JP2004303618A - Terminal structure and secondary battery protection circuit - Google Patents

Terminal structure and secondary battery protection circuit Download PDF

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Publication number
JP2004303618A
JP2004303618A JP2003096345A JP2003096345A JP2004303618A JP 2004303618 A JP2004303618 A JP 2004303618A JP 2003096345 A JP2003096345 A JP 2003096345A JP 2003096345 A JP2003096345 A JP 2003096345A JP 2004303618 A JP2004303618 A JP 2004303618A
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Japan
Prior art keywords
terminal
solder
protection circuit
fillet
circuit board
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JP2003096345A
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Japanese (ja)
Inventor
Yoshiaki Miyamoto
欣明 宮本
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Mitsumi Electric Co Ltd
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Mitsumi Electric Co Ltd
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Priority to JP2003096345A priority Critical patent/JP2004303618A/en
Publication of JP2004303618A publication Critical patent/JP2004303618A/en
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Abstract

<P>PROBLEM TO BE SOLVED: To increase mounting strength of a terminal soldered to copper foil (land) on a substrate, and to provide a secondary battery protection circuit using the terminal. <P>SOLUTION: This terminal structure of the terminal 10 soldered to the protecting circuit substrate 1 has a hole part 10a in a soldering part 13 soldered to the substrate 1. Solder plating 14 and solder cream 15 melted by heating in a reflow furnace become familiar with the inside of a recessed end face 10h and the circular hole part 10a and adhere to them with the spread of its cross-sectional shape showing an almost triangle. In addition, solder is cured by a cooling process to form filets 5 and 7. Thereby, strength against peeling caused when moving the free terminal of the terminal 10 by the filet 7 can be increased. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
この発明は、回路基板の端子構造及び二次電池保護回路に係り、特に基板に半田付けされる端子の取り付け強度の向上に関するものである。
【０００２】
【従来の技術】
近年の、携帯電話をはじめとする携帯端末装置は、その駆動源として電池パックを搭載している。
【０００３】
図７は電池パックの分解斜視図を示す。
【０００４】
電池パック２は主に、電池本体２０、保護回路基板１、ケース蓋２１、ケース２３から構成されている。
【０００５】
電池本体２０は、例えば、リチウムイオン蓄電池から構成されている。保護回路基板１は、電池本体２０とここでは図示しない外部端子との間に接続されており、充電時及び放電時の電池本体２０の電圧を監視して、電池本体２０の充放電を制御し、電池本体２０の保護を行うための回路が搭載され、電池本体２０とは端子板１０により接続されている。端子板１０の一端は、電池本体２０にスポット溶接され、他端は保護回路基板１に半田付けされている。
【０００６】
保護回路基板１は、例えば、多層プリント配線基板から構成されており、封止されたＩＣ（ｉｎｔｅｇｒａｔｅｄ ｃｉｒｃｕｉｔ）チップなどの電子部品４２を搭載し、端子板１０が半田付けされている。保護回路基板１はこの状態で、電池パック２の組み立て先に提供される。
