CN113453423A - Resistance welding windowing structure of miniLED circuit board bonding pad - Google Patents
Resistance welding windowing structure of miniLED circuit board bonding pad Download PDFInfo
- Publication number
- CN113453423A CN113453423A CN202110796351.8A CN202110796351A CN113453423A CN 113453423 A CN113453423 A CN 113453423A CN 202110796351 A CN202110796351 A CN 202110796351A CN 113453423 A CN113453423 A CN 113453423A
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- pad
- circuit board
- welding
- windowing
- resistance welding
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a resistance welding windowing structure of a miniLED circuit board welding pad, which comprises a miniLED circuit board serving as a bearing welding pad, wherein a resistance welding layer on the circuit board is provided with a conducting circuit and a welding pad group, the conducting circuit is connected with the welding pad group, the welding pad group is used for welding LED lamp beads, the circuit board is covered with the resistance welding layer, a resistance welding windowing window is arranged on the outer side of the welding pad group, the resistance welding windowing window is a gap of the resistance welding layer, the area of the gap is larger than the occupied area of the welding pad group, the welding pad group is exposed in a resistance welding windowing area, the conducting circuit is hidden under the resistance welding layer, the welding pad group comprises two identical welding pads which are respectively a first welding pad and a second welding pad, and the first welding pad and the second welding pad are arranged on the circuit board in parallel and in the gap area of the resistance welding windowing. The small bonding pad product of 0.1mm grade of the miniLED PCB is manufactured, the product effect of standard size can be achieved by adopting common exposure equipment, the exposure equipment with high price and high use cost does not need to be purchased, and meanwhile, the production efficiency of the miniLED circuit board is improved.
Description
Technical Field
The invention relates to the field of production design and production of PCBs, in particular to a circuit wiring and resistance welding windowing design of a miniLED circuit board bonding pad.
Background
The exposure deviation in the existing PCB solder mask production is one of the main defects, the welding disc or the exposed line on the solder mask ink caused by the exposure deviation affects the subsequent mounting stability and the infirm welding, the more serious defect can bring short circuit and fatal defect to the electrical function, most abnormal bad plates in the deviation can not be repaired, the reworking production can be directly retreated, and the production progress and efficiency are seriously affected.
In order to effectively improve the anti-welding alignment precision, the automatic alignment exposure machine can effectively improve the factors considered as the alignment deviation, but when the machine alignment precision is abnormal, the exposure deviation can be generated under the condition that the sizes of the production board and the film are normal. The alignment precision deviation of a general automatic exposure machine is set to be 50um, the exposure deviation can be generated when the alignment precision of the machine is abnormal, and the precision correction is required to be carried out every 4 hours or after the machine fails in normal production, so that the normal production of the machine is ensured.
The PCB paster pad design of current trade all is the solder mask generally, and two pads are made actual welding pad size, and every pad extends the wire and connects, and the solder mask layer is greater than the unilateral position of circuit layer pad by 0.1mm, and just windows alone and expose the circuit pad, as shown in figure 1. The solder mask is suitable for the design of a paster bonding pad of a common PCB (printed circuit board), the size of the bonding pad is more than 1mm and even 10mm, the deviation of solder mask alignment is 0.1mm, the tolerance is not more than 10% of the size of the bonding pad, and therefore the design of solder mask windowing of a large-size bonding pad is basically not influenced.
At present, with the miniaturization and the miniaturization of electronic products, the production process of the patch parts is developed to be smaller and smaller, the size reaches the level below 0.5mm, particularly, the bead pad design of the miniLED is basically the size of the patch pad of 0.15-0.25mm, and the solder-resisting windowing is only 0.03mm larger on one side. Therefore, the original design is still adopted in the resistance welding windowing design; the precision of the alignment procedure is very accurate, the deviation is less than 0.03mm, the CCD alignment precision of the existing solder-resisting exposure equipment can reach the level of 0.05mm, and the solder-resisting exposure alignment requirement of miniLED products is difficult to meet. The abnormal problem that the sizes of two bonding pads are different can occur due to the misalignment.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide a circuit wiring and solder mask windowing design of a miniLED circuit board pad.
