CN209710425U - A kind of Novel PCB board - Google Patents

A kind of Novel PCB board Download PDF

Info

Publication number
CN209710425U
CN209710425U CN201822182713.0U CN201822182713U CN209710425U CN 209710425 U CN209710425 U CN 209710425U CN 201822182713 U CN201822182713 U CN 201822182713U CN 209710425 U CN209710425 U CN 209710425U
Authority
CN
China
Prior art keywords
hole
welding
pcb board
welding position
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201822182713.0U
Other languages
Chinese (zh)
Inventor
朱晓刚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou De Electronics Technology Co Ltd
Original Assignee
Suzhou De Electronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou De Electronics Technology Co Ltd filed Critical Suzhou De Electronics Technology Co Ltd
Priority to CN201822182713.0U priority Critical patent/CN209710425U/en
Application granted granted Critical
Publication of CN209710425U publication Critical patent/CN209710425U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The utility model discloses a kind of Novel PCB board, including substrate, the substrate includes the patch pad and fixation hole of an at least row;Every row's patch pad includes at least one welding groove, the middle part of the welding groove is arranged in the welding position, the two sides of the welding position are arranged in the through-hole, the fixation hole is positioned close to the position at four angles of the substrate, and welding hole is set in the side of the welding position, with the pin of fixed patch, liquid tin cream sufficiently covers in welding position in the welding position that pcb board provided by the utility model can make, part to enable adequately is contacted with tin cream and is fixed on substrate, falling off for patch is avoided, the fraction defective of product is greatly reduced.