【０００７】
組み立て先では、提供された保護回路基板１と電池本体２０との接続を行うための端子板１０の一端をスポット溶接する。端子板１０の一端は、矢印Ａ、Ｂ方向に示すように折曲されつつ、多端が電池本体２０にスポット溶接される。
【０００８】
従来の保護回路基板における端子板、例えばニッケル板の取付け機構の一例を図８、９に示す。同図中、図７と同一構成部分には同一符号を付しその説明は省略する。
【０００９】
図９は、接着前の保護回路基板１及び端子１０を示す。保護回路基板１の長手方向端側の略中央に、銅箔（以下ランドという）１２、該ランド１２の表面にあらかじめ塗布された半田クリーム１５、こちらもあらかじめ端子１０の表面に施された半田めっき１４、端子１０の順で積層されている。
【００１０】
端子板１０と前記ランド１２に挟まれた半田めっき及び半田クリームはリフローによって溶融され前記端子１０の端面になじみ、広がりに断面形略三角形状を呈して付着する。この三角形状の半田が冷却されて後述するフィレットとなる。
【００１１】
図１０（Ａ）は硬化後の保護回路基板１及び端子板１０の平面図を、図１０（Ｂ）は同図（Ａ）のＣ−Ｃ線断面図を、図１１は図１０（Ａ）のＤ−Ｄ線断面図を示す。他端については同一の取り付け機構であるため図を省略した。
【００１２】
端子板１０の一端１０ｇは保護回路基板１の長手方向と垂直な端面の略中央と半田により固定されており、端子板１０の他端は電池本体２０と接続されるため自由端となっている。前記半田は、リフローによる加熱後、保護回路基板側端面になじみ、冷却工程により硬化して、端面１０ｇにフィレット５を形成する。剥離強度を向上させるためには、該フィレット５を形成することが有効であるとされている。
【００１３】
図１２は図１０の変形例であり、凹状の端面形状としたものを示す。図１２（Ｂ）は、同図（Ａ）のＥ‐Ｅ線断面図を示す。保護回路基板側端面に凹状の端面１０ｈを有する端子１０が、保護回路基板の長手方向と垂直な端面の略中央と半田により固定されており、端子板１０の他端は電池本体２０と接続されるため自由端となっている。
【００１４】
端子板１０の端面１０ｈを凹状に形成したことに伴い、リフローにより加熱された半田が、保護回路基板側端面１０ｈになじみ、冷却工程により硬化して、凹状部分にフィレット５が形成される。端面を凹状とすることでフィレット５が形成される部分が増大し、端面１０ｇよりも剥離強度が増している。また、図１３に示すように、ランド１２に突起部１２ａを形成して、フィレットが形成される部分を増すことが考えられた（例えば、特許文献１参照）。
【００１５】
【特許文献】
特開平２００２−２６４９８（図１）
【００１６】
【発明が解決しようとする課題】
前記図７における上記従来の保護回路基板１における端子１０の取り付け機構は、保護回路基板１と電池本体２０との接続を行うために端子板１０の一端を、矢印Ａ、Ｂ方向に示すように折曲される際、端子板１０が半田付け部１３から剥離することがあった。
【００１７】
前述のとおり、剥離強度を向上させるためには、端子１０の保護回路基板側端面にフィレット５を形成することが有効であるとされていたため、図１２に示す例えば凹状の端面形状の端子１０ｈや、図１３に示すようにランドに突起部１２ａを用い、形成されるフィレット部を増大することが考えられた。しかしながら、フィレット５を形成する部分の増大により剥離強度が増すものの、なお、端子板１０の折曲等により、半田付け部が剥離するという問題があった。これは、図１０において、フィレット５の形成面が端子１０の保護回路基板側端面に向かっている（方向Ｘ）ため、図１０（Ｂ）において、端子１０の自由端を上方へ動かした場合（Ｃ）、ランド１２及び端子１０が剥離するためである。
【００１８】
なお、端子１０の保護回路基板側の端側を上方に動かして端子１０を剥離させる力（Ｄ）は、フィレット５が存在するため働かない。
【００１９】
また、前記半田めっき及び半田クリームがリフローによって溶融され前記端子１０の端面になじみ広がる過程において、凹状の端面１０ｈを取り囲む液状化した半田による不均一な圧力や、半田の冷却、硬化時に前記端子の位置がずれる可能性があり、より位置ずれしにくい端子の取り付け機構が求められていた。
【００２０】
本発明は上記の点に鑑みてなされたもので、取付け強度の高い端子構造及び回路保護基板、位置ずれしにくい端子の取り付け機構を提供することができる。
【００２１】
【課題を解決するための手段】
本発明は、基板（１）と半田付けされる端子（１０）の端子構造において、前記回路保護基板（１）と半田付けされる半田付け部（１３）に、穴部（１０ａ）又は切り欠き部（１０ｂ）を有することを特徴とする。
【００２２】
本発明によれば、該穴部（１０ａ）又は切り欠き部（１０ｄ）の内側にフィレット（５）が形成され、端子（１０）の自由端に向く側にフィレット（７）が形成される。この方向にフィレットが形成されると、基板側端面（１０ｇ）に形成されるフィレット（５）よりも、端子の屈曲、変形などに関し剥離強度が向上する。
【００２３】
また、前記半田めっき（１４）及び半田クリーム（１５）がリフローによって溶融されなじみ広がる過程において、溶融した半田が穴部（１０ａ）又は切り欠き部（１０ｄ）に流れ込むため、半田付け部（１３）を囲む溶融した半田からうける不均一な圧力が吸収され、端子（１０）の位置ずれが縮小する。
【００２４】
前記凹状端面１０ｈと同時に、穴部（１０ａ）又は切り欠き部（１０ｂ）を有することでフィレット（５）が増大するため、端子の屈曲、変形などに関し剥離強度が向上する。
【００２５】
また、端子（１０）の半田付け部（１３）に切り欠き部（１０ｄ）を設けると、切り欠き部に応力が集中しやすくなるため端子の屈曲等に対し切り欠き部（１０ｄ）で屈曲しやすくなり、結果剥離しにくくなる。
【００２６】
