TWI644600B - Rigid-flexible circuit board and method of manufacturing the same - Google Patents
Rigid-flexible circuit board and method of manufacturing the same Download PDFInfo
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Abstract
一種軟硬複合電路板,包含第一硬板、第二硬板、軟板、及第一導電佈線層。第一硬板具有第一側壁。第二硬板具有第二側壁。軟板配置於第一硬板與第二硬板之間。軟板具有相對兩側面,且所述相對兩側面分別與第一側面及第二側面連接且切齊。第一導電佈線層配置於第一硬板上,且自第一硬板上延伸至軟板及第二硬板上。 A soft and hard composite circuit board comprising a first hard board, a second hard board, a soft board, and a first conductive wiring layer. The first rigid plate has a first side wall. The second rigid plate has a second side wall. The soft board is disposed between the first hard board and the second hard board. The flexible board has opposite sides, and the opposite sides are respectively connected and aligned with the first side and the second side. The first conductive wiring layer is disposed on the first hard board and extends from the first hard board to the soft board and the second hard board.
Description
本發明係有關一種製造軟硬複合電路板的結構及製造方法,特別是關於一種具有彎折區及非彎折區的軟硬複合電路板。 The present invention relates to a structure and a manufacturing method for manufacturing a soft and hard composite circuit board, and more particularly to a soft and hard composite circuit board having a bent portion and a non-bent portion.
近年來,隨著科技產業日益發達,電子產品例如筆記型電腦、平板電腦與智慧型手機已頻繁地出現在日常生活中。電子產品的型態與使用功能越來越多元,因此應用於電子產品中的電路板也成為相關技術中的重要角色。此外,為了增加電路板的應用,電路板也可依據需求設計成多層電路板,以增加其內部用來線路佈局的空間。許多不同種類的電子元件,例如連接器、晶片或光電元件,可依據需求配置在多層電路板上,增加其使用功能。以可撓性之基板及硬板製成之印刷電路板,又稱為軟硬複合印刷電路板(flexible printing circuit board),具備質輕、超薄、柔軟、可撓曲、形狀自由度大等優點。 In recent years, with the development of the technology industry, electronic products such as notebook computers, tablet computers and smart phones have frequently appeared in daily life. The types and functions of electronic products are becoming more and more diverse, so the circuit boards used in electronic products have also become an important role in related technologies. In addition, in order to increase the application of the board, the board can also be designed as a multi-layer board according to requirements to increase the space used for wiring layout inside. Many different types of electronic components, such as connectors, wafers, or optoelectronic components, can be placed on a multi-layer circuit board as needed to increase their functionality. A printed circuit board made of a flexible substrate and a hard board, also known as a flexible printed circuit board, is light in weight, ultra-thin, soft, flexible, and has a large degree of freedom in shape. advantage.
軟硬複合印刷電路板已廣泛應用於筆記型電 腦、液晶顯示器、數位相機、手機及許多消費性電子中。隨著資訊電子產品日趨輕薄短小,軟硬複合印刷電路板常需彎折,因此需在軟硬複合電路板中設置彎折區。然而,傳統用於彎折區的基板會由彎折區延伸至兩側的非彎折區,即彎折區的基板材質與非彎折區的基板材質相同,造成軟硬複合印刷電路板過硬且不易彎折。 Soft and hard composite printed circuit boards have been widely used in notebook type Brain, liquid crystal display, digital camera, mobile phone and many consumer electronics. As information electronic products become thinner and lighter, soft and hard composite printed circuit boards often need to be bent, so it is necessary to set a bending zone in the soft and hard composite circuit board. However, the substrate used in the bending zone will extend from the bending zone to the non-bending zone on both sides, that is, the substrate material of the bending zone is the same as that of the non-bending zone, resulting in a hard and soft composite printed circuit board. It is not easy to bend.
根據本發明之多個實施方式,係提供一種軟硬複合電路板,包含第一硬板、第二硬板、軟板、及第一導電佈線層。第一硬板具有第一側壁。第二硬板具有第二側壁。軟板配置於第一硬板與第二硬板之間。軟板具有相對兩側面,且所述相對兩側面分別與第一側面及第二側面連接且切齊。第一導電佈線層配置於第一硬板上,且自第一硬板上延伸至軟板及第二硬板上。 According to various embodiments of the present invention, there is provided a soft and hard composite circuit board comprising a first hard board, a second hard board, a soft board, and a first conductive wiring layer. The first rigid plate has a first side wall. The second rigid plate has a second side wall. The soft board is disposed between the first hard board and the second hard board. The flexible board has opposite sides, and the opposite sides are respectively connected and aligned with the first side and the second side. The first conductive wiring layer is disposed on the first hard board and extends from the first hard board to the soft board and the second hard board.
在某些實施方式中,軟硬複合電路板更包含第一線路層、第二線路層、及上覆蓋層。第一線路層,配置於第一硬板上方上。第二線路層配置於第二硬板上方。上覆蓋層配置於軟板上方。 In some embodiments, the soft and hard composite circuit board further includes a first circuit layer, a second circuit layer, and an upper cover layer. The first circuit layer is disposed above the first hard board. The second circuit layer is disposed above the second hard board. The upper cover layer is disposed above the soft board.
在某些實施方式中,軟硬複合電路板更包含保護層,保護層配置於第一硬板、第二硬板及軟板的下表面上。 In some embodiments, the soft and hard composite circuit board further includes a protective layer disposed on the lower surfaces of the first hard board, the second hard board, and the soft board.
在某些實施方式中,軟硬複合電路板更包含第二導電佈線層,第二導電佈線層配置於第一硬板的下表面上,且 自第一硬板的下表面上延伸至軟板及第二硬板的下表面上。 In some embodiments, the soft and hard composite circuit board further includes a second conductive wiring layer, and the second conductive wiring layer is disposed on a lower surface of the first hard board, and Extending from the lower surface of the first rigid plate to the lower surface of the soft plate and the second hard plate.
在某些實施方式中,軟板包含第一黏著層、聚合物層、及第二黏著層。聚合物層配置於第一黏著層上。第二黏著層配置於聚合物層上。 In some embodiments, the flexible sheet comprises a first adhesive layer, a polymeric layer, and a second adhesive layer. The polymer layer is disposed on the first adhesive layer. The second adhesive layer is disposed on the polymer layer.
