CN102006720A - PCB (Printed Circuit Board) - Google Patents
PCB (Printed Circuit Board) Download PDFInfo
- Publication number
- CN102006720A CN102006720A CN2010105690999A CN201010569099A CN102006720A CN 102006720 A CN102006720 A CN 102006720A CN 2010105690999 A CN2010105690999 A CN 2010105690999A CN 201010569099 A CN201010569099 A CN 201010569099A CN 102006720 A CN102006720 A CN 102006720A
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- CN
- China
- Prior art keywords
- printed circuit
- circuit board
- substrate
- opening
- tinsel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The invention provides a PCB (Printed Circuit Board) for a backlight module, comprising a substrate, a first copper foil, a first soldering-resistance paint layer and a solder layer. The substrate is provided with a first opening, the first metal foil is arranged on the upper surface of the substrate and provided with a through hole aligned with the first opening, the first solder paint layer covers the first metal foil and is provided with a second opening for exposing the through hole and the surface around the through hole of the first metal foil, and the solder layer is arranged on the first metal foil and fills the through hole, the first opening and the second opening. The PCB of the invention can be adopted to enhance the bonding strength between the first metal foil and the substrate so as to improve the tensile strength between wires and the PCB.
Description
Technical field
The present invention relates to a kind of printed circuit board, relate in particular to a kind of printed circuit board that is applied in the module backlight, can promote the tensile strength between tinsel and the substrate.
Background technology
(Printed circuit board PCB) almost can appear in the middle of each electronic equipment printed circuit board.And the processing and manufacturing process of PCB also has a quite complicated flow process, and the Control Parameter and the technology that relate to are a lot.Main body is used certain resin, generally just habitually this copper-clad plate is called certain resin type copper-clad plate.The substrate of present modal used for printed circuit board resin forms through hot pressing coated with tinsel at the one or both sides of substrate.The material of substrate has: phenolic resins, epoxy resin (EP), polyimide resin (PI), mylar (PE), polyphenylene oxide resin (PP () or PPE), cyanate ester resin (CE), polyflon (PTFE), bismaleimide-triazine resin (BT) etc.The material of substrate also can be selected the resin that has added flame-retardant composition for use.
Current, the bond strength of tinsel and substrate is related to the yield that carries out subsequent technique on printed circuit board in the printed circuit board.And mainly combine by hot pressing between tinsel and the substrate, when peeling off test, especially be when adopting the resin of flame-retardant composition to be material at substrate, Chang Wufa is by test, tinsel and substrate are easily peeled off, thereby influence the tensile strength between the wire rod and printed circuit board in the subsequent technique.
In view of this, how designing a kind of novel printed circuit board, increasing the bond strength between tinsel and the substrate as much as possible, and then promote tensile strength between wire rod and the printed circuit board, is the problem that those skilled in the art need solution badly.
Summary of the invention
The defective that exists that combines between wire rod in the prior art and the printed circuit board the invention provides a kind of printed circuit board.
According to the present invention, a kind of printed circuit board is provided, comprise substrate, first tinsel, first welding resistance enamelled coating and the soldering-tin layer.Wherein, substrate has first opening, and first tinsel is positioned on the upper surface of substrate, and first tinsel has through hole, through-hole alignment first opening; The first welding resistance enamelled coating covers first tinsel; The first welding resistance enamelled coating has second opening and exposes the first tinsel surface around through hole and the through hole; Soldering-tin layer is positioned on first tinsel and fills up through hole, first opening and second opening.
Preferably, printed circuit board comprises second tinsel and is positioned on the lower surface of substrate.
Preferably, printed circuit board comprises the second welding resistance enamelled coating and covers second tinsel.
Preferably, first tinsel of printed circuit board is a copper foil.
Preferably, second tinsel of printed circuit board is a copper foil.
Preferably, the soldering-tin layer of printed circuit board electrically connects first tinsel and the wire rod that is arranged on the printed circuit board.
Preferably, first opening connects substrate.
Preferably, the material of substrate is glass fibre, epoxy resin, soft epoxy-glass cloth.
Adopt printed circuit board of the present invention, can increase the bond strength of tinsel and substrate, thereby promote the tensile strength between wire rod and the printed circuit board.