なお、上記参照符号はあくまでも参考であり、これによって、特許請求の範囲が限定されるものではない。
【００２７】
【発明の実施の形態】
〔第１実施例〕
図１（Ａ）は、本発明の第１実施例の形態として半田付け部（１３）に円形の穴部（くりぬき部）を設けた基板及び端子の平面図を示す。なお、図１２と同一構成部分には同一符号を付し、その説明は省略する。
本実施例の端子１０は、保護回路基板側の半田付け部の略中央に円形の穴部１０ａを備える。
【００２８】
図２は、接着前のプリント基板１及び端子１０の側面図を、図１（Ｂ）は接着後の図１（Ａ）のＡ−Ａ線断面図を示す。なお、図１（Ｂ）においては硬化後に端子１０とランド１２間に介在し残留する半田は省略した。また、同図中、図９及び図１０と同一構成部分には同一符号を付し、その説明は省略する。
【００２９】
本実施例では、リフロー炉による加熱によって溶融した半田めっき１４及び半田クリーム１５が端子１０の端面１０ｈ及び円形の穴部１０ａの内側になじみ、広がり断面形略三角形状を呈して付着する。更に、該半田は、前記加熱後の冷却工程により硬化してフィレット５及び７を形成する。
【００３０】
本実施例では、前記端子１０の自由端に向く端面にフィレット７が形成される点に特徴がある。これにより、端子１０の自由端を上方へ動かすときに発生する剥離に対して強度を増すことができる。
【００３１】
なお、フィレット７は正確に端子１０の自由端に向く端面に形成されていなくても剥離強度の向上が期待できる。
【００３２】
また、本実施例によれば、前記半田めっき１４及び半田クリーム１５がリフローによって溶融されなじみ広がる過程において、溶融した半田が穴部１０ａに流れ込むため、半田付け部１３を囲む溶融した半田からうける不均一な圧力が吸収され、端子１０の位置ずれが縮小する。
【００３３】
本実施例に関しては、種々の変形例が考案できる。
【００３４】
図３（Ａ）は、保護回路基板側に長方形の穴部１０ｂを備えた端子１０である。
【００３５】
本変形例では、前記端子１０の自由端に向く側にフィレット７が形成される。自由端に向くフィレット７は、端子１０を上方へ動かすことにより発生する剥離に対し強度を増加させる。
【００３６】
図３（Ｂ）は、保護回路基板側に楕円形状の穴部１０ｃを備えた端子１０の平面図を示す。
【００３７】
本変形例では、前記端子１０の自由端に向く側にフィレット７が形成される。自由端に向く側のフィレットは剥離強度を向上させることができる。また、長方形状とした穴部１０ｂでは、端子の屈曲、変形などに関し、長方形が有する４つの角部に応力が集中する恐れがあるが、本変形例の楕円形状の穴部１０ｃでは応力の集中が軽減できる。
【００３８】
なお、本変形例は、穴部の形状として長方形状、楕円形状に限られるものではなく、多角形状、星型形状などでも良い。
【００３９】
〔第２実施例〕
図４（Ａ）は、本発明の第２実施例の平面図、同（Ｂ）は本発明の第２実施例の図４（Ａ）におけるＢ−Ｂ線断面図を示す。なお、図４（Ｂ）においては硬化後に端子１０とランド１２間に介在し残留する半田は省略した。同図中、図１と同一構成部分には同一符号を付し、その説明は省略する。
【００４０】
本実施例では、端子１０が保護回路基板側の半田付け部１３に切り欠き部１０ｄを備える点で第１実施例と異なる。
【００４１】
リフロー炉による加熱によって溶融した半田めっき１４及び半田クリーム１５が端子１０の切り欠き部１０ｄの内側になじみ、広がり断面形略三角形状を呈して付着する。更に、該半田は、前記加熱後の冷却工程により硬化してフィレット７を形成する。
【００４２】
第１実施例で前述したとおり、端子１０の自由端に向く方向にフィレット７が形成されると、保護回路基板側端面１０ｇに形成されるフィレット５よりも、端子の屈曲、変形などに関し、剥離強度が確保される。なお、フィレット７が正確に端子１０の自由端に向く方向でなくても剥離強度の向上が期待できる。
【００４３】
また、本実施例によれば、前記半田めっき１４及び半田クリーム１５がリフローによって溶融されなじみ広がる過程において、溶融した半田が切り欠き部１０ｄに流れ込むため、半田付け部１３を囲む溶融した半田からうける不均一な圧力が吸収され、端子１０の位置ずれが縮小する。
【００４４】
また、該実施例では切り欠き部に応力が集中しやすくなるため端子の屈曲等に対し切り欠き部で屈曲しやすくなり、その結果、剥離しにくくなるという特徴がある。
【００４５】
本実施例に関しては、種々の変形例が考案できる。
【００４６】
図５（Ａ）は、保護回路基板側の半田付け部１３に矩形の切り欠き部１０ｅを備えた端子１０の平面図である。
【００４７】
本変形例では、前記端子１０の自由端に向く側にフィレット７が形成されるが、自由端に向くフィレット７は、剥離強度を向上させることができる。
【００４８】
図５（Ｂ）は、保護回路基板側の半田付け部１３にＵ字形乃至半楕円形状の切り欠き部１０ｆを備えた端子１０の平面図である。
【００４９】
本変形例では、前記端子１０の自由端に向く側にフィレット７が形成されるが、自由端に向く側のフィレットは、剥離強度を向上させることができる。また、矩形状とした切り欠き部１０ｅでは、端子の屈曲、変形などに関し、矩形が有する角部に応力が集中する恐れがあるが、本変形例では応力の集中が軽減できるため、端子１０の破断の恐れが軽減できる。
【００５０】
図５（Ｃ）は、保護回路基板側の半田付け部１３に切り欠き部を二対備えた端子１０の平面図である。
【００５１】
本変形例では、前記端子１０の自由端に向く側にフィレット７が形成されるとともに、形成されるフィレット部分が増大し剥離強度が増す。同時に屈曲性が向上するという特徴がある。また二対の切り欠き部のうち、基板側端面に近い切り欠き部にフィレット７を形成しもう一方の切り欠き部を簡略化した形状、例えば切り込みにするなどの変形例も考えられる。該実施例では製造行程を簡易化する効果がある。
【００５２】
なお、本変形例は、切り欠き部の形状としてＶ字乃至三角形状、Ｕ字乃至半楕円形状に限られるものではなく、多角形状などでも良い。
