KR20120004088A

KR20120004088A - Manufacturing method for pcb

Info

Publication number: KR20120004088A
Application number: KR1020100064751A
Authority: KR
Inventors: 오영돈
Original assignee: 엘지이노텍 주식회사
Priority date: 2010-07-06
Filing date: 2010-07-06
Publication date: 2012-01-12

Abstract

The present invention relates to a method for manufacturing a printed circuit board, and more particularly, to a method for manufacturing a printed circuit board for planarizing an insulating layer of a printed circuit board manufactured by an etchback process.
A method of manufacturing a printed circuit board of the present invention for achieving the above object, the first step of forming a circuit by coating, exposing and developing a first dry film on a base substrate having a plurality of through holes plated with copper foil And a second step of etching the pattern by removing the exposed copper by etching the first dry film with an etching solution, and a third step of removing the first dry film using a stripping solution, and a solder resist (PSR). ) A fourth step of coating), a second step of coating, exposing and developing the second dry film, and performing gold plating on a pad for connection of electronic components through a preformed plating lead wire, and the gold plating resist. 6th step of peeling the second dry film used, etching to remove the exposed plating lead wire, and to planarize by filling the step of the solder resist layer applied in the fourth step And a seventh step of applying the insulating ink.

Description

Printed Circuit Board Manufacturing Method {MANUFACTURING METHOD FOR PCB}

The present invention relates to a method for manufacturing a printed circuit board, and more particularly, to a method for manufacturing a printed circuit board for planarizing an insulating layer of a printed circuit board manufactured by an etchback process.

With the recent trend toward slimmer and thinner portable terminals, miniaturization of various components such as camera modules mounted in the main body of the terminal has been oriented. Since the size of the image sensor mounted in the camera module is relatively large due to the increase in the number of pixels, a design is required to reduce the thickness of the components constituting the camera module and minimize the assembly space in the camera module. have. In addition, as the adhesive space of the other components, including the image sensor, becomes narrower, the application area of the adhesive is reduced to reduce the possibility of resin overflow, which may affect the quality of the product after curing of the adhesive, including epoxy. have.

In the case of the multilayer printed circuit board including the camera module, the inner surface of the inner layer conductor is exposed by dissolving materials such as glass fibers and plastics on the inner wall of the drilled hole so that plating is performed well in the hole for conduction, and the residue of the resin is exposed. A printed circuit board is manufactured by an etch-back process for the purpose of removing the bar. Referring to FIG. 1, the etch-back process according to the related art will be briefly described as follows.

Solder resist is applied (PSR) to the preprocessed printed circuit board and the secondary outer layer dry film is developed and dried. After plating the pad for electrical connection with various components while applying current through the preformed plating lead wire, the secondary dry film is peeled off, the external etching is etched while the tertiary dry film is coated, and the routing is performed. After removing the plating lead wire through the process, the first plasma process and the process of welding the silver tape or silver face.

A printed circuit board manufactured by the above process is shown in FIG. 2.

Referring to the printed circuit board of FIG. 2, as shown in FIG. 2, the printed circuit board 1 includes a top base layer on which a copper foil layer 2b for forming a circuit pattern on the insulating layer film 2a is thermocompressed. , 2) and a lower base layer 3 on which the copper foil layer 3b for forming a circuit pattern on the insulating film layer 3a are thermocompression bonded to each other by the bonding sheet 4. Next, dry films for circuit pattern formation are laminated on the copper foil layers 2b and 3b of the upper base layer 2 and the lower base layer 3, respectively, and the circuit pattern is completed through an exposure and etching process. The pad 6 for the connection of the components

As the protective film COVERLAY 5 is attached to portions of the upper surface of the pad except for the pad 6, the manufacturing of the printed circuit board 1 is completed. Here, the circuit pattern 7 is formed through the exposure and etching process, and a pattern 6 connected to the circuit pattern 7 is formed at an arbitrary point inside each edge portion of the printed circuit board 1. Electrical connection is made in the form of contact between the electronic component mounted on the upper surface and the wire bonding or bump. Reference numeral 8 is a PSR layer.

In the printed circuit board, a step may be formed by the PSR open area. Such a step is a cause that can cause the bend in the silver tape, the bend of the silver tape is to act as a disadvantage such that the silver tape is peeled off during the post-process ultrasonic cleaning or the like.

An object of the present invention to solve the above problems is to provide a method for manufacturing a printed circuit board added to the process of applying an insulating ink to prevent the formation of a step by the PSR open area.