在某些實施方式中,軟硬複合電路板更包含第三線路層、第四線路層、及下覆蓋層。第三線路層配置於第一硬板的下表面上方。第四線路層配置於第二硬板的下表面上方。下覆蓋層配置於軟板的下表面上方。 In some embodiments, the soft and hard composite circuit board further includes a third circuit layer, a fourth circuit layer, and a lower cover layer. The third circuit layer is disposed above the lower surface of the first hard board. The fourth circuit layer is disposed above the lower surface of the second hard board. The lower cover layer is disposed above the lower surface of the soft board.
在某些實施方式中,聚合物層包含聚醯亞胺(polyimide)層。 In certain embodiments, the polymer layer comprises a polyimide layer.
在某些實施方式中,第一硬板或第二硬板包含絕緣預浸漬材料(prepreg)層。 In certain embodiments, the first hard plate or the second hard plate comprises an insulating prepreg layer.
本發明之多個實施方式,係提供製造軟硬複合電路板的方法。形成第一層於基板的上表面上,第一層包含第一分層及一第一導電佈線層,第一導電佈線層配置於第一分層上,第一分層包含第一軟性材料層及第一剛性材料層,第一軟性材料層夾設於第一剛性材料中間。形成第二層於第一層上,第二層包含第二分層及第二導電佈線層,第二導電佈線層配置於第二分層上,第一分層包含第二軟性材料及第二剛性材料,第二軟性材料夾設於第二剛性材料中間。形成覆蓋層於第二層上。形成下保護層於基板的下表面上。形成第一凹槽,第一凹槽貫穿基板及下保護層,且第一凹槽的側壁與 第一軟性材料層的邊緣切齊。 Various embodiments of the present invention provide a method of manufacturing a soft and hard composite circuit board. Forming a first layer on the upper surface of the substrate, the first layer comprises a first layer and a first conductive wiring layer, the first conductive wiring layer is disposed on the first layer, and the first layer comprises the first layer of soft material And a first layer of rigid material, the first layer of soft material being sandwiched between the first rigid materials. Forming a second layer on the first layer, the second layer includes a second layer and a second conductive wiring layer, the second conductive wiring layer is disposed on the second layer, the first layer comprises the second soft material and the second layer A rigid material, the second soft material being sandwiched between the second rigid materials. A cover layer is formed on the second layer. A lower protective layer is formed on the lower surface of the substrate. Forming a first groove, the first groove penetrating the substrate and the lower protective layer, and the sidewall of the first groove is The edges of the first layer of soft material are aligned.
在某些實施方式中,製造軟硬複合電路板的方法更包含形成線路層於覆蓋層上。再形成上保護層於線路層上。之後形成第二凹槽。第二凹槽貫穿線路層及上保護層,且第二凹槽的相對兩側壁與第二軟性材料層的邊緣對齊。 In some embodiments, the method of making a soft and hard composite circuit board further includes forming a wiring layer on the cover layer. An upper protective layer is formed on the wiring layer. A second groove is then formed. The second recess penetrates the circuit layer and the upper protective layer, and opposite sidewalls of the second recess are aligned with edges of the second layer of soft material.
藉由上述某些實施方式,由於彎折區中的基板的組成不同於非彎折區中的基板的組成,軟硬複合電路板不但可提升彎折品質,且可維持基板的強度。 With some of the above embodiments, since the composition of the substrate in the bending zone is different from the composition of the substrate in the non-bending zone, the soft and hard composite circuit board can not only improve the bending quality, but also maintain the strength of the substrate.
為使本發明之上述及其他目的、特徵和優點更明顯易懂,下文特舉出較佳實施例,並配合所附圖式詳細說明如下。 The above and other objects, features, and advantages of the present invention will become more apparent from the description of the appended claims.
100、200‧‧‧軟硬複合電路板 100,200‧‧‧soft and hard composite circuit boards
110、210、410‧‧‧基板 110, 210, 410‧‧‧ substrates
112、113、212、213‧‧‧硬板 112, 113, 212, 213‧‧‧ hard boards
114、214‧‧‧軟板 114, 214‧‧‧ soft board
1141、1143、2141、2143‧‧‧黏著層 1141, 1143, 2141, 2143‧‧‧ adhesive layer
1142、2142‧‧‧聚合物層 1142, 2142‧‧‧ polymer layer
120、130、220、230‧‧‧導電佈線層 120, 130, 220, 230‧‧‧ conductive wiring layer
140、150、240、250、270、280‧‧‧線路層 140, 150, 240, 250, 270, 280‧‧‧ circuit layers
141、143、145、151、153、155‧‧‧介電層 141, 143, 145, 151, 153, 155‧‧ dielectric layers
142、144、146、152、154、156‧‧‧導電佈線層 142, 144, 146, 152, 154, 156‧‧‧ conductive wiring layers
170‧‧‧上覆蓋層 170‧‧‧Upper cover
172、174‧‧‧子覆蓋層 172, 174‧‧ ‧ sub-coverage
1742‧‧‧黏著層 1742‧‧‧Adhesive layer
1744‧‧‧聚合物層 1744‧‧‧ polymer layer
180‧‧‧下覆蓋層 180‧‧‧Under cover
182、184‧‧‧子覆蓋層 182, 184‧ ‧ sub-coverage
1842‧‧‧黏著層 1842‧‧‧Adhesive layer
1844‧‧‧聚合物層 1844‧‧‧ polymer layer
240、250、270、280‧‧‧線路層 240, 250, 270, 280‧‧‧ circuit layers
241、243、245、251、253、255‧‧‧介電層 2411, 243, 245, 251, 253, 255‧‧ dielectric layers