【００５３】
〔第３実施例〕
図６は、本発明の第３実施例の平面図を示す。なお、同図中、図５と同一構成部分には同一符号を付し、その説明は省略する。
【００５４】
本実施例では、保護回路基板側の半田付け部１３に穴部１０ａとともに切り欠き部１０ｂを備える点で第１、２実施例と異なる。
【００５５】
前述の通り、端子１０の自由端に向く側にフィレット７が形成されることで、保護回路基板側端面１０ｇに形成されるフィレット５よりも、端子の屈曲、変形などに関し、剥離強度が確保される。また、穴部のみ又は切り欠き部のみの形状よりも形成されるフィレット５及び７を増大できるので、第１、２実施例よりも剥離強度を向上させることができる。
【００５６】
また、本実施例によれば、前記半田めっき１４及び半田クリーム１５がリフローによって溶融されなじみ広がる過程において、溶融した半田が穴部及び切り欠き部に流れ込むため、半田付け部１３を囲む溶融した半田からうける不均一な圧力が吸収され、端子１０の位置ずれが縮小する。
【００５７】
また、本実施例では切り欠き部に応力が集中しやすくなるため端子の屈曲等に対し切り欠き部で屈曲しやすくなり、結果剥離しにくくなるという特徴がある。
【００５８】
なお、本実施例においても、穴部の形状として、長方形状、楕円形状、多角形状、星型形状などでも良く、切り欠き部の形状として、Ｖ字乃至三角形状、Ｕ字乃至半楕円形状、多角形状などでも良い。
【００５９】
而して、本発明は、本発明の精神を逸脱しない限り種々の改変を為すことができ、そして本発明が該改変されたものに及ぶことは当然である。
【発明の効果】
以上詳細に説明したように、本発明は、取り付け強度の高い端子構造及び二次電池保護回路を提供する。
【図面の簡単な説明】
【図１】本発明の第１実施例の平面図及び断面図である。
【図２】本発明の第１実施例の側面図である。
【図３】本発明の第１実施例の変形例である端子１０の平面図である。
【図４】本発明の第２実施例の平面図及び断面図である。
【図５】本発明の第２実施例の変形例である端子１０の平面図である。
【図６】本発明の第３実施例である端子１０の平面図である。
【図７】電池パックの分解斜視図である。
【図８】保護回路基板の斜視図である。
【図９】従来発明の側面図である。
【図１０】従来技術の平面図及び断面図である。
【図１１】図１０（Ａ）のＤ−Ｄ線断面図である。
【図１２】従来技術の平面図及び断面図である。
【図１３】従来技術の平面図である。
【符号の説明】
１ プリント基板
２ 電池パック
５ 半田付けされる端面に形成されたフィレット
７ 自由端に向く端面に形成されたフィレット
端子
１０ａ 円形状の穴部
１０ｂ 四角形状の穴部
１０ｃ 楕円形状の穴部
１０ｄ 三角形状の切り欠き部
１０ｅ 矩形状の切り欠き部
１０ｆ 半楕円形状の切り欠き部
１０ｇ 端面
１０ｈ 凹状の端面
１２ ランド
１２ａ ランドの突起部
１３ 半田付け部
半田めっき
クリーム半田
２０ ２次電池本体
２０ａ ２次電池の電極
２１ 電池ケースの蓋
２３ 電池ケース
４２ 封止されたＩＣチップ[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a terminal structure of a circuit board and a secondary battery protection circuit, and more particularly to an improvement in mounting strength of a terminal to be soldered to the board.
[0002]
[Prior art]
2. Description of the Related Art In recent years, mobile terminal devices such as mobile phones are equipped with a battery pack as a driving source.
[0003]
FIG. 7 is an exploded perspective view of the battery pack.
[0004]
The battery pack 2 mainly includes a battery main body 20, a protection circuit board 1, a case lid 21, and a case 23.
[0005]
The battery main body 20 is composed of, for example, a lithium ion storage battery. The protection circuit board 1 is connected between the battery body 20 and an external terminal (not shown), and monitors the voltage of the battery body 20 at the time of charging and discharging to control charging and discharging of the battery body 20. A circuit for protecting the battery body 20 is mounted, and the battery body 20 is connected to the battery body 20 by the terminal plate 10. One end of the terminal plate 10 is spot-welded to the battery body 20, and the other end is soldered to the protection circuit board 1.
