CN107454736A - A kind of circuit board and its cabling impedance adjustment - Google Patents
A kind of circuit board and its cabling impedance adjustment Download PDFInfo
- Publication number
- CN107454736A CN107454736A CN201710501753.4A CN201710501753A CN107454736A CN 107454736 A CN107454736 A CN 107454736A CN 201710501753 A CN201710501753 A CN 201710501753A CN 107454736 A CN107454736 A CN 107454736A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- reference layer
- impedance
- routing
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09236—Parallel layout
Abstract
The invention discloses a kind of circuit board trace impedance adjustment, the circuit board includes routing layer and reference layer, including step：According to the type in reference layer region and impedance target call, in routing layer position corresponding to the type reference layer region, corresponding routing line width is designed.The invention also discloses a kind of circuit board, the circuit board includes reference layer and routing layer, the reference layer includes a variety of reference layer regions, and cabling is provided with the routing layer, and the line width of the cabling designs according to the type and impedance target call in corresponding reference layer region.The present invention relates to printed circuit board field, a kind of circuit board and its cabling impedance adjustment, the line width of circuit board trace layer upward wiring designs according to the type and impedance target call in corresponding reference layer region, make the impedance waveform of circuit board product more steady, circuit board making qualification rate is improved, so as to save cost of manufacture.
Description
Technical field
The present invention relates to printed circuit board field, more particularly to a kind of circuit board and its cabling impedance adjustment.
Background technology
EMI：Electro Magnetic Interference, electromagnetic interference.
Flexible PCB (FPC, Flexible Printed Circuit board) is also known as soft board, and it can be freely curved
Bent, winding, fold, can require any arrangement according to space layout, and arbitrarily moved and flexible in three dimensions, so as to reach
The integration that components and parts assembling connects with wire.The volume of electronic product can be substantially reduced using FPC, be applicable electronic product to
The needs that high density, miniaturization, highly reliable direction are developed.Therefore, FPC is in space flight, military affairs, mobile communication, computer, digital camera
Deng being widely used on field or product.
In circuit boards are made, circuit board walks line impedence by covering film thickness, routing line width, reference layer class
The influence of the factors such as type, reference layer sizing grid, and the board design of early stage is all a kind of circuit board corresponds to a kind of cabling line
Width design, the design of such routing line width, during circuit board is made, circuit board because impedance value is unqualified scrap it is general
Rate is very high, and circuit board product qualified rate is low so that the cost of manufacture of circuit board is high.
The content of the invention
In order to solve the above-mentioned technical problem, it is an object of the invention to provide one kind to improve circuit board making qualification rate, cost
Low circuit board trace impedance adjustment.
The technical solution adopted in the present invention is：A kind of circuit board trace impedance adjustment, the circuit board include walking
Line layer and reference layer, including step：
According to the type in reference layer region and impedance target call, in routing layer position corresponding to the type reference layer region
Put, design corresponding routing line width.
Further, the reference layer region of same type corresponds to same routing line width.
Further, the reference layer area type includes grid regions, individual layer area and Shi Tong areas respectively.
Further, the impedance target call is specially：So that the impedance waveform of circuit board is steady.
Further, the circuit board is FPC plates.
A kind of circuit board, the circuit board include reference layer and routing layer, and the reference layer includes a variety of reference layer regions,
Cabling is provided with the routing layer, the line width of the cabling is set according to the type and impedance target call in corresponding reference layer region
Meter.
Further, the reference layer area type includes grid regions, individual layer area and Shi Tong areas respectively.
Further, the impedance target call is specially：So that the impedance waveform of circuit board is steady.
Further, the routing line width that the grid regions correspond to routing layer position is 60 μm, and the individual layer area corresponds to cabling
The routing line width of layer position is 70 μm, and the routing line width that the Shi Tong areas correspond to routing layer position is 50 μm.
Further, the circuit board is FPC plates.
The beneficial effects of the invention are as follows：
A kind of circuit board trace impedance adjustment, the line width of circuit board trace layer upward wiring is according to corresponding reference layer region
Type and impedance target call design, make the impedance waveform of circuit board product more steady, improve circuit board making qualification rate,
So as to save cost of manufacture.
A kind of circuit board, the line width of circuit board trace layer upward wiring is according to the type and impedance target for corresponding to reference layer region
It is required that design, makes the impedance waveform of circuit board product more steady, circuit board making qualification rate is improved, is fabricated to so as to save
This.