242、244、246、252、254、256‧‧‧導電佈線層 242, 244, 246, 252, 254, 256‧‧‧ conductive wiring layers
260‧‧‧上覆蓋層 260‧‧‧Upper cover
262、264‧‧‧子覆蓋層 262, 264‧ ‧ sub-coverage
2642、2942‧‧‧黏著層 2642, 2942‧‧‧ adhesive layer
2644、2944‧‧‧聚合物層 2644, 2944‧‧‧ polymer layer
271、273、275、281、283、285‧‧‧介電層 271, 273, 275, 281, 283, 285‧‧ dielectric layers
272、274、276、282、284、286‧‧‧導電佈線層 272, 274, 276, 282, 284, 286‧‧‧ conductive wiring layers
290‧‧‧下覆蓋層 290‧‧‧ under cover
292、294‧‧‧子覆蓋層 292, 294‧‧ ‧ sub-coverage
30‧‧‧方法 30‧‧‧Method
S31、S32、S33、S34、S35‧‧‧步驟 S31, S32, S33, S34, S35‧‧ steps
402、406‧‧‧非彎折區 402, 406‧‧‧ non-bending area
404‧‧‧彎折區 404‧‧‧Bending area
412‧‧‧介電層 412‧‧‧ dielectric layer
414、416‧‧‧導電佈線層 414, 416‧‧‧ conductive wiring layer
420‧‧‧軟性材料層 420‧‧‧Soft material layer
422‧‧‧聚合物層 422‧‧‧ polymer layer
424‧‧‧黏著層 424‧‧‧Adhesive layer
510‧‧‧介電層 510‧‧‧ dielectric layer
520‧‧‧導電佈線層 520‧‧‧ Conductive wiring layer
610‧‧‧軟板 610‧‧‧soft board
614、616‧‧‧黏著層 614, 616‧‧‧ adhesive layer
612‧‧‧聚合物層 612‧‧‧ polymer layer
710‧‧‧硬板 710‧‧‧hard board
720‧‧‧導電佈線層 720‧‧‧conductive wiring layer
810‧‧‧覆蓋層 810‧‧‧ Coverage
812‧‧‧黏著層 812‧‧‧Adhesive layer
814‧‧‧聚合物層 814‧‧‧ polymer layer
910‧‧‧線路層 910‧‧‧Line layer
912‧‧‧介電層 912‧‧‧ dielectric layer
914‧‧‧導電佈線層 914‧‧‧ Conductive wiring layer
920、930‧‧‧保護層 920, 930‧‧ ‧ protective layer
1010‧‧‧介電層 1010‧‧‧ dielectric layer
1020‧‧‧導電佈線層 1020‧‧‧ Conductive wiring layer
1030、1040、1050‧‧‧線路層 1030, 1040, 1050‧‧‧ circuit layer
1032、1042、1052‧‧‧介電層 1032, 1042, 1052‧‧ dielectric layer
1034、1044、1054‧‧‧導電佈線層 1034, 1044, 1054‧‧‧ conductive wiring layer
1060、1070‧‧‧保護層 1060, 1070‧‧‧ protective layer
R1、R2、R3‧‧‧凹槽 R 1 , R 2 , R 3 ‧‧‧ grooves
第1圖為根據某些實施方式之軟硬複合電路板的剖面示意圖。 1 is a schematic cross-sectional view of a soft and hard composite circuit board in accordance with some embodiments.
第2圖為根據某些實施方式之軟硬複合電路板的剖面示意圖。 2 is a cross-sectional view of a soft and hard composite circuit board in accordance with some embodiments.
第3圖為根據某些實施方式之軟硬複合電路板的製造方法的流程圖。 3 is a flow chart of a method of fabricating a soft and hard composite circuit board in accordance with some embodiments.
第4-8、9A-9B及10A-10B圖為根據某些實施方式之用於製造軟硬複合電路板的各種階段之一的剖面示意圖。 4-8, 9A-9B, and 10A-10B are schematic cross-sectional views of one of various stages for fabricating a soft and hard composite circuit board in accordance with certain embodiments.
以下將詳細討論本實施例的製造與使用,然而,應瞭解到,本發明提供實務的創新概念,其中可以用廣泛的各種特定內容呈現。下文敘述的實施方式或實施例僅為說明,並不能限制本發明的範圍。 The manufacture and use of the present embodiments will be discussed in detail below, however, it should be appreciated that the present invention provides an innovative concept of practice in which a wide variety of specific content can be presented. The embodiments or examples described below are illustrative only and are not intended to limit the scope of the invention.
儘管本揭露內容中可使用“第一”、“第二”等用語來描述各種元件、區域、層以及/或部分,但是這些用語不應限制此等元件、區域、層以及/或部分。這些用語只是用來將某一元件、區域、層以及/或部分區別於另一區域、層以及/或部分。因此,在不脫離本揭露內容的情況下,下文所述的第一元件、區域、層或部分可稱為第二元件、區域、層或部分。 The terms "first", "second", and the like may be used to describe various elements, regions, layers and/or portions in the present disclosure, but such terms are not limited to such elements, regions, layers and/or portions. These terms are only used to distinguish one element, region, layer and/or portion from another region, layer and/or portion. Thus, a first element, region, layer or portion described hereinafter may be referred to as a second element, region, layer or portion, without departing from the disclosure.
此外,本文所使用的用語僅是為描述特定實施例的目的,且並非想要限制本揭露內容。譬如在說明書中所使用,除非本文另外有明確指示,否則單數形式“一”以及“所述”也包括複數(plurality)的形式。 In addition, the terminology used herein is for the purpose of describing particular embodiments, and is not intended to limit the disclosure. As used in the specification, the singular forms ""
本揭露內容提供一種軟硬複合電路板及其製造方法。此軟硬複合電路板具有彎折區及非彎折區。軟硬複合電路板彎折區中包含軟板,且非彎折區中包含硬板。因此軟硬複合電路板不但可提升彎折品質,且可維持基板的強度。 The present disclosure provides a soft and hard composite circuit board and a method of fabricating the same. The soft and hard composite circuit board has a bending zone and a non-bending zone. The soft and hard composite circuit board includes a soft board in the bending zone, and the non-bending area includes a hard board. Therefore, the soft and hard composite circuit board can not only improve the bending quality, but also maintain the strength of the substrate.
