CN211240263U - Rigid-flex board and electronic equipment comprising same - Google Patents
Rigid-flex board and electronic equipment comprising same Download PDFInfo
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- CN211240263U CN211240263U CN201922211840.3U CN201922211840U CN211240263U CN 211240263 U CN211240263 U CN 211240263U CN 201922211840 U CN201922211840 U CN 201922211840U CN 211240263 U CN211240263 U CN 211240263U
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Abstract
The utility model discloses a soft or hard combination board reaches electronic equipment including it, including first hard board, soft board and the second hard board that arranges in proper order, first hard board with the second hard board is located the hard district of soft or hard combination board, the soft board is located the soft district and the hard district of soft or hard combination board, the soft board is including the first flexible dielectric layer, middle signal layer and the flexible dielectric layer of second that arrange in proper order. The electronic equipment comprises the rigid-flex board. The utility model discloses keep the intermediate signal layer between two-layer flexible dielectric layer, the medium of the two-layer flexible dielectric layer adjacent with the intermediate signal layer does not change along with regional change, has avoided the reflection that high-speed signal produced when the transmission of intermediate signal layer for the signal decay reduces, can avoid the intermediate signal layer to paste the problem that the transmission produced in two kinds of media of dielectric constant difference, can guarantee that signal line impedance is unchangeable.
Description
Technical Field
The utility model belongs to the technical field of the flexible line way board, more specifically relates to a rigid-flex board reaches electronic equipment including it.
Background
With the development of PCB technology, a flexible-rigid PCB is often used to connect two boards in a small handheld device or a product with a requirement on volume, so as to replace a connector, thereby reducing the volume of the product.
The rigid-flex circuit board has the characteristics of both FPC and PCB, so that the rigid-flex circuit board can be used in products with special requirements, has a certain flexible area and a certain rigid area, and is greatly helpful for saving the internal space of the products, reducing the volume of finished products and improving the performance of the products.
The birth and development of FPC and PCB have promoted a new product of soft and hard combined board. Therefore, the rigid-flex circuit board is a circuit board with FPC (flexible printed circuit) characteristics and PCB (printed circuit board) characteristics, which is formed by combining a flexible circuit board and a rigid circuit board according to relevant process requirements through processes such as pressing and the like.
In the past, in a product with multiple PCBs connected, the PCBs are connected through a connector, so that the problems of high installation cost, inconvenience in installation and poor installation reliability are caused, and meanwhile, the problems of short circuit, falling off and the like are caused easily.
With the progress of the PCB manufacturing process, the rigid-flexible board solves the problem of FPC mounting reliability, and the rigid-flexible board connects the two PCBs by designing a flexible area between the two PCBs, so that the attenuation of the connector to signals can be reduced. This seems to solve the signal attenuation, but if the signal flip rate reaches above 1MHZ and there is an impedance matching requirement, the common rigid-flex board stack may not be suitable for transmitting high-speed signals, because the flexible part of the rigid-flex board is made of PI and the rigid part is made of FR4, the two materials have different dielectric constants, the PI dielectric constant is about 2.8-3.2, and the FR4 dielectric constant is about 3.6-4.4, which affects the impedance during high-speed signal transmission (because the dielectric constant directly affects the capacitive reactance, and the capacitive reactance of signals is different when different materials are transmitted). However, although this method ensures impedance, the abrupt change of the line width may cause reflection of high-speed signals during transmission, which may result in signal attenuation.
In addition, because the prior art cannot completely ensure the position of the boundary where the cover film of the flexible core board of the rigid flexible board extends into the rigid board, the line width is changed by presetting a fixed boundary in the LAYOUT software in the old design to ensure the continuous impedance, but certain errors can be generated during machining (the machined rigid flexible board is not necessarily straight in a combining area), and further more serious impedance mismatching and signal reflection can be generated at the boundary where the medium changes by high-speed signals.
