CN112074078A - Rigid-flexible circuit board for 200G light receiving device - Google Patents
Rigid-flexible circuit board for 200G light receiving device Download PDFInfo
- Publication number
- CN112074078A CN112074078A CN202010961001.8A CN202010961001A CN112074078A CN 112074078 A CN112074078 A CN 112074078A CN 202010961001 A CN202010961001 A CN 202010961001A CN 112074078 A CN112074078 A CN 112074078A
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- layer
- board
- fpc
- hard
- soft
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- 238000003491 array Methods 0.000 claims abstract description 4
- 239000003990 capacitor Substances 0.000 claims abstract description 4
- 238000012545 processing Methods 0.000 claims abstract description 4
- 230000008054 signal transmission Effects 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 238000004381 surface treatment Methods 0.000 claims description 3
- 239000004593 Epoxy Substances 0.000 claims 1
- 239000013039 cover film Substances 0.000 claims 1
- 230000005540 biological transmission Effects 0.000 abstract description 4
- 238000001125 extrusion Methods 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 230000003287 optical effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000007306 functionalization reaction Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention relates to a soft and hard combined circuit board for a 200G light receiving device, which comprises an N-path bare DIE TIA chip, N PD arrays, a plurality of routing capacitors and a soft and hard combined board; the PD array transmits the received signal to a TIA chip, and the TIA chip converts the signal and transmits the signal to a mainboard signal processing chip; the PD array and the TIA chip are arranged on a hard board of the soft and hard combination board, and the signals are transmitted on the flexible board. The circuit board is simple in manufacturing process, and can effectively avoid possible transmission instability caused by extrusion of the electric signal wire.
Description
Technical Field
The invention relates to the field of optical fiber communication, in particular to a rigid-flexible circuit board for a 200G light receiving device.
Background
The circuit board is used as a key component in various electronic products, and has a great influence on the performance of the electronic products. With the development of electronic products toward miniaturization and multi-functionalization, the requirements for circuit boards are increasing, multilayer circuit boards are being used in various applications, and the number of layers in the multilayer circuit boards is still increasing, from four layers, six layers to eight layers, or even more. In the manufacturing process of the conventional circuit board, the signal loss caused by the uncontrollable thickness, width and shape of the solder and the soldering alignment deviation of the bonding pad is large, which causes the instability of the possible transmission.
Disclosure of Invention
In view of the above, the present invention provides a rigid-flex circuit board for a 200G light receiving device, which can effectively avoid the extrusion of electrical signal wires, resulting in possible transmission instability.
In order to achieve the purpose, the invention adopts the following technical scheme:
a soft and hard combined circuit board for a 200G light receiving device comprises an N-path bare DIE TIA chip, N PD arrays, a plurality of routing capacitors and a soft and hard combined board; the PD array transmits the received signal to a TIA chip, and the TIA chip converts the signal and transmits the signal to a mainboard signal processing chip; the PD array and the TIA chip are arranged on a hard board of the soft and hard combination board, and the signals are transmitted on the flexible board.
Further, the rigid-flex board is a rigid-flex board with 6 layers.
Further, the laminated structure of the 6 layers of rigid-flex boards specifically includes:
the TOP layer is a hard board and is a BONDING area of TIA and PD;
the second layer and the third layer are combined together to form a flexible board for transmitting high-speed radio-frequency signals, wherein 4 pairs of high-speed differential signal lines are arranged on the second layer, and the third layer is a complete ground plane;
the fourth layer to the fifth layer are combined to form a flexible plate for low-speed electric signal transmission and power supply;
the BOTTOM layer is a hard board, and the soft and hard combination board and the assembly shell are tightly attached together.
Furthermore, an epoxy resin layer is arranged between the third layer and the fourth layer of the 6 soft and hard combined board.
Furthermore, the BONDING area is subjected to nickel-palladium-gold surface treatment, wherein the thickness of palladium is 0.2um, and the thickness of gold is 0.05 um.
Furthermore, the TOP layer is provided with laser blind holes, the high-speed signal line is switched from the TOP layer to the second layer through the laser blind holes, and a pair of ground holes is arranged on the periphery of each laser blind hole.
Furthermore, the BOTTOM layer is a bare flat copper sheet.
Further, the soft board covering film penetrates into the hard board area to be larger than 0.5mm in the soft board combining part of the soft board and the hard board; the soft board extends out of the hard board part and is provided with a part which is longer than 1mm and can not be bent.
Compared with the prior art, the invention has the following beneficial effects:
1. the invention adopts the flexible board to transmit high-speed radio frequency signals, and is directly connected with the PCB. Compared with a pure hard board circuit, the method reduces one-time welding process, and reduces signal loss caused by uncontrollable thickness, width and shape of tin on welding and welding alignment deviation of a welding pad;
2. the BOTTOM layer hard board is a copper sheet which is flat and smooth in whole board without covering green oil, placing devices and routing. Firstly, the coupling and alignment of the optical paths are more facilitated; secondly, the heat dissipation is enhanced, and the chip work and the signal transmission are more stable; thirdly, because the BOTTOM needs to be tightly attached to the shell, the design can avoid the extrusion of the electric signal line to cause the instability of possible transmission.