Description of drawings
The reader will become apparent various aspects of the present invention after the reference accompanying drawing has been read the specific embodiment of the present invention.Wherein,
Fig. 1 shows the structural representation of printed circuit board in the prior art;
Fig. 2 shows according to the present invention, the structural representation of printed circuit board;
Embodiment
With reference to the accompanying drawings, the specific embodiment of the present invention is described in further detail.
Fig. 1 shows the structural representation of printed circuit board in the prior art.With reference to Fig. 1, printed circuit board comprises: substrate 10, first copper foil 11, second copper foil 12, the first welding resistance enamelled coating 13, the second welding resistance enamelled coating 14 and weldering enamelled coating 15.The material of substrate is the resin of anti-combustion of flame resistant material rank FR-4, the meaning of FR-4 representative is a resin material must can be from a kind of material specification of horizontal blanking through fired state, it is not a kind of title material, but a kind of material rate, the material majority that reaches the FR-4 grade at present all is that the epoxy resin with so-called four functions (Tera-Function) adds the composite material that filler (Filler) and glass fibre are made.
But, tensile strength between wire rod and printed circuit board first copper foil 11 depends primarily on the bond strength between first copper foil 11 and the substrate 10, owing to make by hot pressing between first copper foil 11 and the substrate 10, after substrate 10 adopts the resin of anti-the combustion, bonding force between first copper foil 11 and the substrate 10 descends, cause first tinsel 11 to be easy to peel off with substrate 10, this has also directly influenced the tensile strength between wire rod and the printed circuit board.
Fig. 2 shows the board structure schematic diagram according to printed circuit board of the present invention.With reference to Fig. 2, this structure comprises: substrate 20, first copper foil 21, second copper foil 22, the first welding resistance enamelled coating 23, the second welding resistance enamelled coating 24 and soldering-tin layer 25.
In the present embodiment, substrate 20 adopts anti-combustion grade to reach the resin of anti-combustion of FR-4, has first opening 201 on substrate 20.First opening 201 is through holes that run through substrate 20, and first opening 201 also can be a depression in other embodiments.
Be similar to Fig. 1, first copper foil 21 and second copper foil 22 lay respectively at the upper and lower surface of substrate 20, and the first welding resistance enamelled coating 23 covers first copper foil, 21, the second welding resistance enamelled coatings 24 and covers second copper foil 22.But, being that with the difference of Fig. 1 a through hole 211 is arranged on first copper foil 21, substrate 20 has one first opening 201.Through hole 211 on first copper foil 21 is corresponding with first opening, 201 positions of substrate 20.Have second opening, 231, the second openings 231 on the first welding resistance enamelled coating 23 and expose described first copper foil 21 surfaces around through hole 211 and the through hole 211.When soldering-tin layer 25 electrically connected first copper foil 21 with the wire rod that is arranged on the printed circuit board, scolding tin can fill up through hole 211, first opening 201 on the substrate 20 and second opening 231 on the first welding resistance enamelled coating 23 on first copper foil 21.When scolding tin solidifies, scolding tin between first opening 201 of the scolding tin of second opening 231 on the first welding resistance enamelled coating 23 and through hole 211 on first copper foil 21 and substrate 20 forms the structure that is similar to rivet, first copper foil 21 can be combined securely with substrate 20.Therefore, the bond strength by increasing by 20 of first copper foil 21 and substrates can promote the tensile strength between wire rod and the printed circuit board.
Advantage of the present invention is: being positioned on the copper foil of printed circuit board upper surface of base plate has a through hole, one and the corresponding opening of lead to the hole site are also arranged on the substrate of printed circuit board, when electrically connecting the copper foil of printed circuit board upper surface of base plate with scolding tin and be arranged at wire rod on the printed circuit board, scolding tin not only is covered on the copper foil of printed circuit board upper surface of base plate, also can fill up the through hole of printed circuit board upper surface of base plate copper foil and the opening on the substrate, therefore, when scolding tin solidifies, be covered on the printed circuit board upper surface of base plate copper foil scolding tin with fill in the through hole on the printed circuit board upper surface of base plate copper foil and the scolding tin of the opening on the substrate and can form the structure that is similar to rivet, can increase the copper foil of printed circuit board upper surface and the bond strength between the substrate.