第1圖為根據本揭露內容某些實施方式之軟硬複合電路板剖面示意圖。在各種實施方式中,如第1圖所示,在某些實施方式中,軟硬複合電路板100包含基板110及導電佈線層120。導電佈線層120配置於基板110的上表 面上,並和上表面直接接觸。基板110包含硬板112、硬板113、及軟板114。硬板112、及硬板113分別配置於軟板114的兩側。在某些實施例中,硬板112包含絕緣預浸漬材料(prepreg)層。舉例來說,絕緣預浸漬材料層的組成包含玻璃纖維不織物料及環氧樹脂。在某些實施例中,軟板114包含黏著層1141、聚合物層1142及黏著層1143。聚合物層1142配置於黏著層1141上。黏著層1143配置於聚合物層1142上。 1 is a cross-sectional view of a soft and hard composite circuit board in accordance with certain embodiments of the present disclosure. In various embodiments, as shown in FIG. 1 , in some embodiments, the soft and hard composite circuit board 100 includes a substrate 110 and a conductive wiring layer 120 . The conductive wiring layer 120 is disposed on the upper surface of the substrate 110 On the face and in direct contact with the upper surface. The substrate 110 includes a hard board 112, a hard board 113, and a soft board 114. The hard board 112 and the hard board 113 are respectively disposed on both sides of the soft board 114. In certain embodiments, the hard plate 112 comprises an insulating prepreg layer. For example, the composition of the insulating prepreg layer comprises a glass fiber nonwoven material and an epoxy resin. In some embodiments, the flexible board 114 includes an adhesive layer 1141, a polymer layer 1142, and an adhesive layer 1143. The polymer layer 1142 is disposed on the adhesive layer 1141. The adhesive layer 1143 is disposed on the polymer layer 1142.
由於基板110包含硬板112、硬板113、及軟板114,且軟板114配置於彎折區中。因此軟硬複合電路板100不但可提升彎折品質,且不會犧牲基板110的強度。 Since the substrate 110 includes the hard board 112, the hard board 113, and the soft board 114, the soft board 114 is disposed in the bending area. Therefore, the soft and hard composite circuit board 100 can not only improve the bending quality, but also does not sacrifice the strength of the substrate 110.
軟硬複合電路板100更包含導電佈線層130、線路層140及150、上覆蓋層170、及下覆蓋層180。導電佈線層130配置於基板110的下表面上,並和下表面直接接觸。線路層140及150分別配置於非彎折區的導電佈線層120上。線路層140包含介電層141、介電層143、介電層145、導電佈線層142、導電佈線層144、及導電佈線層146。線路層150包含介電層151、介電層153、介電層155、導電佈線層152、導電佈線層154、及導電佈線層156。該技術領域中具有通常知識者應理解,線路層140及150僅為例示性,實際上可依設計需求增減線路層140及150中包含的介電層及導電佈線層。上覆蓋層170包含子覆蓋層172及 174。子覆蓋層172配置於線路層140及150上。子覆蓋層174配置於軟板114上方的導電佈線層120上。子覆蓋層174包含黏著層1742及聚合物層1744,聚合物層1744配置於黏著層1742上。下覆蓋層180配置於導電佈線層130上。下覆蓋層180包含子覆蓋層182及184。子覆蓋層182配置於對應硬板112、及硬板113上方的導電佈線層130上,子覆蓋層184配置於對應軟板114下表面上方的導電佈線層130上。子覆蓋層184包含黏著層1842及聚合物層1844。聚合物層1844配置於黏著層1842上。 The soft and hard composite circuit board 100 further includes a conductive wiring layer 130, circuit layers 140 and 150, an upper cladding layer 170, and a lower cladding layer 180. The conductive wiring layer 130 is disposed on the lower surface of the substrate 110 and is in direct contact with the lower surface. The circuit layers 140 and 150 are respectively disposed on the conductive wiring layer 120 of the non-bending region. The wiring layer 140 includes a dielectric layer 141, a dielectric layer 143, a dielectric layer 145, a conductive wiring layer 142, a conductive wiring layer 144, and a conductive wiring layer 146. The wiring layer 150 includes a dielectric layer 151, a dielectric layer 153, a dielectric layer 155, a conductive wiring layer 152, a conductive wiring layer 154, and a conductive wiring layer 156. It should be understood by those of ordinary skill in the art that the circuit layers 140 and 150 are merely exemplary, and the dielectric layers and conductive wiring layers included in the circuit layers 140 and 150 may actually be increased or decreased according to design requirements. The upper cover layer 170 includes a sub-cover layer 172 and 174. The sub-cover layer 172 is disposed on the circuit layers 140 and 150. The sub-cladding layer 174 is disposed on the conductive wiring layer 120 over the flexible board 114. The sub-cladding layer 174 includes an adhesive layer 1742 and a polymer layer 1744, and the polymer layer 1744 is disposed on the adhesive layer 1742. The lower cover layer 180 is disposed on the conductive wiring layer 130. The lower cover layer 180 includes sub-cover layers 182 and 184. The sub-cover layer 182 is disposed on the conductive wiring layer 130 corresponding to the hard board 112 and the hard board 113, and the sub-cover layer 184 is disposed on the conductive wiring layer 130 above the lower surface of the corresponding soft board 114. Sub-cladding layer 184 includes an adhesive layer 1842 and a polymer layer 1844. The polymer layer 1844 is disposed on the adhesive layer 1842.
在某些實施例中,軟硬複合電路板100可不包含導電佈線層130,下覆蓋層180形成於基板110的下表面上,以形成單面的軟硬複合電路板。 In some embodiments, the soft and hard composite circuit board 100 may not include the conductive wiring layer 130 formed on the lower surface of the substrate 110 to form a single-sided soft and hard composite circuit board.
