WO2022140909A1

WO2022140909A1 - Circuit board manufacturing process, system, and micro diameter end mill

Info

Publication number: WO2022140909A1
Application number: PCT/CN2020/140136
Authority: WO
Inventors: 夏源洪
Original assignee: 深圳市雅信宏达电子科技有限公司
Priority date: 2020-12-28
Filing date: 2020-12-28
Publication date: 2022-07-07

Abstract

The present invention provides a circuit board manufacturing process, a system, and a micro diameter end mill, which are used for manufacturing a flex-rigid bonding plate. The flex-rigid bonding plate comprises a flex plate and a rigid plate. The process comprises: applying at least one micro diameter end mill to cut a rigid plate, so as to form a connection groove; using the connecting groove to connect the flex plate and the rigid plate, wherein the traveling speed of the micro diameter end mill is greater than or equal to 0.05 m/min, and the traveling speed of the micro diameter end mill is less than or equal to 0.5 m/min, and wherein the traveling speed of the micro diameter end mill is greater than or equal to 50000 r/min, and the rotation speed of the micro diameter end mill is less than or equal to 110000 r/min. Using a specific micro diameter end mill instead of a laser to cut a rigid plate can facilitate controlling the cutting strength easier, so that a rigid plate is more stably cut, without causing the carbonization of the rigid plate, thereby improving the cutting quality.

Description

Circuit board manufacturing process, system and micro-diameter gong knife

technical field

The invention relates to the field of circuit board manufacturing, in particular to a manufacturing process, a system and a micro-diameter gong knife for a flexible and rigid circuit board.

Background technique

With the continuous improvement of people's living standards, the penetration rate of mobile terminals such as MP3, MP4, tablet computers, and mobile phones has been increased. The production of these mobile terminals may require the use of rigid-flex boards.

Rigid-flex boards are more popular because they have the advantages of both rigid circuit boards and flexible circuit boards. The rigid-flex board is made of rigid circuit board and flexible circuit board. The finished product includes rigid part and flexible part. The rigid part is used to meet the requirements of electrical components that require a certain bearing capacity, while the flexible part is used to meet the needs Requirements for moving or bent electrical components.

In the current production technology, the conventional process is to use laser cutting to make the rigid board slotting technology of the rigid-flex board. However, when laser cutting is used, its depth is difficult to control; In combination with the plate, only a single or two laser heads can be used for processing.

technical problem

The technical problem to be solved by the present invention is: to provide a circuit board manufacturing process, a system and a micro-diameter gong knife, which can cut the circuit board more accurately and will not cause the problem of carbonization.

technical solutions

In order to solve the above-mentioned technical problems, the technical solution adopted in the present invention is: a manufacturing process of a flexible-rigid circuit board, which is used for manufacturing a flexible-rigid circuit board.

Applying at least one micro-diameter gong knife to cut the hard board to form connecting grooves;

Using the connection slot to connect the soft board and the hard board;

Wherein, the travel speed of the micro-diameter gong knife is greater than or equal to 0.05m/min, and the travel speed of the micro-diameter gong knife is less than or equal to 0.5m/min;

Wherein, the rotational speed of the micro-diameter gong knife is greater than or equal to 50,000 r/min, and the rotational speed of the micro-diameter gong knife is less than or equal to 110,000 r/min.

Optionally, the rotational speed of the micro-diameter gong knife is greater than or equal to 50,000 r/min, and the rotational speed of the micro-diameter gong knife is less than or equal to 70,000 r/min.

Wherein, the rotating speed of the micro-diameter gong knife is 60000r/min.

Optionally, the rotational speed of the micro-diameter gong knife is greater than or equal to 80,000 r/min, and the rotational speed of the micro-diameter gong knife is less than or equal to 100,500 r/min.

Optionally, the traveling speed of the micro-diameter gong knife is greater than or equal to 0.05 m/min, and the traveling speed of the micro-diameter gong knife is less than or equal to 0.25 m/min.

Optionally, the traveling speed of the micro-diameter gong knife is greater than or equal to 0.25 m/min, and the traveling speed of the micro-diameter gong knife is less than or equal to 0.50 m/min.

