WO2021119990A1 - Flexible circuit board - Google Patents

Flexible circuit board Download PDF

Info

Publication number
WO2021119990A1
WO2021119990A1 PCT/CN2019/125933 CN2019125933W WO2021119990A1 WO 2021119990 A1 WO2021119990 A1 WO 2021119990A1 CN 2019125933 W CN2019125933 W CN 2019125933W WO 2021119990 A1 WO2021119990 A1 WO 2021119990A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit
circuit board
via hole
upper layer
electrically connected
Prior art date
Application number
PCT/CN2019/125933
Other languages
French (fr)
Chinese (zh)
Inventor
杨桂霞
Original Assignee
瑞声声学科技(深圳)有限公司
瑞声科技(新加坡)有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 瑞声声学科技(深圳)有限公司, 瑞声科技(新加坡)有限公司 filed Critical 瑞声声学科技(深圳)有限公司
Priority to PCT/CN2019/125933 priority Critical patent/WO2021119990A1/en
Publication of WO2021119990A1 publication Critical patent/WO2021119990A1/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits

Definitions

  • the utility model relates to the field of through holes of flexible circuit boards, in particular to a flexible circuit board.
  • FPC Flexible Printed Circuit
  • the flexible circuit board is composed of an upper circuit, a lower circuit and a substrate board.
  • the upper circuit and the lower circuit are respectively arranged on the front and back of the substrate board, and are electrically connected by the upper circuit and the lower circuit to form a loop.
  • a through hole is usually provided symmetrically on the front and back of the substrate plate, so that the upper layer circuit and the lower layer circuit are electrically connected through the through hole, thereby forming a loop.
  • the via holes may be easily damaged or partially broken due to the presence of foreign matter and other impurities in the via holes, which may cause the upper and lower layers to fail to conduct or present reliability risks.
  • the purpose of the utility model is to provide a flexible circuit board to solve the technical problem that the through holes are easily damaged or the partial holes are broken in the prior art, which causes the upper and lower layers to fail to conduct.
  • a flexible circuit board comprising: a substrate board, an upper circuit fixed on one surface of the substrate board, and the upper circuit fixed on the opposite side of the upper circuit
  • the lower layer circuit on the other surface of the substrate board, and the via hole penetrating the surface of the upper layer circuit and the surface of the lower layer circuit, the via hole contains a conductor
  • the upper-layer circuit at least includes: an upper-layer transmission portion and an upper-layer connection portion electrically connected to the upper-layer transmission portion
  • the lower-layer circuit at least includes: a lower-layer transmission portion and A lower connection part electrically connected to the lower transmission part, the upper connection part and the lower connection part respectively cover both sides of the same part of the base plate to form a circuit board connection part;
  • the circuit board connection portion is provided with at least two through holes, and the upper layer circuit and the lower layer circuit are electrically connected through the conductor in the through hole.
  • the circuit board connection portion is provided with at least two through holes.
  • the via hole is provided with a first via hole and a second via hole, and the first via hole and the second via hole are arranged on the circuit board connecting portion toward the The upper line extends on the same horizontal line as the connection.
  • the electrical conductor is attached to the sidewall of the via hole, one end of the electrical conductor perpendicularly penetrates the surface of the lower line from the surface of the upper line, and one end of the electrical conductor is connected to the surface of the lower line.
  • the upper layer circuit is electrically connected, and the other end of the conductor is electrically connected with the lower layer circuit.
  • the conductive body is a cylindrical conductive ring, and the outer side surface of the conductive ring is attached to the side wall of the via hole.
  • the conductive body is a strip-shaped conductive strip, and one side of the conductive strip is attached to the side wall of the via hole.
  • the material of the conductor is a copper material.
  • the beneficial effect of the present invention is to provide a flexible circuit board, the flexible circuit board comprising: a substrate board, an upper circuit fixed on a surface of the substrate board, fixed on the opposite side of the upper circuit
  • the lower layer circuit on the other surface of the substrate board and the via hole penetrating the surface of the upper layer circuit and the surface of the lower layer circuit, the via hole contains a conductor
  • the upper layer circuit and the lower layer The circuit is electrically connected by the conductor in the via hole
  • the upper layer circuit at least includes: an upper layer transmission portion and an upper layer connection portion electrically connected to the upper layer transmission portion
  • the lower layer circuit at least includes: a lower layer transmission portion And a lower connection part electrically connected to the lower transmission part, the upper connection part and the lower connection part respectively cover both sides of the same part of the base plate to form a circuit board connection part;
  • the circuit board connection The portion is provided with at least two through holes, and the upper layer circuit and the lower layer circuit are electrically connected through the conductor in the through hole.
  • the through holes can be prevented from being damaged and the electrical connection between the upper layer circuit and the lower layer circuit is blocked, and the upper layer is improved. The reliability of the connection between the circuit and the lower-layer circuit.
  • Figure 1 is a schematic diagram of the front structure of a flexible circuit board provided by the utility model
  • Figure 2 is a schematic diagram of the backside structure of a flexible circuit board provided by the utility model
  • Figure 3 is a partial enlarged view of the front structure schematic diagram of the flexible circuit board of the present invention.
  • Fig. 4 is a partial enlarged view of the schematic diagram of the back structure of the flexible circuit board of the present invention.
  • the purpose of the utility model is to provide a flexible circuit board to solve the technical problem that the through holes are easily damaged or the partial holes are broken in the prior art, which causes the upper and lower layers to fail to conduct.
  • Figure 1 is a schematic diagram of the front structure of a flexible circuit board provided by the present invention
  • Figure 2 is a schematic diagram of the back structure of a flexible circuit board provided by the present invention
  • Figure 3 It is a partial enlarged view of the schematic diagram of the front structure of the flexible circuit board of the present invention
  • FIG. 4 is a partial enlarged view of the schematic diagram of the back structure of the flexible circuit board of the present invention.
  • a flexible circuit board comprising: a substrate board 11, an upper circuit 12 fixed on one surface of the substrate board 11, and a substrate board fixed on the opposite side of the upper circuit 12 11
  • the lower layer circuit 13 on the other surface, and the via hole 14 penetrating the surface of the upper layer circuit 12 and the surface of the lower layer circuit 13, the via hole 14 contains a conductor, and the upper layer circuit 12 and the lower layer circuit 13 pass through the via hole 14
  • the upper layer line 12 includes at least: an upper layer transmission portion 121 and an upper layer connection portion 122 electrically connected to the upper layer transmission portion 121
  • the lower layer line 13 at least includes: a lower layer transmission portion 131 and an upper layer connection portion 131 electrically connected to the lower layer transmission portion 131
  • the lower connection portion 132, the upper connection portion 122 and the lower connection portion 132 respectively cover both sides of the same part of the base plate 11 to form a circuit board connection portion;