In order to achieve the purpose, the invention adopts the following technical scheme:
a solder mask windowing structure of a miniLED circuit board bonding pad comprises a miniLED circuit board as a bearing bonding pad, the circuit board is covered with a solder mask, the solder mask on the circuit board is provided with a conducting circuit and a pad group, the conducting circuit is connected with the welding pad group, the welding pad group is used for welding the LED lamp bead, the solder mask window is arranged on the outer side of the solder mask group, the solder mask window is a gap of the solder mask layer, the area of the gap is larger than the area occupied by the solder mask group, the welding pad group is exposed in the resistance welding windowing area, the conducting circuit is hidden under the resistance welding layer, the welding pad group comprises two identical welding pads which are respectively a first welding pad and a second welding pad, the first bonding pad and the second bonding pad are arranged on the circuit board in parallel and in the solder-resisting windowing gap area, the first bonding pad and the second bonding pad are defined to be arranged in parallel along the X direction, and the Y direction is defined to be perpendicular to the X direction.
Furthermore, the shape of the bonding pad is rectangular, and the side length of the bonding pad in the X direction and the Y direction is any value of 0.15-0.5 mm.
Further, the pad is connected with the conducting circuit, and the length of a side of the pad in the X direction is consistent with the width of the conducting circuit in the X direction.
Further, the pad is connected to the conducting line through a pad line, and the pad covers the pad line.
Furthermore, the overlapping area of the pad circuit and the solder mask window is a pad position area, and the conducting circuit is connected with the bottom end of the solder mask circuit.
Furthermore, the solder mask window is a rectangular gap, the pad group is located in the solder mask window area, and the side length of the pad in the Y direction is consistent with the width of the solder mask window in the Y direction.
Further, the length of the pad circuit in the Y direction is longer than the length of the pad window area in the Y direction, that is, the top of the pad circuit in the Y direction exceeds the top edge of the pad in the Y direction, and the bottom of the pad circuit in the Y direction exceeds the bottom edge of the pad in the Y direction.
Furthermore, the length of two ends of the solder mask window (1) in the X direction is designed to exceed the length of connecting lines of the pad group in the X direction.
The invention has the beneficial effects that:
1. manufacturing a 0.1 mm-level small bonding pad product of the miniLED PCB, and achieving the product effect of a standard size by adopting common exposure equipment without purchasing high-price and high-use-cost exposure equipment;
2. the design method reduces the resistance welding deviation in the production process, improves the production efficiency of the miniLED circuit board by 2 times, enables the product to be applied in large batch, effectively reduces the cost of the production and manufacture of the television with the miniLED backlight for the household at present and in future, and is beneficial to greatly improving the yield.
Drawings
FIG. 1 is a block diagram of a pad solder mask windowing design in the prior art;
FIG. 2 is a structural diagram of the wiring and solder mask windowing design of the miniLED circuit board pad of the present invention.
Reference numerals: 1. resistance welding windowing; 11. first resistance welding windowing; 12. second resistance welding windowing; 2. a first pad; 3. a second pad; 4. a first conductive line; 5. a second conductive line; 6. a first pad wiring; 7. And a second pad wiring.
Detailed Description
The invention will be further described with reference to the accompanying drawings and the detailed description below:
the PCB paster pad design of the existing trade among the prior art is generally the solder mask, and two pads are made actual welding pad size, and every pad extends the wire and connects, and the solder mask is greater than the unilateral position of circuit layer pad by 0.1mm, and just windows alone and exposes the circuit pad, as shown in figure 1. The design method is suitable for the design of the paster bonding pad of a common PCB (printed circuit board), the size of the bonding pad is more than 1mm and even 10mm, the deviation of solder mask alignment is 0.1mm, the tolerance is not more than 10% of the size of the bonding pad, and therefore the design of the solder mask windowing window 1 with a large-size bonding pad is basically not influenced.
As shown in fig. 1, the structure of the solder mask window of the pad in the prior art is: the actual sizes of the pad circuit and the pad are the same and are both square, one side of the first pad 2, which is far away from the second pad 3, is connected with the first conducting circuit 4, and the length of the first conducting circuit 4 in the Y direction is smaller than that of the first pad 2 in the Y direction; the side of the second pad 3 far away from the first pad 2 is connected with a second conducting line 5, and the length of the second conducting line 5 in the Y direction is smaller than that of the second pad 3 in the Y direction. A first solder resist window 11 is arranged on the outer side of the first bonding pad 2, a second solder resist window 12 is arranged on the outer side of the second bonding pad 3, the first solder resist window 11 is not connected with the second solder resist window 12, and the length of the single-side of the first solder resist window 11 in the X and Y directions is 0.1mm longer than that of the single-side of the first bonding pad 2 in the X and Y directions; the length of the single-side of the second solder resist window 12 in the X and Y directions is 0.1mm longer than that of the single-side of the second bonding pad 3 in the X and Y directions.