A second aspect of the present application provides a circuit board manufacturing system for manufacturing a rigid-flex board, the rigid-flex board includes a flexible board and a rigid board, including:

The control device is used to control the micro-diameter gong knife;

The micro-diameter gong knife is used for cutting the hard board to form a connecting groove; wherein, the connecting groove is used for connecting the soft board and the hard board

A third aspect of the present application provides a micro-diameter gong knife, comprising:

Tool holder for cooperating with the corresponding control device;

A knife edge, the root end of the knife edge is connected to the knife holding handle, and the other end of the knife edge is provided with a knife edge; wherein, the diameter of the knife edge is 0.15~0.35mm, and the blade length of the knife edge It is greater than or equal to 0.2mm, and the edge length of the blade is less than or equal to 0.5mm.

Wherein, the tool holding handle is cylindrical, and the outer diameter of the tool holding handle is 3.175 mm.

beneficial effect

The beneficial effect of the invention is that: using a specific micro-diameter gong knife to cut the hard plate instead of using a laser, not only it is easier to cut the cutting force, thereby cutting the hard plate more stably, and the carbonization of the hard plate will not be caused. , to improve the cutting quality.

Description of drawings

The specific structure of the present invention will be described in detail below in conjunction with the accompanying drawings

Fig. 1 is the circuit board manufacturing process flow chart in the first embodiment of the present invention;

2 is a block diagram of a circuit board manufacturing system in the first embodiment of the present invention;

Fig. 3 is the overall structure diagram of the micro-diameter gong knife in the first embodiment of the present invention;

100-tool holder; 200-conical transition; 300-tool blade.

Embodiments of the present invention

In order to describe the technical content, structural features, achieved objects and effects of the present invention in detail, the following detailed description is given in conjunction with the embodiments and the accompanying drawings.

Referring to FIG. 1 , a first aspect of the present invention provides a manufacturing process for a rigid-flex circuit board for manufacturing a rigid-flex circuit board. The rigid-flex circuit board includes a flexible board and a rigid board, and includes the following steps:

Step S100, using at least one micro-diameter gong knife to perform a cutting operation on the hard board to form a connection groove;

Step S101, using a connection slot to connect the flexible board and the hard board;

Among them, the travel speed of the micro-diameter gong knife is greater than or equal to 0.05m/min, and the travel speed of the micro-diameter gong knife is less than or equal to 0.5m/min;

Among them, the rotational speed of the micro-diameter gong knife is greater than or equal to 50000r/min, and the rotational speed of the micro-diameter gong knife is less than or equal to 110000r/min.

The advantage of the present invention is that, using a micro-diameter gong knife to cut the hard plate instead of using a laser, it not only makes it easier to cut the cutting force, thereby cutting the hard plate more stably, but also does not cause carbonization of the hard plate and improves the cutting performance. quality. In addition, in this technical solution, the diameter of the blade of the micro-diameter gong knife used is 0.15-0.35 mm; therefore, the normal use of the gong knife can only be guaranteed by matching with specific parameters.

It should be understood that different parameters need to be used when cutting flexible and rigid boards with different thicknesses, and the above parameters include that they can be used to manufacture flexible and rigid boards with different thicknesses.

Optionally, the rotational speed of the micro-diameter gong knife is greater than or equal to 50000 r/min, and the rotational speed of the micro-diameter gong knife is less than or equal to 70000 r/min. It should be understood that most of the machines that drive the micro-diameter gong knives have a maximum speed of less than 80,000r/min. When the speed of these machines is close to 80,000r/min, the micro-diameter gong knives are easily damaged. Therefore, in general, parameters within this range can be used from the point of view of protecting gongs and knives, protecting equipment and saving costs.

Specifically, when the rotating speed of the micro-diameter gong knife is close to 50000r/min, although the cutting accuracy has a certain decline, the safety of the micro-diameter gong knife and equipment can be guaranteed; and when the speed of the micro-diameter gong knife is close to 70000r /min, the cutting accuracy is slightly improved, and the micro-diameter gong knives and equipment are not easily damaged.

