CN216820247U

CN216820247U - Reflow soldering furnace carrier

Info

Publication number: CN216820247U
Application number: CN202123426174.9U
Authority: CN
Inventors: 曾增狄
Original assignee: Jiaxing Qiwang Electronic Technology Co ltd
Current assignee: Jiaxing Qiwang Electronic Technology Co ltd
Priority date: 2021-12-31
Filing date: 2021-12-31
Publication date: 2022-06-24
Anticipated expiration: 2031-12-31

Abstract

The utility model relates to a reflow soldering furnace carrier which comprises a carrier body, wherein a plate groove is arranged on the carrier body, a through hole is formed in the plate groove, socket grooves are respectively formed in two sides of the plate groove in the width direction, the positions and the number of the socket grooves correspond to the through holes in a one-to-one mode, and a welding hole is formed between each socket groove and each through hole. According to the utility model, the corresponding positions of the socket and the PCB can be placed through the upper plate groove and the socket groove on the carrier body, the socket is pasted on the PCB in the carrier manually or mechanically and directly flows into the reflow soldering, the socket is finished in an SMT workshop at one time, the number of the post-stage manual soldering is reduced, the efficiency is improved by 3 times compared with the manual soldering, the product quality is improved by 99.9%, and the labor cost is saved by 0.2 yuan/PCS.

Description

Reflow soldering furnace carrier

Technical Field

The utility model relates to the technical field of circuit board processing, in particular to a reflow soldering furnace carrier.

Background

The reflow soldering process is to realize the soldering of mechanical and electrical connection between the soldering terminal or pin of the surface-mounted component and the pad of the printed board by re-melting the paste soft solder pre-distributed on the pad of the printed board. A reflow process is generally used in the processing of the circuit board, but since the components such as the socket are generally bulky and are not easy to reflow together with the circuit board, the manufacturing process of assembling the socket and the circuit board is to perform a repair soldering process after a Surface Mounting Technology (SMT) and manually solder the socket. At present, the manual welding process needs manual installation of plug-in components and welding, and the plate is washed after welding, so that the process is various, the efficiency is low, the quality is unstable, and the cost is very high.

SUMMERY OF THE UTILITY MODEL

In order to solve the above technical problems, an object of the present invention is to provide a reflow soldering furnace carrier, which can perform reflow soldering after positioning a socket and a circuit board, thereby eliminating the subsequent manual soldering process and improving the production efficiency and the product quality.

In order to realize the purpose of the utility model, the utility model adopts the following technical scheme:

reflow soldering furnace carrier, including the carrier body, be equipped with the board groove on the carrier body, be equipped with the through-hole in the board groove, the board groove is equipped with socket groove respectively along width direction's both sides, the position and the quantity and the through-hole one-to-one in socket groove, still be equipped with the welding hole between socket groove and the through-hole.

As a preferable scheme: the number of plate groove is two on the carrier body, and sets up at interval each other.

As a preferable scheme: the method is characterized in that: the board groove is also provided with four positioning salient points which are positioned at four corners of the board groove.

As a preferable scheme: the both ends of board groove edge length direction still are equipped with the dress groove of getting, and just get the middle part that dress groove is located board groove width direction.

As a preferable scheme: the area of the welding hole is smaller than that of the through hole, and the depth of the socket groove is larger than that of the board groove.

Compared with the prior art, the utility model has the beneficial effects that:

according to the utility model, the corresponding positions of the socket and the PCB can be placed through the upper plate groove and the socket groove on the carrier body, the socket is pasted on the PCB in the carrier manually or mechanically and directly flows into the reflow soldering, the socket is finished in an SMT workshop at one time, the number of the post-stage manual soldering is reduced, the efficiency is improved by 3 times compared with the manual soldering, the product quality is improved by 99.9%, and the labor cost is saved by 0.2 yuan/PCS.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the application and, together with the description, serve to explain the application and are not intended to limit the application.

FIG. 1 is a schematic view of the overall structure of the present invention;

the labels in the figures are: 1. a carrier body; 2. a plate groove; 3. a socket groove; 4. a through hole; 5. welding the hole; 6. a loading and unloading groove; 7. and positioning the salient points.

