KR101315949B1 - Soldering method for nickel-terminal of battery protection circuit board and soldering jig thereof - Google Patents

Soldering method for nickel-terminal of battery protection circuit board and soldering jig thereof Download PDF

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Publication number
KR101315949B1
KR101315949B1 KR1020120036792A KR20120036792A KR101315949B1 KR 101315949 B1 KR101315949 B1 KR 101315949B1 KR 1020120036792 A KR1020120036792 A KR 1020120036792A KR 20120036792 A KR20120036792 A KR 20120036792A KR 101315949 B1 KR101315949 B1 KR 101315949B1
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KR
South Korea
Prior art keywords
circuit board
soldering
nickel terminal
nickel
terminal
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KR1020120036792A
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Korean (ko)
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이신범
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지에스피 주식회사
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0426—Fixtures for other work
    • B23K37/0435—Clamps
    • B23K37/0443—Jigs
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connection Of Batteries Or Terminals (AREA)
  • Battery Mounting, Suspending (AREA)

Abstract

PURPOSE: A soldering method for nickel terminal of battery protection circuit board and a soldering jig thereof are provided to use cream soldering, thereby improving the quality. CONSTITUTION: A circuit board is mounted on a soldering jig (ST10). Cream solder is soldered on the circuit board (ST20). A nickel terminal is mounted on the soldered circuit board (ST30). The mounted nickel terminal is soldered through reflow (ST40). A nickel terminal mounting groove is formed to make a right angle with a circuit board mounting groove. [Reference numerals] (ST10) Step of mounting a circuit board on a soldering jig; (ST20) Step of soldering cream solder on the circuit board; (ST30) Step of mounting a nickel terminal on the soldered circuit board; (ST40) Step of soldering the mounted nickel terminal on the circuit board through reflow

Description

배터리 보호회로 기판의 니켈단자 솔더링 방법 및 그 솔더링 지그{Soldering Method for Nickel-Terminal of Battery Protection Circuit Board and Soldering Jig Thereof} Soldering Method for Nickel-Terminal of Battery Protection Circuit Board and Soldering Jig Thereof}

본 발명은 배터리 보호회로 기판의 니켈단자 솔더링 방법 및 그 솔더링 지그에 관한 것으로, 더욱 상세하게는 배터리의 보호회로가 인쇄된 회로기판에 니켈단자를 정확하게 솔더링할 수 있도록 하는 배터리 보호회로 기판의 니켈단자 솔더링 방법 및 그 솔더링 지그에 관한 것이다.
The present invention relates to a method for soldering a nickel terminal of a battery protection circuit board and a soldering jig thereof, and more particularly, to a nickel terminal of a battery protection circuit board to enable the battery protection circuit to accurately solder the nickel terminal to the printed circuit board. It relates to a soldering method and a soldering jig thereof.

일반적으로 배터리용 보호회로가 인쇄된 회로기판은 배터리의 내부에 설치되어, 배터리의 과충전, 과방전 및 배터리에 과전류가 흐르는 것을 방지하여 배터리가 손상되는 것을 방지함으로써, 배터리의 수명을 연장시키는 배터리 보호 장치이다.In general, a circuit board on which a battery protection circuit is printed is installed inside the battery to prevent battery overcharging, overdischarging, and overcurrent flowing to the battery, thereby preventing damage to the battery, thereby extending battery life. Device.

도 1은 종래의 배터리 보호회로가 인쇄된 회로기판을 나타낸 도면으로, 작업자가 수작업을 통해 회로기판(10)에 형성된 동판(11)에 도시되지 않은 배터리의 단자와 전기적으로 연결되도록 하는 니켈단자(20)가 납땜(Soldering)된다.1 is a view illustrating a circuit board on which a conventional battery protection circuit is printed, and a nickel terminal for allowing an operator to be electrically connected to a terminal of a battery (not shown) on a copper plate 11 formed on a circuit board 10 by manual operation ( 20) is soldered.