第2圖為根據本揭露內容某些實施方式之軟硬複合電路板剖面示意圖。在某些實施方式中,如第2圖所示,在某些實施方式中,軟硬複合電路板200包含基板210及導電佈線層220。導電佈線層220配置於基板210的上表面上,並和上表面直接接觸。基板210包含硬板212、硬板213、及軟板214。硬板212、及硬板213分別配置於軟板214的兩側。在某些實施例中,硬板212、及硬板213包含絕緣預浸漬材料(prepreg)層。舉例來說,絕緣預浸漬材料層的組成包含玻璃纖維不織物料及環氧樹脂。在某些實施例中,軟板214包含黏著層2141、聚合物層2142及黏著層2143。 聚合物層2142配置於黏著層2141上。黏著層2143配置於聚合物層2142上。 2 is a cross-sectional view of a soft and hard composite circuit board according to some embodiments of the present disclosure. In some embodiments, as shown in FIG. 2, in some embodiments, the soft and hard composite circuit board 200 includes a substrate 210 and a conductive wiring layer 220. The conductive wiring layer 220 is disposed on the upper surface of the substrate 210 and is in direct contact with the upper surface. The substrate 210 includes a hard plate 212, a hard plate 213, and a soft plate 214. The hard plate 212 and the hard plate 213 are respectively disposed on both sides of the soft plate 214. In some embodiments, the hard plate 212, and the hard plate 213 comprise an insulating prepreg layer. For example, the composition of the insulating prepreg layer comprises a glass fiber nonwoven material and an epoxy resin. In some embodiments, the flexible sheet 214 includes an adhesive layer 2141, a polymer layer 2142, and an adhesive layer 2143. The polymer layer 2142 is disposed on the adhesive layer 2141. The adhesive layer 2143 is disposed on the polymer layer 2142.
軟硬複合電路板200更包含導電佈線層230、線路層240、線路層250、線路層270、線路層280、上覆蓋層260、及下覆蓋層290。導電佈線層230配置於基板210的下表面上,並和下表面直接接觸。線路層240及250分別配置於對應硬板212、及硬板213上方的導電佈線層220上。線路層270及280分別配置於對應硬板212、及硬板213下表面上方的導電佈線層230上。線路層240包含介電層241、介電層243、介電層245、導電佈線層242、導電佈線層244、及導電佈線層246。線路層250包含介電層251、介電層253、介電層255、導電佈線層252、導電佈線層254、及導電佈線層256。線路層270包含介電層271、介電層273、介電層275、導電佈線層272、導電佈線層274、及導電佈線層276。線路層280包含介電層281、介電層283、介電層285、導電佈線層282、導電佈線層284、及導電佈線層286。該技術領域中具有通常知識者應理解,線路層240、250、270、及280僅為例示性,實際上可依設計需求增減線路層240、250、270、及280中包含的介電層及導電佈線層。上覆蓋層260包含子覆蓋層262及264。子覆蓋層262配置於線路層240及250上。子覆蓋層264配置於軟板214上方的導電佈線層220上。子覆蓋層264包含黏著層2642及聚合物層 2644,聚合物層2644配置於黏著層2642上。下覆蓋層290包含子覆蓋層292及294。子覆蓋層292配置於線路層270及280上。子覆蓋層294配置於軟板214下表面的上方的導電佈線層230上。子覆蓋層294包含黏著層2942及聚合物層2944。 The soft and hard composite circuit board 200 further includes a conductive wiring layer 230, a wiring layer 240, a wiring layer 250, a wiring layer 270, a wiring layer 280, an upper cladding layer 260, and a lower cladding layer 290. The conductive wiring layer 230 is disposed on the lower surface of the substrate 210 and is in direct contact with the lower surface. The circuit layers 240 and 250 are respectively disposed on the conductive wiring layer 220 corresponding to the hard board 212 and the hard board 213. The circuit layers 270 and 280 are respectively disposed on the conductive wiring layer 230 corresponding to the hard board 212 and the lower surface of the hard board 213. The wiring layer 240 includes a dielectric layer 241, a dielectric layer 243, a dielectric layer 245, a conductive wiring layer 242, a conductive wiring layer 244, and a conductive wiring layer 246. The wiring layer 250 includes a dielectric layer 251, a dielectric layer 253, a dielectric layer 255, a conductive wiring layer 252, a conductive wiring layer 254, and a conductive wiring layer 256. The wiring layer 270 includes a dielectric layer 271, a dielectric layer 273, a dielectric layer 275, a conductive wiring layer 272, a conductive wiring layer 274, and a conductive wiring layer 276. The wiring layer 280 includes a dielectric layer 281, a dielectric layer 283, a dielectric layer 285, a conductive wiring layer 282, a conductive wiring layer 284, and a conductive wiring layer 286. Those of ordinary skill in the art will appreciate that circuit layers 240, 250, 270, and 280 are merely exemplary, and that the dielectric layers included in circuit layers 240, 250, 270, and 280 may actually be increased or decreased as desired by the design. And a conductive wiring layer. The upper cover layer 260 includes sub-cover layers 262 and 264. The sub-cover layer 262 is disposed on the circuit layers 240 and 250. The sub-cover layer 264 is disposed on the conductive wiring layer 220 above the flexible board 214. The sub-cover layer 264 includes an adhesive layer 2642 and a polymer layer 2644, the polymer layer 2644 is disposed on the adhesive layer 2642. The lower cover layer 290 includes sub-cover layers 292 and 294. The sub-cover layer 292 is disposed on the circuit layers 270 and 280. The sub-cover layer 294 is disposed on the conductive wiring layer 230 above the lower surface of the flexible board 214. The sub-cover layer 294 includes an adhesive layer 2942 and a polymer layer 2944.
軟硬複合電路板200的結構與軟硬複合電路板100類似,重複的材料性質不再贅述。相較於軟硬複合電路板100,軟硬複合電路板200更包含線路層270及280。線路層270及280配置於導電佈線層230與子覆蓋層292之間,且分別對應至硬板212及硬板213的下表面上方。 The structure of the soft and hard composite circuit board 200 is similar to that of the soft and hard composite circuit board 100, and the repeated material properties are not described again. The soft and hard composite circuit board 200 further includes circuit layers 270 and 280 as compared to the soft and hard composite circuit board 100. The circuit layers 270 and 280 are disposed between the conductive wiring layer 230 and the sub-cover layer 292 and correspond to the upper surfaces of the hard board 212 and the hard board 213, respectively.
第3圖為根據某些實施方式之軟硬複合電路板的製造方法30的流程圖。如第3圖所示,方法30包含步驟S31、步驟S32、步驟S33、步驟S34、及步驟S35。可以理解的是,可以在方法30之前、期間或之後提供額外的步驟,而且某些下述之步驟能被取代或刪除,作為製造方法的額外實施方式。 3 is a flow chart of a method 30 of fabricating a soft and hard composite circuit board in accordance with some embodiments. As shown in FIG. 3, the method 30 includes steps S31, S32, S33, S34, and S35. It will be appreciated that additional steps may be provided before, during or after method 30, and that some of the steps described below may be substituted or deleted as an additional embodiment of the method of manufacture.