  • the circuit board connection portion is provided with at least two via holes 14, and the upper layer circuit 12 and the lower layer circuit 13 are electrically connected through the conductor in the via hole 14.
  • the flexible circuit board includes: a substrate board 11, an upper circuit 12 and a lower circuit 13 located on the front and back of the substrate board 11, an upper connection portion 122 of the upper circuit and a lower connection portion of the lower circuit 132 respectively covers both sides of the same part of the base plate 11, and the covered same part is used as the circuit board connection part.
  • the circuit board connection part structurally includes at least the upper layer connection part 122 and the part covered by both sides of the base plate 11
  • the lower connection portion 132 is provided with a plurality of via holes 14 containing conductors in the circuit board connection portion.
  • the via hole 14 can be made by laser hole formation or plasma etching, etc.
  • the via hole 14 When the via hole 14 is made, it is necessary to drill the upper connection portion 122 of the circuit board connection portion, the part covered by both sides of the base plate 11, and the lower connection portion 132 together, so that the via hole 14 penetrates the circuit board connection Part; and a conductor is provided in the via hole 14, so that the upper layer circuit 12 is electrically connected to the lower layer circuit 13 through the conductor in the via hole 14.
  • the circuit board connection part is provided with at least two via holes 14.
  • a plurality of through holes 14 may be provided in the circuit board connection part.
  • the circuit board connection part in this embodiment is provided with at least two through holes 14 to effectively avoid one of them.
  • the via hole 14 is damaged or part of the hole is broken, causing the upper-layer circuit 12 and the lower-layer circuit 13 to be unable to be electrically connected or to be blocked; the arrangement of the via-hole 14 in this embodiment can improve the distance between the upper-layer circuit 12 and the lower-layer circuit 13 The electrical connection increases reliability.
  • the via hole 14 is provided with a first via hole 141 and a second via hole 142.
  • the first via hole 141 and the second via hole 142 are arranged in the circuit board connection part to extend and connect to the upper layer circuit 12.
  • the horizontal line in the same direction.
  • the arrangement of the multiple vias 14 in the circuit board connection part should consider the flexibility of the upper circuit 12 and the lower circuit 13 on the flexible circuit board, so as to minimize the flexibility of the flexible circuit board or
  • the upper layer circuit 12 and the lower layer circuit 13 are broken or cracked; preferably, this embodiment includes a first via 141 and a second via 142, and the circuit board connection portion includes: an upper circuit board connection portion and a lower circuit board In the connecting portion, the first via hole 141 and the second via hole 142 are arranged on the same horizontal line in the same direction that the upper layer circuit board connection portion extends and connects to the upper layer circuit 12.
  • first via hole 141 and the second via hole 141 The two vias 142 are also arranged on the same horizontal line in the same direction that the lower circuit board connection portion extends and connects to the lower layer circuit 13, wherein the first via hole 141 is located at the circuit board connection portion near the extension connection with the upper circuit 12 One end, and the second through hole 142 is located at the end of the circuit board connection part away from the extended connection with the upper layer circuit 12.
  • the electrical conductor is attached to the sidewall of the via hole 14, one end of the electrical conductor penetrates from the surface of the upper connection portion 122 to the surface of the lower connection portion 132 perpendicularly, and one end of the electrical conductor is electrically connected to the upper connection portion 122. The other end of the body is electrically connected to the lower connection portion 132.
  • the conductive body is a cylindrical conductive ring, and the outer side of the conductive ring is attached to the side wall of the through hole 14.
  • the conductive body in the through hole 14 may be a cylindrical conductive ring.
  • the conductive ring is a hollow cylindrical conductive body, the outer side of the conductive ring is attached to the side wall of the through hole 14, and the cross section of the conductive ring and the cross section of the through hole 14 are on the same horizontal plane, and The cross-sections are all round; one end of the conductive ring is electrically connected to the upper connection portion 122, and extends vertically from the end connected to the upper connection portion 122 to the lower connection portion 132, and is electrically connected to the lower connection portion 132.
  • the conductive body is a strip-shaped conductive strip, and the conductive strip is attached to the side wall of the via hole 14.
  • the conductive body in the via hole 14 can be a strip-shaped conductive strip.
  • the conductive strip is a strip-shaped conductive body with conductive properties.
  • the conductive strip can be a wire, a tin strip, or a conductive strip.
  • Conductors with conductive properties, such as a sheet, preferably, a strip-shaped conductive sheet is used in this embodiment.
  • One end of the conductive strip is electrically connected to the upper connection portion 122 and extends vertically from the end connected to the upper connection portion 122 to the lower connection Part 132, and is electrically connected to the lower connection part 132.
  • the material of the conductor is copper material.
  • the conductor in the via hole 14 is made of Cu (copper) material. Because the copper material product has better conductivity and has certain flexibility, it can realize the upper circuit 12 and the lower layer.
  • the circuit 13 is conductive, and at the same time, the reliability of the process of making the via hole 14 is improved, and the damage of the via hole 14 is avoided to a certain extent;
  • the conductor of the above embodiment is made of copper material, such as the conductive ring and the conductive strip in the above embodiment , So that the upper layer circuit 12 and the lower layer circuit 13 of the flexible circuit board are electrically connected by a copper conductor with better conductivity.
  • the utility model provides a flexible circuit board.
  • the flexible circuit board includes a substrate board, an upper circuit fixed on one surface of the substrate board, a lower circuit fixed on the other surface of the substrate board opposite to the upper circuit, and a self-contained circuit board.
  • the surface of the upper layer circuit is a via hole penetrating the surface of the lower layer circuit.
  • the via hole contains a conductor.
  • the upper layer circuit and the lower layer circuit are electrically connected by the conductor in the via hole.
  • the upper layer circuit at least includes: an upper layer transmission part and an upper layer
  • the lower circuit at least includes: a lower transmission part and a lower connection part electrically connected to the lower transmission part, the upper connection part and the lower connection part respectively cover both sides of the same part of the base plate to form a circuit Board connection part;
  • the circuit board connection part is provided with a plurality of through holes, the through holes respectively penetrate from the surface of the upper circuit to the surface of the lower circuit, so that the upper circuit and the lower circuit are electrically connected through the conductor in the through hole.
  • the through holes can be prevented from being damaged and the electrical connection between the upper layer line and the lower layer line is blocked, and the reliability of the conduction of the upper layer line and the lower layer line is improved.

