CN112743611A - Circuit board manufacturing process, system and micro-diameter routing knife - Google Patents
Circuit board manufacturing process, system and micro-diameter routing knife Download PDFInfo
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- CN112743611A CN112743611A CN202011580390.6A CN202011580390A CN112743611A CN 112743611 A CN112743611 A CN 112743611A CN 202011580390 A CN202011580390 A CN 202011580390A CN 112743611 A CN112743611 A CN 112743611A
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- diameter
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- knife
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
- B26D3/06—Grooving involving removal of material from the surface of the work
Abstract
The invention provides a circuit board manufacturing process, a system and a micro-diameter routing knife, which are used for manufacturing a soft and hard combined board, wherein the soft and hard combined board comprises a soft board and a hard board, and the process comprises the following steps: cutting the hard board by using at least one micro-diameter gong cutter to form a connecting groove; connecting the soft board and the hard board by using a connecting groove; wherein the advancing speed of the micro-diameter gong-knife is more than or equal to 0.05m/min, and the advancing speed of the micro-diameter gong-knife is less than or equal to 0.5 m/min; wherein, the rotating speed of the micro-diameter gong-knife is more than or equal to 50000r/min, and the rotating speed of the micro-diameter gong-knife is less than or equal to 110000 r/min. The hard board is cut by using the specific micro-diameter gong cutter instead of laser, so that the cutting force is easier, the hard board is cut more stably, the hard board is not carbonized, and the cutting quality is improved.
Description
Technical Field
The invention relates to the field of circuit board manufacturing, in particular to a manufacturing process and a system of a soft and hard combined circuit board and a micro-diameter routing knife.
Background
With the continuous improvement of living standard of people, the use popularity of mobile terminals such as MP3, MP4, tablet personal computers, mobile phones and the like is improved. And the manufacture of these mobile terminals may require the use of a rigid-flex board.
The rigid-flex board is more favored because of the advantages of the rigid circuit board and the flexible circuit board. The rigid-flex board is formed by pressing a rigid circuit board and a flexible circuit board, the finished product comprises a rigid part and a flexible part, the rigid part is used for meeting the requirement of an electrical component needing certain bearing capacity, and the flexible part is used for meeting the requirement of the electrical component needing moving or bending.
In the current production technology, the conventional process is a hard board inner groove forming technology for manufacturing a soft and hard combined board by using a laser cutting mode, however, when the laser cutting is used, the depth of the hard board inner groove forming technology is difficult to control; and the laser is used for cutting the rigid-flexible board, and only a single laser head or two laser heads can be used for processing.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: provided are a circuit board manufacturing process, a circuit board manufacturing system, and a micro-diameter routing router, which can more accurately cut a circuit board and do not cause a carbonization problem.
In order to solve the technical problems, the invention adopts the technical scheme that: a manufacturing process of a rigid-flex circuit board is used for manufacturing a rigid-flex board, the rigid-flex board comprises a flexible board and a rigid board, and the manufacturing process comprises the following steps:
cutting the hard board by using at least one micro-diameter gong cutter to form a connecting groove;
connecting the soft board and the hard board by applying the connecting groove;
wherein the travelling speed of the micro-diameter gong-knife is greater than or equal to 0.05m/min, and the travelling speed of the micro-diameter gong-knife is less than or equal to 0.5 m/min;
wherein the rotating speed of the micro-diameter gong-knife is more than or equal to 50000r/min, and the rotating speed of the micro-diameter gong-knife is less than or equal to 110000 r/min.
Optionally, the rotating speed of the micro-diameter gong-knife is greater than or equal to 50000r/min, and the rotating speed of the micro-diameter gong-knife is less than or equal to 70000 r/min.
Wherein the rotating speed of the micro-diameter gong-knife is 60000 r/min.
Optionally, the rotation speed of the micro-diameter gong-knife is greater than or equal to 80000r/min, and the rotation speed of the micro-diameter gong-knife is less than or equal to 100500 r/min.