Brief description of the drawings
The embodiment of the present invention is described further below in conjunction with the accompanying drawings：
A kind of circuit board trace impedance adjustment flow chart of Fig. 1 present invention；
Fig. 2 is the structural representation of a kind of circuit board reference layer specific embodiment routing layer of the present invention and reference layer；
Fig. 3 a are the impedance oscillograms of the single circuit board finished product of prior art；
Fig. 3 b are the impedance oscillograms of the single circuit board finished product of the present invention；
Fig. 4 a are the impedance oscillograms of the multigroup circuit board finished product of prior art；
Fig. 4 b are the impedance oscillograms of the multigroup circuit board finished product of the present invention.
Embodiment
It should be noted that in the case where not conflicting, the feature in embodiment and embodiment in the application can phase
Mutually combination.
A kind of circuit board trace impedance adjustment flow chart of Fig. 1 present invention, a kind of circuit board trace impedance adjustment,
The circuit board includes routing layer and reference layer, including step：
According to the type in reference layer region and impedance target call, in routing layer position corresponding to the type reference layer region
Put, design corresponding routing line width.
Further, the reference layer region of same type corresponds to same routing line width.
Further, the reference layer area type includes grid regions, individual layer area and Shi Tong areas respectively.
Further, the impedance target call is specially：So that the impedance waveform of circuit board is steady.
Further, the circuit board is FPC plates.
A kind of circuit board trace impedance adjustment, the line width of circuit board trace layer upward wiring is according to corresponding reference layer region
Type and impedance target call design, make the impedance waveform of circuit board product more steady, improve circuit board making qualification rate,
So as to save cost of manufacture.
A kind of circuit board, the circuit board include reference layer and routing layer, and the reference layer includes polytype reference
Layer region, is provided with cabling on the routing layer, and the line width of the cabling is according to the type and impedance mesh in corresponding reference layer region
Mark requires design, and the circuit board front is reference layer, the back side is routing layer.
In the present embodiment, circuit board is FPC plates.
If circuit board has EMI (electromagnetic interference), control requires, can be required by increasing shielding construction to realize, typically
, shielding construction can be solid copper sheet, copper sheet grid or silver paste grid etc., controlled and required according to the EMI of circuit board, by electricity
Road plate reference layer is divided into polytype reference layer region, and reference layer region is included with copper sheet grid shielding construction or with hard
The grid regions of part grid shielding construction, the individual layer area for not possessing shielding construction and the Shi Tong areas with solid copper sheet shielding construction
Deng, because circuit board needs to be bending or folding in actual applications, at this time, it may be necessary to circuit board possesses certain flexibility, and
Compared with real copper region, amount of copper tails off for grid regions so that the flexible raising of grid regions, and individual layer area is directly then cabling, individual layer
Area surface does not cover shielding construction, flexible higher.Therefore, circuit board reference layer determines reference layer region class according to the actual requirements
Type.
Fig. 2 is the structural representation of a kind of circuit board reference layer specific embodiment routing layer of the present invention and reference layer, such as Fig. 2
It is shown, controlled and required according to the EMI of circuit board, circuit board reference layer includes grid regions, individual layer area 2, Shi Tong areas 3, circuit board ginseng
Examine floor and be followed successively by grid regions 11, individual layer area 2, Shi Tong areas 3 and lower grid regions 12, the routing layer upward wiring of circuit board from top to bottom
Line width designed according to the type and impedance target call in corresponding reference layer region.In the present embodiment, the reference layer of same type
Region corresponds to same routing line width, and the line width of the first cabling 01 of the corresponding routing layer position in upper grid regions 11 and lower grid regions 12 is set
Evaluation and the line width design load of the 4th cabling 04 are 60 μm, the line width of the second cabling 02 design of the corresponding routing layer position in individual layer area 2
It is worth for 70 μm, the line width design load of the 3rd cabling 03 of the corresponding routing layer position in Shi Tong areas 3 is 50 μm.
Fig. 3 a are the impedance oscillograms of the single circuit board finished product of prior art, and Fig. 3 b are the single circuit board finished products of the present invention
Impedance oscillogram, with reference to shown in Fig. 3 a and Fig. 3 b, when whole circuit board designs only with a kind of routing line width, the impedance of circuit board
Value fluctuates in 110 Ω between 140 Ω；When the routing line width of whole circuit board routing layer is set according to different reference layer area segmentations
Timing, the impedance value of circuit board fluctuate in 135 Ω between 145 Ω.