상기 회로기판(10)에는 도 1에 도시된 바와 같이 배터리 보호회로가 상면 또는 상하면에 인쇄되고, 상기 배터리의 단자와 전기적으로 연결되도록 하는 니켈단자(20)가 납땜될 수 있도록 동판(11)이 상면 또는 상하면에 형성된다.As shown in FIG. 1, the circuit board 10 includes a copper plate 11 so that the battery protection circuit is printed on the upper or upper and lower surfaces, and the nickel terminal 20 for soldering the terminals of the battery is electrically soldered. It is formed on the upper or upper surface.

상기 니켈단자(20)가 상기 회로기판(10)의 동판(11)에 전기적으로 연결되도록 하는 종래의 과정을 살펴보면 다음과 같다.Looking at the conventional process for the nickel terminal 20 is electrically connected to the copper plate 11 of the circuit board 10 as follows.

먼저, 자동화 공정에 따라 컨베이어(Conveyor)를 통해 이동되는 회로기판(10)의 동판(11)에 크림솔더(Cream Sloder)를 도포하고, 크림솔더가 도포된 상기 동판(11)에 니켈단자(20)를 실장(Mounting)시키면 크림솔더가 경화되면서 니켈단자(20)가 동판(11)에 솔더링(Soldering)된다.First, a cream solder is applied to the copper plate 11 of the circuit board 10 that is moved through a conveyor according to an automated process, and the nickel terminal 20 is applied to the copper plate 11 to which the cream solder is applied. ) Mounting (Mounting) and the solder solder is hardened so that the nickel terminal 20 is soldered to the copper plate (11).

이와 같은 과정에서 크림솔더가 도포된 동판(11)의 정해진 범위에 니켈단자(20)가 실장(Mounting)되는데, 상기 니켈단자(20)의 길이가 길거나, 상기 니켈단자(20)의 연결부위 구조 및 형태에 따라 실장(Mounting)이 불가능한 경우가 발생한다.In this process, the nickel terminal 20 is mounted in a predetermined range of the copper plate 11 coated with the cream solder, and the length of the nickel terminal 20 is long, or the structure of the connection portion of the nickel terminal 20. In some cases, mounting may not be possible depending on the form.

즉, 상기 니켈단자(20)의 길이와 폭이 상기 회로기판(10)의 동판(11)의 범위 보다 길어지거나, 큰 경우에는 상기 회로기판(10)에 조립된 부품간에 간섭이 발생함으로써, 상기 회로기판(10)의 동판(11)에 상기 나켈단자(20)를 실장(Mounting)시킬 수 없는 문제점이 있다.That is, when the length and width of the nickel terminal 20 is longer or larger than the range of the copper plate 11 of the circuit board 10, the interference occurs between components assembled to the circuit board 10. There is a problem in that the nickel terminal 20 cannot be mounted on the copper plate 11 of the circuit board 10.

또한, 상기 니켈단자(20)의 길이 및 형태에 따른 SMT(Surface Mount Technology) 작업이 불가능한 경우에는 상기 회로기판(10)의 동판(11)에 와이어납(14)을 이용하여 작업자가 수작업으로 상기 회로기판(10)의 동판(11)에 납땜을 직접하게 되는데, 작업시 이물질과 납볼 등이 발생하여 생산성이 저하되는 단점이 있으며, 수작업으로 납땜을 하는 작업자의 숙련도에 따라 품질 안정도가 떨어지는 문제점이 있다.
In addition, when surface mount technology (SMT) work according to the length and shape of the nickel terminal 20 is not possible, the worker manually uses the wire lead 14 to the copper plate 11 of the circuit board 10. Solder is directly soldered to the copper plate 11 of the circuit board 10, there is a disadvantage that the productivity is reduced by the generation of foreign matter and lead balls, etc., and the quality stability is poor depending on the skill of the operator to solder by hand have.