Optionally, the traveling speed of the micro-diameter gong-knife is greater than or equal to 0.05m/min, and the traveling speed of the micro-diameter gong-knife is less than or equal to 0.25 m/min.
Optionally, the traveling speed of the micro-diameter gong-knife is greater than or equal to 0.25m/min, and the traveling speed of the micro-diameter gong-knife is less than or equal to 0.50 m/min.
The second aspect of the present application provides a circuit board manufacturing system for manufacturing a rigid-flex board, the rigid-flex board including a flexible board and a rigid board, including:
the control device is used for controlling the micro-diameter gong cutter;
the micro-diameter gong cutter is used for cutting the hard board to form a connecting groove; wherein the connecting groove is used for connecting the soft board and the hard board
Wherein the travelling speed of the micro-diameter gong-knife is greater than or equal to 0.05m/min, and the travelling speed of the micro-diameter gong-knife is less than or equal to 0.5 m/min;
wherein the rotating speed of the micro-diameter gong-knife is more than or equal to 50000r/min, and the rotating speed of the micro-diameter gong-knife is less than or equal to 110000 r/min.
The third aspect of the present application provides a minor diameter gong sword, including:
the cutter clamping handle is used for being matched with the corresponding control device;
the root end of the cutter edge part is connected with the cutter clamping handle, and the other end of the cutter edge part is provided with a cutting edge; the diameter of the cutting edge is 0.15-0.35 mm, the edge length of the cutting edge is greater than or equal to 0.2mm, and the edge length of the cutting edge is less than or equal to 0.5 mm.
Wherein, cutter centre gripping handle is cylindricly, the external diameter of cutter centre gripping handle is 3.175 mm.
The invention has the beneficial effects that: the hard board is cut by using the specific micro-diameter gong cutter instead of laser, so that the cutting force is easier, the hard board is cut more stably, the hard board is not carbonized, and the cutting quality is improved.
Drawings
The detailed structure of the invention is described in detail below with reference to the accompanying drawings
FIG. 1 is a flow chart of a circuit board manufacturing process in a first embodiment of the present invention;
fig. 2 is a block diagram of a circuit board manufacturing system in a first embodiment of the present invention;
fig. 3 is an overall structure diagram of a micro-diameter gong-knife according to a first embodiment of the present invention;
100-a tool holding shank; 200-tapered transition section; 300-cutter edge.
Detailed Description
In order to explain technical contents, structural features, and objects and effects of the present invention in detail, the following detailed description is given with reference to the accompanying drawings in conjunction with the embodiments.
Referring to fig. 1, a first aspect of the present invention provides a process for manufacturing a rigid-flex circuit board, which is used for manufacturing a rigid-flex board, where the rigid-flex board includes a flexible board and a rigid board, and the process includes the following steps:
s100, cutting the hard board by using at least one micro-diameter gong cutter to form a connecting groove;
step S101, connecting a soft board and a hard board by using a connecting groove;
wherein the advancing speed of the micro-diameter gong-knife is more than or equal to 0.05m/min, and the advancing speed of the micro-diameter gong-knife is less than or equal to 0.5 m/min;
wherein, the rotating speed of the micro-diameter gong-knife is more than or equal to 50000r/min, and the rotating speed of the micro-diameter gong-knife is less than or equal to 110000 r/min.
The invention has the advantages that the micro-diameter gong cutter is used for cutting the hard board instead of the laser, so that the cutting force is easier to cut, the hard board is cut more stably, the hard board is not carbonized, and the cutting quality is improved. In addition, in the technical scheme, the diameter of the cutting edge of the used micro-diameter gong cutter is 0.15-0.35 mm; therefore, the normal use of the gong-knife can be ensured only by matching with specific parameters.
It should be understood that different parameters are required for cutting the rigid-flex boards with different thicknesses, and the parameters include the rigid-flex boards with different thicknesses.
