CN109757022A - Flexible-rigid compound circuit board and its manufacturing method - Google Patents
Flexible-rigid compound circuit board and its manufacturing method Download PDFInfo
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- CN109757022A CN109757022A CN201711057601.6A CN201711057601A CN109757022A CN 109757022 A CN109757022 A CN 109757022A CN 201711057601 A CN201711057601 A CN 201711057601A CN 109757022 A CN109757022 A CN 109757022A
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- hardboard
- flexible
- circuit board
- conductive wiring
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/058—Direct connection between two or more FPCs or between flexible parts of rigid PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present invention discloses a kind of flexible-rigid compound circuit board and its manufacturing method, which includes the first hardboard, the second hardboard, soft board and the first conductive wiring layer.First hardboard has the first side wall.Second hardboard has second sidewall.Soft board is configured between the first hardboard and the second hardboard.Soft board has opposite sides face, and the opposite sides face connect and trims with first side and second side respectively.First conductive wiring layer is configured on the first hardboard, and is extended on soft board and the second hardboard from the first hardboard.
Description
Technical field
The present invention relates to a kind of structures and manufacturing method for manufacturing flexible-rigid compound circuit board, have more particularly to one kind curved
The flexible-rigid compound circuit board of folding area and non-bent area.
Background technique
In recent years, as scientific and technological industry is increasingly flourishing, electronic product such as notebook computer, tablet computer and intelligent hand
Machine has frequently occurred in daily life.The kenel of electronic product and use function are more and more polynary, therefore are applied to electronics
Circuit board in product also becomes key player in the related technology.In addition, in order to increase the application of circuit board, circuit board can also
According to Demand Design at multilayer circuit board, to increase its internal space for being used to configuration.Many different types of electronics members
Part, such as connector, chip or photoelectric cell can configure on multilayer circuit board according to demand, increase it and use function.With can
Printed circuit board made of flexible substrate and hardboard, also known as soft or hard complex printed-circuit board (flexible printing
Circuit board), have the advantages that light, ultra-thin, soft, deflection, big freedom shape.
Soft or hard complex printed-circuit board is widely used to notebook computer, liquid crystal display, digital camera, mobile phone and is permitted
In more consumer electronics.As information electronic product is increasingly light and short, soft or hard complex printed-circuit board often needs to bend, therefore needs
Bent area is set in flexible-rigid compound circuit board.However, two sides can be extended to by bent area by being conventionally used to the substrate of bent area
Non- bent area, the i.e. substrate material of bent area are identical as the substrate material of non-bent area, cause soft or hard complex printed-circuit board mistake
It is hard and not pliable.
Summary of the invention
Multiple embodiments according to the present invention, provide a kind of flexible-rigid compound circuit board, firmly comprising the first hardboard, second
Plate, soft board and the first conductive wiring layer.First hardboard has the first side wall.Second hardboard has second sidewall.Soft board is configured at
Between first hardboard and the second hardboard.Soft board has an opposite sides face, and the opposite sides face respectively with first side and the
Two side faces are connected and are trimmed.First conductive wiring layer is configured on the first hardboard, and soft board and are extended to from the first hardboard
On two hardboards.
In some embodiments, flexible-rigid compound circuit board also includes first line layer, the second line layer and upper caldding layer.
First line layer is configured above the first hardboard.Second line layer is configured above the second hardboard.Upper caldding layer is configured at soft
Above plate.
In some embodiments, flexible-rigid compound circuit board also includes protective layer, and protective layer is configured at the first hardboard, second
On the lower surface of hardboard and soft board.
In some embodiments, flexible-rigid compound circuit board also includes the second conductive wiring layer, and the second conductive wiring layer is matched
It is placed on the lower surface of the first hardboard, and extends to from the lower surface of the first hardboard on the lower surface of soft board and the second hardboard.
In some embodiments, soft board includes the first adhesion coating, polymeric layer and the second adhesion coating.Polymeric layer configuration
In on the first adhesion coating.Second adhesion coating is configured on polymeric layer.