Optionally, the rotating speed of the micro-diameter gong knife is 60000r/min. Ordinary machines can drive micro-diameter gong knives at this speed, so as to take into account the cost, efficiency and precision as much as possible.

Further, the rotational speed of the micro-diameter gong knife is greater than or equal to 80000r/min, and the rotational speed of the micro-diameter gong knife is less than or equal to 100500r/min. It should be understood that, in this embodiment, a high-quality drive device is required to keep the rotational speed of the micro-diameter gong knife within this range. When the rotation speed in this range is used to control the micro-diameter gong to process the hard plate part to manufacture the connecting groove, the depth of the connecting groove is more consistent. Among them, when the speed of the micro-diameter gong knife is close to 80000r/min, its fineness is better, and when the speed of the micro-diameter gong knife does not exceed 100500r/min, the micro-diameter gong knife is not easily damaged, and the high-quality drive device is also will not be damaged.

Further, on the basis of any of the above embodiments, the traveling speed of the micro-diameter gong knife is greater than or equal to 0.05 m/min, and the traveling speed of the micro-diameter gong knife is less than or equal to 0.25 m/min. In this embodiment, the traveling speed of the micro-diameter gong knife is relatively slow, which can protect the gong knife and equipment, and save costs. When the traveling speed of the micro-diameter gong knife is close to 0.05m/min, the cutting is more detailed; and when the traveling speed of the micro-diameter gong knife is close to 0.25m/min, the damage of the gong knife is not serious.

Further, the traveling speed of the micro-diameter gong knife is greater than or equal to 0.25m/min, and the traveling speed of the micro-diameter gong knife is less than or equal to 0.50m/min. As a result, cutting can be performed relatively quickly. Among them, the travel speed of the micro-diameter gong knife is greater than or equal to 0.25m/min, and its cutting efficiency is improved to a certain extent; and the travel speed of the micro-diameter gong knife is less than 0.50m/min, although it may cause damage to the gong knife, but also can be run.

A second aspect of the present invention provides a circuit board manufacturing system for manufacturing a rigid-flex board, the rigid-flex board includes a flexible board and a rigid board, including:

The control device is used to control the micro-diameter gong knife;

The micro-diameter gong knife is used to cut the hard board to form a connecting groove; among them, the connecting groove is used to connect the soft board and the hard board

In this solution, the control device may be referred to as an operating device, a cutting machine tool, or a machine. Using the solution of the present invention, the fineness achieved is higher than the fineness of using a laser, and the stability is better, and carbonization will not occur.

A third aspect of the present invention provides a micro-diameter gong knife, comprising:

The tool holder 100 is used to cooperate with the corresponding control device;

The knife edge part 300, the root end of the knife edge part 300 is connected to the knife holding handle 100, and the other end of the knife edge part 300 is provided with a knife edge; wherein, the diameter of the knife edge is 0.15~0.35mm, and the edge length of the knife edge is greater than or equal to 0.2 mm, and the blade length of the blade is less than or equal to 0.5mm.

The tool holding handle 100 is cylindrical, and the outer diameter of the tool holding handle 300 is 3.175 mm.

The advantage of the present invention is that the cutting edge in the present invention has the advantage of being easy to control, therefore, the cutting depth, width and shape are all guaranteed, with high stability and accuracy; and this size The multiple knives of the can work together to efficiently cut the rigid board part in the rigid-flex board. Moreover, the use of laser will not lead to different depths and carbonization of the hard board grooves of the flex-hard board.

It should be understood that, according to the experimental data, using the existing laser cutting technology, such as using a single laser head, it takes 150s to process a rigid-flex board; while using a cutting tool of the present utility model, it takes 150s to process a rigid-flex board. 240s. Since the cutter of the present invention has a specific size, multiple cutting cutters can work together to obtain higher processing efficiency. According to the experimental data of 6 cutting tools working together, the working efficiency is about 3.75 times that of using a single laser head.

The tool holding handle 100 is cylindrical, and the outer diameter of the tool holding handle 100 is 3.175 mm. When matched with the blade of the above size, if the outer diameter of the tool holder is 3.175mm, the cutting tool can be controlled more accurately. In addition, the tool holder of this specification is conducive to the cooperation of multiple cutting tools.

