JP4844260B2 - Electronic component and manufacturing method thereof - Google Patents

Electronic component and manufacturing method thereof Download PDF

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JP4844260B2
JP4844260B2 JP2006180271A JP2006180271A JP4844260B2 JP 4844260 B2 JP4844260 B2 JP 4844260B2 JP 2006180271 A JP2006180271 A JP 2006180271A JP 2006180271 A JP2006180271 A JP 2006180271A JP 4844260 B2 JP4844260 B2 JP 4844260B2
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substrate
mounting
electronic component
metal case
auxiliary
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JP2008010669A (en
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朋子 斉藤
貴洋 渡辺
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Murata Manufacturing Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15158—Shape the die mounting substrate being other than a cuboid
    • H01L2924/15162—Top view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Description

この発明は、電子部品およびその製造方法に関し、特に基板の実装面に実装部品が実装された電子部品本体と基板の実装面を覆うように電子部品本体に設けられた金属ケースとを含み、たとえば携帯電話などの無線通信機器に搭載される無線通信用高周波電子部品などに利用される、電子部品およびその製造方法に関する。   The present invention relates to an electronic component and a method for manufacturing the same, and particularly includes an electronic component main body in which a mounting component is mounted on a mounting surface of a substrate and a metal case provided in the electronic component main body so as to cover the mounting surface of the substrate. The present invention relates to an electronic component used for a radio communication high-frequency electronic component mounted on a radio communication device such as a mobile phone and a manufacturing method thereof.

図７は、従来の電子部品の一例を示す斜視図であり、図８は、その電子部品に用いられる電子部品本体を示す図解図である。図７に示す電子部品１は、図８に示す電子部品本体２を含み、電子部品本体２は、たとえば矩形板状の基板３を含む。基板３の一方主面には、実装部品４が実装されている。また、電子部品本体２には、実装部品４を保護するために、基板３の一方主面の実装領域を覆うようにして、金属ケース５が設けられている。この場合、基板３上の４隅に接合用電極６を形成し、それらの接合用電極６上にボール状のはんだペーストを印刷し、接合用電極６上に金属ケース５の４隅の脚部７を載せ、リフローにより、基板３の４隅の接合用電極６と金属ケース５の４隅の脚部７とがはんだで接合される。このように基板３に金属ケース５をリフローにより接合する際には、基板３に対して金属ケース５を位置決めしておく必要がある。この電子部品１では、基板３の対向する両側面に嵌合用凹部８を形成し、それらの嵌合用凹部８に嵌合する爪部９を金属ケース５の両側に形成し、それらの嵌合用凹部８にそれらの爪部９を嵌合することによって、基板３に対して金属ケース５が位置決めされる（例えば特許文献１参照）。   FIG. 7 is a perspective view showing an example of a conventional electronic component, and FIG. 8 is an illustrative view showing an electronic component body used for the electronic component. An electronic component 1 shown in FIG. 7 includes an electronic component main body 2 shown in FIG. 8, and the electronic component main body 2 includes a rectangular plate-like substrate 3, for example. A mounting component 4 is mounted on one main surface of the substrate 3. The electronic component body 2 is provided with a metal case 5 so as to cover the mounting region on one main surface of the substrate 3 in order to protect the mounting component 4. In this case, bonding electrodes 6 are formed at the four corners on the substrate 3, ball-shaped solder paste is printed on the bonding electrodes 6, and the leg portions at the four corners of the metal case 5 are formed on the bonding electrodes 6. 7 and the joining electrodes 6 at the four corners of the substrate 3 and the leg portions 7 at the four corners of the metal case 5 are joined by soldering by reflow. Thus, when the metal case 5 is joined to the substrate 3 by reflow, it is necessary to position the metal case 5 with respect to the substrate 3. In this electronic component 1, fitting recesses 8 are formed on opposite side surfaces of the substrate 3, and claw portions 9 that fit into the fitting recesses 8 are formed on both sides of the metal case 5. The metal case 5 is positioned with respect to the board | substrate 3 by fitting those nail | claw parts 9 in 8 (for example, refer patent document 1).