In some embodiments, flexible-rigid compound circuit board also includes tertiary circuit layer, the 4th line layer and lower caldding layer.
Tertiary circuit layer is configured above the lower surface of the first hardboard.4th line layer is configured above the lower surface of the second hardboard.Under
Coating is configured above the lower surface of soft board.
In some embodiments, polymeric layer includes polyimides (polyimide) layer.
In some embodiments, the first hardboard or the second hardboard include insulation pre impregnated material (prepreg) layer.
Multiple embodiments of the invention provide the method for manufacture flexible-rigid compound circuit board.First layer is formed in substrate
On upper surface, first layer includes that first layer and one first conductive wiring layer, the first conductive wiring layer are configured on first layer,
First layer includes the first flexible material layer and the first rigid material layer, and the first flexible material layer is located in the first rigid material
Between.The second layer is formed on first layer, the second layer includes the second layering and the second conductive wiring layer, the configuration of the second conductive wiring layer
In in the second layering, first layer includes the second flexible material and the second rigid material, and the second flexible material has been located in second just
Among property material.Coating is formed on the second layer.Lower protective layer is formed on the lower surface of substrate.The first groove is formed, the
One groove runs through substrate and lower protective layer, and the side wall of the first groove and the edge of the first flexible material layer trim.
In some embodiments, the method for manufacturing flexible-rigid compound circuit board also includes to form line layer on coating.
Up-protective layer is re-formed on line layer.The second groove is formed later.Second groove runs through line layer and up-protective layer, and second
The two lateral walls of groove are aligned with the edge of the second flexible material layer.
By above-mentioned certain embodiments, the substrate in non-bent area is different from due to the composition of the substrate in bent area
Composition, flexible-rigid compound circuit board can not only promote bending quality, and can maintain the intensity of substrate.
To be clearer and more comprehensible above-mentioned and other purposes of the invention, feature and advantage, preferred embodiment is cited below particularly out,
And detailed description are as follows for the attached drawing appended by cooperating.
Detailed description of the invention
Fig. 1 is the diagrammatic cross-section of the flexible-rigid compound circuit board of certain embodiments；
Fig. 2 is the diagrammatic cross-section of the flexible-rigid compound circuit board of certain embodiments；
Fig. 3 is the flow chart of the manufacturing method of the flexible-rigid compound circuit board of certain embodiments；
Fig. 4~Fig. 8, Fig. 9 A~Fig. 9 B and Figure 10 A~Figure 10 B are certain embodiments for manufacturing soft-hard composite circuit
One diagrammatic cross-section in the various stages of plate.
Symbol description
100,200 flexible-rigid compound circuit board
110,210,410 substrate
112,113,212,213 hardboard
114,214 soft board
1141,1143,2141,2143 adhesion coating
1142,2142 polymeric layer
120,130,220,230 conductive wiring layer
140,150,240,250,270,280 line layer
141,143,145,151,153,155 dielectric layer
142,144,146,152,154,156 conductive wiring layer
170 upper caldding layers
172,174 sub- coating
1742 adhesion coatings
1744 polymeric layers
180 lower caldding layers
182,184 sub- coating
1842 adhesion coatings
1844 polymeric layers
240,250,270,280 line layer
241,243,245,251,253,255 dielectric layer
242,244,246,252,254,256 conductive wiring layer
260 upper caldding layers
262,264 sub- coating
2642,2942 adhesion coating
2644,2944 polymeric layer
271,273,275,281,283,285 dielectric layer
272,274,276,282,284,286 conductive wiring layer
290 lower caldding layers
292,294 sub- coating
30 methods
S31, S32, S33, S34, S35 step
402,406 non-bent area
404 bent areas
412 dielectric layers
414,416 conductive wiring layer
420 flexible material layers
422 polymeric layers
424 adhesion coatings
510 dielectric layers
520 conductive wiring layers
610 soft boards
614,616 adhesion coating
612 polymeric layers
710 hardboards
720 conductive wiring layers
810 coatings
812 adhesion coatings
814 polymeric layers
910 line layers
912 dielectric layers
914 conductive wiring layers
920,930 protective layer
1010 dielectric layers
1020 conductive wiring layers
1030,1040,1050 line layer
1032,1042,1052 dielectric layer
1034,1044,1054 conductive wiring layer
1060,1070 protective layer
R1、R2、R3Groove
Specific embodiment
The manufacture and use of the present embodiment discussed more fully below, it should be appreciated, however, that the present invention provides the innovation of practice
Concept, wherein can be presented with wide variety of specific content.Hereinafter described embodiment or embodiment is only to illustrate, not
It can limit the scope of the invention.