A method of manufacturing a printed circuit board of the present invention for achieving the above object, the first step of forming a circuit by coating, exposing and developing a first dry film on a base substrate having a plurality of through holes plated with copper foil And a second step of etching the pattern by removing the exposed copper by etching the first dry film with an etching solution, and a third step of removing the first dry film using a stripping solution, and a solder resist (PSR). ) A fourth step of coating), a second step of coating, exposing and developing the second dry film, and performing gold plating on a pad for connection of electronic components through a preformed plating lead wire, and the gold plating resist. 6th step of peeling the second dry film used, etching to remove the exposed plating lead wire, and to planarize by filling the step of the solder resist layer applied in the fourth step And a seventh step of applying the insulating ink.

In addition, in the method of manufacturing a printed circuit board of the present invention, applying the insulating ink of the seventh step is a partial application of applying ink only to an open portion of the solder resist layer.

In addition, in the method of manufacturing a printed circuit board of the present invention, after the seventh step, the method may further include the step of welding the silver tape.

On the other hand, the present invention is characterized by a printed circuit board manufactured by the above method.

The printed circuit board manufactured by the manufacturing method of the present invention as described above has the advantage of preventing a defect such as peeling of the tape by preventing bending of the silver tape due to the step.

1 is a view for explaining a printed circuit board by a conventional etch back process
2 is a view showing a printed circuit board manufactured by the process shown in FIG.
3 is a view for explaining a method of manufacturing a printed circuit board according to an embodiment of the present invention.

As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the written description. However, this is not intended to limit the present invention to specific embodiments, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention.

Terms including ordinal numbers such as first and second may be used to describe various components, but the components are not limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

For example, without departing from the scope of the present invention, the second component may be referred to as the first component, and similarly, the first component may also be referred to as the second component.

When a component is said to be "connected" or "connected" to another component, it may be directly connected to or connected to that other component, but it may be understood that another component may exist in between. Should be. On the other hand, when a component is said to be "directly connected" or "directly connected" to another component, it should be understood that there is no other component in between.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In the present application, the terms "comprises", "having", and the like are used to specify that a feature, a number, a step, an operation, an element, a component, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

Now, a method of manufacturing a printed circuit board according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings. The same or corresponding components are denoted by the same reference numerals regardless of the reference numerals, and redundant description thereof will be omitted. Sometimes.

In the method of manufacturing a printed circuit board according to the present embodiment, in the method of manufacturing a printed circuit board by the conventional etch back method, a planarization of the PSR layer is performed after gold plating on pads for electrical connection with various electronic components. Insulating ink coating process is further included. Therefore, the step formed by the open portion of the PSR layer is prevented, and the application of the insulating ink is more preferably a partial application method than the entire application. That is, by applying the insulating ink to only the open portion of the PSR layer, the step formed by the open portion can be prevented and planarized.

The silver tape or the silver paste is welded in a flattened state by welding the silver tape or the silver paste after the step of applying the insulating ink as described above, thereby preventing the occurrence of bending. Therefore, the phenomenon in which the said silver tape or a silver face peels off in the process of ultrasonic cleaning etc. which are a post process is prevented.

One embodiment of the present invention described above should not be construed as limiting the technical spirit of the present invention. The scope of protection of the present invention is limited only by the matters described in the claims, and those skilled in the art will be able to modify the technical idea of the present invention in various forms. Therefore, such improvements and modifications will fall within the protection scope of the present invention as long as it will be apparent to those skilled in the art.

Claims

A first step of forming a circuit by coating, exposing and developing a first dry film on a base substrate having a plurality of conductive holes plated with copper foil;
Etching the pattern by removing the exposed copper by an etching solution by etching the first dry film;
A third step of removing the first dry film using a peeling liquid,
A fourth step of applying a solder resist (PSR),
A fifth step of coating, exposing and developing the second dry film, and performing gold plating on a pad for connection of an electronic component through a previously formed plating lead wire;
A sixth step of peeling the second dry film used as the gold plating resist and etching and removing the exposed plating lead wire;
And a seventh step of applying an insulating ink to fill and planarize the step of the solder resist layer applied in the fourth step.

The method of claim 1,
Applying the insulating ink of the seventh step,
A substrate forming method, which is a partial coating in which ink is applied only to an open portion of a solder resist layer.

The method of claim 2,
After the seventh step,
The method of forming a substrate further comprising the step of welding a silver tape.

A printed circuit board manufactured by the method of any one of claims 1 to 3.