Optionally, the rotating speed of the micro-diameter gong-knife is greater than or equal to 50000r/min, and the rotating speed of the micro-diameter gong-knife is less than or equal to 70000 r/min. It should be understood that most machines driving the minor-diameter gongs have a maximum rotation speed of less than 80000r/min, and the minor-diameter gongs are easily damaged when the rotation speed of the machines approaches 80000 r/min. Therefore, in general, parameters within this range can be used from the viewpoint of cost saving by protecting the gong cutter and the protection device.
Specifically, when the rotating speed of the micro-diameter milling cutter approaches 50000r/min, although the cutting precision is reduced to a certain extent, the safety of the micro-diameter milling cutter and equipment can be guaranteed; when the rotating speed of the micro-diameter milling cutter approaches 70000r/min, the cutting precision is slightly improved, and the micro-diameter milling cutter and equipment are not easy to damage.
Optionally, the rotation speed of the micro-diameter gong-knife is 60000 r/min. The ordinary machine can drive the micro-diameter milling cutter according to the rotating speed, so that the cost, the efficiency and the fineness are considered as much as possible.
Further, the rotating speed of the micro-diameter gong-knife is greater than or equal to 80000r/min, and the rotating speed of the micro-diameter gong-knife is less than or equal to 100500 r/min. It should be understood that, in this embodiment, a high-quality driving device is required to enable the rotation speed of the fine-diameter gong-knife to be within this interval. When the rotating speed in the interval is applied to control the micro-diameter gong cutter to process the hard plate part so as to manufacture the connecting grooves, the depth of the connecting grooves is more consistent. When the rotating speed of the micro-diameter gong-knife is close to 80000r/min, the fineness of the micro-diameter gong-knife is better, and when the rotating speed of the micro-diameter gong-knife is not more than 100500r/min, the micro-diameter gong-knife is not easy to damage, and a high-quality driving device cannot be damaged.
Further, on the basis of any of the above embodiments, the traveling speed of the minor-diameter gong-knife is greater than or equal to 0.05m/min, and the traveling speed of the minor-diameter gong-knife is less than or equal to 0.25 m/min. In this embodiment, the speed of travel of minor diameter gong sword is slower, can protect gong sword, protection equipment, practices thrift the cost. When the advancing speed of the micro-diameter gong cutter is close to 0.05m/min, the cutting is more careful; and when the advancing speed of the minor-diameter milling cutter is close to 0.25m/min, the milling cutter is not seriously damaged.
Further, the advancing speed of the micro-diameter gong-knife is greater than or equal to 0.25m/min, and the advancing speed of the micro-diameter gong-knife is less than or equal to 0.50 m/min. Therefore, the cutting can be performed relatively quickly. Wherein, the advancing speed of the micro-diameter gong cutter is more than or equal to 0.25m/min, and the cutting efficiency is improved to a certain extent; the travelling speed of the micro-diameter gong-knife is less than 0.50m/min, and the gong-knife can be damaged but can also run.
The second aspect of the present invention provides a circuit board manufacturing system for manufacturing a rigid-flex board, where the rigid-flex board includes a flexible board and a rigid board, and the system includes:
the control device is used for controlling the micro-diameter gong cutter;
the micro-diameter milling cutter is used for cutting the hard board to form a connecting groove; wherein the connecting groove is used for connecting the soft board and the hard board
Wherein the advancing speed of the micro-diameter gong-knife is more than or equal to 0.05m/min, and the advancing speed of the micro-diameter gong-knife is less than or equal to 0.5 m/min;
wherein, the rotating speed of the micro-diameter gong-knife is more than or equal to 50000r/min, and the rotating speed of the micro-diameter gong-knife is less than or equal to 110000 r/min.
In this embodiment, the control device may be referred to as an operation device, a cutting machine, or a machine. By using the scheme of the invention, the fineness of the laser beam is higher than that of the laser beam, the stability is better, and the carbonization condition can not occur.
A third aspect of the present invention provides a minor-diameter gong-knife, including:
a tool-holding shank 100 for cooperation with a corresponding control device;
a cutter blade 300, the root end of the cutter blade 300 being connected to the cutter clamping shank 100, the other end of the cutter blade 300 being provided with a blade; wherein the diameter of the blade is 0.15-0.35 mm, the length of the blade is greater than or equal to 0.2mm, and the length of the blade is less than or equal to 0.5 mm.