Wherein, a conical transition section 200 is provided between the root end and the tool holding handle 100 . As a result, the tool holder 100 and the tool blade portion 300 have an excessively stressed structure, the cutting force is not likely to damage the tool, and the manufacturing difficulty of the blade edge portion of the cutting tool is reduced.

It should be understood that the micro-diameter gong cutter in this embodiment may also be called a forming milling cutter.

In addition, the circuit board manufacturing process, system and micro-diameter gong knife provided by the present invention can control the error to the level of ±0.03mm, and the error of using traditional laser cutting is ±0.05mm; therefore, using The solution of the present invention achieves a fineness that exceeds the fineness of using a laser, has better stability, and does not cause carbonization.

The above descriptions are only the embodiments of the present invention, and are not intended to limit the scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the description and drawings of the present invention, or directly or indirectly applied to other related technologies Fields are similarly included in the scope of patent protection of the present invention.

Claims

A circuit board manufacturing process for manufacturing a rigid-flex board, the rigid-flex board includes a flexible board and a rigid board, characterized in that it includes the following steps:

Applying at least one micro-diameter gong knife to cut the hard board to form connecting grooves;

Using the connection slot to connect the soft board and the hard board;

Wherein, the travel speed of the micro-diameter gong knife is greater than or equal to 0.05m/min, and the travel speed of the micro-diameter gong knife is less than or equal to 0.5m/min;

Wherein, the rotational speed of the micro-diameter gong knife is greater than or equal to 50,000 r/min, and the rotational speed of the micro-diameter gong knife is less than or equal to 110,000 r/min.
The circuit board manufacturing process according to claim 1, wherein the rotational speed of the micro-diameter gong knife is greater than or equal to 50,000 r/min, and the rotational speed of the micro-diameter gong knife is less than or equal to 70,000 r/min.
The circuit board manufacturing process according to claim 1, wherein the rotational speed of the micro-diameter gong knife is 60000 r/min.
The circuit board manufacturing process according to claim 1, wherein the rotational speed of the micro-diameter gong knife is greater than or equal to 80,000 r/min, and the rotational speed of the micro-diameter gong knife is less than or equal to 100,500 r/min.
The circuit board manufacturing process according to any one of claims 1 to 4, wherein the travel speed of the micro-diameter gong knife is greater than or equal to 0.05m/min, and the travel speed of the micro-diameter gong knife is less than or Equal to 0.25m/min.
The circuit board manufacturing process according to any one of claims 1 to 4, wherein the travel speed of the micro-diameter gong knife is greater than or equal to 0.25 m/min, and the travel speed of the micro-diameter gong knife is less than or Equal to 0.50m/min.
A circuit board manufacturing system for manufacturing a rigid-flex board, the rigid-flex board includes a flexible board and a rigid board, characterized in that it includes:

The control device is used to control the micro-diameter gong knife;

The micro-diameter gong knife is used for cutting the hard board to form a connecting groove; wherein, the connecting groove is used for connecting the soft board and the hard board

Wherein, the travel speed of the micro-diameter gong knife is greater than or equal to 0.05m/min, and the travel speed of the micro-diameter gong knife is less than or equal to 0.5m/min;

Wherein, the rotational speed of the micro-diameter gong knife is greater than or equal to 50,000 r/min, and the rotational speed of the micro-diameter gong knife is less than or equal to 110,000 r/min.
A micro-diameter gong knife, characterized in that, comprising:

Tool holder for cooperating with the corresponding control device;

A knife edge, the root end of the knife edge is connected to the knife holding handle, and the other end of the knife edge is provided with a knife edge; wherein, the diameter of the knife edge is 0.15~0.35mm, and the blade length of the knife edge It is greater than or equal to 0.2mm, and the edge length of the blade is less than or equal to 0.5mm.
The micro-diameter gong knife according to claim 7, wherein the tool holding handle is cylindrical, and the outer diameter of the tool holding handle is 3.175 mm.