At present, with the miniaturization and the miniaturization of electronic products, the production process of the patch parts is developed to be smaller and smaller, the size reaches the level below 0.5mm, particularly, the bead pad design of the miniLED is basically the size of the patch pad of 0.15-0.25mm, and the solder resisting windowing window 1 is only one side of 0.03 mm. Therefore, if the original design is still used in the design of the solder mask windowing 1, the accuracy of the alignment procedure is very accurate, the deviation is less than 0.03mm, the CCD alignment accuracy of the existing solder mask exposure equipment can reach the level of 0.05mm, and the solder mask exposure alignment requirement of miniLED products is difficult to meet. The abnormal problem that the sizes of two bonding pads are different can occur due to the misalignment. Therefore, when the circuit board patch bonding pad is designed, the product can meet the requirement of the existing equipment processing capacity of exposure alignment, and the dimension of the two patch bonding pads can be ensured to be consistent in the machine deviation of 0.05mm so as to meet the standard requirement.
Therefore, the invention designs a line wiring and resistance welding windowing design of the miniLED circuit board bonding pad, and can use the CCD of the existing anti-welding exposure equipment to carry out anti-welding exposure on the miniLED circuit board.
The utility model provides a miniLED circuit board pad hinder and cut window structure, include the miniLED circuit board as bearing the pad, the solder mask is provided with and switches on circuit and pad group on the circuit board, switch on the circuit and be connected with pad group, pad group is used for welding LED lamp pearl, the circuit board coats and is stamped the solder mask, be equipped with in the pad group outside and hinder and cut window 1, hinder and cut window 1 and be the breach of solder mask, the breach area is bigger than the shared area of pad group, pad group exposes hinders and cuts window 1 region in, switch on the circuit and hide under the solder mask, pad group includes two identical pads, be first pad 2 and second pad 3 respectively, first pad 2 and second pad 3 set up side by side on the circuit board and hinder and cut 1 in the region, define first pad 2 and second pad 3 and stand side by side along the X direction, it is perpendicular with the X direction to define Y direction.
The solder resist layer refers to a portion on which white ink is coated on the miniLED circuit board. The solder resist window 1 is a size of a portion where copper, that is, a pad group is exposed at a position where soldering is required, that is, a size of a portion where white ink is not covered. The LED lamp bead pad on the circuit board needs to expose copper, so that the solder mask window 1 needs to be subjected to solder mask, namely, the area needing to expose copper cannot be covered by solder mask white ink. And prevent to hinder and hinder the white printing ink and cover the pad and expose the copper area and, cause the pad solderability to deteriorate, if hinder and weld 1 regional area of windowing and be as big as the pad, because miniLED circuit board manufacturing's tolerance, just can't avoid hindering the white printing ink and cover on the pad, so generally in order to compromise the technological deviation of board factory, should hinder and weld 1 regional certain size of enlarging than actual pad of windowing, consequently hinder and weld 1 area of windowing and be bigger than the area that the pad occupies.
Further, the shape of the pad is rectangular, and the side lengths of the pad in the X direction and the Y direction are any value of 0.15mm to 0.5 mm.
In this embodiment, the side lengths of the bonding pad on the miniLED circuit board in the X direction and the Y direction are both 0.2 mm.
Furthermore, the bonding pad is connected with the conducting circuit, and the length of the side of the bonding pad in the X direction is consistent with the width of the conducting circuit in the X direction; the first bonding pad 2 is connected with the first conducting circuit 4, the line width of the first conducting circuit 4 is consistent with the length of the side of the first bonding pad 2 in the X direction, the second bonding pad 3 is in contact with the second conducting circuit 5, and the line width of the second conducting circuit 5 is consistent with the length of the side of the second bonding pad 3 in the X direction.
Furthermore, the bonding pad is connected with the conducting circuit through a bonding pad circuit; the pad covers the pad line. The first pad 2 is connected to the first via line 4 via a first pad line 6, and the second pad 3 is connected to the second via line 5 via a second pad line 7. The pad line width and the via line width are designed to be as wide as each other, so that the via line width can be regarded as the width dimension of the bottom edge of the pad.
Further, the area where the pad wiring coincides with the solder resist opening window 1 is the first pad 2 position area. The overlapping area of the first pad circuit 6 and the solder resist window 1 is the area of the first pad 2, and the overlapping area of the second pad circuit 7 and the solder resist window 1 is the area of the second pad 3.
Further, the conducting line is connected with the bottom end of the solder mask line.