따라서, 본 발명은 상기와 같은 문제점을 해결하기 위하여 창작된 것으로서, 배터리의 보호회로가 인쇄된 회로기판의 동판에 니켈단자를 솔더링하는 경우, SMT(Surface Mount Technology) 작업이 불가능한 부분에 대한 솔더링과 수작업 납땜시 발생되는 생산성 및 품질 저하를 개선시킬 수 있는 배터리 보호회로 기판의 니켈단자 솔더링 방법을 제공하는데 그 목적이 있다.Therefore, the present invention was created in order to solve the above problems, and when soldering the nickel terminal to the copper plate of the printed circuit board, the protection circuit of the battery, the soldering for the parts where SMT (Surface Mount Technology) operation is impossible and It is an object of the present invention to provide a nickel terminal soldering method for a battery protection circuit board which can improve productivity and quality deterioration caused by manual soldering.

또한, 본 발명의 다른 목적은 복수개의 장공이 관통된 판형상의 지그의 상부에 복수개의 회로기판이 장착되도록 장공과 십자로 교차되는 회로기판 장착홈을 형성하고, 회로기판 장착홈의 양쪽 끝단부에 니켈단자가 장착하는 니켈단자 장착홈이 형성된 솔더링 지그를 제공하는데 그 목적이 있다.
In addition, another object of the present invention is to form a circuit board mounting groove that crosses the long hole and the cross so that the plurality of circuit boards are mounted on the plate-shaped jig through which the plurality of holes are penetrated, and nickel is formed at both ends of the circuit board mounting groove. It is an object of the present invention to provide a soldering jig in which a nickel terminal mounting groove for mounting a terminal is formed.

상기와 같은 목적을 달성하기 위한 본 발명에 따른 배터리 보호회로 기판의 니켈단자 솔더링 방법은 배터리의 보호회로가 인쇄된 회로기판에 니켈단자를 솔더링하는 방법에 있어서, 솔더링 지그에 회로기판을 장착하는 단계와, 상기 회로기판에 크림솔더(Cream Solder)를 솔더링하는 단계, 상기 크림솔더가 솔더링된 회로기판에 니켈단자를 마운팅하는 단계, 및 상기 회로기판에 마운팅된 니켈단자를 리플로우(Reflow)를 통해 솔더링하는 단계를 포함하는 것을 특징으로 한다.Nickel terminal soldering method of the battery protection circuit board according to the present invention for achieving the above object in the method for soldering the nickel terminal to the circuit board printed the protection circuit of the battery, the step of mounting the circuit board on the soldering jig And soldering a cream solder to the circuit board, mounting a nickel terminal to the circuit board to which the cream solder is soldered, and reflowing the nickel terminal mounted on the circuit board. It characterized in that it comprises a step of soldering.

본 발명의 상기 솔더링 지그에 회로기판을 장착하는 단계에서, 상기 솔더링 지그는, 복수개의 장공이 관통된 판형상의 지그와, 상기 지그의 상부에 복수개의 회로기판이 장착되도록 상기 장공과 십자로 교차되는 회로기판 장착홈, 및 상기 회로기판 장착홈의 양쪽 끝단부에 서로 다른 방향으로 상기 회로기판 장착홈을 기준으로 직각이 되도록 형성되는 니켈단자 장착홈을 포함하는 것을 특징으로 한다.In the step of mounting a circuit board on the soldering jig of the present invention, the soldering jig, a plate-shaped jig through which a plurality of holes are passed, and a circuit intersecting with the long hole and cross so that a plurality of circuit boards are mounted on the jig. And a nickel terminal mounting groove formed at right angles with respect to the circuit board mounting groove in different directions at both ends of the board mounting groove and the circuit board mounting groove.

본 발명의 다른 관점에 따른 배터리 보호회로 기판의 니켈단자 솔더링 지그는 복수개의 장공이 관통된 판형상의 지그와, 상기 지그의 상부에는 복수개의 회로기판이 장착되도록 상기 장공과 십자로 교차되는 회로기판 장착홈이 형성되고, 상기 회로기판 장착홈의 양쪽 끝단부에는 니켈단자가 장착하는 니켈단자 장착홈이 서로 다른 방향으로 상기 회로기판 장착홈과 직각이 되도록 형성되는 것을 특징으로 한다.The nickel terminal soldering jig of the battery protection circuit board according to another aspect of the present invention is a plate-shaped jig through which a plurality of holes are penetrated, and a circuit board mounting groove which crosses the holes and crosses so that a plurality of circuit boards are mounted on the jig. Is formed, the both ends of the circuit board mounting groove is characterized in that the nickel terminal mounting groove for mounting the nickel terminal is formed to be perpendicular to the circuit board mounting groove in different directions.

