TWM643074U - Circuit board structure - Google Patents

Abstract

A circuit board structure includes a main circuit board, a circuit sub-board and at least one conductive metal sheet. The main circuit board has at least one connection opening and two opposite first surfaces and second surfaces. The connection opening communicates between the first surface and the second surface, and the connection opening has a conductive inner wall. The circuit sub-board has at least one connecting portion, and the connecting portion passes through the connecting opening and has a conductive sidewall. The conductive metal sheet has a first part and a second part that are continuous, the first part is located between the conductive inner wall and the conductive side wall, and the second part protrudes from the first surface and has a vertical projection on the first surface.

Description

circuit board structure

The present invention relates to circuit board structure.

Traditionally, the circuit board and the circuit sub-board use the copper fingers of the sub-board to insert into the connection holes on the main board and are soldered by soldering in a wave soldering furnace. However, the solder penetration rate between the connection holes of the main board and the copper fingers of the daughter board cannot be guaranteed to be 100%, resulting in high current transfer impedance and the overall efficiency of the power supply is not as expected.

In view of this, one purpose of the present invention is to provide a circuit board structure to solve the above-mentioned problems of the prior art.

To achieve the above object, according to some embodiments of the present invention, a circuit board structure includes a circuit board, a circuit sub-board and at least one conductive metal sheet. The circuit board has at least one connection opening and two opposite first surfaces and second surfaces, the connection opening communicates between the first surface and the second surface, and the connection opening has a conductive inner wall. The sub-board has at least one connecting portion, and the connecting portion passes through the connecting opening and has a conductive side wall. The conductive metal sheet has a continuous first part and a second part, the first part is located between the conductive inner wall and the conductive side wall, and the second part protrudes from the first surface and has a vertical projection superimposed on the first surface.

In some embodiments of the present invention, the first portion and the second portion of the conductive metal sheet are perpendicular to each other.

In some embodiments of the present invention, the first portion and the second portion of the conductive metal sheet have an L-shaped section.

In some embodiments of the present invention, the conductive metal sheet further includes a third part, and the third part contacts the bottom end surface of the connection part.

In some embodiments of the present invention, the second portion and the third portion of the conductive metal sheet are perpendicular to each other.

In some embodiments of the present invention, the first portion, the second portion and the third portion of the conductive metal sheet have a Z-shaped section.

In some embodiments of the present invention, the circuit board structure further includes a solder paste layer, and the solder paste layer is located between the conductive sidewall and the first portion of the conductive metal sheet.

In some embodiments of the present invention, a circuit board structure includes a circuit board, a circuit sub-board and at least one conductive metal sheet. The circuit board has at least one connection opening and two opposite first surfaces and second surfaces, the connection opening communicates between the first surface and the second surface, and the connection opening has a conductive inner wall. The sub-board has at least one connecting portion, and the connecting portion passes through the connecting opening and has a conductive side wall. The conductive metal sheet has a continuous U-shaped portion and two wing portions, the U-shaped portion is located between the conductive inner wall and the conductive side wall and contacts the bottom end surface of the connecting portion, and the two wing portions protrude from the first surface and have a vertical projection superimposed on the first surface.

In some embodiments of the present invention, the two wing portions are respectively perpendicular to the two top ends of the U-shaped portion.

In some embodiments of the present invention, the circuit board structure further includes a solder paste layer, and the solder paste layer is located between the connecting portion and the U-shaped portion of the conductive metal sheet.

To sum up, the new circuit board structure is used to improve the soldering quality of the circuit board and its sub-board during wave soldering. Effectively absorb enough liquid solder paste to form a high-quality welding structure between the main board and its sub-board, ensuring that the welding structure can transmit current with low impedance. A portion of the conductive metal sheet protrudes from the upper surface of the circuit main board, and is used to fasten the upper surface of the circuit main board to prevent the conductive metal sheet from slipping from the connection opening during the wave soldering process.