Description

A kind of Novel PCB board
Technical field
The utility model relates to which component field is controlled electronically, in particular to a kind of Novel PCB board.
Background technique
Pcb board is also known as printed wiring board, and as important one of electronic control component, pcb board is electronic component Supporter, mainly as the carrier of the electrical connection of electronic component.Since it is made of electron printing, therefore claimed For " printing " circuit board.After electronic equipment uses pcb board, due to the consistency of similar printed board, so as to avoid manually connecing The mistake of line, and can realize electronic component insert or mount automatically, automatic tin soldering and automatic detection, avoid the matter of electronic equipment It measures very different, raises labour productivity, reduces the production cost, it is even more important that pcb board is easy to repair, and then reduces Maintenance cost.
SMT is surface installation technique (abbreviation of Surface Mounted Technology), is in electronic assembly industry A kind of most popular technology and technique.It is a kind of will to be mounted on printed circuit board without pin or short leg surface-assembled component On the surface of (Printed Circuit Board, PCB) or the surface of other substrates, added by the methods of reflow welding or immersed solder With the circuit load technology of welding assembly, and pursues and minimize with electronic product, it has to surface patch element is used, Reflow soldering in SMT basic technology is an important step, and soldering paste is melted, and makes surface-assembled component and pcb board jail Adhere and be connected together, and this process often will appear component fall off or the problems such as poor contact, in order to reduce weldering The fraction defective of pcb board is connect, not just the improvement of welding procedure, is also required to make some improvement on pcb board.
Summary of the invention
In view of the above problems in the prior art, the purpose of the utility model is to provide a kind of Novel PCB boards, to understand Certainly welding is unstable, the caducous problem of part.
In order to solve the above-mentioned technical problem, the specific technical solution of the utility model is as follows:
The utility model provides a kind of Novel PCB board, including substrate, and the substrate is the carrier of the pcb board, the base Plate includes the patch pad and fixation hole of an at least row;Every row's patch pad includes at least one welding groove, the welding groove packet Through-hole and welding position are included, the middle part of the welding groove is arranged in the welding position, and the two of the welding position are arranged in the through-hole Side, the fixation hole are positioned close to the position at four angles of the substrate.
Further, a layer insulating is set on the substrate, and the protective layer of insulation can protect copper wire, be also prevented from wave Short circuit caused by when weldering, and save the dosage of scolding tin.
Specifically, the insulating layer is solder mask, this is more commonly used and target material of waking up relatively, in addition to having very well Insulation effect, maintenance etc. work when can play the role of certain comparison.
Further, the through-hole includes first through hole and the second through-hole, and the first through hole and the second through-hole are with respect to institute It states welding position setting, the first through hole and is equal to the design of the second through-hole patch pad is divided into several welding grooves.
Specifically, the first through hole and the second through-hole are L-shaped, and the short side of the first through hole and the second through-hole exists On same straight line.
Further, the welding position includes the first welding position and the second welding position, one patch of welding in each welding position Piece, first welding position and the second welding position are disposed side by side between the first through hole and two long sides of the second through-hole.
Further, the welding position includes welding hole, and the side of the welding position, the weldering is arranged in the welding hole Hole is connect for fixing the pin of the patch.
Further, the substrate is lamina.
Further, the substrate is copper-clad plate.
Optionally, the two sides of the length direction of the substrate are arranged in the fixation hole, and every side is arranged three uniformly The fixation hole of distribution can be better by three fixation holes of setting since the patch in pcb board under normal circumstances all can be very much Fixed pcb board.
By adopting the above technical scheme, a kind of Novel PCB board described in the utility model has the following beneficial effects:
1. row's welding groove is arranged on patch pad, can integrate weldering for a kind of Novel PCB board described in the utility model Large batch of patch is connect, different product demands is met.
2. a kind of Novel PCB board described in the utility model, the welding for reinforcing pcb board by the quantity of fixation hole are strong Degree, increases product quality and stability.
3. a kind of Novel PCB board described in the utility model can accelerate welding by the well-regulated design of welding position Speed improves the efficiency of welding.
4. a kind of Novel PCB board described in the utility model, by designing through-hole by welding position, the welding position that can make Upper liquid tin cream sufficiently covers in welding position, so that the part enable is adequately contacted with tin cream and is fixed on substrate, keeps away Exempt from falling off for patch, greatly reduces the fraction defective of product.
Detailed description of the invention
It, below will be to institute in embodiment or description of the prior art in order to illustrate more clearly of the technical solution of the utility model Attached drawing to be used is needed to be briefly described.It should be evident that the accompanying drawings in the following description is only some of the utility model Embodiment for those of ordinary skill in the art without creative efforts, can also be attached according to these Figure obtains other attached drawings.
A kind of Fig. 1 structural schematic diagram of Novel PCB board described in the utility model;
The structural schematic diagram of welding groove in a kind of Fig. 2 Novel PCB board described in the utility model;
Side view when a kind of soldering surface mounted completion of Fig. 3 Novel PCB board described in the utility model.
In figure: 1- patch pad, 2- fixation hole, 3- patch, 11- welding groove, 111- through-hole, 112- welding position, 113- weldering Connect hole, 1111- first through hole, the second through-hole of 1112-, the first welding position of 1121-, the second welding position of 1122-.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are in the premise for not making creative work Under every other embodiment obtained, fall within the protection scope of the utility model.