第4-8、9A-9B、及10A-10B圖繪示根據本發明某些實施方式之製造軟硬複合電路板之各製程階段的剖面示意圖。請參照第3圖及第4-5圖,方法30開始於步驟S31,形成第一層於基板的上表面上。在某些實施方式中,如第4圖所示,基板410包含介電層412、導電佈線層414、及導電佈線層416,導電佈線層414及導電佈線層416分別配置於介電層412的上、下表面上。基板410被劃分出預設 之非彎折區402、彎折區404、及非彎折區406。彎折區404位於非彎折區402及非彎折區406之間。軟性材料層420形成於基板410的彎折區404上。軟性材料420包含聚合物層422及黏著層424。在某些實施例中,介電層412包含聚酯(PET)層、聚亞醯胺(PI)層、氰酯(Cyanate)、玻璃纖維樹脂、雙順丁烯二酸醯亞胺(Bismaleimide)樹脂、BT樹脂(Bismaleimide Triazine Resin)、或混合環氧樹脂與玻璃纖維的混合材料層。在一實施例中,聚合物層422包含聚亞醯胺(PI)層,黏著層424包含丙烯酸樹脂層、或環氧樹脂層。在另一實施例中,可使用覆蓋膠膜(Coverlay)作為軟性材料層420。在又一實施例中,形成導電佈線層414及416的材料包含壓延銅、或電解銅。 4-8, 9A-9B, and 10A-10B are schematic cross-sectional views showing various stages of manufacturing a soft and hard composite circuit board in accordance with some embodiments of the present invention. Referring to FIGS. 3 and 4-5, the method 30 begins in step S31 to form a first layer on the upper surface of the substrate. In some embodiments, as shown in FIG. 4 , the substrate 410 includes a dielectric layer 412 , a conductive wiring layer 414 , and a conductive wiring layer 416 . The conductive wiring layer 414 and the conductive wiring layer 416 are respectively disposed on the dielectric layer 412 . On the upper and lower surfaces. The substrate 410 is divided into presets The non-bending area 402, the bending area 404, and the non-bending area 406. The bend zone 404 is located between the non-bent zone 402 and the non-bend zone 406. A layer of soft material 420 is formed on the bend region 404 of the substrate 410. The soft material 420 includes a polymer layer 422 and an adhesive layer 424. In some embodiments, the dielectric layer 412 comprises a polyester (PET) layer, a polyamidamine (PI) layer, a cyanoate, a glass fiber resin, and a bismuthimide (Bismaleimide). A resin, BT resin (Bismaleimide Triazine Resin), or a mixed material layer of a mixed epoxy resin and glass fiber. In one embodiment, polymer layer 422 comprises a polyiminamide (PI) layer and adhesive layer 424 comprises an acrylic layer, or an epoxy layer. In another embodiment, a coverlay film (Coverlay) may be used as the soft material layer 420. In still another embodiment, the material forming the conductive wiring layers 414 and 416 comprises rolled copper, or electrolytic copper.
如第5圖所示,提供介電層510及導電佈線層520。介電層510的位置對應至基板410的非彎折區402及406。導電佈線層520配置於軟性材料層420及介電層510上,並直接接觸軟性材料層420及介電層510。之後對基板410、軟性材料層420、介電層510、及導電佈線層520進行壓合製程。在一實施例中,介電層510包含絕緣預浸漬材料(prepreg)層。舉例來說,絕緣預浸漬材料層的組成包含玻璃纖維不織物料及環氧樹脂。 As shown in FIG. 5, a dielectric layer 510 and a conductive wiring layer 520 are provided. The location of the dielectric layer 510 corresponds to the non-bent regions 402 and 406 of the substrate 410. The conductive wiring layer 520 is disposed on the soft material layer 420 and the dielectric layer 510 and directly contacts the soft material layer 420 and the dielectric layer 510. Thereafter, the substrate 410, the soft material layer 420, the dielectric layer 510, and the conductive wiring layer 520 are subjected to a pressure bonding process. In an embodiment, the dielectric layer 510 comprises an insulating prepreg layer. For example, the composition of the insulating prepreg layer comprises a glass fiber nonwoven material and an epoxy resin.
以上僅為例示性的說明,任何形成軟性材料層420、介電層510、及導電佈線層520的步驟皆可做為本揭 露內容替代的實施方式。在另一實施方式中,可先形成介電層510於基板410上,再形成軟性材料層420,最後提供導電佈線層520並進行壓合製程。 The above is merely an illustrative description, and any steps of forming the soft material layer 420, the dielectric layer 510, and the conductive wiring layer 520 can be used as the disclosure. An alternative implementation of the content. In another embodiment, the dielectric layer 510 may be formed on the substrate 410 first, then the soft material layer 420 is formed, and finally the conductive wiring layer 520 is provided and subjected to a pressing process.
請參照第3圖及第6-7圖,方法30進行至步驟S32,形成第二層於第一層上。在某些實施方式中,如第6圖所示,軟板610形成於導電佈線層520上,且對應至基板410的彎折區404的上方。軟板610包含黏著層614、聚合物層612、及黏著層616。在一實施例中,聚合物612層包含聚亞醯胺(PI)層,且黏著層614及616包含丙烯酸樹脂層、或環氧樹脂層。在另一實施例中,可使用覆蓋膠膜(Coverlay)替代聚合物層612及黏著層614。在又一實施例中,可使用覆蓋膠替代聚合物層612及黏著層616。 Referring to Figures 3 and 6-7, the method 30 proceeds to step S32 to form a second layer on the first layer. In some embodiments, as shown in FIG. 6, the flexible board 610 is formed on the conductive wiring layer 520 and corresponds to the upper side of the bent region 404 of the substrate 410. The flexible board 610 includes an adhesive layer 614, a polymer layer 612, and an adhesive layer 616. In one embodiment, the layer of polymer 612 comprises a layer of polyamine (PI), and the layers of adhesive 614 and 616 comprise an acrylic layer, or an epoxy layer. In another embodiment, a cover film (Coverlay) can be used in place of the polymer layer 612 and the adhesive layer 614. In yet another embodiment, a cover glue can be used in place of the polymer layer 612 and the adhesive layer 616.