In order to make the description of the present invention more detailed and complete, reference may be made to the accompanying drawings and various embodiments described below. Elements in the drawings are not drawn to scale and are provided for illustrative purposes only. Numerous practical details are described below to provide a comprehensive understanding of the present invention; however, those of ordinary skill in the relevant art will understand that the present invention may be practiced without one or more of the practical details, and therefore, these details are not Applied to define the new model.

Please refer to Figures 1 and 2. Figure 1 shows a three-dimensional exploded view of the circuit board structure according to some embodiments of the present invention, and Figure 2 shows an assembled view of the circuit board structure shown in Figure 1. The circuit board structure 100 basically includes a circuit board 130 and at least one circuit board 110 . In some embodiments of the present invention, the main circuit board 130 and the sub-circuit board 110 are first designed and manufactured separately, and then connected and integrated by soldering to perform computer functions. The circuit sub-board 110 may be a circuit module performing a specific function, such as a power supply module sub-board. The circuit board 130 has at least one connection hole 132 and two opposite first surface 130a and second surface 130b, and the connection hole 132 communicates between the first surface 130a and the second surface 130b. The sub-circuit board 110 has at least one connection portion 112, the connection portion 112 of the sub-circuit board 110 is used to pass through the connection opening 132 of the circuit board 130, and the connection portion 112 is electrically connected to the connection opening 132 by welding, so that The circuits of the sub-board 110 and the main board 130 can be electrically connected. In some embodiments of the present invention, the connecting portion 112 is located at an edge (eg bottom edge) of the board body of the sub-board 110 and protrudes from the edge of the board body.

Please refer to FIG. 3 , which shows a partial cross-sectional view along the A-A section of FIG. 2 according to some embodiments of the present invention. In order to strengthen the electrical connection between the circuit sub-board 110 and the circuit main board 130 , the present invention adds a conductive metal sheet 114 between the connection portion 112 and the connection opening 132 . Specifically, the connection portion 112 of the sub-board 110 has a conductive sidewall 112b. The conductive sidewall 112 b is electrically connected to other active circuit elements or passive circuit elements of the sub-board 110 . In some embodiments of the present invention, the conductive sidewall 112b can be metal plating, such as brass plating, gold-copper plating, nickel-copper plating, or gold, nickel, tin, lead or alloys thereof. In some embodiments of the present invention, the conductive metal sheet 114 may have the same material as the conductive sidewall 112b, such as gold, nickel, tin, lead, copper or alloys thereof. The connection opening 132 of the circuit board 130 has a conductive inner wall 132a. The conductive inner wall 132 a is electrically connected to other active circuit elements or passive circuit elements of the circuit board 130 . In some embodiments of the present invention, the conductive inner wall 132a can be metal plating, such as brass plating, gold-copper plating, nickel-copper plating, or gold, nickel, tin, lead or alloys thereof. In some embodiments of the present invention, the conductive sidewall 112b and the conductive inner wall 132a may have the same or similar metal conductive material. In some embodiments of the present invention, the conductive side wall 112b, the conductive inner wall 132a and the conductive metal sheet 114 may have the same or similar metal conductive material.