Fig. 4 a are the impedance oscillograms of the multigroup circuit board finished product of prior art, and Fig. 4 b are the multigroup circuit board finished products of the present invention
Impedance oscillogram, target impedance value scope is 90 Ω to 110 Ω, with reference to shown in Fig. 4 a and Fig. 4 b, it is assumed that target impedance value scope
For 90 Ω to 110 Ω, when the whole routing layer of circuit board designs only with a kind of routing line width, the impedance value of circuit board is in 90 Ω
Fluctuated between 115 Ω, beyond the Ω of the impedance upper limit 110, when the routing line width of whole circuit board is according to different reference layer regions point
During section design, the impedance value of circuit board fluctuates in 95 Ω between 110 Ω, i.e., is fluctuated in target impedance value scope.According to difference
Reference layer area segmentation design reference layer region corresponds to the routing line width of routing layer position, makes the impedance waveform of circuit board product more
Add steady, raising circuit board making qualification rate, so as to save cost of manufacture.
A kind of circuit board, the line width of circuit board trace layer upward wiring is according to the type and impedance target for corresponding to reference layer region
It is required that design, makes the impedance waveform of circuit board product more steady, circuit board making qualification rate is improved, is fabricated to so as to save
This.
Above is the preferable implementation to the present invention is illustrated, but the invention is not limited to the implementation
Example, those skilled in the art can also make a variety of equivalent variations on the premise of without prejudice to spirit of the invention or replace
Change, these equivalent deformations or replacement are all contained in the application claim limited range.
Claims (10)
1. a kind of circuit board trace impedance adjustment, the circuit board includes routing layer and reference layer, it is characterised in that it is wrapped
Include step：
According to the type in reference layer region and impedance target call, in routing layer position corresponding to the type reference layer region, if
Count corresponding routing line width.
A kind of 2. circuit board trace impedance adjustment according to claim 1, it is characterised in that the reference layer of same type
Region corresponds to same routing line width.
A kind of 3. circuit board trace impedance adjustment according to claim 2, it is characterised in that the reference layer region
Type includes grid regions, individual layer area and Shi Tong areas respectively.
4. a kind of circuit board trace impedance adjustment according to claim 2, it is characterised in that the impedance target will
Ask specially：So that the impedance waveform of circuit board is steady.
5. a kind of circuit board trace impedance adjustment according to any one of Claims 1-4, it is characterised in that described
Circuit board is FPC plates.
6. a kind of circuit board, it is characterised in that the circuit board includes reference layer and routing layer, and the reference layer includes more seed ginsengs
A layer region is examined, cabling is provided with the routing layer, the line width of the cabling is according to the type and impedance for corresponding to reference layer region
Target call designs.
7. a kind of circuit board according to claim 6, it is characterised in that the reference layer area type includes grid respectively
Area, individual layer area and Shi Tong areas.
8. a kind of circuit board according to claim 7, it is characterised in that the impedance target call is specially：It is so that electric
The impedance waveform of road plate is steady.
9. a kind of circuit board according to claim 8, it is characterised in that the grid regions correspond to the cabling of routing layer position
Line width is 60 μm, and the routing line width that the individual layer area corresponds to routing layer position is 70 μm, and the Shi Tong areas correspond to routing layer position
Routing line width be 50 μm.