Meanwhile, with the continuous update of the technology of the board factory, the current way for solving the problem of the board factory is to add a flexible core board between the rigid area and the flexible area, fill PP (NF PP is similar to PI material, and the dielectric constant is lower than FR4) between the two flexible core boards, and lay copper foil beside the trace of the two intermediate signal layers of L3 and L4 to reduce the influence of the sudden change of the impedance of the flexible area and the rigid area, and the signal line with the same line width of the flexible area and the rigid area has smaller impedance difference but still has a certain difference, which still causes signal attenuation.
SUMMERY OF THE UTILITY MODEL
To the above defect of prior art or improve the demand, the utility model provides a rigid-flex board reaches electronic equipment including it, its intermediate signal layer that will be used for transmitting high-speed signal sets up between two flexible introduction layers to guarantee that the material that is adjacent with intermediate signal layer is the same in hard district and soft district, avoided the signal attenuation that line width sudden change and material change lead to.
In order to achieve the above object, according to the utility model discloses, a rigid-flex board is provided, a serial communication port, including first hard board, soft board and the second hard board that arranges in proper order, first hard board with the second hard board is located the hard district of rigid-flex board, the soft board is located the soft district and the hard district of rigid-flex board, the soft board is including the first flexible dielectric layer, intermediate signal layer and the flexible dielectric layer of second that arrange in proper order.
Preferably, the wiring of the intermediate signal layer is a differential signal line or a single-ended signal line.
Preferably, the first hard board comprises a first hard board composite layer, and the first hard board composite layer comprises a first hard board metal layer and a first rigid substrate which are sequentially arranged along the direction close to the soft board;
the second hard board comprises a second hard board composite layer, and the second hard board composite layer comprises a second rigid substrate and a second hard board metal layer which are sequentially arranged along the direction far away from the soft board.
Preferably, the flexible printed circuit board further includes a first cover film and a second cover film, the first cover film is disposed on the first surface of the flexible area of the flexible printed circuit board, the second cover film is disposed on the second surface of the flexible area of the flexible printed circuit board, the first cover film extends into the first rigid substrate, and the second cover film extends into the second rigid substrate.
Preferably, the rigid-flexible printed circuit board has two hard areas and a soft area located between the two hard areas.
Preferably, the flexible printed circuit board further comprises a first cover film and a second cover film, the first cover film is arranged on the first surface of the flexible area of the flexible printed circuit board, and the second cover film is arranged on the second surface of the flexible area of the flexible printed circuit board.
Preferably, a first power supply layer is arranged between the first flexible medium layer and the intermediate signal layer, and a second power supply layer is arranged between the second flexible medium layer and the intermediate signal layer;
and/or
A first grounding layer is arranged between the first flexible medium layer and the middle signal layer, and a second grounding layer is arranged between the second flexible medium layer and the middle signal layer.
Preferably, the first power layer and/or the second power layer are formed by etching and removing 5% -10% of a whole piece of metal.
Preferably, the intermediate signal layer comprises a plurality of signal sublayers.
An electronic device comprises the rigid-flex board.
Generally, through the utility model discloses above technical scheme who conceives compares with prior art, can gain following beneficial effect:
1) because the rigid-flex board technology is complicated, so the increase in the number of piles brings the cost increase unobvious, consequently the utility model discloses can regard as under the cost increase unobvious prerequisite the second through rationally set up the material between the layer and rationally arrange the wiring layer and avoided the discontinuous problem of impedance, reduce the calculation degree of difficulty of board factory management and control impedance.
2) The utility model discloses keep the middle signal layer in the centre of the flexible material of two-layer flexible dielectric layer, the medium of the two-layer flexible dielectric layer of next-door neighbour does not change along with the regional change, the reflection of high-speed signal production when the transmission of middle signal layer has been avoided, make the signal decay reduce, can avoid the middle signal layer to paste the problem that the transmission produced in two kinds of media of dielectric constant difference, can guarantee that signal line impedance is unchangeable, and need not to reduce the impedance change through the line width that increases flexible region, wiring density has been increased.