Before the connection portion 112 of the circuit sub-board 110 is inserted into the connection opening 132 of the circuit main board 130, the conductive metal sheet 114 can be pasted on the connection portion 112 of the circuit sub-board 110 by means of a viscous solder paste layer 116, and passed through Reflow soldering is to solder the conductive metal sheet 114 on the connection portion 112 , and then insert it into the connection opening 132 of the circuit board 130 for subsequent wave soldering process. In some embodiments of the present invention, the conductive metal sheet 114 includes a continuous first portion 114a, a second portion 114b and a third portion 114c. The first portion 114 a of the conductive metal sheet 114 passes through the connection hole 132 and is located between the conductive inner wall 132 a of the connection hole 132 and the conductive side wall 112 b of the connection portion 112 . The second portion 114b of the conductive metal sheet 114 protrudes from the first surface 130a of the circuit board 130 . The first portion 114a and the second portion 114b of the conductive metal sheet 114 are substantially perpendicular to each other, but not limited thereto. The second part 114b of the conductive metal sheet 114 has a vertical projection overlapping the first surface 130a of the circuit board 130, so it can buckle the first surface 130a to prevent the conductive metal sheet 114 from slipping from the connection opening 132 during the wave soldering process. . The third portion 114c of the conductive metal sheet 114 contacts the bottom surface 112a of the connecting portion 112 of the circuit sub-board 110 . In some embodiments of the present invention, the conductive sidewall 112b of the connecting portion 112 extends to the bottom end surface 112a of the connecting portion 112, the third portion 114c of the conductive metal sheet 114 contacts the bottom end surface 112a of the connecting portion 112, and the solder paste layer 116 also Extend the bottom end surface 112a of the connection portion 112 between the third portion 114c of the conductive metal sheet 114 , and solder the third portion 114c of the conductive metal sheet 114 to the bottom end surface 112a of the connection portion 112 by reflow soldering. In some embodiments of the present invention, the first portion 114a and the third portion 114c of the conductive metal sheet 114 are perpendicular to each other, but not limited thereto. In some embodiments of the present invention, the first portion 114 a , the second portion 114 b and the third portion 114 c of the conductive metal sheet 114 have a Z-shaped section.

Please refer to FIG. 10 , which shows a schematic cross-sectional view of the wave soldering process in the embodiment of FIG. 3 . When the conductive metal sheet 114 is added to the connecting portion 112 of the circuit sub-board 110 and wave soldering is performed, the preheated conductive metal sheet 114 contacts the solder paste that melts into liquid, and the liquid solder paste 150 can be effectively adsorbed on the conductive metal sheet 114 and the solder paste. Between the connecting openings 132 , after the solder paste cools down, the connecting portion 112 of the circuit sub-board 110 can be firmly welded in the connecting opening 132 of the circuit main board 130 .

Please refer to FIG. 4 , which shows a partial cross-sectional view along the A-A section in FIG. 2 according to other embodiments of the present invention. In order to strengthen the electrical connection between the circuit sub-board 110 and the circuit main board 130, in this embodiment, conductive metal sheets 114' are added on both sides of the connecting portion 112 of the circuit sub-board 110. Similar to the embodiment shown in FIG. 3 , the conductive metal sheet 114 ′ can be attached to both sides of the connecting portion 112 of the circuit board 110 with an adhesive solder paste layer 116 , and then reflow soldering (reflow soldering) The conductive metal sheet 114' is welded on the connecting portion 112, and then the connecting portion 112 and the conductive metal sheet 114' are inserted into the connection opening 132 of the circuit board 130 for subsequent wave soldering process. In some embodiments of the present invention, the solder paste layer 116 can be printed on both sides of the connection portion 112 of the circuit sub-board 110 first, and then the conductive metal sheet 114 ′ is attached to the two sides of the connection portion 112 of the circuit sub-board 110 or the solder paste layer 116 can be printed on the conductive metal sheet 114 ′ first, and then the conductive metal sheet 114 ′ is pasted on both sides of the connecting portion 112 of the circuit sub-board 110 . Similar to the embodiment in FIG. 3, the conductive sidewall 112b, the conductive inner wall 132a, and the conductive metal sheet 114' may have the same or similar metal conductive material. Similar to the embodiment in FIG. 3, the second portion 114b of the conductive metal sheet 114' has a vertical projection overlapping the first surface 130a of the circuit board 130, so it can buckle the first surface 130a and avoid the conductive metal sheet 114 from being on the peak When the soldering process is in progress, it slides off from the connection opening 132 . Different from the embodiment in FIG. 3, the conductive metal sheet 114' does not have the third portion 114c of the conductive metal sheet 114. During wave soldering, the preheated conductive metal sheet 114' can also effectively absorb the liquid solder paste between the conductive metal sheet 114' and the connection opening 132, and the solder paste can be connected to the connection part of the circuit board 110 after cooling. 112 is firmly welded in the connection opening 132 of the circuit board 130 . In some embodiments of the present invention, the first portion 114a and the second portion 114b of the conductive metal sheet 114' have an L-shaped cross section.

