WO2021119990A1 - Carte de circuit imprimé flexible - Google Patents

Carte de circuit imprimé flexible Download PDF

Info

Publication number
WO2021119990A1
WO2021119990A1 PCT/CN2019/125933 CN2019125933W WO2021119990A1 WO 2021119990 A1 WO2021119990 A1 WO 2021119990A1 CN 2019125933 W CN2019125933 W CN 2019125933W WO 2021119990 A1 WO2021119990 A1 WO 2021119990A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit
circuit board
via hole
upper layer
electrically connected
Prior art date
Application number
PCT/CN2019/125933
Other languages
English (en)
Chinese (zh)
Inventor
杨桂霞
Original Assignee
瑞声声学科技(深圳)有限公司
瑞声科技(新加坡)有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 瑞声声学科技(深圳)有限公司, 瑞声科技(新加坡)有限公司 filed Critical 瑞声声学科技(深圳)有限公司
Priority to PCT/CN2019/125933 priority Critical patent/WO2021119990A1/fr
Publication of WO2021119990A1 publication Critical patent/WO2021119990A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits

Definitions

  • the utility model relates to the field of through holes of flexible circuit boards, in particular to a flexible circuit board.
  • FPC Flexible Printed Circuit
  • the flexible circuit board is composed of an upper circuit, a lower circuit and a substrate board.
  • the upper circuit and the lower circuit are respectively arranged on the front and back of the substrate board, and are electrically connected by the upper circuit and the lower circuit to form a loop.
  • a through hole is usually provided symmetrically on the front and back of the substrate plate, so that the upper layer circuit and the lower layer circuit are electrically connected through the through hole, thereby forming a loop.
  • the via holes may be easily damaged or partially broken due to the presence of foreign matter and other impurities in the via holes, which may cause the upper and lower layers to fail to conduct or present reliability risks.
  • the purpose of the utility model is to provide a flexible circuit board to solve the technical problem that the through holes are easily damaged or the partial holes are broken in the prior art, which causes the upper and lower layers to fail to conduct.
  • a flexible circuit board comprising: a substrate board, an upper circuit fixed on one surface of the substrate board, and the upper circuit fixed on the opposite side of the upper circuit
  • the lower layer circuit on the other surface of the substrate board, and the via hole penetrating the surface of the upper layer circuit and the surface of the lower layer circuit, the via hole contains a conductor
  • the upper-layer circuit at least includes: an upper-layer transmission portion and an upper-layer connection portion electrically connected to the upper-layer transmission portion
  • the lower-layer circuit at least includes: a lower-layer transmission portion and A lower connection part electrically connected to the lower transmission part, the upper connection part and the lower connection part respectively cover both sides of the same part of the base plate to form a circuit board connection part;
  • the circuit board connection portion is provided with at least two through holes, and the upper layer circuit and the lower layer circuit are electrically connected through the conductor in the through hole.
  • the circuit board connection portion is provided with at least two through holes.
  • the via hole is provided with a first via hole and a second via hole, and the first via hole and the second via hole are arranged on the circuit board connecting portion toward the The upper line extends on the same horizontal line as the connection.
  • the electrical conductor is attached to the sidewall of the via hole, one end of the electrical conductor perpendicularly penetrates the surface of the lower line from the surface of the upper line, and one end of the electrical conductor is connected to the surface of the lower line.
  • the upper layer circuit is electrically connected, and the other end of the conductor is electrically connected with the lower layer circuit.
  • the conductive body is a cylindrical conductive ring, and the outer side surface of the conductive ring is attached to the side wall of the via hole.
  • the conductive body is a strip-shaped conductive strip, and one side of the conductive strip is attached to the side wall of the via hole.
  • the material of the conductor is a copper material.
  • the beneficial effect of the present invention is to provide a flexible circuit board, the flexible circuit board comprising: a substrate board, an upper circuit fixed on a surface of the substrate board, fixed on the opposite side of the upper circuit
  • the lower layer circuit on the other surface of the substrate board and the via hole penetrating the surface of the upper layer circuit and the surface of the lower layer circuit, the via hole contains a conductor
  • the upper layer circuit and the lower layer The circuit is electrically connected by the conductor in the via hole
  • the upper layer circuit at least includes: an upper layer transmission portion and an upper layer connection portion electrically connected to the upper layer transmission portion
  • the lower layer circuit at least includes: a lower layer transmission portion And a lower connection part electrically connected to the lower transmission part, the upper connection part and the lower connection part respectively cover both sides of the same part of the base plate to form a circuit board connection part;
  • the circuit board connection The portion is provided with at least two through holes, and the upper layer circuit and the lower layer circuit are electrically connected through the conductor in the through hole.
  • the through holes can be prevented from being damaged and the electrical connection between the upper layer circuit and the lower layer circuit is blocked, and the upper layer is improved. The reliability of the connection between the circuit and the lower-layer circuit.
  • Figure 1 is a schematic diagram of the front structure of a flexible circuit board provided by the utility model
  • Figure 2 is a schematic diagram of the backside structure of a flexible circuit board provided by the utility model
  • Figure 3 is a partial enlarged view of the front structure schematic diagram of the flexible circuit board of the present invention.
  • Fig. 4 is a partial enlarged view of the schematic diagram of the back structure of the flexible circuit board of the present invention.
  • the purpose of the utility model is to provide a flexible circuit board to solve the technical problem that the through holes are easily damaged or the partial holes are broken in the prior art, which causes the upper and lower layers to fail to conduct.
  • Figure 1 is a schematic diagram of the front structure of a flexible circuit board provided by the present invention
  • Figure 2 is a schematic diagram of the back structure of a flexible circuit board provided by the present invention
  • Figure 3 It is a partial enlarged view of the schematic diagram of the front structure of the flexible circuit board of the present invention
  • FIG. 4 is a partial enlarged view of the schematic diagram of the back structure of the flexible circuit board of the present invention.
  • a flexible circuit board comprising: a substrate board 11, an upper circuit 12 fixed on one surface of the substrate board 11, and a substrate board fixed on the opposite side of the upper circuit 12 11
  • the lower layer circuit 13 on the other surface, and the via hole 14 penetrating the surface of the upper layer circuit 12 and the surface of the lower layer circuit 13, the via hole 14 contains a conductor, and the upper layer circuit 12 and the lower layer circuit 13 pass through the via hole 14
  • the upper layer line 12 includes at least: an upper layer transmission portion 121 and an upper layer connection portion 122 electrically connected to the upper layer transmission portion 121
  • the lower layer line 13 at least includes: a lower layer transmission portion 131 and an upper layer connection portion 131 electrically connected to the lower layer transmission portion 131
  • the lower connection portion 132, the upper connection portion 122 and the lower connection portion 132 respectively cover both sides of the same part of the base plate 11 to form a circuit board connection portion;