Drawings
FIG. 1 is a schematic diagram of a rigid-flex circuit board for a 200G light-receiving device according to an embodiment of the present invention;
fig. 2 is a schematic view of a laminated structure of 6 layers of rigid-flex boards according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a TOP layer of a rigid-flex board according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a second layer of the rigid-flex board according to an embodiment of the present invention;
FIG. 5 is a schematic view of a third layer of the rigid-flex circuit board according to an embodiment of the invention;
FIG. 6 is a diagram illustrating a fourth layer of the rigid-flex board according to an embodiment of the present invention;
FIG. 7 is a fifth layer of the rigid-flex circuit board according to an embodiment of the present invention;
fig. 8 is a schematic diagram of a sixth layer of the rigid-flex board in an embodiment of the invention.
Detailed Description
The invention is further explained below with reference to the drawings and the embodiments.
Referring to fig. 1, the present embodiment provides a rigid-flex circuit board for a 200G optical receiver, including a 4-channel bare DIE TIA chip, 4 PD arrays, a plurality of wire bonding capacitors, and a 6-layer rigid-flex board;
in this embodiment, 4 paths of light transmitted from an external optical path, which carries a 50G-PAM4 signal, are converted into photocurrent by a PIN photodiode, transmitted to a TIA chip by a gold wire, converted into four paths of differential voltage signals by the TIA, and transmitted to a motherboard signal processing chip. The TIA and PD chips related in the embodiment are assembled on a hard board of a circuit board; the high-speed signal line is transmitted on the flexible board and is linked to the main board through the flexible board; the low speed electrical control signal and the power supply are transmitted on the other flexible board.
Preferably, in this embodiment, it is vertical that the rigid-flex board is a rigid-flex board with 6 layers, and the laminated structure specifically includes:
the TOP layer is a hard board and is a BONDING area of TIA and PD;
the second layer and the third layer are combined together to form a flexible board for transmitting high-speed radio-frequency signals, wherein 4 pairs of high-speed differential signal lines are arranged on the second layer, and the third layer is a complete ground plane and is a reference plane of the high-speed signal transmission line of the second layer, so that the impedance continuity of the high-speed signal transmission line is ensured;
the fourth layer to the fifth layer are combined to form a flexible plate for low-speed electric signal transmission and power supply;
the BOTTOM layer is a hard board, and the soft and hard combination board and the assembly shell are tightly attached together.
Preferably, in this embodiment, an epoxy resin layer is disposed between the third layer and the fourth layer of the 6-layer rigid-flex printed circuit board. First in order to guarantee the alignment of the optical chip on the PCB and rear end light path, on the other hand is in order to separate two flexible boards, the bending behind convenient contact mainboard PCB.
In this embodiment, the BONDING region is subjected to nickel-palladium-gold surface treatment, with palladium thickness of 0.2um and gold thickness of 0.05um, so that flatness of the BONDING region is ensured, alignment of a rear-end optical path is facilitated, and optical path coupling loss is reduced;
in this embodiment, because the power consumption of the TIA chip is large, a certain number of through holes need to be drilled to remove heat from the bottom layer, and the working reliability of the chip and the stability of signal transmission are maintained.
In this embodiment, the TOP layer is provided with laser blind holes, the high-speed signal line is switched from the TOP layer to the second layer through the laser blind holes, and in order to ensure the impedance continuity of the high-speed signal transmission line and reduce the signal return area, a pair of ground holes is arranged on the periphery of each laser blind hole.
In this embodiment, the BOTTOM layer is a bare flat copper sheet, no signal line is needed, no device is placed, and no green oil is covered, so that the BOTTOM layer is convenient to attach to the wall of the housing, and the BOTTOM layer is used for enhancing heat dissipation.
In the embodiment, the soft board covering film penetrates into the hard board area to be more than 0.5mm in the soft board combining part of the soft board and the hard board; the soft board extends out of the hard board part and is provided with a part which is longer than 1mm and can not be bent.
The above description is only a preferred embodiment of the present invention, and all equivalent changes and modifications made in accordance with the claims of the present invention should be covered by the present invention.
Claims (8)
1. A soft and hard combined circuit board for a 200G light receiving device is characterized by comprising N paths of TIA chips of bare DIE, N PD arrays, a plurality of routing capacitors and a soft and hard combined board; the PD array transmits the received signal to a TIA chip, and the TIA chip converts the signal and transmits the signal to a mainboard signal processing chip; the PD array and the TIA chip are arranged on a hard board of the soft and hard combination board, and the signals are transmitted on the flexible board.