Further, the solder resist window 1 is a rectangular notch, and the first pad 2 and the second pad 3 are juxtaposed in the area of the solder resist window 1. The side length in the Y direction of the pad is identical to the width in the Y direction of the solder resist window 1. The side lengths of the first pad 2 and the second pad 3 in the Y direction are each in accordance with the width of the solder resist window 1 in the Y direction.
In the present embodiment, the width of solder resist window 1 in the Y direction is identical to the length of the side of first pad 2 and second pad 3 in the Y direction, and both are 0.2 mm. In actual production, the length of the side of the pad in the Y direction is determined by the actual width of the solder resist window 1 in the Y direction.
Further, the length of the pad circuit in the Y direction is longer than the length of the pad window area in the Y direction, that is, the top of the pad circuit in the Y direction exceeds the top edge of the pad in the Y direction, and the bottom of the pad circuit in the Y direction exceeds the bottom edge of the pad in the Y direction.
The top of the first land line 6 is beyond the top edge of the first land 2, and the bottom of the first land line 6 is beyond the bottom edge of the first land 2. The top of the second land line 7 is beyond the top edge of the second land 3, and the bottom of the second land line 7 is beyond the bottom edge of the second land 3.
In this embodiment, considering that the alignment precision of the solder mask CCD is 0.05mm, there may be an offset in the Y direction, the offset is added during the design, and the lengths of the two ends of the pad line in the Y direction are designed to exceed the pad or more than 0.1mm of the top edge and the bottom edge of the solder mask window 1, so that the solder mask window 1 is offset by 0.05mm in the Y direction, and the size of the pad in the Y direction is also ensured.
Furthermore, the length of the connecting line at the two ends of the solder mask window 1 in the X direction is designed to exceed the length of the connecting line at the two ends of the solder mask group in the X direction, the solder mask window 1 connects the first solder mask window 11 and the second solder mask window 12 in fig. 1, and the length of the two ends of the solder mask window 1 in the X direction is designed to exceed the left side of the first solder mask 2 and the right side of the second solder mask 3 respectively.
In the embodiment, considering that the alignment precision of the solder mask CCD is 0.05mm, the offset can be generated in the X direction, the offset is added during design, the length design of the two ends of the solder mask window 1 in the X direction respectively exceeds more than 0.5mm of the left side of the first bonding pad 2 and the right side of the second bonding pad 3, so that the offset of the solder mask along the X direction is 0.05mm, the size of the bonding pad in the X direction is also ensured, and the circuit bonding pad can not be covered by the solder mask white ink.
Various other modifications and changes may be made by those skilled in the art based on the above-described technical solutions and concepts, and all such modifications and changes should fall within the scope of the claims of the present invention.
Claims (8)
1. The utility model provides a miniLED circuit board pad hinder welds windowing structure, a serial communication port, include the miniLED circuit board as bearing the pad, the circuit board coats and is stamped the solder mask, the solder mask on the circuit board is provided with and switches on circuit and pad group, switch on the circuit with pad group link, pad group is used for welding LED lamp pearl, is equipped with in the pad external side and hinders and welds windowing (1), hinder and weld windowing (1) for the breach of solder mask, the breach area is big than the shared area of pad group, the pad group exposes and hinders and weld windowing (1) in the region, switch on the circuit and hide under the solder mask, pad group includes two identical pads, is first pad (2) and second pad (3) respectively, first pad (2) with second pad (3) set up side by side on the circuit board and hinder and weld windowing (1) breach region in, the first bonding pad (2) and the second bonding pad (3) are defined to be juxtaposed along the X direction, and the Y direction is defined to be perpendicular to the X direction.
2. The structure of claim 1, wherein the pad is rectangular, and the sides of the pad in the X and Y directions are 0.15mm to 0.5 mm.
3. The structure of claim 1, wherein the pad is connected to the conducting line, and the length of the pad in the X direction is equal to the width of the conducting line in the X direction.
4. The structure of claim 1, wherein the pad is connected to the conducting trace through a pad trace, and the pad covers the pad trace.
5. The miniLED circuit board pad resistance welding window structure as claimed in claim 4, wherein the area where the pad circuit is overlapped with the resistance welding window (1) is a pad position area, and the conducting circuit is connected with the bottom end of the resistance welding circuit.
6. The resistance welding windowing structure of the miniLED circuit board pad according to claim 5, wherein the resistance welding windowing (1) is a rectangular gap, the pad group is in the area of the resistance welding windowing (1), and the side length of the pad in the Y direction is consistent with the width of the resistance welding windowing (1) in the Y direction.
