CN207531172U - A kind of electric connection structure of multi-layer PCB board - Google Patents
A kind of electric connection structure of multi-layer PCB board Download PDFInfo
- Publication number
- CN207531172U CN207531172U CN201721566968.6U CN201721566968U CN207531172U CN 207531172 U CN207531172 U CN 207531172U CN 201721566968 U CN201721566968 U CN 201721566968U CN 207531172 U CN207531172 U CN 207531172U
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- China
- Prior art keywords
- layer
- hole
- adhesive layer
- pcb board
- conducting layer
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Abstract
The utility model system provides a kind of electric connection structure of multi-layer PCB board, including central adhesive layer, the upper and lower of central adhesive layer is respectively and fixedly provided with center conducting layer, is equipped with first through hole at least one center conducting layer, each center conducting layer is respectively and fixedly provided with outer shape layer on one side far from central adhesive layer；Outer shape layer includes outer adhesive layer and outer conducting layer, and the second through-hole is equipped at least one outer conducting layer；One end of conductive communication column is fixedly connected on center conducting layer and/or outer conducting layer, the other end of conductive communication column is fixed with through head, conductive communication column runs through central adhesive layer and/or outer adhesive layer, conductive communication column also extends through first through hole and/or the second through-hole, is located in first through hole or the second through-hole through head.Corresponding each conductive layer through connectivity structure can be realized effectively and is electrically connected by the utility model setting, it is ensured that each layer stabilized structure of multi-layer PCB board, and then ensure the performance of multi-layer PCB board, and overall structure is simple.
Description
Technical field
The utility model is related to multi-layer PCB boards, specifically disclose a kind of electric connection structure of multi-layer PCB board.
Background technology
PCB (Printed Circuit Board, i.e. printed circuit board) is at least attached there are one conductive pattern thereon, and cloth
There is hole slot to realize the interconnection between electronic component, the basis of almost all electronic products.If it is, in general, that
There is electronic component in some equipment, then they are integrated on the pcb board of different sizes.In addition to the various members of fixation
Outside device, the main function of pcb board is to provide the connection circuit between every component.Multi-layer PCB just refers to more than two layers
Printed board, it is made of the pad of the connecting wire on substrate insulation substrate and erection welding electronic component, has both had and has led
Lead to each sandwich circuit, and there is mutually insulated.
The making of conventional multilayer pcb board is to be completed in pressing and then form through-hole or blind hole by drilling, realizes each layer
Between electrical connection.It is designed with the light and smallization of electronic product, to realize different functions, the depth-to-width ratio of part multi-layer PCB board
It is larger, the parameters of drilling is caused to be difficult to control in the range of requiring, it is also possible to which the structure for causing multi-layer PCB board is unstable
It is fixed, the performance of multi-layer PCB board is influenced, for the big multi-layer PCB board of depth-to-width ratio, satisfactory through-hole is obtained or blind hole is very tired
It is difficult.
Utility model content
Based on this, it is necessary to for prior art problem, provide a kind of electric connection structure of multi-layer PCB board, can keep away
Exempt from each conductive layer be connected in the case that the multi-layer PCB board big to depth-to-width ratio drills, and overall structure consolidates.
To solve prior art problem, the utility model discloses a kind of electric connection structure of multi-layer PCB board, is glued including center
Layer is closed, the upper and lower surface of central adhesive layer is respectively and fixedly provided with center conducting layer, first through hole is equipped at least one center conducting layer,
Each center conducting layer is respectively and fixedly provided with one or more layers outer shape layer on one side far from central adhesive layer；
Outer shape layer includes outer adhesive layer and outer conducting layer, and outer adhesive layer is located at the side of close central adhesive layer, at least
The second through-hole is equipped in one outer conducting layer, the thickness of center conducting layer and outer conducting layer is d；
One end of conductive communication column, the other end of conductive communication column are fixedly connected on center conducting layer and/or outer conducting layer
It is fixed with through head, through a height of h, h of head<D, conductive communication column run through central adhesive layer and/or outer adhesive layer, conductive communication
Column also extends through first through hole and/or the second through-hole, is located in first through hole or the second through-hole through head.
Further, h≤0.5d.
Further, it is centrum through head.
Further, it is fixed with additional reinforcement item in central adhesive layer.
Further, additional reinforcement item is insulating ceramics item.
The beneficial effects of the utility model are：The utility model discloses a kind of electric connection structure of multi-layer PCB board, is provided with
It is special to be drilled without the multi-layer PCB board big to depth-to-width ratio through connectivity structure, it can effectively will be right through connectivity structure
Each conductive layer for answering, which is realized, to be electrically connected, it is ensured that each layer stabilized structure of multi-layer PCB board, and then ensure multi-layer PCB board performance and
Service life, and overall structure is simple, it is easy to make.