본 발명의 상기 니켈단자 장착홈의 깊이는 상기 회로기판 장착홈에 장착된 회로기판의 높이와 일치하는 것을 특징으로 한다.
The depth of the nickel terminal mounting groove of the present invention is characterized in that it corresponds to the height of the circuit board mounted in the circuit board mounting groove.

상기와 같이 구성된 본 발명에 따른 배터리 보호회로 기판의 니켈단자 솔더링 방법 및 그 솔더링 지그는 배터리 보회로 기판의 동판에 니켈단자를 마운팅시키는 경우, 회로기판과 니켈단자의 형상에 맞는 솔더링 지그를 사용하여 크림솔더링(Cream Soldering)과 회로기판에 니켈단자를 마운팅(Mounting)하고, 회로기판에 마운팅된 니켈단자를 리플로우(Reflow)를 통해 솔더링함으로써, 별다른 추가 구조 없이 회로기판의 동판에 니켈단자를 정확하게 위치시켜 솔더링할 수 있으며, 수작업으로 솔더링시 발생하는 생산성 및 품질 저하를 개선시킬 수 있는 효과가 있다.
The nickel terminal soldering method and the soldering jig of the battery protection circuit board according to the present invention configured as described above, when mounting the nickel terminal on the copper plate of the battery circuit board, using a soldering jig suitable for the shape of the circuit board and the nickel terminal By cream soldering and mounting the nickel terminal on the circuit board and soldering the nickel terminal mounted on the circuit board through reflow, the nickel terminal on the copper plate of the circuit board can be accurately It can be located and soldered, and has the effect of improving productivity and quality deterioration caused by soldering by hand.

도 1은 종래의 배터리 보호회로가 인쇄된 회로기판을 나타낸 도면.
도 2는 본 발명에 따른 솔더링 지그의 외관 형상을 나타낸 도면.
도 3은 본 발명에 따른 회로기판에 니켈단자가 솔더링된 상태를 나타낸 도면.
도 4는 본 발명에 따른 배터리 보호회로 기판의 니켈단자 솔더링 방법을 설명하기 위한 흐름도.1 is a view showing a circuit board printed with a conventional battery protection circuit.
Figure 2 is a view showing the appearance of the soldering jig according to the present invention.
3 is a view showing a state in which a nickel terminal is soldered to a circuit board according to the present invention.
Figure 4 is a flow chart for explaining a nickel terminal soldering method of a battery protection circuit board according to the present invention.

이하, 본 발명의 바람직한 실시예를 첨부된 도면을 참조하여 상세히 설명하면 다음과 같다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 2는 본 발명에 따른 솔더링 지그의 외관 형상을 나타낸 도면이고, 도 3은 본 발명에 따른 회로기판에 니켈단자가 솔더링된 상태를 나타낸 도면이다.2 is a view showing the appearance of the soldering jig according to the present invention, Figure 3 is a view showing a state where the nickel terminal is soldered to the circuit board according to the present invention.

먼저, 도 2와 도 3에 도시된 바와 같이 본 발명에 따른 솔더링 지그(100)는, 복수개의 장공(112)이 관통된 예를 들어, 알루미늄 재질로 이루어진 판형상의 지그판(110)과, 상기 지그판(110)의 상부에는 복수개의 회로기판(10)이 장착되도록 상기 장공(112)과 십자로 교차되는 회로기판 장착홈(114)이 형성된다.First, as shown in FIGS. 2 and 3, the soldering jig 100 according to the present invention includes a plate-shaped jig plate 110 made of, for example, an aluminum material, through which a plurality of long holes 112 penetrate. A circuit board mounting groove 114 is formed on the jig plate 110 to cross the long holes 112 and the cross so that the plurality of circuit boards 10 may be mounted.