7. The structure of claim 4, wherein the length of the pad trace in the Y direction is longer than the length of the pad window area in the Y direction, i.e. the top of the pad trace in the Y direction exceeds the top edge of the pad in the Y direction, and the bottom of the pad trace in the Y direction exceeds the bottom edge of the pad in the Y direction.
8. The solder mask window structure of miniLED circuit board pad of claim 1, wherein the length of both ends of the solder mask window (1) in the X direction is designed to exceed the length of the connecting line of the pad group in the X direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110796351.8A CN113453423A (en) | 2021-07-14 | 2021-07-14 | Resistance welding windowing structure of miniLED circuit board bonding pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110796351.8A CN113453423A (en) | 2021-07-14 | 2021-07-14 | Resistance welding windowing structure of miniLED circuit board bonding pad |
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| Publication Number | Publication Date |
|---|---|
| CN113453423A true CN113453423A (en) | 2021-09-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110796351.8A Pending CN113453423A (en) | 2021-07-14 | 2021-07-14 | Resistance welding windowing structure of miniLED circuit board bonding pad |
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Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20110023393A (en) * | 2009-08-31 | 2011-03-08 | 삼성전기주식회사 | Printed circuit board |
| CN204062538U (en) * | 2014-05-20 | 2014-12-31 | 贵州光浦森光电有限公司 | With the LED light thermomechanical components of radiator |
| CN104994685A (en) * | 2015-07-13 | 2015-10-21 | 竞陆电子(昆山)有限公司 | PCB bonding pad/line connection structure |
| CN205177838U (en) * | 2014-12-04 | 2016-04-20 | 瑞萨电子株式会社 | Semiconductor device |
| CN106356353A (en) * | 2015-07-14 | 2017-01-25 | 苏州旭创科技有限公司 | Substrate and substrate-applying welding structure and welding method |
| CN206061289U (en) * | 2016-10-11 | 2017-03-29 | 信利半导体有限公司 | A kind of FPC pad structures of adapter and FPC |
| CN206908944U (en) * | 2017-05-09 | 2018-01-19 | 歌尔科技有限公司 | A kind of PCB encapsulating structures |
| CN208175099U (en) * | 2018-05-28 | 2018-11-30 | 信利光电股份有限公司 | A kind of encapsulation of capacitor side by side |
| CN109862687A (en) * | 2018-12-27 | 2019-06-07 | 深圳市景旺电子股份有限公司 | A kind of Mini LED flexible circuit board and preparation method thereof |
| CN110456570A (en) * | 2019-08-09 | 2019-11-15 | 佛山市国星光电股份有限公司 | A kind of LED backlight module and display device |
| CN111315124A (en) * | 2020-02-27 | 2020-06-19 | 歌尔股份有限公司 | Circuit board assembly and electronic device |
-
2021
- 2021-07-14 CN CN202110796351.8A patent/CN113453423A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20110023393A (en) * | 2009-08-31 | 2011-03-08 | 삼성전기주식회사 | Printed circuit board |
| CN204062538U (en) * | 2014-05-20 | 2014-12-31 | 贵州光浦森光电有限公司 | With the LED light thermomechanical components of radiator |
| CN205177838U (en) * | 2014-12-04 | 2016-04-20 | 瑞萨电子株式会社 | Semiconductor device |
| CN104994685A (en) * | 2015-07-13 | 2015-10-21 | 竞陆电子(昆山)有限公司 | PCB bonding pad/line connection structure |
| CN106356353A (en) * | 2015-07-14 | 2017-01-25 | 苏州旭创科技有限公司 | Substrate and substrate-applying welding structure and welding method |
| CN206061289U (en) * | 2016-10-11 | 2017-03-29 | 信利半导体有限公司 | A kind of FPC pad structures of adapter and FPC |
| CN206908944U (en) * | 2017-05-09 | 2018-01-19 | 歌尔科技有限公司 | A kind of PCB encapsulating structures |
| CN208175099U (en) * | 2018-05-28 | 2018-11-30 | 信利光电股份有限公司 | A kind of encapsulation of capacitor side by side |
| CN109862687A (en) * | 2018-12-27 | 2019-06-07 | 深圳市景旺电子股份有限公司 | A kind of Mini LED flexible circuit board and preparation method thereof |
| CN110456570A (en) * | 2019-08-09 | 2019-11-15 | 佛山市国星光电股份有限公司 | A kind of LED backlight module and display device |
| CN111315124A (en) * | 2020-02-27 | 2020-06-19 | 歌尔股份有限公司 | Circuit board assembly and electronic device |
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Application publication date: 20210928 |