Although can be used in the content of present invention " first ", the terms such as " second " come describe various elements, region, layer and/
Or part, but these terms should not limit these elements, region, layer and/or part.These terms are used only to will be a certain
Element, region, layer and/or part are different from another region, layer and/or part.Therefore, the content of present invention is not being departed from
In the case of, first element described below, region, layer or part can be described as second element, region, layer or part.
In addition, term used herein is only and to be not intended to limit the present invention for for the purpose of describing particular embodiments
Content.For example used in the description, unless in addition clearly dictate otherwise herein, otherwise singular " one " and " described "
Form including plural (plurality).
The content of present invention provides a kind of flexible-rigid compound circuit board and its manufacturing method.This flexible-rigid compound circuit board has bending
Area and non-bent area.Include soft board in flexible-rigid compound circuit board bent area, and includes hardboard in non-bent area.Therefore soft or hard compound
Circuit board can not only promote bending quality, and can maintain the intensity of substrate.
Fig. 1 is the flexible-rigid compound circuit board diagrammatic cross-section according to the content of present invention certain embodiments.In various implementations
In mode, as shown in Figure 1, in some embodiments, flexible-rigid compound circuit board 100 includes substrate 110 and conductive wiring layer
120.Conductive wiring layer 120 is configured on the upper surface of substrate 110.Substrate 110 includes hardboard 112, hardboard 113 and soft board 114.
Hardboard 112 and hardboard 113 are respectively arranged at the two sides of soft board 114.In certain embodiments, dielectric layer 112 includes insulation preimpregnation
Stain material (prepreg) layer.For example, the composition of prepreg layer of insulating includes glass fibre not fabric material and asphalt mixtures modified by epoxy resin
Rouge.In certain embodiments, soft board 114 includes adhesion coating 1141, polymeric layer 1142 and adhesion coating 1143.Polymeric layer 1142
It is configured on adhesion coating 1141.Adhesion coating 1143 is configured on polymeric layer 1142.
Since substrate 110 includes hardboard 112, hardboard 113 and soft board 114, and soft board 114 is configured in bent area.Therefore
Flexible-rigid compound circuit board 100 can not only promote bending quality, and will not sacrificial substrate 110 intensity.
Flexible-rigid compound circuit board 100 also comprising conductive wiring layer 130, line layer 140 and 150, upper caldding layer 170 and under cover
Cap rock 180.Conductive wiring layer 130 is configured on the lower surface of substrate 110.Line layer 140 and 150 is respectively arranged at non-bent area
On 102 and 106 conductive wiring layer 120.Line layer 140 includes dielectric layer 141, dielectric layer 143, dielectric layer 145, conducting wiring
Layer 142, conductive wiring layer 144 and conductive wiring layer 146.Line layer 150 includes dielectric layer 151, dielectric layer 153, dielectric layer
155, conductive wiring layer 152, conductive wiring layer 154 and conductive wiring layer 156.Having usually intellectual in the technical field should manage
Solution, line layer 140 and 150 is only illustrative, actually can increase and decrease the dielectric for including in line layer 140 and 150 according to design requirement
Layer and conductive wiring layer.Upper caldding layer 170 includes sub- coating 172 and 174.Sub- coating 172 be configured at line layer 140 and
On 150.Sub- coating 174 is configured on the conductive wiring layer 120 of 114 top of soft board.Sub- coating 174 includes adhesion coating 1742
And polymeric layer 1744, polymeric layer 1744 are configured on adhesion coating 1742.Lower caldding layer 180 is configured at conductive wiring layer 130
On.Lower caldding layer 180 includes sub- coating 182 and 184.Sub- coating 182 is configured at 113 top of corresponding hardboard 112 and hardboard
Conductive wiring layer 130 on, sub- coating 184 is configured on the conductive wiring layer 130 above corresponding 114 lower surface of soft board.Son
Coating 184 includes adhesion coating 1842 and polymeric layer 1844.Polymeric layer 1844 is configured on adhesion coating 1842.