Abstract

Provided is a flexible circuit board, including: a substrate (11), an upper circuit (12) and a lower circuit (13) being fixed on the substrate (11), and a conduction hole (14) penetrating the surface of the upper circuit (12) and the surface of the lower circuit (13); the conduction hole (14) contains a conductor, the upper layer circuit (12) and the lower layer circuit (13) are electrically connected by means of the conductor; the upper layer circuit (12) at least comprises: an upper layer transmission part (121) and an upper layer connection part (122) electrically connected to the upper layer transmission part (121); the lower layer circuit (13) at least comprises: a lower layer transmission part (131) and a lower layer connection part (132) electrically connected to the lower layer transmission part (131), the upper layer connecting part (122) and the lower layer connection part (132) respectively covering the two sides of the same part of the substrate (11) to form a circuit board connection part; the circuit board connection part is provided with at least two conduction holes (14), and the upper layer circuit (12) and the lower layer circuit (13) are electrically connected by means of the conductor in the conduction holes (14). The plurality of conduction holes can prevent the electrical connection between the upper layer circuit (12) and the lower layer circuit (13) being blocked as a result of damage to the conduction holes, thus the reliability of the conduction between the upper layer circuit (12) and the lower layer circuit (13) is improved.

Description

一种柔性电路板Flexible circuit board 技术领域Technical field
本实用新型涉及柔性电路板导通孔领域,尤其涉及一种柔性电路板。The utility model relates to the field of through holes of flexible circuit boards, in particular to a flexible circuit board.
背景技术Background technique
FPC(Flexible Printed Circuit,柔性电路板)在设计上一般分为双面板或多面板。具体的,柔性电路板是由上层线路、下层线路和基材板组成,上层线路和下层线路分别设于基材板的正面和背面,通过上层线路和下层线路电连接,从而形成回路。FPC(Flexible Printed Circuit (flexible circuit board) is generally divided into double-panel or multi-panel in design. Specifically, the flexible circuit board is composed of an upper circuit, a lower circuit and a substrate board. The upper circuit and the lower circuit are respectively arranged on the front and back of the substrate board, and are electrically connected by the upper circuit and the lower circuit to form a loop.
现有技术通常是在基材板的正面和背面分别对称设有设有一个导通孔,使得上层线路和下层线路通过导通孔形成电连接,从而形成回路。但是,在加工制作过程中,导通孔会因导通孔内存在残胶异物等杂质,使得导通孔容易破坏或局部孔破,导致上下层线路无法导通或存在可靠性风险。In the prior art, a through hole is usually provided symmetrically on the front and back of the substrate plate, so that the upper layer circuit and the lower layer circuit are electrically connected through the through hole, thereby forming a loop. However, in the process of processing, the via holes may be easily damaged or partially broken due to the presence of foreign matter and other impurities in the via holes, which may cause the upper and lower layers to fail to conduct or present reliability risks.
因此,有必要提供一种新的柔性电路板。Therefore, it is necessary to provide a new flexible circuit board.
技术问题technical problem
本实用新型的目的在于提供一种柔性电路板,以解决现有技术中导通孔容易破坏或局部孔破导致上下层线路无法导通的技术问题。The purpose of the utility model is to provide a flexible circuit board to solve the technical problem that the through holes are easily damaged or the partial holes are broken in the prior art, which causes the upper and lower layers to fail to conduct.
技术解决方案Technical solutions
本实用新型的技术方案如下:一种柔性电路板,所述柔性电路板包含:基材板、固定于所述基材板一表面的上层线路、固定于与所述上层线路相背的所述基材板另一表面的下层线路、及贯穿于所述上层线路的表面及所述下层线路的表面的导通孔,所述导通孔内包含导电体,所述上层线路与所述下层线路通过所述导通孔内的所述导电体电连接,所述上层线路至少包括:上层传输部及与所述上层传输部电连接的上层连接部,所述下层线路至少包括:下层传输部及与所述下层传输部电连接的下层连接部,所述上层连接部及所述下层连接部分别覆盖所述基材板的同一部位的两面,以形成电路板连接部;The technical solution of the present invention is as follows: a flexible circuit board comprising: a substrate board, an upper circuit fixed on one surface of the substrate board, and the upper circuit fixed on the opposite side of the upper circuit The lower layer circuit on the other surface of the substrate board, and the via hole penetrating the surface of the upper layer circuit and the surface of the lower layer circuit, the via hole contains a conductor, the upper layer circuit and the lower layer circuit Through the electrical connection of the conductor in the via hole, the upper-layer circuit at least includes: an upper-layer transmission portion and an upper-layer connection portion electrically connected to the upper-layer transmission portion, and the lower-layer circuit at least includes: a lower-layer transmission portion and A lower connection part electrically connected to the lower transmission part, the upper connection part and the lower connection part respectively cover both sides of the same part of the base plate to form a circuit board connection part;
所述电路板连接部设有至少两个所述导通孔,所述上层线路与所述下层线路通过所述导通孔内的导电体电连接。The circuit board connection portion is provided with at least two through holes, and the upper layer circuit and the lower layer circuit are electrically connected through the conductor in the through hole.
可选的,所述电路板连接部至少设有2个所述导通孔。Optionally, the circuit board connection portion is provided with at least two through holes.
可选的,所述导通孔设有第一导通孔及第二导通孔,所述第一导通孔及所述第二导通孔排布于所述电路板连接部向所述上层线路延伸连接的相同水平线上。Optionally, the via hole is provided with a first via hole and a second via hole, and the first via hole and the second via hole are arranged on the circuit board connecting portion toward the The upper line extends on the same horizontal line as the connection.