特開２００２−５７２３４公報JP 2002-57234 A

しかしながら、上述の電子部品１が搭載される携帯電話などの無線通信機器において近年の小型化・低背化が進むにつれ、電子部品１の電子部品本体２ないしは基板３の厚みも薄くなってきた。上述の電子部品１では、通常、金属ケース５は基板３上の接合用電極６に印刷されたボール状のはんだペーストの上に載せられてリフローのための加熱ドームに通されるため、電子部品本体２ないしは基板３の厚みが薄いものの場合、基板３の嵌合用凹部８と金属ケース５の爪部９とが嵌合する部分の長さが非常に短くなる。このため、僅かの衝撃で金属ケース５の爪部９が基板３の嵌合用凹部８から外れて基板３の主面に乗り上がってしまうという基板３に対する金属ケース５の位置ずれの問題が生じてしまう。
また、このような位置ずれの問題を防止するために爪部９の長さを長く形成すると、リフロー後に、ボール状のはんだペーストが溶融して金属ケース５が沈み込むため、基板３の下面から金属ケース５の爪部９が突出してしまうという問題が生じてしまう。 However, in recent wireless communication devices such as mobile phones on which the electronic component 1 is mounted, the thickness of the electronic component main body 2 or the substrate 3 of the electronic component 1 has been reduced. In the electronic component 1 described above, the metal case 5 is usually placed on a ball-shaped solder paste printed on the bonding electrode 6 on the substrate 3 and passed through a heating dome for reflow. In the case where the thickness of the main body 2 or the substrate 3 is thin, the length of the portion where the fitting recess 8 of the substrate 3 and the claw portion 9 of the metal case 5 are fitted becomes very short. For this reason, the problem of the position shift of the metal case 5 with respect to the substrate 3 occurs that the claw portion 9 of the metal case 5 comes off the fitting recess 8 of the substrate 3 and rides on the main surface of the substrate 3 with a slight impact. End up.
Further, if the length of the claw portion 9 is formed long in order to prevent such a problem of misalignment, the ball-shaped solder paste melts and the metal case 5 sinks after reflow. The problem that the nail | claw part 9 of the metal case 5 will protrude will arise.

それゆえに、この発明の主たる目的は、製造する際に基板に対する金属ケースの位置ずれを防止することができ、しかも、基板の下面から金属ケースの爪部が突出しにくくすることができる構造を有する電子部品およびその製造方法を提供することである。   Therefore, the main object of the present invention is to provide an electronic device having a structure capable of preventing the displacement of the metal case with respect to the substrate during manufacturing and making it difficult for the claw portion of the metal case to protrude from the lower surface of the substrate. It is to provide a component and a manufacturing method thereof.