In certain embodiments, flexible-rigid compound circuit board 100 can not include conductive wiring layer 130, the formation of lower caldding layer 180
In on the lower surface of substrate 110, to form the flexible-rigid compound circuit board of single side.
Fig. 2 is the flexible-rigid compound circuit board diagrammatic cross-section according to the content of present invention certain embodiments.In certain implementations
In mode, as shown in Fig. 2, in some embodiments, flexible-rigid compound circuit board 200 includes substrate 210 and conductive wiring layer
220.Conductive wiring layer 220 is configured on the upper surface of substrate 210.Substrate 210 includes hardboard 212, hardboard 213 and soft board 214.
Hardboard 212 and hardboard 213 are respectively arranged at the two sides of soft board 214.In certain embodiments, hardboard 212 and hardboard 213 include exhausted
Edge pre impregnated material (prepreg) layer.For example, insulate prepreg layer composition include glass fibre not fabric material and
Epoxy resin.In certain embodiments, soft board 214 includes adhesion layer 2141, polymeric layer 2142 and adhesion coating 2143.Polymer
Layer 2142 is configured on adhesion coating 2141.Adhesion coating 2143 is configured on polymeric layer 2142.
Flexible-rigid compound circuit board 200 also includes conductive wiring layer 230, line layer 240, line layer 250, line layer 270, line
Road floor 280, upper caldding layer 260 and lower caldding layer 290.Conductive wiring layer 230 is configured on the lower surface of substrate 210.Line layer
240 and 250 are respectively arranged on the conductive wiring layer 220 of 213 top of corresponding hardboard 212 and hardboard.Line layer 270 and 280 points
It is not configured on the conductive wiring layer 230 above 213 lower surface of corresponding hardboard 212 and hardboard.Line layer 240 includes dielectric layer
241, dielectric layer 243, dielectric layer 245, conductive wiring layer 242, conductive wiring layer 244 and conductive wiring layer 246.Line layer 250
Include dielectric layer 251, dielectric layer 253, dielectric layer 255, conductive wiring layer 252, conductive wiring layer 254 and conductive wiring layer 256.
Line layer 270 includes dielectric layer 271, dielectric layer 273, dielectric layer 275, conductive wiring layer 272, conductive wiring layer 274 and conduction
Wiring layer 276.Line layer 280 includes dielectric layer 281, dielectric layer 283, dielectric layer 285, conductive wiring layer 282, conductive wiring layer
284 and conductive wiring layer 286.Having usually intellectual in the technical field should be understood that line layer 240,250,270 and 280 only
To be illustrative, actually the dielectric layer and conducting wiring for including in line layer 240,250,270 and 280 can be increased and decreased according to design requirement
Layer.Upper caldding layer 260 includes sub- coating 262 and 264.Sub- coating 262 is configured on line layer 240 and 250.Sub- coating
264 are configured on the conductive wiring layer 220 of 214 top of soft board.Sub- coating 264 includes adhesion coating 2642 and polymeric layer
2644, polymeric layer 2644 is configured on adhesion coating 2642.Lower caldding layer 290 includes sub- coating 292 and 294.Sub- coating
292 are configured on line layer 270 and 280.Sub- coating 294 is configured at the conductive wiring layer 230 of the top of 214 lower surface of soft board
On.Sub- coating 294 includes adhesion coating 2942 and polymeric layer 2944.