可选的,所述导电体与所述导通孔的侧壁贴合,所述导电体的一端自所述上层线路的表面垂直贯穿于所述下层线路的表面,所述导电体的一端与所述上层线路电连接,所述导电体的另一端与所述下层线路电连接。Optionally, the electrical conductor is attached to the sidewall of the via hole, one end of the electrical conductor perpendicularly penetrates the surface of the lower line from the surface of the upper line, and one end of the electrical conductor is connected to the surface of the lower line. The upper layer circuit is electrically connected, and the other end of the conductor is electrically connected with the lower layer circuit.
可选的,所述导电体为圆筒状的导电环,所述导电环的外侧面与所述导通孔的侧壁贴合。Optionally, the conductive body is a cylindrical conductive ring, and the outer side surface of the conductive ring is attached to the side wall of the via hole.
可选的,所述导电体为条状的导电条,所述导电条的一面与所述导通孔的侧壁贴合。Optionally, the conductive body is a strip-shaped conductive strip, and one side of the conductive strip is attached to the side wall of the via hole.
可选的,所述导电体的材质为铜质材料。Optionally, the material of the conductor is a copper material.
有益效果Beneficial effect
本实用新型的有益效果在于:提供一种柔性电路板,所述柔性电路板包含:基材板、固定于所述基材板一表面的上层线路、固定于与所述上层线路相背的所述基材板另一表面的下层线路、及贯穿于所述上层线路的表面及所述下层线路的表面的导通孔,所述导通孔内包含导电体,所述上层线路与所述下层线路通过所述导通孔内的所述导电体电连接,所述上层线路至少包括:上层传输部及与所述上层传输部电连接的上层连接部,所述下层线路至少包括:下层传输部及与所述下层传输部电连接的下层连接部,所述上层连接部及所述下层连接部分别覆盖所述基材板的同一部位的两面,以形成电路板连接部;所述电路板连接部设有至少两个所述导通孔,所述上层线路与所述下层线路通过所述导通孔内的导电体电连接。通过在所述柔性电路板的电路板连接部设置多个所述导通孔,可防止所述导通孔损坏导致所述上层线路与所述下层线路的电连接阻断,提高了所述上层线路与所述下层线路导通的可靠性。The beneficial effect of the present invention is to provide a flexible circuit board, the flexible circuit board comprising: a substrate board, an upper circuit fixed on a surface of the substrate board, fixed on the opposite side of the upper circuit The lower layer circuit on the other surface of the substrate board and the via hole penetrating the surface of the upper layer circuit and the surface of the lower layer circuit, the via hole contains a conductor, the upper layer circuit and the lower layer The circuit is electrically connected by the conductor in the via hole, the upper layer circuit at least includes: an upper layer transmission portion and an upper layer connection portion electrically connected to the upper layer transmission portion, and the lower layer circuit at least includes: a lower layer transmission portion And a lower connection part electrically connected to the lower transmission part, the upper connection part and the lower connection part respectively cover both sides of the same part of the base plate to form a circuit board connection part; the circuit board connection The portion is provided with at least two through holes, and the upper layer circuit and the lower layer circuit are electrically connected through the conductor in the through hole. By arranging a plurality of through holes in the circuit board connection part of the flexible circuit board, the through holes can be prevented from being damaged and the electrical connection between the upper layer circuit and the lower layer circuit is blocked, and the upper layer is improved. The reliability of the connection between the circuit and the lower-layer circuit.
附图说明Description of the drawings
图1为本实用新型提供的一种柔性电路板正面结构示意图; Figure 1 is a schematic diagram of the front structure of a flexible circuit board provided by the utility model;
图2为本实用新型提供的一种柔性电路板背面结构示意图;Figure 2 is a schematic diagram of the backside structure of a flexible circuit board provided by the utility model;
图3为本实用新型的柔性电路板正面结构示意图的局部放大图;Figure 3 is a partial enlarged view of the front structure schematic diagram of the flexible circuit board of the present invention;
图4为本实用新型的柔性电路板背面结构示意图的局部放大图。Fig. 4 is a partial enlarged view of the schematic diagram of the back structure of the flexible circuit board of the present invention.
本发明的实施方式Embodiments of the present invention
下面结合附图和实施方式对本实用新型作进一步说明。The present utility model will be further explained below in conjunction with the drawings and embodiments.
本实用新型的目的在于提供一种柔性电路板,以解决现有技术中导通孔容易破坏或局部孔破导致上下层线路无法导通的技术问题。The purpose of the utility model is to provide a flexible circuit board to solve the technical problem that the through holes are easily damaged or the partial holes are broken in the prior art, which causes the upper and lower layers to fail to conduct.
请参阅图1、图2、图3及图4,图1为本实用新型提供的一种柔性电路板正面结构示意图,图2为本实用新型提供的一种柔性电路板背面结构示意图,图3为本实用新型的柔性电路板正面结构示意图的局部放大图,图4为本实用新型的柔性电路板背面结构示意图的局部放大图。Please refer to Figure 1, Figure 2, Figure 3 and Figure 4. Figure 1 is a schematic diagram of the front structure of a flexible circuit board provided by the present invention, and Figure 2 is a schematic diagram of the back structure of a flexible circuit board provided by the present invention. Figure 3 It is a partial enlarged view of the schematic diagram of the front structure of the flexible circuit board of the present invention, and FIG. 4 is a partial enlarged view of the schematic diagram of the back structure of the flexible circuit board of the present invention.
本实用新型的技术方案如下:一种柔性电路板,该柔性电路板包含:基材板11、固定于基材板11一表面的上层线路12、固定于与上层线路12相背的基材板11另一表面的下层线路13、及贯穿于上层线路12的表面及下层线路13的表面的导通孔14,导通孔14内包含导电体,上层线路12与下层线路13通过导通孔14内的导电体电连接,上层线路12至少包括:上层传输部121及与上层传输部121电连接的上层连接部122,下层线路13至少包括:下层传输部131及与下层传输部131电连接的下层连接部132,上层连接部122及下层连接部132分别覆盖基材板11的同一部位的两面,以形成电路板连接部;The technical solution of the present invention is as follows: a flexible circuit board comprising: a substrate board 11, an upper circuit 12 fixed on one surface of the substrate board 11, and a substrate board fixed on the opposite side of the upper circuit 12 11 The lower layer circuit 13 on the other surface, and the via hole 14 penetrating the surface of the upper layer circuit 12 and the surface of the lower layer circuit 13, the via hole 14 contains a conductor, and the upper layer circuit 12 and the lower layer circuit 13 pass through the via hole 14 The upper layer line 12 includes at least: an upper layer transmission portion 121 and an upper layer connection portion 122 electrically connected to the upper layer transmission portion 121, and the lower layer line 13 at least includes: a lower layer transmission portion 131 and an upper layer connection portion 131 electrically connected to the lower layer transmission portion 131 The lower connection portion 132, the upper connection portion 122 and the lower connection portion 132 respectively cover both sides of the same part of the base plate 11 to form a circuit board connection portion;