Detailed Description

It should be noted that the following detailed description is exemplary and is intended to provide further explanation of the disclosure. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an", and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.

Further, in the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, unless otherwise specified, "a plurality" means two or more unless explicitly defined otherwise.

In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The utility model is further illustrated by the following examples in conjunction with the following figures:

as shown in fig. 1, a reflow soldering furnace carrier includes a carrier body 1, a plate groove 2 is arranged on the carrier body 1, a through hole 4 is arranged in the plate groove 2, socket grooves 2 are respectively arranged on two sides of the plate groove 2 along the width direction, the positions and the number of the socket grooves 2 correspond to the through holes 4 one by one, and a welding hole 5 is further arranged between the socket grooves 2 and the through holes 4.

According to the utility model, the socket and the PCB can be placed at corresponding positions through the upper plate groove and the socket groove of the carrier body, and meanwhile, components of the PCB can be exposed through the through holes arranged in the plate groove, so that the influence on the flatness of a welding surface is avoided, and the welding quality is improved.

The number of the plate grooves 2 on the carrier body 1 is two, and the two plate grooves are arranged at intervals. The area of the welding hole 5 is smaller than that of the through hole 4, and the depth of the socket groove 2 is larger than that of the board groove 2. The utility model is designed to put two jointed boards on the carrier at the same time, thus improving the efficiency; meanwhile, the sinking height in the socket groove is matched with the socket, so that the floating height is avoided, the installation flatness reaches 100%, and the manufacturing process is stable and efficient in quality.

The board groove 2 is also provided with four positioning salient points, and the four positioning salient points 7 are positioned at four corners of the board groove 2. The both ends of board groove 2 along length direction still are equipped with the groove 6 of getting to adorn, and just get the middle part that adorns groove 6 and be located 2 width direction in the board groove. When the PCB board imbeds the carrier completely like this, also can snatch the PCB board through getting the dress groove, reduced the degree of difficulty of workman's operation, improved the operation convenience.

The carrier of the utility model is adopted to change the socket into the paster, and the problems of less tin loading quantity, more tin loading quantity of the through hole of the pin of the socket, hole plugging and tin dripping are also needed to be solved; the steel sheet thickness at the socket position can be individually thickened by adopting a step steel mesh process, so that the purpose of increasing the tin amount is achieved. Meanwhile, the via hole is opened by adding a single rib, tin printing on the via hole is shielded, and tin flowing caused by too much tin in the via hole is avoided. By adopting the carrier of the utility model and matching with the specially designed step steel mesh process, the efficiency is improved by 3 times compared with manual welding, the product quality is improved by 99.9 percent, and the labor cost is saved by 0.2 yuan/PCS.

In the description of the specification, reference to the description of "one embodiment," "some embodiments," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Although the embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and not to be construed as limiting the present invention, and those skilled in the art can make changes, modifications, substitutions and alterations to the above embodiments without departing from the principle and spirit of the present invention, and any simple modification, equivalent change and modification made to the above embodiments according to the technical spirit of the present invention still fall within the technical scope of the present invention.

Claims

1. Reflow soldering furnace carrier, its characterized in that: including carrier body (1), be equipped with board groove (2) on carrier body (1), be equipped with through-hole (4) in board groove (2), board groove (2) are equipped with the socket groove respectively along width direction's both sides, the position and the quantity in socket groove and through-hole (4) one-to-one, still be equipped with between socket groove and through-hole (4) welding hole (5).

2. The reflow oven carrier of claim 1, wherein: the number of the plate grooves (2) on the carrier body (1) is two, and the plate grooves are arranged at intervals.

3. The reflow oven carrier of claim 1, wherein: the board groove (2) is also provided with four positioning salient points, and the four positioning salient points (7) are positioned at four corners of the board groove (2).

4. The reflow oven carrier of claim 1, wherein: the two ends of the plate groove (2) in the length direction are also provided with a taking and installing groove (6), and the taking and installing groove (6) is positioned in the middle of the plate groove (2) in the width direction.

5. The reflow oven carrier of claim 1, wherein: the area of the welding hole (5) is smaller than that of the through hole (4), and the depth of the socket groove is larger than that of the plate groove (2).