[0006]
The protection circuit board 1 is composed of, for example, a multilayer printed wiring board, on which an electronic component 42 such as a sealed IC (integrated circuit) chip is mounted, and the terminal plate 10 is soldered. The protection circuit board 1 is provided to the assembly destination of the battery pack 2 in this state.
[0007]
At the assembly destination, one end of the terminal plate 10 for connecting the provided protection circuit board 1 and the battery body 20 is spot-welded. One end of the terminal plate 10 is spot-welded to the battery body 20 at one end while being bent as indicated by arrows A and B.
[0008]
FIGS. 8 and 9 show an example of a mounting mechanism of a terminal plate, for example, a nickel plate in a conventional protection circuit board. 7, the same components as those of FIG. 7 are denoted by the same reference numerals, and the description thereof will be omitted.
[0009]
FIG. 9 shows the protection circuit board 1 and the terminals 10 before bonding. A copper foil (hereinafter referred to as a land) 12, a solder cream 15 previously applied to the surface of the land 12, and a solder plating also applied to the surface of the terminal 10 in advance at substantially the center on the longitudinal end side of the protection circuit board 1. 14, terminals 10 are stacked in this order.
[0010]
The solder plating and the solder cream sandwiched between the terminal plate 10 and the land 12 are melted by reflow and adapted to the end surface of the terminal 10 and adhere to the terminal surface in a substantially triangular cross section. The triangular solder is cooled to form a fillet described later.
[0011]
10A is a plan view of the protection circuit board 1 and the terminal plate 10 after curing, FIG. 10B is a cross-sectional view taken along the line CC of FIG. 10A, and FIG. 11 is FIG. 1 shows a cross-sectional view taken along line DD of FIG. The other end has the same attachment mechanism, so that the illustration is omitted.
[0012]
One end 10g of the terminal plate 10 is fixed by solder to substantially the center of the end surface perpendicular to the longitudinal direction of the protection circuit board 1, and the other end of the terminal plate 10 is a free end because it is connected to the battery body 20. . After the solder is heated by reflow, the solder adapts to the end face on the side of the protection circuit board and is hardened by a cooling process to form the fillet 5 on the end face 10g. It is said that forming the fillet 5 is effective in improving the peel strength.
[0013]
FIG. 12 shows a modified example of FIG. 10 in which a concave end surface is formed. FIG. 12B is a sectional view taken along line EE of FIG. A terminal 10 having a concave end face 10h on an end face on the side of the protection circuit board is fixed by solder to substantially the center of an end face perpendicular to the longitudinal direction of the protection circuit board, and the other end of the terminal plate 10 is connected to the battery body 20. Free end.
[0014]
With the end face 10h of the terminal plate 10 formed in a concave shape, the solder heated by the reflow fits into the protection circuit board side end face 10h and is hardened by a cooling process, so that the fillet 5 is formed in the concave portion. By making the end face concave, the portion where the fillet 5 is formed increases, and the peel strength is higher than that of the end face 10g. Further, as shown in FIG. 13, it has been considered that a protrusion 12 a is formed on the land 12 to increase a portion where a fillet is formed (for example, see Patent Document 1).
[0015]
[Patent Document]
JP-A-2002-26498 (FIG. 1)
[0016]
[Problems to be solved by the invention]
In the conventional protection circuit board 1 mounting mechanism shown in FIG. 7, one end of the terminal plate 10 is connected to the protection circuit board 1 and the battery body 20 as shown by arrows A and B in FIG. When bent, the terminal plate 10 may be peeled off from the soldered portion 13 in some cases.
[0017]
As described above, it has been considered effective to form the fillet 5 on the end face of the terminal 10 on the side of the protection circuit board in order to improve the peel strength. Therefore, for example, the terminal 10h having a concave end face shape shown in FIG. As shown in FIG. 13, it has been considered that the protrusions 12a are used for the lands to increase the number of fillets formed. However, although the peel strength increases due to the increase in the portion where the fillet 5 is formed, there is a problem that the soldered portion is peeled off due to bending of the terminal plate 10 or the like. This is because, in FIG. 10, since the surface on which the fillet 5 is formed faces the end surface of the terminal 10 on the side of the protection circuit board (direction X), the free end of the terminal 10 is moved upward in FIG. C), because the lands 12 and the terminals 10 are peeled off.
[0018]
The force (D) for moving the end of the terminal 10 on the side of the protection circuit board upward to detach the terminal 10 does not work because the fillet 5 exists.
[0019]
Further, in the process in which the solder plating and the solder cream are melted by reflow and spread over the end face of the terminal 10, uneven pressure due to liquefied solder surrounding the concave end face 10h, and the cooling and curing of the terminal during solder cooling. There is a possibility that the position is shifted, and there has been a demand for a mechanism for mounting the terminal which is less likely to be shifted.
[0020]
The present invention has been made in view of the above points, and can provide a terminal structure with high mounting strength, a circuit protection board, and a terminal mounting mechanism that is less likely to be displaced.
[0021]
[Means for Solving the Problems]
According to the present invention, in a terminal structure of a terminal (10) to be soldered to a substrate (1), a hole (10a) or a notch is formed in a soldering portion (13) to be soldered to the circuit protection substrate (1). (10b).