この発明は、少なくとも一方主面が実装面となる基板、および基板の実装面に実装される実装部品を備え、基板の側面に電極非形成部を備えた嵌合用凹部と、基板の一方主面に接合用電極とが形成された電子部品本体と、基板の実装面の少なくとも一部を覆うように基板の実装面から所定間隔を隔てて設けられる天板部、天板部から曲折されるように形成され、基板に形成された嵌合用凹部に嵌合する爪部、および天板部から曲折されるように形成され、接合用電極に接合される脚部を備える金属ケースとを含む電子部品であって、電子部品本体において基板の実装面上であって嵌合用凹部の内側に補助用ランドが形成され、補助用ランド上に、金属ケースの爪部が嵌合用凹部から外れて基板の主面に乗り上がることを防止するための補助用はんだ塊が形成されている、電子部品である。
この発明にかかる電子部品では、基板における嵌合用凹部と補助用ランドとの隙間は、金属ケースの材料である金属板の板厚以下であることが好ましい。
また、この発明にかかる電子部品の製造方法は、この発明にかかる電子部品を製造するための電子部品の製造方法であって、電子部品本体用の基板に実装用ランドおよび補助用ランドを形成する工程と、実装用ランドおよび補助用ランド上に実装用はんだパターンおよび補助用はんだ塊を形成する工程と、実装用はんだパターンが形成された実装用ランドの所定のものの上に実装部品を搭載する工程と、金属ケースの爪部が基板の嵌合用凹部に嵌合するように、実装用はんだパターンが形成された実装用ランドの他のものの上に金属ケースを搭載する工程と、リフローにより実装部品および金属ケースを実装用ランドに接合する工程とを含む、電子部品の製造方法である。 The present invention includes a substrate having at least one main surface as a mounting surface, and a mounting component mounted on the mounting surface of the substrate, and a fitting recess having an electrode non-forming portion on the side surface of the substrate, and one main surface of the substrate The electronic component main body having the bonding electrode formed thereon and the top plate portion provided at a predetermined interval from the mounting surface of the substrate so as to cover at least a part of the mounting surface of the substrate, and bent from the top plate portion And a metal case provided with a leg portion formed to be bent from the top plate portion and joined to the joining electrode. In the electronic component main body, an auxiliary land is formed on the mounting surface of the board and inside the concave portion for fitting, and the claw portion of the metal case is separated from the concave portion for fitting on the auxiliary land. Auxiliary to prevent getting on the surface I's mass is formed, which is an electronic component.
In the electronic component according to the present invention, the gap between the fitting recess and the auxiliary land in the substrate is preferably equal to or less than the thickness of the metal plate that is the material of the metal case.
An electronic component manufacturing method according to the present invention is an electronic component manufacturing method for manufacturing an electronic component according to the present invention, wherein a mounting land and an auxiliary land are formed on a substrate for an electronic component main body. A step of forming a mounting solder pattern and an auxiliary solder lump on the mounting land and the auxiliary land, and a step of mounting a mounting component on the predetermined mounting land on which the mounting solder pattern is formed Mounting the metal case on the other of the mounting lands on which the mounting solder pattern is formed so that the claw portion of the metal case is fitted into the fitting concave portion of the board, and mounting components and And a step of bonding a metal case to a mounting land.

この発明にかかる電子部品では、電子部品本体において基板の実装面上であって嵌合用凹部の内側に補助用ランドが形成され、補助用ランド上に、金属ケースの爪部が嵌合用凹部から外れて基板の主面に乗り上がることを防止するための補助用はんだ塊が形成されているので、金属ケースの爪部が乗り上がろうとする部分の相対高さが補助用ランドおよび補助用はんだ塊によって高まる。そのため、この発明にかかる電子部品を製造する際に金属ケースの爪部が基板の嵌合用凹部に嵌合するように金属ケースを搭載した後に金属ケースの爪部が持ち上げられても、金属ケースの爪部の基板上への乗り上がり、すなわち基板に対する金属ケースの位置ずれを防止することができる。
さらに、この発明にかかる電子部品では、金属ケースの爪部が乗り上がろうとする部分の相対高さが補助用ランドおよび補助用はんだ塊によって高まるので、基板に対する金属ケースの位置ずれを防止するためには基板の下面から突出するような長い爪部が不要であり、基板の下面から金属ケースの爪部が突出することを防止することができる。
このように、この発明にかかる電子部品では、基板のコプラナリティ（平坦度）の悪化および金属ケースの実装不良の危険性をおかすことがなく、課題を解決することができる。
また、この発明にかかる電子部品では、基板における嵌合用凹部と補助用ランドとの隙間が金属ケースの材料である金属板の板厚以下であることによって、その隙間に金属ケースの爪部が乗り上がることを防止することができる。
さらに、この発明にかかる電子部品の製造方法では、この発明にかかる電子部品を製造することができる。 In the electronic component according to the present invention, an auxiliary land is formed on the mounting surface of the substrate in the electronic component main body and inside the concave portion for fitting, and the claw portion of the metal case is detached from the concave portion for fitting on the auxiliary land. Since the auxiliary solder lump for preventing the board from climbing on the main surface of the board is formed, the relative height of the part where the claw part of the metal case tries to climb is set to the auxiliary land and the auxiliary solder lump. Increased by. Therefore, even when the metal case is lifted after the metal case is mounted so that the claw portion of the metal case is fitted in the fitting recess of the substrate when the electronic component according to the present invention is manufactured, It is possible to prevent the claw portion from climbing onto the substrate, that is, the displacement of the metal case with respect to the substrate.
Furthermore, in the electronic component according to the present invention, the relative height of the portion where the claw portion of the metal case tries to climb is increased by the auxiliary land and the auxiliary solder lump, so that the metal case is prevented from being displaced relative to the substrate. Does not require a long claw portion that protrudes from the lower surface of the substrate, and can prevent the claw portion of the metal case from protruding from the lower surface of the substrate.
As described above, the electronic component according to the present invention can solve the problems without deteriorating the coplanarity (flatness) of the substrate and the risk of poor mounting of the metal case.
In the electronic component according to the present invention, since the gap between the fitting recess and the auxiliary land on the board is equal to or less than the thickness of the metal plate that is the material of the metal case, the claw portion of the metal case gets on the gap. It can be prevented from going up.
Furthermore, in the electronic component manufacturing method according to the present invention, the electronic component according to the present invention can be manufactured.