It should be noted that the specification and claims of the utility model and term " first " in above-mentioned attached drawing, " second " etc. is to be used to distinguish similar objects, without being used to describe a particular order or precedence order.It should be understood that in this way The data used are interchangeable under appropriate circumstances, so that the embodiments of the present invention described herein can be in addition at this In illustrate or description those of other than sequence implement.In addition, term " includes " and " having " and their any deformation, meaning Figure be to cover it is non-exclusive include, for example, containing the process, method of a series of steps or units, device, product or equipment Those of be not necessarily limited to be clearly listed step or unit, but may include be not clearly listed or for these processes, The intrinsic other step or units of method, product or equipment.
Embodiment 1
Since existing pcb board can all occur that the welding is not firm when carrying out patch welding, tin cream and patch are not connect sufficiently Touching causes patch easy to fall off to increase the fraction defective of product, as shown in Figure 1, the present embodiment provides a kind of Novel PCB board, packet Substrate is included, the substrate includes the patch pad 1 and fixation hole 2 of an at least row;The patch pad 1 includes at least one welding Slot 11, the welding groove 11 include through-hole 111 and welding position 112, and the welding position 112 is arranged in the welding groove 11 The two sides of the welding position 112 are arranged in portion, the through-hole 111, and the fixation hole 2 is positioned close to four of the substrate 1 The pcb board is fixed by fixation hole 2 in the position at angle.
In some embodiments, a layer insulating is set on the substrate, the protective layer of insulation can protect copper wire, Short circuit caused by when preventing wave soldering, and save the dosage of scolding tin.Specifically, the insulating layer is solder mask, this is that comparison is normal With and target material of waking up relatively can be played in work such as maintenances certain to being compared in addition to there is good insulation effect With.
In some embodiments, the through-hole 111 includes first through hole 1111 and the second through-hole 1112, the first through hole 1111 and second welding position setting relatively of through-hole 1112, the first through hole 1111 and the design etc. with the second through-hole 1112 In patch pad is divided into several welding grooves 11.Specifically, the first through hole 1111 and the second through-hole 1112 are in L Type, and the short side of the first through hole 1111 and the second through-hole 1112 is on the same line.
In some embodiments, the welding position 112 includes the first welding position 1121 and the second welding position 1122, each weldering One patch 2 of welding on position is connect, first welding position 1121 and the second welding position 1122 are disposed side by side on the first through hole 1111 and second through-hole 1112 two long sides between.
In some embodiments, the welding position 112 includes welding hole 113, and the welding hole 113 is arranged in the welding The side of position, the welding hole 113 are used to fix the pin of the patch 3.
In some embodiments, the substrate is lamina.
In some embodiments, the substrate is copper-clad plate.
Embodiment 2, for the alternative embodiment for being embodiment 1
As shown in Figure 1, the present embodiment provides a kind of Novel PCB board, including substrate, the substrate include the patch of an at least row Piece pad 1 and fixation hole 2;The patch pad 1 includes at least one welding groove 11, and the welding groove 11 includes 111 He of through-hole The middle part of the welding groove 11 is arranged in welding position 112, the welding position 112, and the through-hole 111 is arranged in the welding position The two sides of the length direction of the substrate are arranged in 112 two sides, the fixation hole 2, and every side setting three equally distributed solid Determine hole 2, since the patch 3 in pcb board under normal circumstances all can be very much, can preferably be fixed by the way that three fixation holes 2 are arranged Pcb board.
In some embodiments, a layer insulating is set on the substrate, the protective layer of insulation can protect copper wire, Short circuit caused by when preventing wave soldering, and save the dosage of scolding tin.Specifically, the insulating layer is solder mask, this is that comparison is normal With and target material of waking up relatively can be played in work such as maintenances certain to being compared in addition to there is good insulation effect With.
In some embodiments, the through-hole 111 includes first through hole 1111 and the second through-hole 1112, the first through hole 1111 and second welding position setting relatively of through-hole 1112, the first through hole 1111 and the design etc. with the second through-hole 1112 In patch pad is divided into several welding grooves 11.Specifically, the first through hole 1111 and the second through-hole 1112 are in L Type, and the short side of the first through hole 1111 and the second through-hole 1112 is on the same line.
In some embodiments, the welding position 112 includes the first welding position 1121 and the second welding position 1122, each weldering One patch 3 of welding on position is connect, first welding position 1121 and the second welding position 1122 are disposed side by side on the first through hole 1111 and second through-hole 1112 two long sides between.
In some embodiments, the welding position 112 includes welding hole 113, and the welding hole 113 is arranged in the welding The side of position, the welding hole 113 are used to fix the pin of the patch 3.
In some embodiments, the substrate is lamina.
In some embodiments, the substrate is copper-clad plate.
A kind of Novel PCB board provided through this embodiment has the following technical effect that several by designing on substrate Patch pad is arranged, row's welding groove is set on patch pad, the large batch of patch of welding is can integrate, meets different products Demand;The weld strength for reinforcing pcb board by the quantity of fixation hole, increases product quality and stability;Pass through welding position Well-regulated design can accelerate the speed of welding, improve the efficiency of welding;By designing through-hole by welding position, can make Welding position on liquid tin cream sufficiently cover in welding position, so that the part enable adequately contacts with tin cream and is fixed on base On plate, falling off for patch is avoided, greatly reduces the fraction defective of product.
The above is only the preferred embodiment of the present invention, is not intended to limit the utility model, for this field For technical staff, it is clear that the present invention is not limited to the details of the above exemplary embodiments, and practical new without departing substantially from this In the case where the spirit or essential attributes of type, the utility model can be realized in other specific forms.Therefore, no matter from which From the point of view of point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the utility model is by appended right It is required that rather than above description limit, it is intended that all changes that will be fallen within the meaning and scope of the equivalent elements of the claims Change is embraced therein.Any reference signs in the claims should not be construed as limiting the involved claims.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art The other embodiments being understood that.