Please refer to FIG. 5, which shows a partial cross-sectional view along the A-A section of FIG. 2 according to yet another embodiment of the present invention. In order to strengthen the electrical connection between the circuit sub-board 110 and the circuit main board 130, in this embodiment, a conductive metal sheet 114 and a conductive metal sheet 114' are added on both sides of the connecting portion 112 of the circuit sub-board 110. Similar to the embodiment shown in Figures 3 and 4, the conductive metal sheet 114' can first be attached to the two sides of the connecting portion 112 of the circuit board 110 with a viscous solder paste layer 116, and the conductive metal sheet is bonded through reflow soldering. The piece 114' is soldered on the connection part 112, and then the connection part 112 and the conductive metal piece 114' are inserted into the connection opening 132 of the circuit board 130 for subsequent wave soldering process. Different from the embodiment shown in Fig. 3 and Fig. 4, a conductive metal sheet 114 is attached to one side of the connecting portion 112 of the sub-board 110, and a conductive metal sheet 114' is attached to the other side. Even if the two sides of the connecting portion 112 of the circuit sub-board 110 are equipped with different conductive metal sheets 114 and conductive metal sheets 114', during wave soldering, the preheated conductive metal sheets 114 and the conductive metal sheets 114' can also make the liquid tin The paste is effectively adsorbed between the conductive metal sheet and the connecting opening 132 , and the connecting portion 112 of the circuit sub-board 110 can be firmly welded in the connecting opening 132 of the circuit main board 130 after the solder paste cools down.

Please refer to FIG. 6, which shows a partial cross-sectional view along the A-A section of FIG. 2 according to some other embodiments of the present invention. In order to strengthen the electrical connection between the circuit sub-board 110 and the circuit main board 130 , in this embodiment, a conductive metal sheet 115 is added to the connection portion 112 of the circuit sub-board 110 . Similar to the above-mentioned embodiments, the conductive metal sheet 115 can first be pasted on the periphery of the connecting portion 112 of the circuit sub-board 110 (including the conductive sidewall 112b and the bottom end surface 112a ) with the adhesive solder paste layer 116 , and then soldered through reflow Solder the conductive metal sheet 115 on the connecting portion 112 , and then insert the connecting portion 112 and the conductive metal sheet 115 into the connection opening 132 of the circuit board 130 for subsequent wave soldering process. The conductive metal sheet 115 has a continuous U-shaped portion 115 a and two wing portions 115 b. The U-shaped portion 115 a is located between the conductive inner wall 132 a and the conductive side wall 112 b and contacts the bottom end surface 112 a of the connecting portion 112 . The two wing portions 115b respectively protrude from the first surface 130a of the circuit board 130 and have a vertical projection overlapping on the first surface 130a, so that the first surface 130a can be fastened to prevent the conductive metal sheet 115 from being carried out during the wave soldering process. Slip off from the connection opening 132 . In some embodiments of the present invention, the two wing portions 115b of the conductive metal sheet 115 are respectively perpendicular to the two top ends of the U-shaped portion 115a, but not limited thereto. Even if the structure of the conductive metal sheet 115 is different from the aforementioned conductive metal sheet, the preheated conductive metal sheet 115 can also effectively adsorb the liquid solder paste between the conductive metal sheet 115 and the connection opening 132 during wave soldering. After cooling down, the connecting portion 112 of the circuit sub-board 110 can be firmly welded in the connection opening 132 of the circuit board 130 .