The tool clamping shank 100 is cylindrical, and the outer diameter of the tool clamping shank 300 is 3.175 mm.
The invention has the advantages that the cutting edge has the advantage of easy control, so that the cutting depth, width and shape are ensured, the stability is high, and the precision is ensured; and a plurality of cutters with the size can work together to effectively cut the hard plate part in the soft and hard combined plate. The situation that the hard board of the rigid-flex board is not uniform in depth and carbonized due to the use of laser can be avoided.
It should be appreciated that, according to experimental data, 150 seconds is required to process a rigid-flex board using existing laser cutting techniques, such as using a single laser head; however, 240 seconds are required for processing a rigid-flex board by using a cutting tool of the present invention. Because the tool of the present invention is in a particular size, multiple cutting tools can be used in concert to achieve higher processing efficiency. According to the experimental data of 6 cutting tools working together, the working efficiency is about 3.75 times that of a single laser head.
The tool clamping shank 100 is cylindrical, and the outer diameter of the tool clamping shank 100 is 3.175 mm. When the cutting tool is matched with the cutting edge with the size, if the outer diameter of the tool clamping handle is 3.175mm, the cutting tool can be controlled more accurately. In addition, a tool-holding shank of this size facilitates the cooperative operation of multiple cutting tools.
Wherein a tapered transition section 200 is provided between the root end and the tool holding shank 100. Therefore, the tool clamping handle 100 and the tool edge 300 have a stressed transition structure, the cutting force is not easy to damage the tool, and the difficulty in manufacturing the blade edge of the cutting tool is reduced.
It should be understood that the minor-diameter milling cutter in the present embodiment may also be referred to as a forming milling cutter.
In addition, experiments prove that the circuit board manufacturing process, the circuit board manufacturing system and the micro-diameter routing knife can control the error to be +/-0.03 mm, and the error of cutting by using the traditional laser is +/-0.05 mm; therefore, the scheme of the invention achieves fineness exceeding the fineness of using laser, has better stability and does not generate carbonization.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (9)
1. A circuit board manufacturing process is used for manufacturing a rigid-flex board, the rigid-flex board comprises a flexible board and a hard board, and the circuit board manufacturing process is characterized by comprising the following steps:
cutting the hard board by using at least one micro-diameter gong cutter to form a connecting groove;
connecting the soft board and the hard board by applying the connecting groove;
wherein the travelling speed of the micro-diameter gong-knife is greater than or equal to 0.05m/min, and the travelling speed of the micro-diameter gong-knife is less than or equal to 0.5 m/min;
wherein the rotating speed of the micro-diameter gong-knife is more than or equal to 50000r/min, and the rotating speed of the micro-diameter gong-knife is less than or equal to 110000 r/min.
2. The circuit board manufacturing process according to claim 1, wherein: the rotating speed of the micro-diameter gong-knife is greater than or equal to 50000r/min, and the rotating speed of the micro-diameter gong-knife is less than or equal to 70000 r/min.
3. The circuit board manufacturing process according to claim 1, wherein: the rotating speed of the micro-diameter gong cutter is 60000 r/min.
4. The circuit board manufacturing process according to claim 1, wherein: the rotating speed of the micro-diameter gong-knife is greater than or equal to 80000r/min, and the rotating speed of the micro-diameter gong-knife is less than or equal to 100500 r/min.
5. The manufacturing process of a circuit board according to any one of claims 1 to 4, wherein: the advancing speed of the micro-diameter gong-knife is greater than or equal to 0.05m/min, and the advancing speed of the micro-diameter gong-knife is less than or equal to 0.25 m/min.
6. The manufacturing process of a circuit board according to any one of claims 1 to 4, wherein: the advancing speed of the micro-diameter gong-knife is greater than or equal to 0.25m/min, and the advancing speed of the micro-diameter gong-knife is less than or equal to 0.50 m/min.