Drawings
FIG. 1 is a schematic structural view of a five-layer rigid-flexible board of the present invention;
fig. 2 is a schematic structural view of the six-layer rigid-flexible board of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. Furthermore, the technical features mentioned in the embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.
Referring to each drawing, a rigid-flex board, it has two hard districts and is located soft district between two hard districts, rigid-flex board is including the first hard board 1, soft board 2 and the second hard board 3 that arrange in proper order, first hard board 1 with the second hard board 3 is located rigid district of rigid-flex board, soft board 2 is located the soft district and the hard district of rigid-flex board, soft board 2 is including the first flexible dielectric layer 212, intermediate signal layer 22 and the second flexible dielectric layer 231 that arrange in proper order. Preferably, the wiring of the intermediate signal layer 22 is a differential signal line or a single-ended signal line, the flexible printed circuit board 2 further has a first flexible printed circuit board metal layer 211 and a second flexible printed circuit board metal layer 232, the first flexible dielectric layer 212 and the first flexible printed circuit board metal layer 211 are stacked together to form a first flexible printed circuit board composite layer 21, and the second flexible dielectric layer 231 and the second flexible printed circuit board metal layer 232 of the flexible printed circuit board 2 are stacked together to form a second flexible printed circuit board composite layer 23.
Further, the flexible printed circuit board 2 further includes a first cover film 24 and a second cover film 25, the first cover film 24 is disposed on a first surface of the flexible area of the flexible printed circuit board 2, the second cover film 25 is disposed on a second surface of the flexible area of the flexible printed circuit board 2, the first cover film 24 extends into the first rigid substrate 112, and the second cover film 25 extends into the second rigid substrate 311.
The first hard board 1 comprises a first hard board composite layer 11, the first hard board composite layer 11 comprises a first hard board metal layer 111 and a first rigid substrate 112 which are sequentially arranged along a direction close to the soft board 2, the second hard board 3 comprises a second hard board composite layer 31, the second hard board composite layer 31 comprises a second rigid substrate 311 and a second hard board metal layer 312 which are sequentially arranged along a direction far away from the soft board 2, and the first rigid substrate 112 and the second rigid substrate 311 clamp the soft board 2.
The first flexible dielectric layer 212 and the second flexible dielectric layer 231 may be formed using PI material, and the first rigid substrate 112 and the second rigid substrate 311 may be formed using FR-4 material.
Further, a first power supply layer is arranged between the first flexible dielectric layer 212 and the intermediate signal layer 22, and a second power supply layer is arranged between the second flexible dielectric layer 231 and the intermediate signal layer 22; the first power supply layer and/or the second power supply layer are formed by etching and removing 5% -10% of a whole piece of metal, so that impedance can be matched, and as high-speed signals need to have impedance with a set value when high-frequency signals pass through, as long as materials of two layers adjacent to the middle signal layer 22 do not change, the complete power supply layer can further ensure that the impedance of the middle signal layer 22 does not change;
and/or
A first ground plane is provided between the first flexible dielectric layer 212 and the intermediate signal layer 22, and a second ground plane is provided between the second flexible dielectric layer 231 and the intermediate signal layer 22. Therefore, the signal interference of external signals to the transmission of the intermediate signal layer 22 can be effectively avoided, and meanwhile, the stability is better and the voltage fluctuation is smaller.
Further, the flexible printed circuit board 2 further includes a first cover film 24 and a second cover film 25, the first cover film 24 is disposed on a first surface of the flexible area of the flexible printed circuit board 2, and the second cover film 25 is disposed on a second surface of the flexible area of the flexible printed circuit board 2. The first cover film 24 extends into the first rigid substrate 112 and the second cover film 25 extends into the second rigid substrate 311, so that the upper first flexible printed circuit board composite layer 21 and the second flexible printed circuit board composite layer 23 can be better isolated from air, and the flexible printed circuit boards 2 can be better protected.