2. The FPC of claim 1, wherein the FPC is a 6-layer rigid-flex board.
3. The FPC of claim 1, wherein the laminated structure of the 6-layer FPC specifically comprises:
the TOP layer is a hard board and is a BONDING area of TIA and PD;
the second layer and the third layer are combined together to form a flexible board for transmitting high-speed radio-frequency signals, wherein 4 pairs of high-speed differential signal lines are arranged on the second layer, and the third layer is a complete ground plane;
the fourth layer to the fifth layer are combined to form a flexible plate for low-speed electric signal transmission and power supply;
the BOTTOM layer is a hard board, and the soft and hard combination board and the assembly shell are tightly attached together.
4. The FPC of claim 3, wherein an epoxy layer is disposed between the third layer and the fourth layer of the 6-layer FPC.
5. The FPC of claim 3, wherein the BONDING region is subjected to NiPdAu surface treatment, wherein Pd is 0.2 μm thick and Au is 0.05 μm thick.
6. The rigid-flex circuit board for 200G light-receiving device as claimed in claim 3, wherein the TOP layer is provided with laser blind holes, the high-speed signal lines are switched from the TOP layer to the second layer through the laser blind holes, and each laser blind hole is provided with a pair of ground holes on the periphery side.
7. The FPC of claim 3, wherein the BOTTOM layer is a bare flat copper sheet.
8. The FPC of claim 1, wherein the FPC/FPC board has a FPC-bonding portion, and the FPC/FPC cover film extends more than 0.5mm into the FPC area; the soft board extends out of the hard board part and is provided with a part which is longer than 1mm and can not be bent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010961001.8A CN112074078A (en) | 2020-09-14 | 2020-09-14 | Rigid-flexible circuit board for 200G light receiving device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010961001.8A CN112074078A (en) | 2020-09-14 | 2020-09-14 | Rigid-flexible circuit board for 200G light receiving device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112074078A true CN112074078A (en) | 2020-12-11 |
Family
ID=73696689
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010961001.8A Pending CN112074078A (en) | 2020-09-14 | 2020-09-14 | Rigid-flexible circuit board for 200G light receiving device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112074078A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170139162A1 (en) * | 2015-11-16 | 2017-05-18 | Electronics And Telecommunications Research Institute | Multi-channel receiver optical sub-assembly and manufacturing method thereof |
| CN106961799A (en) * | 2017-04-28 | 2017-07-18 | 无锡市同步电子科技有限公司 | A kind of high speed Rigid Flex method for designing |
| CN107896418A (en) * | 2017-10-10 | 2018-04-10 | 青岛海信宽带多媒体技术有限公司 | A kind of optical module |
| CN108494495A (en) * | 2018-05-07 | 2018-09-04 | 深圳市迅特通信技术有限公司 | A kind of miniaturization hot plug high speed optical receiver module |
| CN109757022A (en) * | 2017-11-01 | 2019-05-14 | 健鼎（无锡）电子有限公司 | Flexible-rigid compound circuit board and its manufacturing method |
| US20190364184A1 (en) * | 2016-12-23 | 2019-11-28 | Ningbo Sunny Opotech Co., Ltd. | Camera module, circuit board assembly and manufacturing method thereof, and electronic device with camera module |
| CN209731254U (en) * | 2019-05-29 | 2019-12-03 | 广东瑞谷光网通信股份有限公司 | A kind of multichannel QSFP DD optical module |
| CN111308620A (en) * | 2020-03-20 | 2020-06-19 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN211240263U (en) * | 2019-12-11 | 2020-08-11 | 武汉精立电子技术有限公司 | Rigid-flex board and electronic equipment comprising same |
-
2020
- 2020-09-14 CN CN202010961001.8A patent/CN112074078A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170139162A1 (en) * | 2015-11-16 | 2017-05-18 | Electronics And Telecommunications Research Institute | Multi-channel receiver optical sub-assembly and manufacturing method thereof |
| US20190364184A1 (en) * | 2016-12-23 | 2019-11-28 | Ningbo Sunny Opotech Co., Ltd. | Camera module, circuit board assembly and manufacturing method thereof, and electronic device with camera module |
| CN106961799A (en) * | 2017-04-28 | 2017-07-18 | 无锡市同步电子科技有限公司 | A kind of high speed Rigid Flex method for designing |
| CN107896418A (en) * | 2017-10-10 | 2018-04-10 | 青岛海信宽带多媒体技术有限公司 | A kind of optical module |
| CN109757022A (en) * | 2017-11-01 | 2019-05-14 | 健鼎（无锡）电子有限公司 | Flexible-rigid compound circuit board and its manufacturing method |
| CN108494495A (en) * | 2018-05-07 | 2018-09-04 | 深圳市迅特通信技术有限公司 | A kind of miniaturization hot plug high speed optical receiver module |
| CN209731254U (en) * | 2019-05-29 | 2019-12-03 | 广东瑞谷光网通信股份有限公司 | A kind of multichannel QSFP DD optical module |
| CN211240263U (en) * | 2019-12-11 | 2020-08-11 | 武汉精立电子技术有限公司 | Rigid-flex board and electronic equipment comprising same |
| CN111308620A (en) * | 2020-03-20 | 2020-06-19 | 青岛海信宽带多媒体技术有限公司 | Optical module |
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| PB01 | Publication | ||
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Application publication date: 20201211 |