상기 회로기판 장착홈(114)의 양쪽 끝단부에는 니켈단자(20)가 장착하는 니켈단자 장착홈(116)이 서로 다른 방향으로 상기 회로기판 장착홈(114)과 직각이 되도록 형성된다.Both end portions of the circuit board mounting groove 114 are formed such that the nickel terminal mounting groove 116 mounted by the nickel terminal 20 is perpendicular to the circuit board mounting groove 114 in different directions.

상기 니켈단자 장착홈(116)의 깊이는 상기 회로기판 장착홈(114)에 장착된 회로기판(10)의 상면 높이와 일치하도록 설계되는 것이 바람직하다.The depth of the nickel terminal mounting groove 116 is preferably designed to match the height of the upper surface of the circuit board 10 mounted in the circuit board mounting groove 114.

또한, 상기 지그판(110)과 상기 회로기판 장착홈(114) 및 상기 니켈단자 장착홈(116)은 상기 회로기판(10)을 제조하는 수량과 크기 및 형태에 따라 다양하게 제작될 수 있으며, 도 2에 도시된 지그판(110)은 샘플 제작된 것이다.In addition, the jig board 110, the circuit board mounting groove 114, and the nickel terminal mounting groove 116 may be variously manufactured according to the quantity, size, and shape of manufacturing the circuit board 10. The jig plate 110 shown in FIG. 2 is sampled.

상기 회로기판(10)은 상기 니켈단자(20)가 솔더링되도록 상면 또는 상하면에 동판(11)을 구비하고, 상기 니켈단자(20)는 도시되지 않은 배터리의 단자와 전기적으로 연결된다.The circuit board 10 includes a copper plate 11 on an upper surface or an upper surface so that the nickel terminal 20 is soldered, and the nickel terminal 20 is electrically connected to a terminal of a battery (not shown).

즉, 일반적으로 배터리(미도시) 내부에는 배터리 보호회로가 인쇄된 회로기판(10)이 설치된다. 또한, 상기 회로기판(10)의 적어도 한면에는 회로 패턴이 인쇄되고, 회로 패턴에 연결되는 동판(11)이 각각 형성된다. That is, generally, a circuit board 10 on which a battery protection circuit is printed is installed in a battery (not shown). In addition, a circuit pattern is printed on at least one surface of the circuit board 10, and copper plates 11 connected to the circuit pattern are formed, respectively.

상기 회로기판(10)의 상면에 형성된 동판(11)에는 니켈단자(20)가 마운팅되며, 상기 니켈단자(20)는 배터리 보호회로의 외측으로 돌출되어 상기 배터리의 내부에 마련된 (+)(-)단자와 각각 접속 연결된다.
The nickel terminal 20 is mounted on the copper plate 11 formed on the upper surface of the circuit board 10, and the nickel terminal 20 protrudes out of the battery protection circuit to be provided with a positive (+) (−) provided inside the battery. Each terminal is connected.

이하, 첨부한 도 4를 참조하여 본 발명에 따른 배터리 보호회로 기판의 니켈단자 솔더링 과정을 상세히 설명한다.Hereinafter, the nickel terminal soldering process of the battery protection circuit board according to the present invention will be described in detail with reference to FIG. 4.

도 4는 본 발명에 따른 배터리 보호회로 기판의 니켈단자 솔더링 방법을 설명하기 위한 흐름도이다.4 is a flowchart illustrating a nickel terminal soldering method of a battery protection circuit board according to the present invention.