Description of the drawings
Fig. 1 is the structure diagram of the utility model embodiment one.
Fig. 2 is the structure diagram of the utility model embodiment two.
Reference numeral is：Central adhesive layer 10, center conducting layer 11, first through hole 111, conductive communication column 12, through head
121st, additional reinforcement item 13, outer shape layer 20, outer adhesive layer 21, outer conducting layer 22, the second through-hole 221.
Specific embodiment
For that can further appreciate that the feature, technological means and the specific purposes reached, function of the utility model, below
The utility model is described in further detail with specific embodiment with reference to attached drawing.
With reference to figure 1, Fig. 2.
The utility model discloses a kind of electric connection structure of multi-layer PCB board, including central adhesive layer 10, central adhesive layer 10
Upper and lower surface be respectively and fixedly provided with center conducting layer 11, first through hole 111, each center are equipped at least one center conducting layer 11
Conductive layer 11 is respectively and fixedly provided with one or more layers outer shape layer 20 on one side far from central adhesive layer 10；
Outer shape layer 20 includes outer adhesive layer 21 and outer conducting layer 22, and outer adhesive layer 21 is located at close to central adhesive layer 11
Side, is equipped with the second through-hole 221 at least one outer conducting layer 22, and the thickness of center conducting layer 11 and outer conducting layer 22 is d,
Preferably, central adhesive layer 10 and outer adhesive layer 21 are layer of prepreg, and center conducting layer 11 and outer conducting layer 22 are copper
Foil conductive layer；
One end of conductive communication column 12, conductive communication column 12 are fixedly connected on center conducting layer 11 and/or outer conducting layer 22
The other end be fixed with through first 121, conductive communication column 12 is conductive metal, through first 121 a height of h, h<D, it can be ensured that
Conductive communication column 12 with corresponding conductive layer realizes and is electrically connected that conductive communication column 12 is through central adhesive layer 10 and/or outer bonding
Layer 21, conductive communication column 12 also extends through 111 and/or second through-hole 221 of first through hole, through first 121 be located at first through hole 111 or
In second through-hole 221.
According to the demand of design, first through hole 111 is drilled out to center conducting layer 11, the second through-hole is drilled out to outer conducting layer 22
221, conductive communication column 12 is welded on center conducting layer 11 and/or outer conducting layer 22, is required successively in central adhesive layer 10
Center conducting layer 11 and outer shape layer 20 is laminated in both sides, and each lamination is closed, through first 121 through central adhesive layer 10 and/or outer
Adhesive layer 21 reaches corresponding center conducting layer 11 or outer conducting layer 22, and conductive communication column 12 passes through corresponding first through hole 111
And/or second through-hole 221, conductive communication column 12 are electrically connected corresponding conductive layer.
It is special through connectivity structure that the utility model is provided with, and drills without the multi-layer PCB board big to depth-to-width ratio,
Effectively corresponding each conductive layer can be realized through connectivity structure and be electrically connected, it is ensured that each layer stabilized structure of multi-layer PCB board, and then
Ensure the performance and service life of multi-layer PCB board, and overall structure is simple, it is easy to make.
To further ensure that conductive communication column 12 can come into full contact with realization electrical connection, h≤0.5d with corresponding conductive layer.
Be centrum through first 121 to improve through head 121 through effect, can improve through central adhesive layer 10 and/
Or stability during outer adhesive layer 21.
To improve the warping resistance performance of multi-layer PCB board, additional reinforcement item 13, additional reinforcement are fixed in central adhesive layer 11
Item 13 can effectively improve the warping resistance performance of multi-layer PCB board, and additional reinforcement item 13 is insulating ceramics item, can be effectively improved more
The heat dissipation performance of layer pcb board.
Embodiment one, as shown in Figure 1, including central adhesive layer 10, during the upper and lower surface of central adhesive layer 10 is respectively and fixedly provided with
Heart conductive layer 11, is equipped with first through hole 111 in two center conducting layers 11, center conducting layer 11 far from central adhesive layer 10 one
Face is fixed with one layer of outer shape layer 20；Outer shape layer 20 includes outer adhesive layer 21 and outer conducting layer 22, and outer adhesive layer 21, which is located at, to be leaned on
The side of nearly central adhesive layer 10 is equipped with the second through-hole 221, center conducting layer 11 and outer conducting layer 22 in two outer conducting layers 22
Thickness be d；One of center conducting layer 11 is fixedly connected with the first conductive communication column close to the side of central adhesive layer 10
One end, one of outer conducting layer 22 is fixedly connected with one end of the second conductive communication column close to the side of central adhesive layer 10,
The other end of two conductive communication columns 12 is respectively and fixedly provided with through first 121, through first 121 a height of h, h≤0.5d；First conduction is even
Through post is reached through central adhesive layer 10 in corresponding first through hole 111, and the first conductive communication column is electrically connected two center conducting layers
11, the second conductive communication column reaches corresponding second through two outer adhesive layers 21,10 and two first through hole 111 of central adhesive layer and leads to
In hole 221, the second conductive communication column is electrically connected two outer conducting layers 22.