电路板连接部设有至少两个导通孔14,上层线路12与下层线路13通过导通孔14内的导电体电连接。The circuit board connection portion is provided with at least two via holes 14, and the upper layer circuit 12 and the lower layer circuit 13 are electrically connected through the conductor in the via hole 14.
在本实用新型的实施例中,该柔性电路板包括:基材板11、位于基材板11正反面的上层线路12及下层线路13,上层电路的上层连接部122与下层电路的下层连接部132分别覆盖基材板11的同一部位的两面,以覆盖的同一部位作为电路板连接部,该电路板连接部在结构上至少包括:上层连接部122、基材板11的两面都覆盖的部位、下层连接部132,通过在电路板连接部设置包含导电体的多个导通孔14,该导通孔14的工艺制作方式可以通过激光成孔或等离子体蚀孔等方式,应当注意的是,在制作导通孔14时,需要将电路板连接部的上层连接部122、基材板11的两面都覆盖的部位及下层连接部132一起钻孔,使得导通孔14贯穿于电路板连接部;并在导通孔14内设置导电体,使得上层线路12通过导通孔14内的导电体与下层线路13电连接。In the embodiment of the present invention, the flexible circuit board includes: a substrate board 11, an upper circuit 12 and a lower circuit 13 located on the front and back of the substrate board 11, an upper connection portion 122 of the upper circuit and a lower connection portion of the lower circuit 132 respectively covers both sides of the same part of the base plate 11, and the covered same part is used as the circuit board connection part. The circuit board connection part structurally includes at least the upper layer connection part 122 and the part covered by both sides of the base plate 11 The lower connection portion 132 is provided with a plurality of via holes 14 containing conductors in the circuit board connection portion. The via hole 14 can be made by laser hole formation or plasma etching, etc. It should be noted that When the via hole 14 is made, it is necessary to drill the upper connection portion 122 of the circuit board connection portion, the part covered by both sides of the base plate 11, and the lower connection portion 132 together, so that the via hole 14 penetrates the circuit board connection Part; and a conductor is provided in the via hole 14, so that the upper layer circuit 12 is electrically connected to the lower layer circuit 13 through the conductor in the via hole 14.
进一步的,电路板连接部至少设有2个导通孔14。在本实用新型的实施例中,可在电路板连接部设置多个导通孔14,优选的,本实施例中的电路板连接部至少设有2个导通孔14,有效避免因其中一个导通孔14损坏或部分孔破导致上层线路12与下层线路13之间无法电连接或电连接阻断;通过本实施例的导通孔14设置方式能够提高上层线路12与下层线路13之间的电连接,增加了可靠性。Furthermore, the circuit board connection part is provided with at least two via holes 14. In the embodiment of the present invention, a plurality of through holes 14 may be provided in the circuit board connection part. Preferably, the circuit board connection part in this embodiment is provided with at least two through holes 14 to effectively avoid one of them. The via hole 14 is damaged or part of the hole is broken, causing the upper-layer circuit 12 and the lower-layer circuit 13 to be unable to be electrically connected or to be blocked; the arrangement of the via-hole 14 in this embodiment can improve the distance between the upper-layer circuit 12 and the lower-layer circuit 13 The electrical connection increases reliability.
进一步的,导通孔14设有第一导通孔141及第二导通孔142,第一导通孔141及第二导通孔142排布于电路板连接部向上层线路12延伸连接的相同方向的水平线上。在本实用新型的实施例中,在多个导通孔14在电路板连接部的排布方式应当考虑柔性电路板上的上层线路12和下层线路13的柔韧度,最大程度降低柔性电路板或上层线路12和下层线路13的断裂或破裂问题;优选的,本实施例包含第一导通孔141及第二导通孔142,该电路板连接部包括:上层电路板连接部及下层电路板连接部,将第一导通孔141及第二导通孔142设置排布于上层电路板连接部向上层线路12延伸连接的相同方向的同一水平线上,同时,第一导通孔141及第二导通孔142也是设置排布于下层电路板连接部向下层线路13延伸连接的相同方向的同一水平线上,其中,第一导通孔141位于电路板连接部靠近与上层线路12延伸连接的一端,而第二导通孔142位于电路板连接部远离与上层线路12延伸连接的一端。Further, the via hole 14 is provided with a first via hole 141 and a second via hole 142. The first via hole 141 and the second via hole 142 are arranged in the circuit board connection part to extend and connect to the upper layer circuit 12. The horizontal line in the same direction. In the embodiment of the present invention, the arrangement of the multiple vias 14 in the circuit board connection part should consider the flexibility of the upper circuit 12 and the lower circuit 13 on the flexible circuit board, so as to minimize the flexibility of the flexible circuit board or The upper layer circuit 12 and the lower layer circuit 13 are broken or cracked; preferably, this embodiment includes a first via 141 and a second via 142, and the circuit board connection portion includes: an upper circuit board connection portion and a lower circuit board In the connecting portion, the first via hole 141 and the second via hole 142 are arranged on the same horizontal line in the same direction that the upper layer circuit board connection portion extends and connects to the upper layer circuit 12. At the same time, the first via hole 141 and the second via hole 141 The two vias 142 are also arranged on the same horizontal line in the same direction that the lower circuit board connection portion extends and connects to the lower layer circuit 13, wherein the first via hole 141 is located at the circuit board connection portion near the extension connection with the upper circuit 12 One end, and the second through hole 142 is located at the end of the circuit board connection part away from the extended connection with the upper layer circuit 12.
进一步的,导电体与导通孔14的侧壁贴合,导电体的一端自上层连接部122的表面垂直贯穿于下层连接部132的表面,导电体的一端与上层连接部122电连接,导电体的另一端与下层连接部132电连接。Further, the electrical conductor is attached to the sidewall of the via hole 14, one end of the electrical conductor penetrates from the surface of the upper connection portion 122 to the surface of the lower connection portion 132 perpendicularly, and one end of the electrical conductor is electrically connected to the upper connection portion 122. The other end of the body is electrically connected to the lower connection portion 132.