The structure of flexible-rigid compound circuit board 200 is similar with flexible-rigid compound circuit board 100, and duplicate material properties is no longer superfluous
It states.Compared to flexible-rigid compound circuit board 100, flexible-rigid compound circuit board 200 also includes line layer 270 and 280.Line layer 270 and
280 are configured between conductive wiring layer 230 and sub- coating 292, and are respectively corresponding to the lower surface of hardboard 112 and hardboard 113
Top.
Fig. 3 is the flow chart according to the manufacturing method 30 of the flexible-rigid compound circuit board of certain embodiments.As shown in Figure 1,
Method 30 includes step S31, step S32, step S33, step S34 and step S35.It is understood that can be in method 30
Before, during or after additional step is provided, and certain following steps can be substituted or delete, as manufacturing method
Additional embodiments.
The manufacture that Fig. 4~Fig. 8, Fig. 9 A~Fig. 9 B and Figure 10 A~Figure 10 B are painted certain embodiments according to the present invention is soft or hard
The diagrammatic cross-section in each manufacture craft stage of composite circuit board.Referring to figure 3. and Fig. 4~Fig. 5, method 30 start from step
S31 forms first layer on the upper surface of substrate.In some embodiments, as shown in figure 4, substrate 410 includes dielectric layer
412, conductive wiring layer 414 and conductive wiring layer 416, line layer 414 and line layer 416 be respectively arranged at dielectric layer 412 it is upper,
On lower surface.Substrate 410 is divided into preset non-bent area 402, bent area 404 and non-bent area 406.Bent area 404
Between non-bent area 402 and non-bent area 406.Flexible material layer 420 is formed on the bent area 404 of substrate 410.Soft material
Material 420 includes polymeric layer 422 and adhesion coating 424.In certain embodiments, dielectric layer 412 includes polyester (PET) layer, poly- Asia
Amide (PI) layer, hydrocyanic ester (Cyanate), glass fiber resin, bismaleimide (Bismaleimide) resin, BT
The mixed material layer of resin (Bismaleimide Triazine Resin) or blending epoxy and glass fibre.It is real one
It applies in example, polymeric layer 422 includes polyimide (PI) layer, and adhesion coating 424 includes acrylate resin layer or epoxy resin layer.?
In another embodiment, covering glue film (Coverlay) can be used to be used as flexible material layer 420.In another embodiment, formation is led
The material of electrical wiring layer 414 and 416 includes calendering copper or cathode copper.
As shown in figure 5, providing dielectric layer 510 and conductive wiring layer 520.The position of dielectric layer 510 is corresponding to substrate 410
Non- bent area 402 and 406.Conductive wiring layer 520 is configured on flexible material layer 420 and dielectric layer 510.Later to substrate 410,
Flexible material layer 420, dielectric layer 510 and conductive wiring layer 520 carry out pressing manufacture craft.In one embodiment, dielectric layer 510
Include pre impregnated material (prepreg) layer that insulate.For example, insulate prepreg layer composition include glass fibre do not knit
Material and epoxy resin.
It is any to form flexible material layer 420, dielectric layer 510 and conductive wiring layer 520 the above is only illustrative explanation
Step all can be used as the content of present invention alternative embodiment.In another embodiment, dielectric layer 510 can be initially formed in substrate
On 410, flexible material layer 420 is re-formed, conductive wiring layer 520 is finally provided and carries out pressing manufacture craft.
Referring to figure 3. and Fig. 6~Fig. 7, method 30 are carried out to step S32, form the second layer on first layer.In certain realities
It applies in mode, as shown in fig. 6, soft board 610 is formed on conductive wiring layer 520, and corresponding to the bent area of substrate 410 404
Top.Soft board 610 includes adhesion coating 614, polymeric layer 612 and adhesion coating 616.In one embodiment, include for 612 layers of polymer
Polyimide (PI) layer, and adhesion coating 614.616 includes acrylate resin layer or epoxy resin layer.In another embodiment, may be used
Use covering glue film (Coverlay) substitution adhesion coating 614 and polymeric layer 612.In another embodiment, rubber cover can be used
Substitute polymeric layer 612 and adhesion coating 616.