Please refer to FIG. 7, which shows a partial cross-sectional view along the A-A section of FIG. 2 according to some other embodiments of the present invention. In the present invention, a conductive metal sheet 114" is added between the connection portion 112 and the connection opening 132. The conductive metal sheet 114" includes a continuous first part 114a, a second part 114b' and a third part 114c. Similar to the embodiment in Fig. 3, the conductive sidewall 112b, the conductive inner wall 132a and the conductive metal sheet 114" can have the same or similar metal conductive material. Different from the embodiment in Fig. 3, the second conductive metal sheet 114" The portion 114b' is not perpendicular to its first portion 114a, but still has a vertical projection overlapping the first surface 130a of the circuit board 130, so it can buckle the first surface 130a and prevent the conductive metal sheet 114" from falling off during the wave soldering process. The connection opening 132 slides down. Even if the structure of the conductive metal sheet 114" is different from that of the conductive metal sheet 114, during wave soldering, the preheated conductive metal sheet 114" can also effectively adsorb the liquid solder paste on the conductive metal sheet 114" and Between the connecting openings 132 , after the solder paste cools down, the connecting portion 112 of the circuit sub-board 110 can be firmly welded in the connecting opening 132 of the circuit main board 130 .

Referring to FIG. 8, it shows a partial cross-sectional view along the A-A section of FIG. 2 according to some other embodiments of the present invention. This embodiment is different from the embodiment shown in FIG. 3 in that only one side of the connecting portion 112 of the circuit board 110 has a conductive side wall 112b. Similar to the embodiment in FIG. 3 , the conductive metal sheet 114 can first be attached to one side of the connecting portion 112 of the circuit board 110 with an adhesive solder paste layer 116 , and the conductive metal sheet 114 is welded by reflow soldering. On the connecting portion 112 , the connecting portion 112 and the conductive metal sheet 114 are inserted together into the connection opening 132 of the circuit board 130 for subsequent wave soldering process. Even if only one side of the connection portion 112 is attached to the conductive metal sheet 114, the preheated conductive metal sheet 114 can also effectively adsorb the liquid solder paste between the conductive metal sheet 114 and the connection opening 132 during wave soldering. After the paste is cooled, the connecting portion 112 of the sub-board 110 can be firmly soldered to the connecting hole 132 of the main board 130 to achieve the required electrical connection.

Referring to Fig. 9, it shows a partial sectional view along the A-A section of Fig. 2 according to some other embodiments of the present invention. This embodiment is different from the embodiment shown in FIG. 4 in that only one side of the connecting portion 112 of the circuit board 110 has a conductive side wall 112b. Similar to the embodiment shown in FIG. 4, the conductive metal sheet 114' can be attached to one side of the connecting portion 112 of the circuit board 110 with an adhesive solder paste layer 116, and the conductive metal sheet 114 is bonded through reflow soldering. 'solder on the connection part 112, and then insert the connection part 112 and the conductive metal sheet 114' into the connection opening 132 of the circuit board 130 for subsequent wave soldering process. Even if only one side of the connection part 112 is attached to the conductive metal sheet 114', during wave soldering, the preheated conductive metal sheet 114' can also effectively absorb the liquid solder paste between the conductive metal sheet 114' and the connection opening 132. During this time, after the solder paste cools down, the connecting portion 112 of the circuit sub-board 110 can be firmly soldered to the connection opening 132 of the circuit board 130 to achieve the required electrical connection.

To sum up, the new circuit board structure is used to improve the soldering quality of the circuit board and its sub-board during wave soldering. Effectively absorb enough liquid solder paste to form a high-quality welding structure between the main board and its sub-board, ensuring that the welding structure can transmit current with low impedance. A portion of the conductive metal sheet protrudes from the upper surface of the circuit main board, and is used to fasten the upper surface of the circuit main board to prevent the conductive metal sheet from slipping from the connection opening during the wave soldering process.

Although the present invention has been disclosed as above with the embodiments, it is not intended to limit the present invention. Anyone who is familiar with this technology can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection of the present invention The scope shall be defined by the appended patent application scope.