  • the circuit board connection portion is provided with at least two via holes 14, and the upper layer circuit 12 and the lower layer circuit 13 are electrically connected through the conductor in the via hole 14.
  • the flexible circuit board includes: a substrate board 11, an upper circuit 12 and a lower circuit 13 located on the front and back of the substrate board 11, an upper connection portion 122 of the upper circuit and a lower connection portion of the lower circuit 132 respectively covers both sides of the same part of the base plate 11, and the covered same part is used as the circuit board connection part.
  • the circuit board connection part structurally includes at least the upper layer connection part 122 and the part covered by both sides of the base plate 11
  • the lower connection portion 132 is provided with a plurality of via holes 14 containing conductors in the circuit board connection portion.
  • the via hole 14 can be made by laser hole formation or plasma etching, etc.
  • the via hole 14 When the via hole 14 is made, it is necessary to drill the upper connection portion 122 of the circuit board connection portion, the part covered by both sides of the base plate 11, and the lower connection portion 132 together, so that the via hole 14 penetrates the circuit board connection Part; and a conductor is provided in the via hole 14, so that the upper layer circuit 12 is electrically connected to the lower layer circuit 13 through the conductor in the via hole 14.
  • the circuit board connection part is provided with at least two via holes 14.
  • a plurality of through holes 14 may be provided in the circuit board connection part.
  • the circuit board connection part in this embodiment is provided with at least two through holes 14 to effectively avoid one of them.
  • the via hole 14 is damaged or part of the hole is broken, causing the upper-layer circuit 12 and the lower-layer circuit 13 to be unable to be electrically connected or to be blocked; the arrangement of the via-hole 14 in this embodiment can improve the distance between the upper-layer circuit 12 and the lower-layer circuit 13 The electrical connection increases reliability.
  • the via hole 14 is provided with a first via hole 141 and a second via hole 142.
  • the first via hole 141 and the second via hole 142 are arranged in the circuit board connection part to extend and connect to the upper layer circuit 12.
  • the horizontal line in the same direction.
  • the arrangement of the multiple vias 14 in the circuit board connection part should consider the flexibility of the upper circuit 12 and the lower circuit 13 on the flexible circuit board, so as to minimize the flexibility of the flexible circuit board or
  • the upper layer circuit 12 and the lower layer circuit 13 are broken or cracked; preferably, this embodiment includes a first via 141 and a second via 142, and the circuit board connection portion includes: an upper circuit board connection portion and a lower circuit board In the connecting portion, the first via hole 141 and the second via hole 142 are arranged on the same horizontal line in the same direction that the upper layer circuit board connection portion extends and connects to the upper layer circuit 12.
  • first via hole 141 and the second via hole 141 The two vias 142 are also arranged on the same horizontal line in the same direction that the lower circuit board connection portion extends and connects to the lower layer circuit 13, wherein the first via hole 141 is located at the circuit board connection portion near the extension connection with the upper circuit 12 One end, and the second through hole 142 is located at the end of the circuit board connection part away from the extended connection with the upper layer circuit 12.
  • the electrical conductor is attached to the sidewall of the via hole 14, one end of the electrical conductor penetrates from the surface of the upper connection portion 122 to the surface of the lower connection portion 132 perpendicularly, and one end of the electrical conductor is electrically connected to the upper connection portion 122. The other end of the body is electrically connected to the lower connection portion 132.
  • the conductive body is a cylindrical conductive ring, and the outer side of the conductive ring is attached to the side wall of the through hole 14.
  • the conductive body in the through hole 14 may be a cylindrical conductive ring.
  • the conductive ring is a hollow cylindrical conductive body, the outer side of the conductive ring is attached to the side wall of the through hole 14, and the cross section of the conductive ring and the cross section of the through hole 14 are on the same horizontal plane, and The cross-sections are all round; one end of the conductive ring is electrically connected to the upper connection portion 122, and extends vertically from the end connected to the upper connection portion 122 to the lower connection portion 132, and is electrically connected to the lower connection portion 132.
  • the conductive body is a strip-shaped conductive strip, and the conductive strip is attached to the side wall of the via hole 14.
  • the conductive body in the via hole 14 can be a strip-shaped conductive strip.
  • the conductive strip is a strip-shaped conductive body with conductive properties.
  • the conductive strip can be a wire, a tin strip, or a conductive strip.
  • Conductors with conductive properties, such as a sheet, preferably, a strip-shaped conductive sheet is used in this embodiment.
  • One end of the conductive strip is electrically connected to the upper connection portion 122 and extends vertically from the end connected to the upper connection portion 122 to the lower connection Part 132, and is electrically connected to the lower connection part 132.
  • the material of the conductor is copper material.
  • the conductor in the via hole 14 is made of Cu (copper) material. Because the copper material product has better conductivity and has certain flexibility, it can realize the upper circuit 12 and the lower layer.
  • the circuit 13 is conductive, and at the same time, the reliability of the process of making the via hole 14 is improved, and the damage of the via hole 14 is avoided to a certain extent;
  • the conductor of the above embodiment is made of copper material, such as the conductive ring and the conductive strip in the above embodiment , So that the upper layer circuit 12 and the lower layer circuit 13 of the flexible circuit board are electrically connected by a copper conductor with better conductivity.
  • the utility model provides a flexible circuit board.
  • the flexible circuit board includes a substrate board, an upper circuit fixed on one surface of the substrate board, a lower circuit fixed on the other surface of the substrate board opposite to the upper circuit, and a self-contained circuit board.
  • the surface of the upper layer circuit is a via hole penetrating the surface of the lower layer circuit.
  • the via hole contains a conductor.
  • the upper layer circuit and the lower layer circuit are electrically connected by the conductor in the via hole.
  • the upper layer circuit at least includes: an upper layer transmission part and an upper layer
  • the lower circuit at least includes: a lower transmission part and a lower connection part electrically connected to the lower transmission part, the upper connection part and the lower connection part respectively cover both sides of the same part of the base plate to form a circuit Board connection part;
  • the circuit board connection part is provided with a plurality of through holes, the through holes respectively penetrate from the surface of the upper circuit to the surface of the lower circuit, so that the upper circuit and the lower circuit are electrically connected through the conductor in the through hole.
  • the through holes can be prevented from being damaged and the electrical connection between the upper layer line and the lower layer line is blocked, and the reliability of the conduction of the upper layer line and the lower layer line is improved.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