[0022]
According to the present invention, the fillet (5) is formed inside the hole (10a) or the notch (10d), and the fillet (7) is formed on the side facing the free end of the terminal (10). When the fillet is formed in this direction, the peel strength with respect to the bending and deformation of the terminal is improved as compared with the fillet (5) formed on the substrate side end surface (10g).
[0023]
Further, in a process in which the solder plating (14) and the solder cream (15) are melted and spread by reflow, the melted solder flows into the hole (10a) or the cutout (10d). The uneven pressure received from the molten solder surrounding the terminal is absorbed, and the displacement of the terminal (10) is reduced.
[0024]
Since the fillet (5) is increased by having the hole (10a) or the cutout (10b) at the same time as the concave end face 10h, the peel strength is improved with respect to bending and deformation of the terminal.
[0025]
Further, when the notch portion (10d) is provided in the soldering portion (13) of the terminal (10), stress tends to concentrate on the notch portion, so that the terminal bends at the notch portion (10d) against bending or the like. It is easy to peel off as a result.
[0026]
Note that the above reference numerals are for reference only, and do not limit the scope of the claims.
[0027]
BEST MODE FOR CARRYING OUT THE INVENTION
[First embodiment]
FIG. 1A is a plan view of a substrate and a terminal in which a circular hole (opening) is provided in a soldering portion (13) as an embodiment of the first embodiment of the present invention. The same components as those in FIG. 12 are denoted by the same reference numerals, and description thereof will be omitted.
The terminal 10 of this embodiment has a circular hole 10a substantially at the center of the soldering portion on the protection circuit board side.
[0028]
FIG. 2 is a side view of the printed circuit board 1 and the terminals 10 before bonding, and FIG. 1B is a cross-sectional view taken along line AA of FIG. 1A after bonding. In FIG. 1B, the solder remaining between the terminal 10 and the land 12 after curing is omitted. 9, the same components as those in FIGS. 9 and 10 are denoted by the same reference numerals, and description thereof will be omitted.
[0029]
In the present embodiment, the solder plating 14 and the solder cream 15 melted by heating in the reflow furnace fit into the end face 10h of the terminal 10 and the inside of the circular hole 10a, and spread and adhere in a substantially triangular cross section. Further, the solder hardens in the cooling step after the heating to form fillets 5 and 7.
[0030]
The present embodiment is characterized in that a fillet 7 is formed on the end face of the terminal 10 facing the free end. Thereby, the strength against peeling that occurs when the free end of the terminal 10 is moved upward can be increased.
[0031]
Note that even if the fillet 7 is not accurately formed on the end face facing the free end of the terminal 10, improvement in peel strength can be expected.
[0032]
Further, according to the present embodiment, in a process in which the solder plating 14 and the solder cream 15 are melted and spread by the reflow, the melted solder flows into the hole 10a, so that the molten solder surrounding the soldering portion 13 cannot receive. The uniform pressure is absorbed, and the displacement of the terminal 10 is reduced.
[0033]
Regarding the present embodiment, various modifications can be devised.
[0034]
FIG. 3A shows a terminal 10 having a rectangular hole 10b on the protection circuit board side.
[0035]
In this modification, a fillet 7 is formed on the side of the terminal 10 facing the free end. The fillet 7 facing the free end increases the strength against peeling caused by moving the terminal 10 upward.
[0036]
FIG. 3B is a plan view of the terminal 10 having the elliptical hole 10c on the protection circuit board side.
[0037]
In this modification, a fillet 7 is formed on the side of the terminal 10 facing the free end. The fillet facing the free end can improve the peel strength. Further, in the rectangular hole 10b, stress may be concentrated on four corners of the rectangle with respect to bending and deformation of the terminal, but in the elliptical hole 10c of this modification, stress concentration may occur. Can be reduced.
[0038]
In this modification, the shape of the hole is not limited to a rectangle or an ellipse, but may be a polygon, a star, or the like.
[0039]
[Second embodiment]
FIG. 4A is a plan view of a second embodiment of the present invention, and FIG. 4B is a cross-sectional view taken along the line BB of FIG. 4A of the second embodiment of the present invention. In FIG. 4B, the solder remaining between the terminal 10 and the land 12 after curing is omitted. In the figure, the same components as those of FIG. 1 are denoted by the same reference numerals, and description thereof will be omitted.
[0040]
This embodiment is different from the first embodiment in that the terminal 10 has a notch 10d in the soldering portion 13 on the protection circuit board side.
[0041]
The solder plating 14 and the solder cream 15 melted by the heating in the reflow furnace are adapted to the inside of the cutout portion 10d of the terminal 10 and adhere to the terminal 10 in a substantially triangular cross section. Further, the solder is cured by the cooling step after the heating to form the fillet 7.
[0042]
As described above in the first embodiment, when the fillet 7 is formed in the direction toward the free end of the terminal 10, the terminal is more peeled with respect to bending and deformation of the terminal than the fillet 5 formed on the protection circuit board side end surface 10g. Strength is ensured. In addition, even if the fillet 7 does not face the free end of the terminal 10 accurately, improvement in peel strength can be expected.