进一步的,导电体为圆筒状的导电环,导电环的外侧面与导通孔14的侧壁贴合,在本实施例中,导通孔14内的导电体可为圆筒状的导电环,该导电环为具有空心的圆筒导电体,导电环的外侧面与导通孔14的侧壁贴合,及导电环的横截面与导通孔14的横截面处于同一水平面,且其横截面都为圆形状;该导电环的一端与上层连接部122电连接,且自与上层连接部122连接的一端垂直延伸至下层连接部132,并与下层连接部132电连接。Further, the conductive body is a cylindrical conductive ring, and the outer side of the conductive ring is attached to the side wall of the through hole 14. In this embodiment, the conductive body in the through hole 14 may be a cylindrical conductive ring. The conductive ring is a hollow cylindrical conductive body, the outer side of the conductive ring is attached to the side wall of the through hole 14, and the cross section of the conductive ring and the cross section of the through hole 14 are on the same horizontal plane, and The cross-sections are all round; one end of the conductive ring is electrically connected to the upper connection portion 122, and extends vertically from the end connected to the upper connection portion 122 to the lower connection portion 132, and is electrically connected to the lower connection portion 132.
进一步的,导电体为条状的导电条,导电条与导通孔14的侧壁贴合。在本实施例中,导通孔14内的导电体可选用条状的导电条,该导电条为具有导电性能的条状导电体,该具体的,该导电条可为导线、锡条、导电片等具有导电属性的导电体,优选的,本实施例选用条状的导电片,该导电条的一端与上层连接部122电连接,且自与上层连接部122连接的一端垂直延伸至下层连接部132,并与下层连接部132电连接。Further, the conductive body is a strip-shaped conductive strip, and the conductive strip is attached to the side wall of the via hole 14. In this embodiment, the conductive body in the via hole 14 can be a strip-shaped conductive strip. The conductive strip is a strip-shaped conductive body with conductive properties. Specifically, the conductive strip can be a wire, a tin strip, or a conductive strip. Conductors with conductive properties, such as a sheet, preferably, a strip-shaped conductive sheet is used in this embodiment. One end of the conductive strip is electrically connected to the upper connection portion 122 and extends vertically from the end connected to the upper connection portion 122 to the lower connection Part 132, and is electrically connected to the lower connection part 132.
进一步的,导电体的材质为铜质材料。在本实施例中,导通孔14内的导电体选用Cu(铜)质材料制作导电体,由于铜质材料制品的导电性能较好,且具有一定的柔韧性,可实现上层线路12与下层线路13导通,同时提高制作导通孔14工艺的可靠性,一定程度上避免导通孔14损坏;通过铜质材料制作上述实施例的导电体,如上述实施例中的导电环、导电条,使得柔性电路板的上层线路12与下层线路13之间通过具有较好导电性能的铜质导电体电连接。Further, the material of the conductor is copper material. In this embodiment, the conductor in the via hole 14 is made of Cu (copper) material. Because the copper material product has better conductivity and has certain flexibility, it can realize the upper circuit 12 and the lower layer. The circuit 13 is conductive, and at the same time, the reliability of the process of making the via hole 14 is improved, and the damage of the via hole 14 is avoided to a certain extent; the conductor of the above embodiment is made of copper material, such as the conductive ring and the conductive strip in the above embodiment , So that the upper layer circuit 12 and the lower layer circuit 13 of the flexible circuit board are electrically connected by a copper conductor with better conductivity.
本实用新型提供一种柔性电路板,柔性电路板包含:基材板、固定于基材板一表面的上层线路、固定于与上层线路相背的基材板另一表面的下层线路、及自上层线路的表面向下层线路的表面贯穿的导通孔,导通孔内包含导电体,上层线路与下层线路通过导通孔内的导电体电连接,上层线路至少包括:上层传输部及与上层传输部电连接的上层连接部,下层线路至少包括:下层传输部及与下层传输部电连接的下层连接部,上层连接部及下层连接部分别覆盖基材板的同一部位的两面,以形成电路板连接部;电路板连接部设有多个导通孔,导通孔分别自上层线路的表面向下层线路的表面贯穿,使得上层线路与下层线路通过导通孔内的导电体电连接。通过在柔性电路板的电路板连接部设置多个导通孔,可防止导通孔损坏导致上层线路与下层线路的电连接阻断,提高了上层线路与下层线路导通的可靠性。The utility model provides a flexible circuit board. The flexible circuit board includes a substrate board, an upper circuit fixed on one surface of the substrate board, a lower circuit fixed on the other surface of the substrate board opposite to the upper circuit, and a self-contained circuit board. The surface of the upper layer circuit is a via hole penetrating the surface of the lower layer circuit. The via hole contains a conductor. The upper layer circuit and the lower layer circuit are electrically connected by the conductor in the via hole. The upper layer circuit at least includes: an upper layer transmission part and an upper layer The upper connection part electrically connected to the transmission part, the lower circuit at least includes: a lower transmission part and a lower connection part electrically connected to the lower transmission part, the upper connection part and the lower connection part respectively cover both sides of the same part of the base plate to form a circuit Board connection part; the circuit board connection part is provided with a plurality of through holes, the through holes respectively penetrate from the surface of the upper circuit to the surface of the lower circuit, so that the upper circuit and the lower circuit are electrically connected through the conductor in the through hole. By arranging a plurality of through holes in the circuit board connection part of the flexible circuit board, the through holes can be prevented from being damaged and the electrical connection between the upper layer line and the lower layer line is blocked, and the reliability of the conduction of the upper layer line and the lower layer line is improved.
以上所述的仅是本实用新型的实施方式,在此应当指出,对于本领域的普通技术人员来说,在不脱离本实用新型创造构思的前提下,还可以做出改进,但这些均属于本实用新型的保护范围。The above are only the embodiments of the present utility model. It should be pointed out here that for those of ordinary skill in the art, improvements can be made without departing from the inventive concept of the present utility model, but these all belong to The scope of protection of the utility model.