우선, 도 4에 도시된 바와 같이 본 발명에 따른 배터리 보호회로 기판의 니켈단자 솔더링 방법은, 상기 솔더링 지그(100)에 작업 수량에 따라 배터리 보호회로가 인쇄된 회로기판(10)을 복수개 상기 지그판(110)의 회로기판 장착홈(112)에 장착시키고(ST10), 복수개의 상기 회로기판(10)의 동판(12)에 크림솔더(Cream Solder)를 솔더링하는 작업을 수행한다(ST20). 여기서, 작업자는 크림솔더의 점도를 확인하여 크림솔더의 점도를 변경할 수도 있다.First, as shown in FIG. 4, in the nickel terminal soldering method of the battery protection circuit board according to the present invention, a plurality of the circuit boards 10 on which the battery protection circuit is printed are printed on the soldering jig 100 according to the quantity of work. It is mounted to the circuit board mounting groove 112 of the plate 110 (ST10), and the solder solder (Cream Solder) to the copper plate 12 of the plurality of the circuit board 10 is performed (ST20). Here, the operator may change the viscosity of the cream solder by checking the viscosity of the cream solder.

상기 크림솔더링 작업(ST20)이 완료되면, 상기 크림솔더가 솔더링된 회로기판(10)에 상기 니켈단자(20)를 마운팅하고(ST30), 상기 회로기판(10)에 마운팅된 니켈단자(20)를 리플로우(Reflow)를 통해 솔더링을 수행한다(ST40).When the cream soldering operation ST20 is completed, the nickel terminal 20 is mounted on the circuit board 10 to which the cream solder is soldered (ST30), and the nickel terminal 20 mounted on the circuit board 10. Soldering is performed through reflow (ST40).

이와 같이 상기 회로기판(10)의 동판(11)에 니켈단자(20)가 정위치에 마운팅된 상태에서 리플로우를 통과하게 되면 상기 회로기판(10)의 동판(11)에 형성된 솔더(Solder)가 경화되면서 상기 니켈단자(11)가 정위치에 고정 연결된다.As such, when the nickel terminal 20 passes through the reflow while the nickel terminal 20 is mounted on the copper plate 11 of the circuit board 10, the solder formed on the copper plate 11 of the circuit board 10 is passed. The nickel terminal 11 is fixedly fixed in place while being cured.

상기 실시예에서는 니켈단자(20)의 형상이 스트리트 형태에서 솔더링하는 것을 예로 들었지만, 상기 니켈단자(20)가 어떠한 형상에서도 크림솔더링 작업을 할 수 있게 된다.In the above embodiment, although the shape of the nickel terminal 20 is soldered in a street form as an example, the nickel terminal 20 may be cream soldered in any shape.

상술한 바와 같이 구성된 본 발명에 따른 배터리 보호회로 기판의 니켈단자 솔더링 방법 및 그 솔더링 지그는 배터리 보호회로 기판의 동판에 니켈단자를 마운팅시키는 경우, 회로기판과 니켈단자의 형상에 맞는 솔더링 지그를 사용하여 크림솔더링(Cream Soldering)과 회로기판에 니켈단자를 마운팅(Mounting)하고, 회로기판에 마운팅된 니켈단자를 리플로우(Reflow)를 통해 솔더링함으로써, 별다른 추가 구조 없이 회로기판의 동판에 니켈단자를 정확하게 위치시켜 솔더링할 수 있게 된다.
The nickel terminal soldering method and the soldering jig of the battery protection circuit board according to the present invention configured as described above, when mounting the nickel terminal on the copper plate of the battery protection circuit board, use a soldering jig suitable for the shape of the circuit board and the nickel terminal. Cream soldering and mounting the nickel terminal on the circuit board, and soldering the nickel terminal mounted on the circuit board through reflow, so that the nickel terminal on the copper plate of the circuit board without any additional structure It can be accurately positioned and soldered.

이상, 전술한 본 발명의 바람직한 실시예는, 예시의 목적을 위해 개시된 것으로, 당업자라면, 이하 첨부된 특허청구범위에 개시된 본 발명의 기술적 사상과 그 기술적 범위 내에서, 또 다른 다양한 실시예들을 개량, 변경, 대체 또는 부가 등이 가능할 것이다.
It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined in the appended claims. , Alteration, substitution, addition, or the like.