La présente invention concerne une carte de circuit imprimé flexible comprenant : un substrat (11), un circuit supérieur (12) et un circuit inférieur (13) fixés sur le substrat (11), et un trou de conduction (14) pénétrant dans la surface du circuit supérieur (12) et la surface du circuit inférieur (13) ; le trou de conduction (14) contient un conducteur, le circuit de couche supérieure (12) et le circuit de couche inférieure (13) sont connectés électriquement au moyen du conducteur ; le circuit de couche supérieure (12) comprend au moins : une partie de transmission de couche supérieure (121) et une partie de liaison de couche supérieure (122) connectée électriquement à la partie de transmission de couche supérieure (121) ; le circuit de couche inférieure (13) comprend au moins : une partie de transmission de couche inférieure (131) et une partie de liaison de couche inférieure (132) connectée électriquement à la partie de transmission de couche inférieure (131), la partie de liaison de couche supérieure (122) et la partie de liaison de couche inférieure (132) recouvrant respectivement les deux côtés de la même partie du substrat (11) pour former une partie de connexion de carte de circuit imprimé ; la partie de connexion de carte de circuit imprimé est pourvue d'au moins deux trous de conduction (14), et le circuit de couche supérieure (12) et le circuit de couche inférieure (13) sont connectés électriquement au moyen du conducteur dans les trous de conduction (14). La pluralité de trous de conduction permet d'empêcher la connexion électrique entre le circuit de couche supérieure (12) et le circuit de couche inférieure (13) d'être bloquée suite à une détérioration des trous de conduction, la fiabilité de la conduction entre le circuit de couche supérieure (12) et le circuit de couche inférieure (13) étant ainsi améliorée.
PCT/CN2019/125933 2019-12-17 2019-12-17 Carte de circuit imprimé flexible WO2021119990A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2019/125933 WO2021119990A1 (fr) 2019-12-17 2019-12-17 Carte de circuit imprimé flexible