Claims (10)

1. a kind of Novel PCB board, which is characterized in that including substrate, the substrate includes the patch pad (1) of an at least row and consolidates Determine hole (2);The patch pad (1) includes at least one welding groove (11), and the welding groove (11) includes through-hole (111) and weldering It connects position (112), at the middle part of the welding groove (11), the through-hole (111) is arranged in the weldering for welding position (112) setting The two sides of position (112) are connect, the fixation hole (2) is positioned close to the position at four angles of the substrate.
2. a kind of Novel PCB board according to claim 1, which is characterized in that a layer insulating is arranged on the substrate.
3. a kind of Novel PCB board according to claim 2, which is characterized in that the insulating layer is solder mask.
4. a kind of Novel PCB board according to claim 1, which is characterized in that the through-hole (111) includes first through hole (1111) and the second through-hole (1112), the first through hole (1111) and the relatively described welding position (112) of the second through-hole (1112) Setting.
5. a kind of Novel PCB board according to claim 4, which is characterized in that the first through hole (1111) and second is led to Hole (1112) is L-shaped, and the short side of the first through hole (1111) and the second through-hole (1112) is on the same line.
6. a kind of Novel PCB board according to claim 4, which is characterized in that the welding position (112) includes the first welding Position (1121) and the second welding position (1122), first welding position (1121) and the second welding position (1122) are disposed side by side on institute It states between first through hole (1111) and two long sides of the second through-hole (1112).
7. a kind of Novel PCB board according to claim 6, which is characterized in that the welding position (112) includes welding hole (113), side of welding hole (113) setting in the welding position (112).
8. a kind of Novel PCB board according to claim 1, which is characterized in that the substrate is lamina.
9. a kind of Novel PCB board according to claim 1, which is characterized in that the substrate is copper-clad plate.
10. a kind of Novel PCB board according to claim 1, which is characterized in that the fixation hole (2) is arranged in the base Three equally distributed fixation holes (2) are arranged in the two sides of the length direction of plate, every side.
CN201822182713.0U 2018-12-25 2018-12-25 A kind of Novel PCB board Expired - Fee Related CN209710425U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201822182713.0U CN209710425U (en) 2018-12-25 2018-12-25 A kind of Novel PCB board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201822182713.0U CN209710425U (en) 2018-12-25 2018-12-25 A kind of Novel PCB board

Publications (1)

Publication Number Publication Date
CN209710425U true CN209710425U (en) 2019-11-29

Family

ID=68638226

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201822182713.0U Expired - Fee Related CN209710425U (en) 2018-12-25 2018-12-25 A kind of Novel PCB board

Country Status (1)

Country Link
CN (1) CN209710425U (en)

Similar Documents

Publication Publication Date Title
US7637415B2 (en) Methods and apparatus for assembling a printed circuit board
CN101336042B (en) Solder pad, circuit board and electronic apparatus having the solder pad
TWI517769B (en) A welding structure and method of filtering component and pcb board
CN102224375A (en) Illumination device and method for manufacturing the same
CN106686905A (en) Surface mount technology for sheet components
CN100355327C (en) A printed circuit board and production method thereof
CN211630498U (en) PCB and common bonding pad thereof
CN209710425U (en) A kind of Novel PCB board
CN205430776U (en) Circuit board combination
CN211267256U (en) Packaging structure for improving reliability welding of high-power device
CN210328192U (en) Pcba
CN110958786A (en) Method for soldering tin on side surface of PCBA (printed Circuit Board Assembly) of on-chip paster
CN205320367U (en) Circuit board convenient to welding surface pastes dress device
CN110944462A (en) PCB (printed circuit board) welding method with metal elastic sheet switch and product
CN204818358U (en) Device of simulation backward flow brazier holds container
CN219876346U (en) Wave soldering prevents even plug-in components packaging structure of tin
KR101315949B1 (en) Soldering method for nickel-terminal of battery protection circuit board and soldering jig thereof
CN216146519U (en) Connecting structure of surface-mounted element
CN210225876U (en) Multi-group impedance PCB
CN102056405B (en) Surface mount structure and circuit board with same
CN1722937A (en) Surface mounting method for electronic element and printed circuit board applying same mounting method
CN206879217U (en) Mobile terminal and its circuit board assemblies
US20020008313A1 (en) Substrate mounting an integrated circuit pakage with a deformed lead
US20100003843A1 (en) Smt/dip type connector structure having at least three rows of terminals
US20130148320A1 (en) Method for producing an electronic module by sequential fixation of the components

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20191129