Claims (7)

  1. 一种柔性电路板,所述柔性电路板包含:基材板、固定于所述基材板一表面的上层线路、固定于所述基材板另一表面的下层线路、及贯穿于所述上层线路的表面及所述下层线路的表面的导通孔,所述导通孔内包含导电体,所述上层线路与所述下层线路通过所述导通孔内的所述导电体电连接,其特征在于,所述上层线路至少包括:上层传输部及与所述上层传输部电连接的上层连接部,所述下层线路至少包括:下层传输部及与所述下层传输部电连接的下层连接部,所述上层连接部及所述下层连接部分别覆盖所述基材板的同一部位的两面,以形成电路板连接部;A flexible circuit board, the flexible circuit board comprising: a substrate board, an upper circuit fixed on one surface of the substrate board, a lower circuit fixed on the other surface of the substrate board, and penetrating through the upper layer The via hole on the surface of the circuit and the surface of the lower layer circuit, the via hole contains a conductor, the upper layer circuit and the lower layer circuit are electrically connected by the conductor in the via hole, and It is characterized in that the upper layer line at least includes: an upper layer transmission part and an upper layer connection part electrically connected to the upper layer transmission part, and the lower layer line at least includes: a lower layer transmission part and a lower layer connection part electrically connected to the lower layer transmission part , The upper connecting portion and the lower connecting portion respectively cover both sides of the same part of the base plate to form a circuit board connecting portion;
    所述电路板连接部设有至少两个所述导通孔,所述上层线路与所述下层线路通过所述导通孔内的导电体电连接。The circuit board connection portion is provided with at least two through holes, and the upper layer circuit and the lower layer circuit are electrically connected through the conductor in the through hole.
  2. 根据权利要求1所述的柔性电路板,其特征在于,所述电路板连接部设有2个所述导通孔。The flexible circuit board according to claim 1, wherein the circuit board connection portion is provided with two through holes.
  3. 根据权利要求2所述的柔性电路板,其特征在于,所述导通孔设有第一导通孔及第二导通孔,所述第一导通孔及所述第二导通孔排布于所述电路板连接部向所述上层线路延伸连接的相同水平线上。The flexible circuit board according to claim 2, wherein the via hole is provided with a first via hole and a second via hole, the first via hole and the second via hole row They are arranged on the same horizontal line extending and connecting the circuit board connection part to the upper layer circuit.
  4. 根据权利要求1所述的柔性电路板,其特征在于,所述导电体与所述导通孔的侧壁贴合,所述导电体的一端自所述上层线路的表面垂直贯穿于所述下层线路的表面,所述导电体的一端与所述上层线路电连接,所述导电体的另一端与所述下层线路电连接。The flexible circuit board according to claim 1, wherein the conductive body is attached to the side wall of the via hole, and one end of the conductive body penetrates the lower layer perpendicularly from the surface of the upper layer circuit. On the surface of the circuit, one end of the conductor is electrically connected with the upper-layer circuit, and the other end of the conductor is electrically connected with the lower-layer circuit.
  5. 根据权利要求4所述的柔性电路板,其特征在于,所述导电体为圆筒状的导电环,所述导电环的外侧面与所述导通孔的侧壁贴合。4. The flexible circuit board according to claim 4, wherein the conductor is a cylindrical conductive ring, and the outer side surface of the conductive ring is attached to the side wall of the via hole.
  6. 根据权利要求4所述的柔性电路板,其特征在于,所述导电体为条状的导电条,所述导电条的一面与所述导通孔的侧壁贴合。4. The flexible circuit board according to claim 4, wherein the conductive body is a strip-shaped conductive strip, and one side of the conductive strip is attached to the side wall of the via hole.
  7. 根据权利要求5或6所述的柔性电路板,其特征在于,所述导电体的材质为铜质材料。The flexible circuit board according to claim 5 or 6, wherein the material of the conductor is a copper material.
PCT/CN2019/125933 2019-12-17 2019-12-17 Flexible circuit board WO2021119990A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2019/125933 WO2021119990A1 (en) 2019-12-17 2019-12-17 Flexible circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2019/125933 WO2021119990A1 (en) 2019-12-17 2019-12-17 Flexible circuit board