Further, the first flexible printed circuit board composite layer 21 has a plurality of layers and they are stacked together, and the second flexible printed circuit board composite layer 23 has a plurality of layers and they are stacked together, no matter how many layers the first flexible printed circuit board composite layer 21 and the second flexible printed circuit board composite layer 23 are provided with, it is necessary to ensure that the intermediate signal layer 22 for transmitting high-speed signals is between the first flexible medium layer 212 and the second flexible medium layer 231, and to ensure that the medium material is unchanged. Each first flexible board metal layer 211 of the first flexible board composite layer 21 and each second flexible board metal layer 232 of the second flexible board composite layer 23 can be used as a working layer of the PCB (the working layer can be a ground layer, a signal layer, a mechanical layer, a power layer, etc.); the intermediate signal layer 22 may also include a plurality of signal sub-layers, and the first flexible printed circuit board composite layer 21, the intermediate signal layer 22, and the second flexible printed circuit board composite layer 23 may be combined in various ways.
In the case of the five-layer board shown in fig. 1, the five-layer board has, in order from top to bottom, a first hard board metal layer 111(L1 layer), a first soft board metal layer 211(L2 layer), an intermediate signal layer 22(L3 layer), a second soft board metal layer 232(L4 layer), and a second hard board metal layer 312(L5 layer) (in the case of a five-layer board structure, L1 to L5 layers are a top layer, a ground layer, an intermediate signal layer 22, a ground layer, and a bottom layer).
In the case of the six-layer board design of fig. 2, which has a first hard board metal layer 111(L1 layer), two first soft board metal layers 211(L2 layer, L3 layer), an intermediate signal layer 22(L4 layer), a second soft board metal layer 232(L5 layer) and a second hard board metal layer 312(L6 layer) in this order from top to bottom (in this structure, L1 layer to L6 layer are a top layer, a ground layer, a power supply layer, an intermediate signal layer 22, a ground layer and a bottom layer in this order), or has a first hard board metal layer 111(L1 layer), a first soft board metal layer 211(L2 layer), an intermediate signal layer 22(L3 layer), two second soft board metal layers 232(L4 layer, L5 layer) and a second hard board metal layer 312(L6 layer) in this order from top to bottom (in this six-layer board structure, L1 to L6 layer are a top layer, an intermediate signal layer, a ground layer 22, a power supply layer and a bottom layer in this order), two-layer ground plane can play the shielding interference effect for middle signal layer 22 and power layer, two-layer flexible dielectric layer in the middle of the soft board 2 can avoid walking the line and bring the discontinuous problem of impedance between these two-layer, and can make the difference of middle signal layer 22 or single-ended high-speed network keep unchangeable at rigidity and the adjacent two-layer medium in flexible region, can avoid the discontinuous problem of impedance of medium change bringing, also do not have the design that changes the line width when the medium changes simultaneously, can avoid the reflection of signal like this, furthest promotes the transmission distance of high-speed signal, can do bigger more complicated with PCB.
Further, the first hard board composite layer 11 is provided in plural and they are stacked together, and the second hard board composite layer 31 is provided in plural and they are stacked together, the number of layers of the first hard board 1 and the second hard board 3 may be set according to the working layer (the metal layer is the working layer) of the PCB board, and may be as many as several tens of layers.
In addition, solder resist ink 4 is laid on the outer surface of the first hard board 1 and the outer surface of the second hard board 3.
The utility model discloses a middle signal layer 22 that will be used for transmitting high-speed signal sets up in the centre of flexonics board to guarantee with middle signal layer 22 adjacent two-layer the same at rigidity region and flexible region material, and then avoided the signal attenuation that line width sudden change and material change lead to.
Furthermore, the utility model discloses still relate to an electronic equipment, including the rigid-flex board that the aforesaid mentioned. The utility model discloses the electronic equipment that says can be small-size hand-held device or have the product that requires to the volume, like cell-phone, camera, audio player, panel computer etc. also can be industrial connector, test equipment, computer, on-vehicle display module group etc. the utility model discloses do not injecing to this.