如第7圖所示,提供硬板710及導電佈線層720。硬板710的位置對應至基板410的非彎折區402及406上方。導電佈線層720配置於軟板610及硬板710上。之後對軟板610、硬板710、及導電佈線層720進行壓合製程。在一實施例中,硬板710包含絕緣預浸漬材料(prepreg)層。舉例來說,絕緣預浸漬材料層的組成包含玻璃纖維不織物料及環氧樹脂。在另一實施例中,形成導電佈線層720的材料包含壓延銅、或電解銅。 As shown in FIG. 7, a hard board 710 and a conductive wiring layer 720 are provided. The position of the hard plate 710 corresponds to the non-bending regions 402 and 406 of the substrate 410. The conductive wiring layer 720 is disposed on the flexible board 610 and the hard board 710. Thereafter, the soft board 610, the hard board 710, and the conductive wiring layer 720 are subjected to a press-bonding process. In an embodiment, the hard plate 710 comprises an insulating prepreg layer. For example, the composition of the insulating prepreg layer comprises a glass fiber nonwoven material and an epoxy resin. In another embodiment, the material forming the conductive wiring layer 720 comprises rolled copper, or electrolytic copper.
請參照第3圖及第8圖,方法30進行至步驟S33,形成覆蓋層於第二層上。在某些實施方式中,如第8 圖所示,形成覆蓋層810於導電佈線層720上,且對應於基板410的彎折區404上方。在一實施例中,覆蓋層810包含黏著層812、及聚合物層814。舉例來說,聚合物層814包含聚亞醯胺(PI)層,且黏著層812包含丙烯酸樹脂、或環氧樹脂。在另一實施例中,覆蓋層810為覆蓋膠膜。在又一實施例中,覆蓋層810為軟性防焊層。 Referring to FIGS. 3 and 8, the method 30 proceeds to step S33 to form a cover layer on the second layer. In some embodiments, such as the 8th As shown, a capping layer 810 is formed over the conductive routing layer 720 and corresponds to the overlying region 404 of the substrate 410. In an embodiment, the cover layer 810 includes an adhesive layer 812 and a polymer layer 814. For example, polymer layer 814 comprises a polybenzamine (PI) layer and adhesive layer 812 comprises an acrylic resin, or an epoxy resin. In another embodiment, the cover layer 810 is a cover film. In yet another embodiment, the cover layer 810 is a soft solder mask.
請參照第3圖及第9A圖,方法30進行至步驟S34,形成下保護層於基板的下表面上。在某些實施方式中,如第9A圖所示,保護層920形成於基板410的下表面上方。在一實施例中,在形成保護層920之前,可先形成線路層910於基板410的下表面上方。線路層910包含介電層912及導電佈線層914。形成線路層910之後,保護層920形成於線路層910上。該技術領域中具有通常知識者應理解,線路層910僅為例示性,實際上可依設計需求配置更多層的線路層。在另一實施例中,保護層920直接接觸基板410的下表面。在又一實施例中,可再形成保護層930於導電佈線層720上,形成保護層930的位置對應於非彎折區402及406。 Referring to FIGS. 3 and 9A, the method 30 proceeds to step S34 to form a lower protective layer on the lower surface of the substrate. In some embodiments, as shown in FIG. 9A, a protective layer 920 is formed over the lower surface of the substrate 410. In an embodiment, the wiring layer 910 may be formed over the lower surface of the substrate 410 before the protective layer 920 is formed. The wiring layer 910 includes a dielectric layer 912 and a conductive wiring layer 914. After the wiring layer 910 is formed, the protective layer 920 is formed on the wiring layer 910. It should be understood by those of ordinary skill in the art that the circuit layer 910 is merely exemplary, and in fact, more layers of circuit layers can be configured according to design requirements. In another embodiment, the protective layer 920 directly contacts the lower surface of the substrate 410. In still another embodiment, the protective layer 930 may be further formed on the conductive wiring layer 720, and the position where the protective layer 930 is formed corresponds to the non-bending regions 402 and 406.
請參照第3圖及第9B圖,方法30進行至步驟S35,形成凹槽。在某些實施方式中,如第9B圖所示,形成凹槽R1貫穿保護層920、線路層910及基板410。凹槽R1的位置對應至基板410的彎折區404的下方。在某些實施例中,保護層920與基板410之間並未有其他線路層,因此凹 槽R1僅貫穿保護層920及基板410。 Referring to FIGS. 3 and 9B, the method 30 proceeds to step S35 to form a groove. In certain embodiments, the first as shown in FIG. 9B, R 1 form a groove penetrating the protective layer 920, circuit layer 910 and the substrate 410. The position of the groove R 1 corresponds to the lower side of the bent portion 404 of the substrate 410. In some embodiments, there is no other wiring layer between the protective layer 920 and the substrate 410, so the recess R 1 only penetrates the protective layer 920 and the substrate 410.
第10A-10B圖接續第8圖,且第10A-10B圖為第9A-9B圖的替代實施方式。請參照第3圖及第10A圖,方法30進行至步驟S34,形成下保護層於基板的下表面上。在某些實施方式中,如第10A圖所示,保護層1060形成於基板410的下表面上方。在一實施例中,在形成保護層1060之前,可先形成線路層1040於基板410的下表面上方。線路層1040包含介電層1042及導電佈線層1044。形成線路層1040之後,保護層1060形成於線路層1040上。該技術領域中具有通常知識者應理解,線路層1040僅為例示性,實際上可依設計需求配置更多層的線路層。在另一實施例中,保護層1060直接接觸基板410的下表面。 Figures 10A-10B are continued from Figure 8, and Figures 10A-10B are alternative embodiments of Figures 9A-9B. Referring to FIGS. 3 and 10A, the method 30 proceeds to step S34 to form a lower protective layer on the lower surface of the substrate. In some embodiments, as shown in FIG. 10A, a protective layer 1060 is formed over the lower surface of the substrate 410. In an embodiment, the wiring layer 1040 may be formed over the lower surface of the substrate 410 before the protective layer 1060 is formed. The wiring layer 1040 includes a dielectric layer 1042 and a conductive wiring layer 1044. After the wiring layer 1040 is formed, the protective layer 1060 is formed on the wiring layer 1040. It should be understood by those of ordinary skill in the art that the circuit layer 1040 is merely exemplary, and in fact, more layers of circuit layers can be configured according to design requirements. In another embodiment, the protective layer 1060 directly contacts the lower surface of the substrate 410.