10. a kind of circuit board according to any one of claim 6 to 9, it is characterised in that the circuit board is FPC plates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710501753.4A CN107454736B (en) | 2017-06-27 | 2017-06-27 | A kind of circuit board and its cabling impedance adjustment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710501753.4A CN107454736B (en) | 2017-06-27 | 2017-06-27 | A kind of circuit board and its cabling impedance adjustment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107454736A true CN107454736A (en) | 2017-12-08 |
| CN107454736B CN107454736B (en) | 2019-08-27 |
Family
ID=60487078
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710501753.4A Expired - Fee Related CN107454736B (en) | 2017-06-27 | 2017-06-27 | A kind of circuit board and its cabling impedance adjustment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107454736B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108535535A (en) * | 2018-04-02 | 2018-09-14 | 郑州云海信息技术有限公司 | A kind of current detection method and system for integrated chip |
| CN114786349A (en) * | 2022-05-05 | 2022-07-22 | 博敏电子股份有限公司 | Method for manufacturing asymmetric impedance product |
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| US20110061898A1 (en) * | 2009-09-15 | 2011-03-17 | International Business Machines Corporation | Reducing cross-talk in high speed ceramic packages using selectively-widened mesh |
| CN203616552U (en) * | 2013-12-13 | 2014-05-28 | Tcl显示科技（惠州）有限公司 | Liquid crystal display module and double-layer flexible circuit board structure used for transmitting signals of liquid crystal display module |
| CN103970956A (en) * | 2014-05-19 | 2014-08-06 | 浪潮电子信息产业股份有限公司 | Design method for control transmission lines on same layer and with different impedance |
| CN104185362A (en) * | 2014-08-19 | 2014-12-03 | 深圳市兴森快捷电路科技股份有限公司 | Flexible printed circuit board trace impedance and delay control method |
| CN104244598A (en) * | 2014-09-24 | 2014-12-24 | 浪潮(北京)电子信息产业有限公司 | Method and device for controlling impedance continuity of transmission line on PCB (printed circuit board) |
| CN204291567U (en) * | 2014-12-09 | 2015-04-22 | 上海天马微电子有限公司 | A kind of wiring board, display module and electronic equipment |
| CN105045985A (en) * | 2015-07-08 | 2015-11-11 | 浪潮电子信息产业股份有限公司 | Design method for realizing trace impedance matching |
| CN106385765A (en) * | 2016-09-09 | 2017-02-08 | 郑州云海信息技术有限公司 | Method and system for determining signal line reference layer |
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2017
- 2017-06-27 CN CN201710501753.4A patent/CN107454736B/en not_active Expired - Fee Related
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0340482A (en) * | 1989-07-06 | 1991-02-21 | Fujitsu Ltd | Printed wiring board |
| JPH07326829A (en) * | 1994-06-02 | 1995-12-12 | Nitto Denko Corp | Printed circuit board |
| US20040228100A1 (en) * | 2003-05-14 | 2004-11-18 | Wright Mitchel E. | Tailoring impedances of conductive traces in a circuit board |
| US20070251720A1 (en) * | 2003-05-14 | 2007-11-01 | Wright Mitchel E | Tailoring impedances of conductive traces in a circuit board |
| US20110061898A1 (en) * | 2009-09-15 | 2011-03-17 | International Business Machines Corporation | Reducing cross-talk in high speed ceramic packages using selectively-widened mesh |
| CN203616552U (en) * | 2013-12-13 | 2014-05-28 | Tcl显示科技（惠州）有限公司 | Liquid crystal display module and double-layer flexible circuit board structure used for transmitting signals of liquid crystal display module |
| CN103970956A (en) * | 2014-05-19 | 2014-08-06 | 浪潮电子信息产业股份有限公司 | Design method for control transmission lines on same layer and with different impedance |
| CN104185362A (en) * | 2014-08-19 | 2014-12-03 | 深圳市兴森快捷电路科技股份有限公司 | Flexible printed circuit board trace impedance and delay control method |
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| CN106385765A (en) * | 2016-09-09 | 2017-02-08 | 郑州云海信息技术有限公司 | Method and system for determining signal line reference layer |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108535535A (en) * | 2018-04-02 | 2018-09-14 | 郑州云海信息技术有限公司 | A kind of current detection method and system for integrated chip |
| CN114786349A (en) * | 2022-05-05 | 2022-07-22 | 博敏电子股份有限公司 | Method for manufacturing asymmetric impedance product |
| CN114786349B (en) * | 2022-05-05 | 2024-03-12 | 博敏电子股份有限公司 | Manufacturing method of asymmetric impedance product |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107454736B (en) | 2019-08-27 |
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| TR01 | Transfer of patent right |
Effective date of registration: 20200601 Address after: Room 318, floor 3, central auxiliary area, A5 reservoir area, No. 530, Zhengding Road, free trade Experimental Zone, Pudong New Area, Shanghai Patentee after: Rongwubao International Financial Leasing Co.,Ltd. Address before: 518104 1-4 floors and 2-3 floors of Building A, Huangpu Run and Industrial Park, South Ring Road, Huangpu Community, Shajing Street, Baoan District, Shenzhen City, Guangdong Province Patentee before: LEADER-TECH ELECTRONICS (SHENZHEN) Inc. |
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Granted publication date: 20190827 |
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