It will be understood by those skilled in the art that the foregoing is merely a preferred embodiment of the present invention, and is not intended to limit the invention to the particular forms disclosed, but on the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. The utility model provides a rigid-flex board, its characterized in that, is including the first hard board, soft board and the second hard board that arrange in proper order, first hard board with the second hard board is located rigid-flex board's hard district, the soft board is located rigid-flex board's soft district and hard district, the soft board is including the first flexible dielectric layer, intermediate signal layer and the flexible dielectric layer of second that arrange in proper order.
2. The board according to claim 1, wherein the intermediate signal layer is wired as a differential signal line or a single-ended signal line.
3. The rigid-flex board according to claim 1, wherein the first rigid board comprises a first rigid board composite layer, the first rigid board composite layer comprises a first rigid board metal layer and a first rigid substrate which are sequentially arranged along a direction close to the flexible board;
the second hard board comprises a second hard board composite layer, and the second hard board composite layer comprises a second rigid substrate and a second hard board metal layer which are sequentially arranged along the direction far away from the soft board.
4. The board of claim 3, wherein the flexible board further comprises a first cover film and a second cover film, the first cover film is disposed on a first surface of the flexible region of the flexible board, the second cover film is disposed on a second surface of the flexible region of the flexible board, the first cover film extends into the first rigid substrate, and the second cover film extends into the second rigid substrate.
5. The board of claim 1, wherein the board has two hard areas and a soft area between the two hard areas.
6. The board of claim 1, wherein the flexible board further comprises a first cover film and a second cover film, the first cover film is disposed on a first surface of the flexible area of the flexible board, and the second cover film is disposed on a second surface of the flexible area of the flexible board.
7. The board of claim 1, wherein a first power layer is disposed between the first flexible dielectric layer and the intermediate signal layer, and a second power layer is disposed between the second flexible dielectric layer and the intermediate signal layer;
and/or
A first grounding layer is arranged between the first flexible medium layer and the middle signal layer, and a second grounding layer is arranged between the second flexible medium layer and the middle signal layer.
8. The board of claim 7, wherein the first power layer and/or the second power layer is formed by etching an entire metal away by 5% to 10%.
9. The board according to claim 1, wherein the intermediate signal layer comprises a plurality of signal sublayers.
10. An electronic device comprising the rigid-flex board according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922211840.3U CN211240263U (en) | 2019-12-11 | 2019-12-11 | Rigid-flex board and electronic equipment comprising same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922211840.3U CN211240263U (en) | 2019-12-11 | 2019-12-11 | Rigid-flex board and electronic equipment comprising same |
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| Publication Number | Publication Date |
|---|---|
| CN211240263U true CN211240263U (en) | 2020-08-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201922211840.3U Active CN211240263U (en) | 2019-12-11 | 2019-12-11 | Rigid-flex board and electronic equipment comprising same |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112074078A (en) * | 2020-09-14 | 2020-12-11 | 福建中科光芯光电科技有限公司 | Rigid-flexible circuit board for 200G light receiving device |
| CN114615796A (en) * | 2022-03-09 | 2022-06-10 | 四川九洲电器集团有限责任公司 | High-speed rigid-flex printed circuit board and design method thereof |
| CN114827831A (en) * | 2021-01-28 | 2022-07-29 | 昆腾微电子股份有限公司 | Pseudo-differential audio input circuit and apparatus |
-
2019
- 2019-12-11 CN CN201922211840.3U patent/CN211240263U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112074078A (en) * | 2020-09-14 | 2020-12-11 | 福建中科光芯光电科技有限公司 | Rigid-flexible circuit board for 200G light receiving device |
| CN114827831A (en) * | 2021-01-28 | 2022-07-29 | 昆腾微电子股份有限公司 | Pseudo-differential audio input circuit and apparatus |
| CN114615796A (en) * | 2022-03-09 | 2022-06-10 | 四川九洲电器集团有限责任公司 | High-speed rigid-flex printed circuit board and design method thereof |
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