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2019/125933 WO2021119990A1 (fr) 2019-12-17 2019-12-17 Carte de circuit imprimé flexible

Publications (1)

Publication Number Publication Date
WO2021119990A1 true WO2021119990A1 (fr) 2021-06-24

Family

ID=76476891

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/125933 WO2021119990A1 (fr) 2019-12-17 2019-12-17 Carte de circuit imprimé flexible

Country Status (1)

Country Link
WO (1) WO2021119990A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001127392A (ja) * 1999-10-26 2001-05-11 Sansha Electric Mfg Co Ltd プリント配線板
DE102004052495A1 (de) * 2004-10-28 2006-05-11 Walter Mayer Leiterplatte zum Aufbau beliebiger Schaltungen mit SMD Bauelementen
CN101296556A (zh) * 2007-04-25 2008-10-29 群康科技(深圳)有限公司 软性电路板
CN103338590A (zh) * 2013-06-14 2013-10-02 业成光电（深圳）有限公司 软性电路板及其制造方法
CN204887669U (zh) * 2015-05-26 2015-12-16 深圳市信义隆通讯技术有限公司 柔性电路板

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001127392A (ja) * 1999-10-26 2001-05-11 Sansha Electric Mfg Co Ltd プリント配線板
DE102004052495A1 (de) * 2004-10-28 2006-05-11 Walter Mayer Leiterplatte zum Aufbau beliebiger Schaltungen mit SMD Bauelementen
CN101296556A (zh) * 2007-04-25 2008-10-29 群康科技(深圳)有限公司 软性电路板
CN103338590A (zh) * 2013-06-14 2013-10-02 业成光电（深圳）有限公司 软性电路板及其制造方法
CN204887669U (zh) * 2015-05-26 2015-12-16 深圳市信义隆通讯技术有限公司 柔性电路板

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