Embodiment two, as shown in Fig. 2, including central adhesive layer 10, during the upper and lower surface of central adhesive layer 10 is respectively and fixedly provided with
Heart conductive layer 11, is equipped with first through hole 111 in two center conducting layers 11, center conducting layer 11 far from central adhesive layer 10 one
Face is fixed with one layer of outer shape layer 20；Outer shape layer 20 includes outer adhesive layer 21 and outer conducting layer 22, and outer adhesive layer 21, which is located at, to be leaned on
The side of nearly central adhesive layer 10 is equipped with the second through-hole 221, center conducting layer 11 and outer conduction in one of outer conducting layer 22
The thickness of layer 22 is d；One of side of the center conducting layer 11 far from central adhesive layer 10 is fixedly connected with the first conduction even
One end of through post, one of outer conducting layer 22 are fixedly connected with the one of the second conductive communication column close to the side of central adhesive layer 10
End, the other end of two conductive communication columns 12 are respectively and fixedly provided with through first 121, through first 121 a height of h, h≤0.5d；First leads
The through post that is electrically connected is reached through adjacent outer adhesive layer 22 in corresponding second through-hole 221, and the electrical connection of the first conductive communication column is adjacent
Center conducting layer 11 and outer conducting layer 22, the second conductive communication column through outer adhesive layer 22, adjacent 111 and of first through hole
Central adhesive layer 10 is reached in separate first through hole 111,11 He of center conducting layer that the electrical connection of the second conductive communication column is separated by
Outer conducting layer 22.
Embodiment described above only expresses the several embodiments of the utility model, and description is more specific and detailed,
But it should not be interpreted as limiting the scope of the present invention.It should be pointed out that for the common of this field
For technical staff, without departing from the concept of the premise utility, various modifications and improvements can be made, these all belong to
In the scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (5)
1. a kind of electric connection structure of multi-layer PCB board, which is characterized in that including central adhesive layer (10), the central adhesive layer
(10) upper and lower surface is respectively and fixedly provided with center conducting layer (11), and first through hole is equipped at least one center conducting layer (11)
(111), each center conducting layer (11) far from the central adhesive layer (10) be respectively and fixedly provided on one side one layer or one layer with
Upper outer shape layer (20)；
The outer shape layer (20) includes outer adhesive layer (21) and outer conducting layer (22), and the outer adhesive layer (21) is positioned at close to institute
The side of central adhesive layer (10) is stated, is equipped with the second through-hole (221) at least one outer conducting layer (22), the center is led
The thickness of electric layer (11) and the outer conducting layer (22) is d；
One end of conductive communication column (12), institute are fixedly connected on the center conducting layer (11) and/or the outer conducting layer (22)
The other end for stating conductive communication column (12) is fixed with through head (121), a height of h, h through head (121)<D, the conduction
Column (12) is connected through the central adhesive layer (10) and/or the outer adhesive layer (21), the conductive communication column (12) is also worn
The first through hole (111) and/or second through-hole (221) are crossed, the head (121) that runs through is positioned at the first through hole
(111) or in second through-hole (221).
A kind of 2. electric connection structure of multi-layer PCB board according to claim 1, which is characterized in that h≤0.5d.
3. the electric connection structure of a kind of multi-layer PCB board according to claim 1, which is characterized in that described to run through head (121)
For centrum.
A kind of 4. electric connection structure of multi-layer PCB board according to claim 1, which is characterized in that the central adhesive layer
(10) additional reinforcement item (13) is fixed in.
A kind of 5. electric connection structure of multi-layer PCB board according to claim 4, which is characterized in that the additional reinforcement item
(13) it is insulating ceramics item.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721566968.6U CN207531172U (en) | 2017-11-20 | 2017-11-20 | A kind of electric connection structure of multi-layer PCB board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721566968.6U CN207531172U (en) | 2017-11-20 | 2017-11-20 | A kind of electric connection structure of multi-layer PCB board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207531172U true CN207531172U (en) | 2018-06-22 |
Family
ID=62579987
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721566968.6U Expired - Fee Related CN207531172U (en) | 2017-11-20 | 2017-11-20 | A kind of electric connection structure of multi-layer PCB board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207531172U (en) |
-
2017
- 2017-11-20 CN CN201721566968.6U patent/CN207531172U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180622 Termination date: 20201120 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |