CN101063756A - Optical displaying module with heat sinking structure - Google Patents
Optical displaying module with heat sinking structure Download PDFInfo
- Publication number
- CN101063756A CN101063756A CN 200610078978 CN200610078978A CN101063756A CN 101063756 A CN101063756 A CN 101063756A CN 200610078978 CN200610078978 CN 200610078978 CN 200610078978 A CN200610078978 A CN 200610078978A CN 101063756 A CN101063756 A CN 101063756A
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- display module
- printed wiring
- flexible printed
- wiring board
- optical display
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Abstract
This invention relates to one dissipation structure optical display module, which comprises one LCD panel, one driver IC, one flexible print circuit board, multiple first weld pad and second weld pad, at least one source and one conductor, wherein the LCD panel is set with driver IC and the flexible print circuit board is connected with IC one front and back surfaces set with first and second weld pads; the print board pass holes are connected with source on first weld pad sticking to second weld pad; the above structure is to send the source thermal energy from first weld pad to conductor to lower surround temperature.
Description
Technical field
The present invention is relevant with optical display module, more detailed is meant a kind of dissipation structure optical display module that has, and is the situation that can improve the display abnormality that display causes because of light source heat radiation is bad especially.
Background technology
With the mobile phone is the electronic product of example, be towards compact with have multifunctional direction research and development, but, the function that mobile phone possesses is many more, need to use more electronic package relatively, however can be in mobile phone inside in the finite space of cloth spare, and most electronic packages are provided with approaching each other, if the heat energy that each electronic package produces in start will produce influence improperly to contiguous electronic package easily when too high.
Is example with mobile phone shown in Figure 1 with LCD MODULE 1, and its drive IC 2 is arranged on the liquid crystal panel 3, and its LED 4 is arranged on the flexible printed wiring board 5, and flexible printed wiring board 5 is caused LED 4 corresponding light guide plate 6 by bending, simultaneously LED 4 contiguous drive IC 2; In above-mentioned each member, drive IC 2 not only shows outside the specific image as control liquid crystal panel 3, the interior temperature-compensation circuit that has to be detecting the temperature of liquid crystal panel 3 at any time, and in time regulates this temperature to the influence that liquid crystal molecule caused, and makes liquid crystal panel 3 keep good display effect; And be to obtain good display effect, the mode that also can select to promote LED 4 briliancy (luminance) is come the required backlight of forced fluid crystal panel 3, but, when the briliancy of LED 4 is high more, it is the generation that is accompanied by high heat energy, and with regard to present LCD MODULE 1, its LED 4 is that contiguous drive IC 2 is provided with, therefore, drive IC 2 is as easy as rolling off a log senses the temperatures involved that LED 4 produces when luminous, cause erroneous judgement liquid crystal panel 3 temperature take place, cause temperature-compensation circuit to make the compensating movement that makes mistake, instead cause liquid crystal panel 3 display abnormalities; Secondly, temperature raises LED 4 causes current lead-through easily because of encapsulating material heat conduction is not good after, and this situation also may cause the erroneous judgement of 2 pairs of liquid crystal panel 3 temperature of drive IC.
Summary of the invention
Fundamental purpose of the present invention is to provide a kind of dissipation structure optical display module that has, the environment temperature when it can reduce the light source luminescent of display.
Secondary objective of the present invention is to provide a kind of dissipation structure optical display module that has, and is that the drive IC that can improve display causes erroneous judgement to temperature and causes the situation of display panel display abnormality.
For reaching above-mentioned purpose, provided by the present invention a kind ofly have dissipation structure optical display module and include a liquid crystal panel, and electrically be arranged at drive IC on this liquid crystal panel, and electrically connect the flexible printed wiring board of this drive IC, most first weld pads, most second weld pads, at least one light source and heat conductors, and wherein this flexible printed wiring board is provided with the intercommunicating pore at most the passed through said front surface and the back side; This first, second corresponding those intercommunicating pores of weld pad and be located at the front and the back side of this flexible printed wiring board respectively, and see through those intercommunicating pores and interconnect; This light source is electrically connected on those first weld pads; This heat conductor and those second weld pads are fitted; By this, the heat energy that is produced during this light source luminescent can conduct to this heat conductor more in regular turn via first weld pad and second weld pad, by to reduce the temperature around the light source.
Description of drawings
Fig. 1 is the synoptic diagram of general LCD MODULE;
Fig. 2 is the three-dimensional exploded view with dissipation structure optical display module of a preferred embodiment of the present invention;
Fig. 3 is the schematic rear view of Fig. 2;
Fig. 4 is a sectional view, the aspect after the optical display module assembling of announcement Fig. 2;
Fig. 5 is the partial enlarged drawing of Fig. 4;
Fig. 6 is Fig. 2 roughly the same, discloses the optical display module of Fig. 2 and more sets up a metal frame;
Fig. 7 is a sectional view, discloses the aspect after each member assembling is finished among Fig. 6;
Fig. 8 is the three-dimensional exploded view with dissipation structure optical display module of another preferred embodiment of the present invention;
Fig. 9 discloses the schematic rear view of liquid crystal panel and flexible printed wiring board among Fig. 8;
Figure 10 is a sectional view, the aspect after the optical display module assembling of announcement Fig. 8.
[primary clustering symbol description]
10 optical display module
12 liquid crystal panels, 121 viewing areas
122 non-display areas
14 drive IC
16 flexible printed wiring boards, 161 film bodies
The positive 161b of the 161a back side
162 signal input parts, 163 signal output parts
164 intercommunicating pores
18 first weld pads
20 second weld pads
22 LED
24 heat conductors
Support face in 26 metal frames 261
40 optical display module
42 liquid crystal panels
44 drive IC
46 flexible printed wiring boards 461 fall into portion
462 film bodies
48 first weld pads
50 second weld pads
52 LED
54 metal frames 541 support portion
56 coverlays
Embodiment
Please refer to Fig. 2 to shown in Figure 5, be to have a dissipation structure optical display module 10 for a preferred embodiment of the present invention, this optical display module 10 includes a liquid crystal panel 12, a drive IC 14, a flexible printed wiring board 16, four first weld pads 18, four second weld pads 20, two light sources are to be a LED 22 and a heat conductor 24 as shown in the figure, wherein:
These liquid crystal panel 12 fronts have an adjacent viewing area 121 and a non-display area 122, this drive IC 14 is electrically connected on the non-display area 122 of this liquid crystal panel 12, and in have temperature-compensation circuit detecting liquid crystal panel 12 temperature and the too high or too low temperature of timely adjustment, to reduce this temperature to influence that liquid crystal molecule was caused.
This flexible printed wiring board 16 has a film body 161, and form a signal input part 162 and a signal output part 163 respectively in these film body 161 relative two ends, this signal input part 162 electrically connects with hard system circuit board (figure does not show), this signal output part 163 electrically connects with this drive IC 14, this flexible printed wiring board 16 is made its film body 161 place this liquid crystal panel 12 lower rear (Fig. 4 by bending when assembling, Fig. 5 reference), a side of these film body 161 approach signal output terminals 163 has several intercommunicating pores 164 that runs through film body 161 positive 161a and back side 161b.
Those first weld pads 18 are that one group mode is arranged at this film body 161 positive 161a with two, and cover those intercommunicating pores 164, are connected with a LED 22 on first weld pad 18 of each group.
Those second weld pads 20 are that one group mode is arranged at this film body 161 back side 161b with two, and respectively this second weld pad 20 corresponding respectively one first weld pad 18, and see through those intercommunicating pores 164 and electrically connect with pairing first weld pad 18.
What deserves to be mentioned is that the area that above-mentioned LED 22 contacts with first weld pad 18 is much smaller than each first weld pad 18 or the area of each second weld pad 20.
This heat conductor 24 is to be the made long rectangle lamellar body of the insulating material with high thermal conduction characteristic, and it simultaneously is to be close to the back side 161b that is butted on this film body 161, and fully covers those second weld pads 20 and contact with second weld pad 20 surface.
More than be the explanation with dissipation structure optical display module 10 each member and relevant position thereof of the present invention, narrate its effect now in the back:
When LED 22 is driven luminous and produce heat energy release, the surface of contact that heat energy sees through itself and those first weld pad 18 conducts to whole first weld pad 18, because the area that the surface area of each first weld pad 18 contacts with first weld pad 18 much larger than LED 22, therefore can increase radiating rate, heat energy also conducts to the second corresponding weld pad 20 again via this intercommunicating pore 164 respectively, and be passed to heat conductor 24 again by second weld pad 20, because second weld pad 20 also is provided with in the mode of surface area greater than LED 22 and first weld pad, 18 contacts area, therefore the heat energy that can be conducted via intercommunicating pore 164 is from the slit of 24 of second weld pad 20 and heat conductors, and from the surface of heat conductor 24 and once more dissipation in air, quicken the heat radiation purpose so that receive, and the temperature arround the LED 22 is reduced rapidly, avoiding the built-in temperature-compensation circuit of drive IC 14, and then cause temperature-compensation circuit liquid crystal panel 12 to be made the compensating movement that makes mistake to may the judging by accident of ambient temperature.
Explanation is in addition, optical display module 10 of the present invention can be set up a metal frame 26 on demand and again, as Fig. 6, shown in Figure 7, this metal frame 26 mainly covers at the outside of this film body 161, it has in one to face 261, and should interiorly support face 261 fits with the one side that this heat conductor 24 differs from this second weld pad 20, therefore, conducted to the heat energy of this heat conductor 24, more will be through this metal frame 26 dissipation in air, so, as shown in the above description, the heat energy that produces when the LED 22 of optical display module 10 of the present invention is luminous is reached the purpose to the cooling of LED 22 ambient temperature through the progressively dispersion of multiple tracks radiating subassembly.
Fig. 8 to shown in Figure 10 be optical display module 40 for another preferred embodiment of the present invention; this optical display module 40 has the structure roughly the same with Fig. 6; promptly include a liquid crystal panel 42; one drive IC 44; one flexible printed wiring board 46; four first weld pads 48; four second weld pads 50; two LED 52 and a metal frame 54; different being in the optical display module 40 of present embodiment more include a coverlay 56 made from polymkeric substance (polyimide) material; this coverlay 56 is to be attached in the depressed part of being reserved when this flexible printed wiring board 46 is made 461; and hide those second weld pads 50 fully; make coverlay 56 surfaces concordant with film body 462 surfaces of flexible printed wiring board 46; and the metal frame 54 of present embodiment more has a portion 541 that supports that caves inward in the punching out in advance of corresponding coverlay 56 positions; be mounted when finishing at metal frame 54; it supports portion's 541 one sides and is tight against this coverlay 56 surfaces; this structure has the heat conduction path shorter than structure that Fig. 7 discloses; therefore can accelerate the dissipation of heat energy; secondly; coverlay 56 has the effect of isolating second weld pad 50 and metal frame 54; by to protect second weld pad 50; that is when the assembling of all members after during test; in the time of must dismantling metal frame 54 as if finding to test unusual; coverlay 56 can prevent effectively that metal frame 54 is disassembled in the process scraping (scratch) that may cause second weld pad 50 and peels off (peeling) phenomenon, and then avoids the Copper Foil in the flexible printed wiring board 46 to suffer oxidation.
The above only is several preferable possible embodiments of the present invention, uses the equivalent structure variation that instructions of the present invention and claim are done such as, ought to be included in the claim of the present invention.
Claims (11)
1. one kind has dissipation structure optical display module, it is characterized in that comprising:
One liquid crystal panel;
One drive IC is arranged on this liquid crystal panel, and electrically connects with this liquid crystal panel;
One flexible printed wiring board, one end are to electrically connect with this drive IC, and this flexible printed wiring board is provided with the intercommunicating pore at most the passed through said front surface and the back side;
Most first weld pads are the fronts that are arranged at this flexible printed wiring board, and correspondence out of the ordinary this intercommunicating pore respectively;
Most second weld pads are the back side that is arranged at this flexible printed wiring board, and correspondence out of the ordinary this intercommunicating pore respectively, and are connected with this first weld pad respectively respectively;
At least one light source is to electrically connect with those first weld pads; And
One heat conductor is to be located at this flexible printed wiring board back side, and fits with those second weld pads.
2. have dissipation structure optical display module according to claim 1, it is characterized in that, described this light source and the first weld pad contact area are less than this first pad area.
3. have dissipation structure optical display module according to claim 1, it is characterized in that, described this light source and the first weld pad contact area are less than this second pad area.
4. have dissipation structure optical display module according to claim 1, it is characterized in that, described this light source is LED.
5. have dissipation structure optical display module according to claim 1, it is characterized in that, more include a metal frame, this metal frame is incorporated into the back side one side of this flexible printed wiring board, and with this heat conductor butt.
6. one kind has dissipation structure optical display module, it is characterized in that, comprising:
One liquid crystal panel;
One drive IC is arranged on this liquid crystal panel, and electrically connects with this liquid crystal panel;
One flexible printed wiring board, one end are to electrically connect with this drive IC, and this flexible printed wiring board is provided with the intercommunicating pore at most the passed through said front surface and the back side;
Most first weld pads are the fronts that are arranged at this flexible printed wiring board, and correspondence out of the ordinary this intercommunicating pore respectively;
At least one light source is to electrically connect with those first weld pads;
Most second weld pads are the back side that is arranged at this flexible printed wiring board, and correspondence out of the ordinary this intercommunicating pore respectively, and are connected with this first weld pad respectively respectively;
One coverlay is the back side that is arranged at this flexible printed wiring board, and covers those second weld pads;
One metal frame is incorporated into the back side one side of this flexible printed wiring board, and with this coverlay butt.
7. have dissipation structure optical display module as described in claim 6, it is characterized in that, described this coverlay is constituted by polymeric material.