In addition, do not having on the copper foil of printed circuit board upper surface under the situation of through hole, because the contact-making surface of hot pressing has only very thin one deck between the copper foil of printed circuit board upper surface and the substrate, bond strength between them is less, be arranged on the printed circuit board wire rod may along with the copper foil of soldering-tin layer and printed circuit board upper surface together with the strippable substrate of printed circuit board.Yet, a through hole is arranged on the copper foil that is positioned at the printed circuit board upper surface of base plate, also have on the substrate of printed circuit board under the situation with the corresponding opening of lead to the hole site, when electrically connecting the copper foil of printed circuit board upper surface of base plate with scolding tin and be arranged at wire rod on the printed circuit board, fill up in the process of through hole on the printed circuit board upper surface copper foil sheet and the opening on the substrate at scolding tin, the copper foil of printed circuit board upper surface and the contact-making surface between the printed circuit base board have been increased, promptly increased the adhesive surface between them, therefore, can increase the bond strength between printed circuit board upper surface copper foil sheet and the substrate equally, thereby promote the tensile strength between printed circuit board and the setting wire rod thereon.
Above, describe the specific embodiment of the present invention with reference to the accompanying drawings.But those skilled in the art can understand, and under situation without departing from the spirit and scope of the present invention, can also do various changes and replacement to the specific embodiment of the present invention.These changes and replacement all drop in claims restricted portion of the present invention.
Claims (8)
1. a printed circuit board is characterized in that, comprising:
Substrate, described substrate has first opening;
First tinsel is positioned on the upper surface of described substrate, and described first tinsel has through hole, described first opening of described through-hole alignment;
The first welding resistance enamelled coating covers described first tinsel, and the described first welding resistance enamelled coating has second opening and exposes the described first tinsel surface around described through hole and the described through hole; And
Soldering-tin layer is positioned on described first tinsel, and described soldering-tin layer fills up described through hole, described first opening and described second opening.
2. printed circuit board as claimed in claim 1 is characterized in that, described printed circuit board comprises that more second tinsel is positioned on the lower surface of described printed circuit board.
3. printed circuit board as claimed in claim 1 is characterized in that, described printed circuit board comprises that more the second welding resistance enamelled coating covers described second tinsel.
4. printed circuit board as claimed in claim 1 is characterized in that, described first tinsel is a copper foil.
5. printed circuit board as claimed in claim 1 is characterized in that, described second tinsel is a copper foil.
6. printed circuit board as claimed in claim 1 is characterized in that, described soldering-tin layer electrically connects described first tinsel and the wire rod that is arranged on the described printed circuit board.
7. printed circuit board as claimed in claim 1 is characterized in that, described first opening connects described substrate.
8. printed circuit board as claimed in claim 1 is characterized in that, the material of described substrate is glass fibre, epoxy resin or soft epoxy-glass cloth etc.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105690999A CN102006720A (en) | 2010-11-24 | 2010-11-24 | PCB (Printed Circuit Board) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105690999A CN102006720A (en) | 2010-11-24 | 2010-11-24 | PCB (Printed Circuit Board) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102006720A true CN102006720A (en) | 2011-04-06 |
Family
ID=43813674
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105690999A Pending CN102006720A (en) | 2010-11-24 | 2010-11-24 | PCB (Printed Circuit Board) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102006720A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103025089A (en) * | 2011-09-26 | 2013-04-03 | 启碁科技股份有限公司 | Housing of electronic device and manufacturing method of housing |
| CN103596382A (en) * | 2013-11-08 | 2014-02-19 | 溧阳市江大技术转移中心有限公司 | Printed circuit board |
| CN107613670A (en) * | 2017-09-26 | 2018-01-19 | 维沃移动通信有限公司 | A kind of method for manufacturing printed circuit board and printed circuit harden structure |
-
2010
- 2010-11-24 CN CN2010105690999A patent/CN102006720A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103025089A (en) * | 2011-09-26 | 2013-04-03 | 启碁科技股份有限公司 | Housing of electronic device and manufacturing method of housing |
| CN103025089B (en) * | 2011-09-26 | 2016-04-27 | 启碁科技股份有限公司 | Shell of electronic installation and preparation method thereof |
| CN103596382A (en) * | 2013-11-08 | 2014-02-19 | 溧阳市江大技术转移中心有限公司 | Printed circuit board |
| CN107613670A (en) * | 2017-09-26 | 2018-01-19 | 维沃移动通信有限公司 | A kind of method for manufacturing printed circuit board and printed circuit harden structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110406 |