[0043]
Further, according to the present embodiment, in a process in which the solder plating 14 and the solder cream 15 are melted and spread by reflow, the melted solder flows into the notch 10d, so that the solder is received from the melted solder surrounding the soldering portion 13. The uneven pressure is absorbed, and the displacement of the terminal 10 is reduced.
[0044]
Further, in this embodiment, the stress is easily concentrated on the notch, so that the terminal is easily bent at the notch with respect to the bending of the terminal and the like, and as a result, it is difficult to peel off.
[0045]
Regarding the present embodiment, various modifications can be devised.
[0046]
FIG. 5A is a plan view of the terminal 10 having the rectangular cutout portion 10e in the soldering portion 13 on the protection circuit board side.
[0047]
In the present modification, the fillet 7 is formed on the side of the terminal 10 facing the free end, but the fillet 7 facing the free end can improve the peel strength.
[0048]
FIG. 5B is a plan view of the terminal 10 having the U-shaped or semi-elliptical cutout 10 f in the soldering portion 13 on the protection circuit board side.
[0049]
In this modification, the fillet 7 is formed on the side of the terminal 10 facing the free end, but the fillet on the side facing the free end can improve the peel strength. Further, in the rectangular cutout 10e, stress may be concentrated on the corners of the rectangle with respect to bending and deformation of the terminal. However, in this modification, the concentration of the stress can be reduced. The risk of breakage can be reduced.
[0050]
FIG. 5C is a plan view of the terminal 10 having two notches in the soldering portion 13 on the protection circuit board side.
[0051]
In the present modified example, the fillet 7 is formed on the side facing the free end of the terminal 10, and the formed fillet portion increases to increase the peel strength. At the same time, there is a feature that the flexibility is improved. Further, a modified example in which a fillet 7 is formed in the notch near the end face on the substrate side of the two notches and the other notch is formed in a simplified shape, for example, a notch may be considered. This embodiment has the effect of simplifying the manufacturing process.
[0052]
In this modification, the shape of the cutout portion is not limited to the V-shaped or triangular shape, the U-shaped or semi-elliptical shape, and may be a polygonal shape.
[0053]
[Third embodiment]
FIG. 6 shows a plan view of a third embodiment of the present invention. 5, the same components as those of FIG. 5 are denoted by the same reference numerals, and the description thereof will be omitted.
[0054]
This embodiment is different from the first and second embodiments in that a notch 10b is provided in the soldering portion 13 on the protection circuit board side together with the hole 10a.
[0055]
As described above, since the fillet 7 is formed on the side facing the free end of the terminal 10, the peel strength of the terminal in terms of bending, deformation, and the like is secured more than the fillet 5 formed on the protection circuit board side end surface 10g. You. In addition, since the fillets 5 and 7 formed can be increased more than the shape of only the hole or the notch, the peel strength can be improved as compared with the first and second embodiments.
[0056]
Further, according to the present embodiment, in the process where the solder plating 14 and the solder cream 15 are melted and spread by reflow, the molten solder flows into the holes and the notches, so that the molten solder surrounding the soldering portion 13 is formed. The uneven pressure received is absorbed, and the displacement of the terminal 10 is reduced.
[0057]
Further, in the present embodiment, the stress is easily concentrated on the notch, so that the terminal is easily bent at the notch with respect to the bending of the terminal and the like, and as a result, it is difficult to peel off.
[0058]
In the present embodiment, the hole may have a rectangular shape, an elliptical shape, a polygonal shape, a star shape, or the like. A polygonal shape may be used.
[0059]
Thus, the present invention can be variously modified without departing from the spirit of the present invention, and it goes without saying that the present invention extends to the modifications.
【The invention's effect】
As described in detail above, the present invention provides a terminal structure and a secondary battery protection circuit with high mounting strength.
[Brief description of the drawings]
FIG. 1 is a plan view and a sectional view of a first embodiment of the present invention.
FIG. 2 is a side view of the first embodiment of the present invention.
FIG. 3 is a plan view of a terminal 10 which is a modification of the first embodiment of the present invention.
FIG. 4 is a plan view and a sectional view of a second embodiment of the present invention.
FIG. 5 is a plan view of a terminal 10 which is a modification of the second embodiment of the present invention.
FIG. 6 is a plan view of a terminal 10 according to a third embodiment of the present invention.
FIG. 7 is an exploded perspective view of the battery pack.
FIG. 8 is a perspective view of a protection circuit board.
FIG. 9 is a side view of a conventional invention.
FIG. 10 is a plan view and a sectional view of a conventional technique.
FIG. 11 is a sectional view taken along line DD of FIG.
FIG. 12 is a plan view and a cross-sectional view of a conventional technique.