7. A circuit board manufacturing system for manufacturing a rigid-flex board, the rigid-flex board comprising a flexible board and a rigid board, comprising:
the control device is used for controlling the micro-diameter gong cutter;
the micro-diameter gong cutter is used for cutting the hard board to form a connecting groove; wherein the connecting groove is used for connecting the soft board and the hard board
Wherein the travelling speed of the micro-diameter gong-knife is greater than or equal to 0.05m/min, and the travelling speed of the micro-diameter gong-knife is less than or equal to 0.5 m/min;
wherein the rotating speed of the micro-diameter gong-knife is more than or equal to 50000r/min, and the rotating speed of the micro-diameter gong-knife is less than or equal to 110000 r/min.
8. The utility model provides a minor diameter gong sword which characterized in that includes:
the cutter clamping handle is used for being matched with the corresponding control device;
the root end of the cutter edge part is connected with the cutter clamping handle, and the other end of the cutter edge part is provided with a cutting edge; the diameter of the cutting edge is 0.15-0.35 mm, the edge length of the cutting edge is greater than or equal to 0.2mm, and the edge length of the cutting edge is less than or equal to 0.5 mm.
9. The minor-diameter gong-knife according to claim 7, wherein: the cutter centre gripping handle is cylindric, the external diameter of cutter centre gripping handle is 3.175 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011580390.6A CN112743611A (en) | 2020-12-28 | 2020-12-28 | Circuit board manufacturing process, system and micro-diameter routing knife |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011580390.6A CN112743611A (en) | 2020-12-28 | 2020-12-28 | Circuit board manufacturing process, system and micro-diameter routing knife |
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| Publication Number | Publication Date |
|---|---|
| CN112743611A true CN112743611A (en) | 2021-05-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011580390.6A Pending CN112743611A (en) | 2020-12-28 | 2020-12-28 | Circuit board manufacturing process, system and micro-diameter routing knife |
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| US20090120671A1 (en) * | 2007-11-12 | 2009-05-14 | Fukui Precision Component (Shenzhen) Co., Ltd. | Fpcb substrate and method of manufacturing the same |
| CN102595807A (en) * | 2012-02-29 | 2012-07-18 | 博罗县精汇电子科技有限公司 | Production technology of soft and hard combination circuit board |
| CN204031595U (en) * | 2014-08-30 | 2014-12-17 | 江西景旺精密电路有限公司 | A kind of rigid-flexible in conjunction with pcb board |
| CN108012420A (en) * | 2017-10-27 | 2018-05-08 | 深圳市金洲精工科技股份有限公司 | A kind of molding milling method of pcb board microflute |
| CN209599384U (en) * | 2019-01-07 | 2019-11-08 | 珠海市海辉电子有限公司 | A kind of dedicated gong knife of Rigid Flex |
| CN215848443U (en) * | 2020-12-28 | 2022-02-18 | 深圳市雅信宏达电子科技有限公司 | Minor-diameter gong knife |
-
2020
- 2020-12-28 CN CN202011580390.6A patent/CN112743611A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090120671A1 (en) * | 2007-11-12 | 2009-05-14 | Fukui Precision Component (Shenzhen) Co., Ltd. | Fpcb substrate and method of manufacturing the same |
| CN102595807A (en) * | 2012-02-29 | 2012-07-18 | 博罗县精汇电子科技有限公司 | Production technology of soft and hard combination circuit board |
| CN204031595U (en) * | 2014-08-30 | 2014-12-17 | 江西景旺精密电路有限公司 | A kind of rigid-flexible in conjunction with pcb board |
| CN108012420A (en) * | 2017-10-27 | 2018-05-08 | 深圳市金洲精工科技股份有限公司 | A kind of molding milling method of pcb board microflute |
| CN209599384U (en) * | 2019-01-07 | 2019-11-08 | 珠海市海辉电子有限公司 | A kind of dedicated gong knife of Rigid Flex |
| CN215848443U (en) * | 2020-12-28 | 2022-02-18 | 深圳市雅信宏达电子科技有限公司 | Minor-diameter gong knife |
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Application publication date: 20210504 |