8. have dissipation structure optical display module as described in claim 6, it is characterized in that, described this light source and the first weld pad contact area are less than this first pad area.
9. have dissipation structure optical display module as described in claim 6, it is characterized in that, described this light source and the first weld pad contact area are less than this second pad area.
10. have dissipation structure optical display module as described in claim 6, it is characterized in that, described this light source is LED.
11. as described in claim 6, have dissipation structure optical display module, it is characterized in that described this metal frame has the portion that supports of a depression, the portion that should support is to should coverlay, should support the portion surface and contact with this coverlay.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100789785A CN100526944C (en) | 2006-04-29 | 2006-04-29 | Optical displaying module with heat sinking structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100789785A CN100526944C (en) | 2006-04-29 | 2006-04-29 | Optical displaying module with heat sinking structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101063756A true CN101063756A (en) | 2007-10-31 |
| CN100526944C CN100526944C (en) | 2009-08-12 |
Family
ID=38964887
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100789785A Expired - Fee Related CN100526944C (en) | 2006-04-29 | 2006-04-29 | Optical displaying module with heat sinking structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100526944C (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102235620A (en) * | 2010-04-30 | 2011-11-09 | 瀚宇彩晶股份有限公司 | Liquid crystal display device and backlight module thereof |
| CN101770753B (en) * | 2009-01-06 | 2013-07-24 | 胜华科技股份有限公司 | Display device structure |
| CN103338590A (en) * | 2013-06-14 | 2013-10-02 | 业成光电（深圳）有限公司 | Flexible circuit board and manufacturing method thereof |
| CN105674147A (en) * | 2016-01-14 | 2016-06-15 | 京东方科技集团股份有限公司 | Backlight module and display device |
| CN108155220A (en) * | 2018-01-29 | 2018-06-12 | 武汉华星光电半导体显示技术有限公司 | Display device and its manufacturing method, display panel |
| CN109031774A (en) * | 2017-06-12 | 2018-12-18 | 群创光电股份有限公司 | Display |
| CN111630445A (en) * | 2018-02-09 | 2020-09-04 | 三星电子株式会社 | Display including multiple wiring layers in bend region |
| WO2021142881A1 (en) * | 2020-01-16 | 2021-07-22 | 重庆康佳光电技术研究院有限公司 | Display backplane, display device, and splicing display device |
-
2006
- 2006-04-29 CN CNB2006100789785A patent/CN100526944C/en not_active Expired - Fee Related
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101770753B (en) * | 2009-01-06 | 2013-07-24 | 胜华科技股份有限公司 | Display device structure |
| CN102235620B (en) * | 2010-04-30 | 2016-06-29 | 瀚宇彩晶股份有限公司 | LCD device and backlight module thereof |
| CN102235620A (en) * | 2010-04-30 | 2011-11-09 | 瀚宇彩晶股份有限公司 | Liquid crystal display device and backlight module thereof |
| CN103338590A (en) * | 2013-06-14 | 2013-10-02 | 业成光电（深圳）有限公司 | Flexible circuit board and manufacturing method thereof |
| CN103338590B (en) * | 2013-06-14 | 2016-12-28 | 业成光电（深圳）有限公司 | Flexible circuit board and manufacture method thereof |
| CN105674147A (en) * | 2016-01-14 | 2016-06-15 | 京东方科技集团股份有限公司 | Backlight module and display device |
| CN109031774A (en) * | 2017-06-12 | 2018-12-18 | 群创光电股份有限公司 | Display |
| CN108155220A (en) * | 2018-01-29 | 2018-06-12 | 武汉华星光电半导体显示技术有限公司 | Display device and its manufacturing method, display panel |
| WO2019144563A1 (en) * | 2018-01-29 | 2019-08-01 | 武汉华星光电半导体显示技术有限公司 | Display device and manufacturing method therefor, and display panel |
| CN108155220B (en) * | 2018-01-29 | 2019-08-02 | 武汉华星光电半导体显示技术有限公司 | The manufacturing method of display device |
| CN111630445A (en) * | 2018-02-09 | 2020-09-04 | 三星电子株式会社 | Display including multiple wiring layers in bend region |
| US11600640B2 (en) | 2018-02-09 | 2023-03-07 | Samsung Electronics Co., Ltd. | Display including plurality of wiring layers in bending region |
| CN111630445B (en) * | 2018-02-09 | 2023-10-20 | 三星电子株式会社 | Display comprising a plurality of wiring layers in a bending region |
| WO2021142881A1 (en) * | 2020-01-16 | 2021-07-22 | 重庆康佳光电技术研究院有限公司 | Display backplane, display device, and splicing display device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100526944C (en) | 2009-08-12 |
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Granted publication date: 20090812 Termination date: 20150429 |
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