10 : 회로기판 11 : 동판
20 : 니켈단자
100 : 솔더링 지그 110 : 지그판
112 : 장공 114 : 회로기판 장착홈
116 : 니켈단자 장착홈 10: circuit board 11: copper plate
20: nickel terminal
100: soldering jig 110: jig plate
112: long hole 114: circuit board mounting groove
116: Nickel terminal mounting groove

Claims (5)

배터리의 보호회로가 인쇄된 회로기판에 니켈단자를 솔더링하는 방법에 있어서,
솔더링 지그에 회로기판을 장착하는 단계;
상기 회로기판에 크림솔더(Cream Solder)를 솔더링하는 단계;
상기 크림솔더가 솔더링된 회로기판에 니켈단자를 마운팅하는 단계;
상기 회로기판에 마운팅된 니켈단자를 리플로우(Reflow)를 통해 솔더링하는 단계;를 포함하되,
상기 솔더링 지그에 회로기판이 장착하는 단계에서, 상기 솔더링 지그는 복수개의 장공이 관통된 판형상의 지그와, 상기 지그의 상부에 복수개의 회로기판이 장착되도록 상기 장공과 십자로 교차되는 회로기판 장착홈, 및 상기 회로기판 장착홈의 양쪽 끝단부에 서로 다른 방향으로 상기 회로기판 장착홈을 기준으로 직각이 되도록 형성되는 니켈단자 장착홈을 포함하는 것을 특징으로 하는 배터리 보호회로 기판의 니켈단자 솔더링 방법.
In a method of soldering a nickel terminal to a circuit board printed with a battery protection circuit,
Mounting a circuit board on the soldering jig;
Soldering a cream solder to the circuit board;
Mounting a nickel terminal on the circuit board to which the cream solder is soldered;
And soldering the nickel terminal mounted on the circuit board through reflow.
In the step of mounting the circuit board on the soldering jig, the soldering jig is a plate-shaped jig through which a plurality of long holes, and a circuit board mounting groove that crosses the hole and cross so that a plurality of circuit boards are mounted on the jig, And nickel terminal mounting grooves formed at both ends of the circuit board mounting groove at right angles with respect to the circuit board mounting groove in different directions.
삭제delete 제 1 항에 있어서,
상기 니켈단자 장착홈의 깊이는
상기 장착홈에 장착된 회로기판의 상단 높이와 일치하는 것을 특징으로 하는 배터리 보호회로 기판의 니켈단자 솔더링 방법.The method of claim 1,
The depth of the nickel terminal mounting groove
The nickel terminal soldering method of the battery protection circuit board, characterized in that the same as the upper height of the circuit board mounted in the mounting groove. 삭제delete 삭제delete
KR1020120036792A 2012-04-09 2012-04-09 Soldering method for nickel-terminal of battery protection circuit board and soldering jig thereof KR101315949B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210070127A (en) * 2019-12-04 2021-06-14 주식회사 파워로직스 Protect circuit module and method of manufacturing the same

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JP2002026498A (en) 2000-07-12 2002-01-25 Mitsumi Electric Co Ltd Mounting mechanism of nickel plate in printed circuit board
JP2004303618A (en) * 2003-03-31 2004-10-28 Mitsumi Electric Co Ltd Terminal structure and secondary battery protection circuit
KR100704968B1 (en) * 2006-04-25 2007-04-09 삼성전기주식회사 Jig for joining flexible printed cercuit board
KR101128125B1 (en) * 2010-05-24 2012-03-22 넥스콘 테크놀러지 주식회사 a tabby type PCM manufacturing method

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JP2002026498A (en) 2000-07-12 2002-01-25 Mitsumi Electric Co Ltd Mounting mechanism of nickel plate in printed circuit board
JP2004303618A (en) * 2003-03-31 2004-10-28 Mitsumi Electric Co Ltd Terminal structure and secondary battery protection circuit
KR100704968B1 (en) * 2006-04-25 2007-04-09 삼성전기주식회사 Jig for joining flexible printed cercuit board
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210070127A (en) * 2019-12-04 2021-06-14 주식회사 파워로직스 Protect circuit module and method of manufacturing the same
KR102378294B1 (en) * 2019-12-04 2022-03-25 주식회사 파워로직스 Protect circuit module and method of manufacturing the same

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