As shown in fig. 7, providing hardboard 710 and conductive wiring layer 720.The position correspondence of hardboard 710 is non-curved to substrate 410
Folding area 402 and 406 tops.Conductive wiring layer 720 is configured on soft board 610 and hardboard 710.Later to soft board 610, hardboard 710
And conductive wiring layer 720 carries out pressing manufacture craft.In one embodiment, hardboard 710 includes insulation pre impregnated material
(prepreg) layer.For example, the composition of prepreg layer of insulating includes glass fibre not fabric material and epoxy resin.?
In another embodiment, the material for forming conductive wiring layer 720 includes calendering copper or cathode copper.
Referring to figure 3. and Fig. 8, method 30 are carried out to step S33, form coating on the second layer.In certain embodiment party
In formula, as shown in figure 8, forming coating 810 on conductive wiring layer 720, and correspond to 404 top of bent area of substrate 410.
In one embodiment, coating 810 includes adhesion coating 812 and polymeric layer 814.For example, include poly- Asia for 814 layers of polymer
Amide (PI) layer, and adhesion coating 812 includes acrylic resin or epoxy resin.In another embodiment, coating 810 is covering
Glue film.In another embodiment, coating 810 is soft soldermask layer.
Referring to figure 3. and Fig. 9 A, method 30 are carried out to step S34, form lower protective layer on the lower surface of substrate.At certain
In a little embodiments, as shown in Figure 9 A, protective layer 920 is formed in above the lower surface of substrate 410.In one embodiment, in shape
Before protective layer 920, line layer 910 can be initially formed above the lower surface of substrate 410.Line layer 910 includes dielectric layer 912
And conductive wiring layer 914.It is formed after line layer 910, protective layer 920 is formed on line layer 910.Have in the technical field
Usual skill should be understood that line layer 910 is only illustrative, and the line layer of more layers can be actually configured according to design requirement.?
In another embodiment, protective layer 920 directly contacts the lower surface of substrate 410.In another embodiment, protective layer can be re-formed
930 correspond to non-bent area 402 and 404 in the position on conductive wiring layer 720, forming protective layer 930.
Referring to figure 3. and Fig. 9 B, method 30 are carried out to step S35, form groove.In some embodiments, such as Fig. 9 B
It is shown, form recess R1Through protective layer 920, line layer 910 and substrate 410.Recess R1Position it is corresponding curved to substrate 410
The lower section of folding area 404.In certain embodiments, there are not All other routes layer, therefore groove between protective layer 920 and substrate 410
R1Only run through protective layer 920 and substrate 410.
Figure 10 A~Figure 10 B hookup 8, and Figure 10 A~Figure 10 B is the alternate embodiments of Fig. 9 A~Fig. 9 B.Please refer to figure
3 and Figure 10 A, method 30 are carried out to step S34, form lower protective layer on the lower surface of substrate.In some embodiments, such as
Shown in Figure 10 A, protective layer 1060 is formed in above the lower surface of substrate 410.In one embodiment, formed protective layer 920 it
Before, line layer 1040 can be initially formed above the lower surface of substrate 410.Line layer 1040 includes dielectric layer 1042 and conducting wiring
Layer 1044.It is formed after line layer 1040, protective layer 1060 is formed on line layer 1040.Have in the technical field and usually knows
The knowledgeable should be understood that line layer 1040 is only illustrative, and the line layer of more layers can be actually configured according to design requirement.In another reality
It applies in example, protective layer 1060 directly contacts the lower surface of substrate 410.
Compared to the embodiment that Fig. 9 A is painted, in the embodiment that Figure 10 A is painted, it is further formed 1010 dielectric layers
In on conductive wiring layer 720, and the corresponding top to the non-bent area 402 and 406 of substrate 410 in position of 1010 dielectric layers.It
Conductive wiring layer 1020 is formed afterwards on 1010 dielectric layers and coating 810.Line layer appropriate be can be selectively formed in leading
On electrical wiring layer 1020, such as line layer 1030 and 1050 is formed on conductive wiring layer 1020.Line layer 1030 includes dielectric
Layer 1032 and conductive wiring layer 1034.Line layer 1050 includes dielectric layer 1052 and conductive wiring layer 1054.In the technical field
Tool usually intellectual should be understood that line layer 1030 and 1050 is only illustrative, can actually be configured according to design requirement it is less or
The line layer of more layers.After forming line layer 1050, coating 1070 is formed on line layer 1050.