Publications (1)

Publication Number Publication Date
WO2021119990A1 true WO2021119990A1 (en) 2021-06-24

Family

ID=76476891

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/125933 WO2021119990A1 (en) 2019-12-17 2019-12-17 Flexible circuit board

Country Status (1)

Country Link
WO (1) WO2021119990A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001127392A (en) * 1999-10-26 2001-05-11 Sansha Electric Mfg Co Ltd Printed-wiring board
DE102004052495A1 (en) * 2004-10-28 2006-05-11 Walter Mayer Printed circuit board (PCB) has auxiliary conductive strip arranged on front side and pivoted to conductive strip on back side rotated at an angle greater than zero degrees
CN101296556A (en) * 2007-04-25 2008-10-29 群康科技(深圳)有限公司 Flexible circuit board
CN103338590A (en) * 2013-06-14 2013-10-02 业成光电(深圳)有限公司 Flexible circuit board and manufacturing method thereof
CN204887669U (en) * 2015-05-26 2015-12-16 深圳市信义隆通讯技术有限公司 Flexible circuit board

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001127392A (en) * 1999-10-26 2001-05-11 Sansha Electric Mfg Co Ltd Printed-wiring board
DE102004052495A1 (en) * 2004-10-28 2006-05-11 Walter Mayer Printed circuit board (PCB) has auxiliary conductive strip arranged on front side and pivoted to conductive strip on back side rotated at an angle greater than zero degrees
CN101296556A (en) * 2007-04-25 2008-10-29 群康科技(深圳)有限公司 Flexible circuit board
CN103338590A (en) * 2013-06-14 2013-10-02 业成光电(深圳)有限公司 Flexible circuit board and manufacturing method thereof
CN204887669U (en) * 2015-05-26 2015-12-16 深圳市信义隆通讯技术有限公司 Flexible circuit board

Similar Documents

Publication Publication Date Title
CN104871654B (en) Electric substrate and its structure of joint connection
TWI531288B (en) Flexible printed circuit board with gold fingers and method for manufacturing same
CN106922072A (en) Flexible PCB and preparation method thereof
US9706640B2 (en) Method for manufacturing printed circuit board
CN207603990U (en) Flexible PCB
CN104427789B (en) Multilayer circuit board and preparation method thereof
US7907418B2 (en) Circuit board including stubless signal paths and method of making same
US20080308302A1 (en) Printed circuit board with anti-oxidation layer
WO2021119990A1 (en) Flexible circuit board
TW201624635A (en) Wiring substrate
CN211531414U (en) Flexible circuit board
TW201316895A (en) Printed circuit board capable of preventing electromagnetic interface
KR102123637B1 (en) Multi-channel connector
CN208480035U (en) Flexible circuit board
CN106488652B (en) Flexible circuit board and preparation method thereof
CN205883714U (en) Flexible circuit board
KR100737262B1 (en) Organic electroluminescent device for preventing long distance short
CN207587726U (en) Integrated circuit package structure
JP2008530798A5 (en)
CN113271726B (en) Three-side gold plating method for gold finger
JP2018163924A (en) Wiring board and method for manufacturing the same
CN114628062B (en) Conductive film and display panel
JPH0695591B2 (en) Flexible circuit board for mounting IC and manufacturing method thereof
CN205961574U (en) High density multilayer PCB circuit board
TWM550960U (en) Flexible printed circuit board

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19956341

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19956341

Country of ref document: EP

Kind code of ref document: A1