相較於第9A圖繪示的實施方式,在第10A圖繪示的實施方式中,進一步形成1010介電層於導電佈線層720上,且1010介電層的位置對應至基板410的非彎折區402及406的上方。之後形成導電佈線層1020於1010介電層及覆蓋層810上。可選擇性地形成適當的線路層於導電佈線層1020上,例如形成線路層1030、及1050於導電佈線層1020上。線路層1030包含介電層1032及導電佈線層1034。線路層1050包含介電層1052及導電佈線層1054。該技術領域中具有通常知識者應理解,線路層1030及1050僅為例示性,實際上可依設計需求配置更少或更多層的線路層。在形成線 路層1050之後,形成保護層1070於線路層1050上。 Compared with the embodiment shown in FIG. 9A , in the embodiment illustrated in FIG. 10A , a 1010 dielectric layer is further formed on the conductive wiring layer 720 , and the position of the 1010 dielectric layer corresponds to the non-bend of the substrate 410 . Above the fold zones 402 and 406. The conductive wiring layer 1020 is then formed on the 1010 dielectric layer and the cap layer 810. A suitable wiring layer can be selectively formed on the conductive wiring layer 1020, for example, the wiring layers 1030, and 1050 are formed on the conductive wiring layer 1020. The wiring layer 1030 includes a dielectric layer 1032 and a conductive wiring layer 1034. The wiring layer 1050 includes a dielectric layer 1052 and a conductive wiring layer 1054. It will be understood by those of ordinary skill in the art that the circuit layers 1030 and 1050 are merely illustrative, and in fact fewer or more layers of circuit layers may be configured as desired by the design. Forming a line After the via layer 1050, a protective layer 1070 is formed on the wiring layer 1050.
請參照第3圖及第10B圖,方法30進行至步驟S35,形成凹槽。在某些實施方式中,如第10B圖所示,形成凹槽R2及R3。凹槽R2貫穿保護層1070、線路層1050、線路層1030、及導電佈線層1020。凹槽R2的位置對應至基板410的彎折區404的上方。形成凹槽R3貫穿保護層1060、線路層1040及基板410。凹槽R3的位置對應至基板410的彎折區404的下方。 Referring to FIGS. 3 and 10B, the method 30 proceeds to step S35 to form a groove. In some embodiments, as shown in FIG. 10B, grooves R 2 and R 3 are formed . The groove R 2 penetrates through the protective layer 1070, the wiring layer 1050, the wiring layer 1030, and the conductive wiring layer 1020. The position of the groove R 2 corresponds to above the bending region 404 of the substrate 410. The groove R 3 is formed to penetrate the protective layer 1060, the wiring layer 1040, and the substrate 410. The position of the groove R 3 corresponds to the lower side of the bent portion 404 of the substrate 410.
綜上所述,本揭露內容提供的某些實施方式可提升彎折品質,且可維持基板的強度。應當理解的是,並非所有的優點都要在本文中討論,所有實施方式或實施例不需要特定的優點,且其他實施方式或實施例可提供不同的優點。 In summary, certain embodiments provided by the present disclosure can improve the bending quality and maintain the strength of the substrate. It should be understood that not all of the advantages are discussed herein, that all embodiments or embodiments do not require particular advantages, and that other embodiments or embodiments may provide different advantages.
上文概述若干實施例之特徵結構,使得熟習此項技術者可更好地理解本發明之態樣。熟習此項技術者應瞭解,可輕易使用本發明作為設計或修改其他製程及結構的基礎,以便實施本文所介紹之實施例的相同目的及/或實現相同優勢。熟習此項技術者亦應認識到,此類等效結構並未脫離本發明之精神及範疇,且可在不脫離本發明之精神及範疇的情況下做出對本發明的各種變化、替代及更改。 The features of the several embodiments are summarized above so that those skilled in the art can better understand the aspects of the invention. It will be appreciated by those skilled in the art that the present invention can be readily utilized as a basis for designing or modifying other processes and structures to achieve the same objectives and/or achieve the same advantages of the embodiments described herein. It will be appreciated by those skilled in the art that the present invention is not limited to the spirit and scope of the invention, and various changes, substitutions and alterations of the invention may be made without departing from the spirit and scope of the invention. .
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TW201130405A (en) * | 2010-02-23 | 2011-09-01 | Ibiden Co Ltd | Flex-rigid wiring board and method for manufacturing the same |
CN103493610A (en) * | 2011-04-26 | 2014-01-01 | 株式会社村田制作所 | Rigid-flexible substrate and method for manufacturing same |
CN102159026B (en) * | 2010-02-12 | 2014-03-05 | 揖斐电株式会社 | Flex-rigid wiring board and method for manufacturing same |
CN104582261A (en) * | 2013-10-24 | 2015-04-29 | 揖斐电株式会社 | Flex-rigid wiring board and method for manufacturing flex-rigid wiring board |
TWM541689U (en) * | 2016-11-18 | 2017-05-11 | 同泰電子科技股份有限公司 | Rigid-flex board structure |
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CN102159026B (en) * | 2010-02-12 | 2014-03-05 | 揖斐电株式会社 | Flex-rigid wiring board and method for manufacturing same |
TW201130405A (en) * | 2010-02-23 | 2011-09-01 | Ibiden Co Ltd | Flex-rigid wiring board and method for manufacturing the same |
CN103493610A (en) * | 2011-04-26 | 2014-01-01 | 株式会社村田制作所 | Rigid-flexible substrate and method for manufacturing same |
CN104582261A (en) * | 2013-10-24 | 2015-04-29 | 揖斐电株式会社 | Flex-rigid wiring board and method for manufacturing flex-rigid wiring board |
TWM541689U (en) * | 2016-11-18 | 2017-05-11 | 同泰電子科技股份有限公司 | Rigid-flex board structure |
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