Referring to figure 3. and Figure 10 B, method 30 are carried out to step S35, form groove.In some embodiments, as schemed
Shown in 10B, recess R is formed2And R3.Recess R2Through coating 1070, line layer 1050, line layer 1030 and conductive wiring layer
1020.Recess R2The corresponding top to the bent area of substrate 410 404 in position.Form recess R3Through protective layer 1060, route
Layer 1040 and substrate 410.Recess R3The corresponding lower section to the bent area of substrate 410 404 in position.
In conclusion the certain embodiments that the content of present invention provides can promote bending quality, and the strong of substrate can be maintained
Degree.It should be understood that and not all advantage will discuss that all embodiments or embodiment do not need specific herein
The advantages of, and other embodiments or embodiment can provide different advantages.
The feature structure of several embodiments of above-outlined, so that those skilled in the art is better understood state of the invention
Sample.Those skilled in the art it will be appreciated that can use the present invention as the base for designing or modifying other manufacture crafts and structure easily
Plinth, to implement the identical purpose of embodiments described herein and/or to realize identical advantage.Those skilled in the art should also recognize
Know, such equivalent structure can not depart from spirit and scope of the invention without departing from spirit and scope of the invention
In the case of make to various change of the invention, substitution and change.
Claims (10)
1. a kind of flexible-rigid compound circuit board, includes:
First hardboard has the first side wall；
Second hardboard has second sidewall；
Soft board is configured between first hardboard and second hardboard, which has opposite sides face, and the opposite sides
Face connect and trims with the first side and second side respectively；And
First conductive wiring layer is configured on first hardboard, and extends to from first hardboard soft board and this is second hard
On plate.
2. flexible-rigid compound circuit board as described in claim 1, also includes:
First line layer is configured above first hardboard；
Second line layer is configured above second hardboard；And
Upper caldding layer is configured above the soft board.
3. flexible-rigid compound circuit board as claimed in claim 2 includes also protective layer, is configured at first hardboard, the second hardboard
And on the lower surface of the soft board.
4. flexible-rigid compound circuit board as claimed in claim 2 includes also the second conductive wiring layer, is configured at first hardboard
Lower surface on, and extend to from the lower surface of first hardboard on the lower surface of the soft board and second hardboard.
5. flexible-rigid compound circuit board as described in claim 3 or 4, wherein the soft board includes:
First adhesion coating；
Polymeric layer is configured on first adhesion coating；And
Second adhesion coating is configured on the polymeric layer.
6. flexible-rigid compound circuit board as claimed in claim 4, also includes:
Tertiary circuit layer is configured above the lower surface of first hardboard；
4th line layer is configured above the lower surface of second hardboard；And
Lower caldding layer is configured above the lower surface of the soft board.
7. flexible-rigid compound circuit board as claimed in claim 5, wherein the polymeric layer includes polyimides (polyimide)
Layer.
8. flexible-rigid compound circuit board as described in claim 1, wherein first hardboard or second hardboard include insulation preimpregnation
Stain material (prepreg) layer.
9. a kind of method for manufacturing flexible-rigid compound circuit board, includes:
A first layer is formed on a upper surface of a substrate, which includes first layer and the first conductive wiring layer, is somebody's turn to do
First conductive wiring layer is configured on the first layer, which includes the first flexible material layer and the first rigid material
Layer, the first flexible material layer are located among first rigid material；
A second layer is formed on the first layer, which includes the second layering and the second conductive wiring layer, second conduction
Wiring layer is configured in second layering, which includes the second flexible material and the second rigid material, this is second soft
Material clip is set among second rigid material；
A coating is formed on the second layer；
A lower protective layer is formed on a lower surface of the substrate；And
Form one first groove, which runs through the substrate and the lower protective layer, and the side wall of first groove and this
The edge of one flexible material layer trims.
