impedance standard of transmission line, determines the thickness of the first insulating barrier between transmission line place PCB layer and the first reference layer
Degree；Wherein, impedance corresponding reference layer of first reference layer for transmission line narrow portion；
Second thickness computing unit, for according to impedance standard, impedance deviation standard and from the of first thickness computing unit
The thickness of one insulating barrier, determines the thickness of the second insulating barrier between the first reference layer and the second reference layer；Wherein, the second reference layer
For the corresponding reference layer of impedance of transmission line wide portion, the distance between the second reference layer and transmission line place PCB layer are more than the
The distance between one reference layer and transmission line place PCB layer；
Area of knockout determining unit, for corresponding first reference of upright projection by transmission line wide portion on the first reference layer
The part of layer is set to area of knockout；
The first thickness calculate specifically for：
According to the impedance ranges that the impedance standard shows, transmission line place PCB layer is calculated relative to the described first reference
First distance range of layer；
According to the first distance range, the thickness of first insulating barrier is determined；Wherein, the thickness of first insulating barrier is located at the
In one distance range；
The second thickness computing unit specifically for：
The first impedance of transmission line narrow portion according to the THICKNESS CALCULATION of first insulating barrier；
According to the impedance standard and impedance deviation standard, the first impedance for calculating, the resistance of the transmission line wide portion is determined
Anti- scope；
According to the impedance ranges determined, calculate transmission line place PCB layer relative to second reference layer it is actual away from
From scope；
The thickness of the thickness and first reference layer of first insulating barrier is individually subtracted in actual range scope, is obtained
Two distance ranges；
According to the second distance scope for obtaining, the second insulating barrier between first reference layer and second reference layer is determined
Thickness；Wherein, the thickness of the second insulating barrier is located in second distance scope.
4. device according to claim 3, it is characterised in that the second thickness computing unit, is calculating the biography
During the first impedance of defeated line narrow portion, specifically for：
According to first impedance and the impedance deviation standard, the corresponding impedance ranges of impedance deviation standard are determined；
Determine the coincidence scope of the impedance ranges that the corresponding impedance ranges of impedance deviation standard and the impedance standard show, and will
Impedance ranges of the coincidence scope determined as the transmission line wide portion.
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| CN201410494864.3A CN104244598B (en) | 2014-09-24 | 2014-09-24 | Method and device for controlling impedance continuity of transmission line on PCB (printed circuit board) |
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| CN201410494864.3A CN104244598B (en) | 2014-09-24 | 2014-09-24 | Method and device for controlling impedance continuity of transmission line on PCB (printed circuit board) |
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| CN104797079A (en) * | 2015-04-10 | 2015-07-22 | 福州瑞芯微电子有限公司 | Method for reducing impedance mismatching on package and PCB (printed circuit board) |
| CN104797078A (en) * | 2015-04-10 | 2015-07-22 | 福州瑞芯微电子有限公司 | Method for reducing impedance mismatching degree under condition of discontinuous returning path |
| CN107454736B (en) * | 2017-06-27 | 2019-08-27 | 上达电子（深圳）股份有限公司 | A kind of circuit board and its cabling impedance adjustment |
| CN111985180B (en) * | 2020-07-30 | 2022-08-12 | 苏州浪潮智能科技有限公司 | Impedance matching device, method, equipment and medium for PCB (printed Circuit Board) routing of solid state disk |
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