FIG. 13 is a plan view of the prior art.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Printed circuit board 2 Battery pack 5 Fillet formed on end face to be soldered 7 Fillet terminal 10a formed on end face facing free end Circular hole 10b Square hole 10c Elliptical hole 10d Triangular shape Notch 10e Rectangular notch 10f Semi-elliptical notch 10g End face 10h Recessed end face 12 Land 12a Land protrusion 13 Solder solder plating cream solder 20 Secondary battery body 20a Secondary battery body Electrode 21 Battery case lid 23 Battery case 42 Sealed IC chip

Claims (3)

基板と半田付けされる端子の端子構造において、
前記基板と半田付けされる半田付け部に、穴部又は切り欠き部を有することを特徴とする端子構造。In the terminal structure of the terminal soldered to the board,
A terminal structure having a hole or a notch in a soldering portion to be soldered to the substrate. 前記穴部又は切り欠き部は楕円形状又は多角形状であることを特徴とする請求項１記載の端子構造。The terminal structure according to claim 1, wherein the hole or the notch has an elliptical shape or a polygonal shape. 請求項１又は２に記載の端子構造を有する端子を用いて電極と接続された二次電池保護回路。A secondary battery protection circuit connected to an electrode using the terminal having the terminal structure according to claim 1.
JP2003096345A 2003-03-31 2003-03-31 Terminal structure and secondary battery protection circuit Pending JP2004303618A (en)

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JP2007026813A (en) * 2005-07-14 2007-02-01 Nichicon Corp Terminal board, and protective circuit unit of secondary battery equipped with it
JP2009146600A (en) * 2007-12-11 2009-07-02 Nec Tokin Corp Protection circuit module
KR100965683B1 (en) 2008-03-31 2010-06-24 삼성에스디아이 주식회사 Battery pack
KR101023879B1 (en) * 2008-12-18 2011-03-22 삼성에스디아이 주식회사 Secondary battery with protection circuit module
CN102315407A (en) * 2010-07-01 2012-01-11 通用汽车环球科技运作有限责任公司 The battery fin connects and manufacturing approach
US8369095B2 (en) 2007-09-28 2013-02-05 Samsung Sdi Co., Ltd. Protection circuit board for secondary battery and secondary battery using the protection circuit board
KR101315949B1 (en) * 2012-04-09 2013-10-08 지에스피 주식회사 Soldering method for nickel-terminal of battery protection circuit board and soldering jig thereof
US8632900B2 (en) 2008-09-22 2014-01-21 Samsung Sdi Co., Ltd. Secondary battery
CN103531741A (en) * 2013-09-24 2014-01-22 北京鼎能开源电池科技股份有限公司 Lithium ion battery negative electrode tab component, manufacturing method thereof and lithium ion battery
US8703327B2 (en) 2008-06-20 2014-04-22 Samsung Sdi Co., Ltd. Rechargeable battery and manufacturing method thereof
US9065083B2 (en) 2008-06-03 2015-06-23 Samsung Sdi Co., Ltd. Lithium polymer battery
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Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007026813A (en) * 2005-07-14 2007-02-01 Nichicon Corp Terminal board, and protective circuit unit of secondary battery equipped with it
US8369095B2 (en) 2007-09-28 2013-02-05 Samsung Sdi Co., Ltd. Protection circuit board for secondary battery and secondary battery using the protection circuit board
JP2009146600A (en) * 2007-12-11 2009-07-02 Nec Tokin Corp Protection circuit module
KR100965683B1 (en) 2008-03-31 2010-06-24 삼성에스디아이 주식회사 Battery pack
US8795865B2 (en) 2008-03-31 2014-08-05 Samsung Sdi Co., Ltd. Battery pack
US9065083B2 (en) 2008-06-03 2015-06-23 Samsung Sdi Co., Ltd. Lithium polymer battery
US8703327B2 (en) 2008-06-20 2014-04-22 Samsung Sdi Co., Ltd. Rechargeable battery and manufacturing method thereof
US8632900B2 (en) 2008-09-22 2014-01-21 Samsung Sdi Co., Ltd. Secondary battery
KR101023879B1 (en) * 2008-12-18 2011-03-22 삼성에스디아이 주식회사 Secondary battery with protection circuit module
US8685552B2 (en) 2008-12-18 2014-04-01 Samsung Sdi Co., Ltd. Secondary battery including protection circuit module
CN102315407A (en) * 2010-07-01 2012-01-11 通用汽车环球科技运作有限责任公司 The battery fin connects and manufacturing approach
KR101315949B1 (en) * 2012-04-09 2013-10-08 지에스피 주식회사 Soldering method for nickel-terminal of battery protection circuit board and soldering jig thereof
CN103531741A (en) * 2013-09-24 2014-01-22 北京鼎能开源电池科技股份有限公司 Lithium ion battery negative electrode tab component, manufacturing method thereof and lithium ion battery
JP6297199B1 (en) * 2017-01-12 2018-03-20 日本碍子株式会社 End current collecting member and cell stack device
KR20210070127A (en) * 2019-12-04 2021-06-14 주식회사 파워로직스 Protect circuit module and method of manufacturing the same
KR102378294B1 (en) * 2019-12-04 2022-03-25 주식회사 파워로직스 Protect circuit module and method of manufacturing the same

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