100: Circuit board structure 110: circuit board 112: connection part 112a: Bottom face 112b: conductive sidewall 114: conductive metal sheet 114': conductive metal sheet 114": conductive metal sheet 114a: Part I 114b: Part II 114b': Part II 114c: Part III 115: conductive metal sheet 115a: U-shaped part 115b: Wings 116: Solder paste layer 130: circuit board 130a: first surface 130b: second surface 132: connection opening 132a: conductive inner wall 150: liquid solder paste

In order to make the above-mentioned and other purposes, features, advantages and embodiments of the present invention more obvious and understandable, the accompanying drawings are described as follows: FIG. 1 is an exploded perspective view illustrating a structure of a circuit board according to some embodiments of the present invention. Fig. 2 is an assembly diagram showing the structure of the circuit board shown in Fig. 1. Fig. 3 is a partial cross-sectional view along section A-A of Fig. 2 according to some embodiments of the present invention. Fig. 4 is a partial cross-sectional view along the section A-A of Fig. 2 according to other embodiments of the present invention. Fig. 5 is a partial cross-sectional view along the section A-A of Fig. 2 according to yet another embodiment of the present invention. Fig. 6 is a partial cross-sectional view along the section A-A of Fig. 2 according to some other embodiments of the present invention. Fig. 7 is a partial cross-sectional view along the section A-A of Fig. 2 according to some other embodiments of the present invention. Fig. 8 is a partial cross-sectional view along the A-A section of Fig. 2 according to some other embodiments of the present invention. Fig. 9 is a partial cross-sectional view along the section A-A of Fig. 2 according to some other embodiments of the present invention. FIG. 10 is a schematic cross-sectional view illustrating a wave soldering process according to some embodiments of the present invention.

110: circuit board

112: connection part

112a: Bottom face

112b: conductive sidewall

114: conductive metal sheet

114a: Part I

114b: Part II

114c: Part III

116: Solder paste layer

130a: first surface

130b: second surface

132: connection opening

132a: conductive inner wall

Claims (10)

A circuit board structure comprising: A circuit main board has at least one connection opening and two opposite first surfaces and second surfaces, the connection opening communicates between the first surface and the second surface, and the connection opening has a conductive inner wall ; A sub-board having at least one connection portion passing through the connection opening and having a conductive sidewall; and At least one conductive metal sheet has a continuous first portion and a second portion, the first portion is located between the conductive inner wall and the conductive side wall, the second portion protrudes from the first surface and has a vertical projection overlapping the on the first surface. The circuit board structure according to claim 1, wherein the first portion and the second portion of the conductive metal sheet are perpendicular to each other. The circuit board structure according to claim 1, wherein the first part and the second part of the conductive metal sheet have an L-shaped cross section. The circuit board structure according to claim 1, wherein the conductive metal sheet further includes a third portion, and the third portion contacts the bottom surface of the connecting portion. The circuit board structure according to claim 4, wherein the first portion and the third portion of the conductive metal sheet are perpendicular to each other. The circuit board structure according to claim 5, wherein the first part, the second part and the third part of the conductive metal sheet have a Z-shaped section. According to the circuit board structure of claim 1, further comprising a solder paste layer, the solder paste layer is located between the conductive sidewall and the first portion of the conductive metal sheet. A circuit board structure comprising: A circuit main board has at least one connection opening and two opposite first surfaces and second surfaces, the connection opening communicates between the first surface and the second surface, and the connection opening has a conductive inner wall ; A sub-board having at least one connection portion passing through the connection opening and having a conductive sidewall; and At least one conductive metal sheet has a continuous U-shaped portion and two wing portions, the U-shaped portion is located between the conductive inner wall and the conductive side wall and contacts the bottom end surface of the connecting portion, and the two wing portions protrude from the The first surface has a vertical projection superimposed on the first surface. The circuit board structure according to claim 8, wherein the two wing portions are respectively perpendicular to the two top ends of the U-shaped portion. According to the circuit board structure of claim 8, further comprising a solder paste layer, the solder paste layer is located between the connecting portion and the U-shaped portion of the conductive metal sheet.

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