10. method as claimed in claim 9, also includes:
A line layer is formed on the coating；
A up-protective layer is formed on the line layer；And
Form one second groove, second groove run through the line layer and the up-protective layer, and the side wall of second groove with should
The edge of second flexible material layer trims.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111374198.6A CN114025470B (en) | 2017-11-01 | 2017-11-01 | Soft-hard composite circuit board and manufacturing method thereof |
| CN201711057601.6A CN109757022A (en) | 2017-11-01 | 2017-11-01 | Flexible-rigid compound circuit board and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711057601.6A CN109757022A (en) | 2017-11-01 | 2017-11-01 | Flexible-rigid compound circuit board and its manufacturing method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112074078A (en) * | 2020-09-14 | 2020-12-11 | 福建中科光芯光电科技有限公司 | Rigid-flexible circuit board for 200G light receiving device |
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|---|---|---|---|---|
| DE4208610C1 (en) * | 1992-03-18 | 1993-05-19 | Fa. Carl Freudenberg, 6940 Weinheim, De | Rigid-flexible PCB with flexible circuit foil mfg. - having flexible PCB in flexible region with fracture lines in rigid outer layers along rigid-flexible transition allowing rigid part to be removed along fracture lines after processing |
| JPH08288655A (en) * | 1995-04-18 | 1996-11-01 | Nippon Avionics Co Ltd | Manufacture of flex rigid printed wiring board |
| CN101310574A (en) * | 2006-10-24 | 2008-11-19 | 揖斐电株式会社 | Rigid and flexible circuit board and production method therefor |
| CN103327738A (en) * | 2012-03-22 | 2013-09-25 | 富葵精密组件(深圳)有限公司 | Softness-hardness combined circuit board and manufacturing method thereof |
| CN105828523A (en) * | 2015-01-10 | 2016-08-03 | 富葵精密组件(深圳)有限公司 | Rigid-flex combined circuit board and manufacturing method thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007250884A (en) * | 2006-03-16 | 2007-09-27 | Shirai Denshi Kogyo Kk | Flexible printed circuit board and its manufacturing method |
| JP2008166300A (en) * | 2006-12-26 | 2008-07-17 | Sharp Corp | Flexible rigid multilayer printed wiring board, manufacturing method thereof, and electronic apparatus |
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2017
- 2017-11-01 CN CN202111374198.6A patent/CN114025470B/en active Active
- 2017-11-01 CN CN201711057601.6A patent/CN109757022A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4208610C1 (en) * | 1992-03-18 | 1993-05-19 | Fa. Carl Freudenberg, 6940 Weinheim, De | Rigid-flexible PCB with flexible circuit foil mfg. - having flexible PCB in flexible region with fracture lines in rigid outer layers along rigid-flexible transition allowing rigid part to be removed along fracture lines after processing |
| JPH08288655A (en) * | 1995-04-18 | 1996-11-01 | Nippon Avionics Co Ltd | Manufacture of flex rigid printed wiring board |
| CN101310574A (en) * | 2006-10-24 | 2008-11-19 | 揖斐电株式会社 | Rigid and flexible circuit board and production method therefor |
| CN103327738A (en) * | 2012-03-22 | 2013-09-25 | 富葵精密组件(深圳)有限公司 | Softness-hardness combined circuit board and manufacturing method thereof |
| CN105828523A (en) * | 2015-01-10 | 2016-08-03 | 富葵精密组件(深圳)有限公司 | Rigid-flex combined circuit board and manufacturing method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112074078A (en) * | 2020-09-14 | 2020-12-11 | 福建中科光芯光电科技有限公司 | Rigid-flexible circuit board for 200G light receiving device |
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| CN114025470A (en) | 2022-02-08 |
| CN114025470B (en) | 2024-05-10 |
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Application publication date: 20190514 |