この発明によれば、製造する際に基板に対する金属ケースの位置ずれを防止することができ、しかも、基板の下面から金属ケースの爪部が突出しにくくすることができる構造を有する電子部品およびその製造方法が得られる。   According to the present invention, an electronic component having a structure capable of preventing the displacement of the metal case with respect to the substrate during manufacture and making it difficult for the claw portion of the metal case to protrude from the lower surface of the substrate and the manufacture thereof. A method is obtained.

この発明の上述の目的、その他の目的、特徴および利点は、図面を参照して行う以下の発明を実施するための最良の形態の説明から一層明らかとなろう。   The above-mentioned object, other objects, features, and advantages of the present invention will become more apparent from the following description of the best mode for carrying out the invention with reference to the drawings.

図１は、この発明にかかる電子部品の一例を示す斜視図であり、図２は、図１に示す電子部品に用いられる電子部品本体を示す図解図である。図１に示す電子部品１０は、図２に示す電子部品本体１２を含む。電子部品本体１２は、たとえば矩形状の両面プリント基板からなる基板１４を含む。基板１４には、４つの側面にたとえば半円形状の切欠からなる多数の電極用凹部１６が形成され、長手方向において対向する２つの側面にたとえば矩形状の切欠からなる２つの嵌合用凹部１８が形成される。電極用凹部１６は端子用電極を形成するための凹部であり、嵌合用凹部１８は後述する金属ケース３２の爪部３８を嵌合するための凹部である。   FIG. 1 is a perspective view showing an example of an electronic component according to the present invention, and FIG. 2 is an illustrative view showing an electronic component main body used in the electronic component shown in FIG. An electronic component 10 shown in FIG. 1 includes an electronic component main body 12 shown in FIG. The electronic component body 12 includes a substrate 14 made of, for example, a rectangular double-sided printed circuit board. The substrate 14 has a large number of electrode recesses 16 formed on, for example, semicircular cutouts on four side surfaces, and two fitting recesses 18 formed on, for example, rectangular cutouts on two side surfaces opposed in the longitudinal direction. It is formed. The electrode recess 16 is a recess for forming a terminal electrode, and the fitting recess 18 is a recess for fitting a claw portion 38 of a metal case 32 described later.

この基板１４は、その一方主面が実装部品などを実装するための実装面として用いられる。そのため、基板１４の一方主面には、その４隅以外の部分に実装用ランドを有する多数の電極パターン（図示せず）が形成され、その４隅にさらなる実装用ランドとしての４つの接合用電極２０が形成される。それらの電極パターンの所定のものは、基板１４の多数の電極用凹部１６に形成されている多数の端子用電極（図示ぜず）にのびて形成され、それらの端子用電極に接続されている。また、基板１４において４つの接合用電極２０が形成される部分には４つのスルーホール２２が形成され、４つの接合用電極２０は、それらのスルーホール２２を介して、基板１４の他方主面に形成されているグランド電極（図示せず）に接続されている。なお、基板１４として多層基板が用いられる場合には、接合用電極２０に接続されるグランド電極は、基板１４の内部に形成されてもよい。   One side of the substrate 14 is used as a mounting surface for mounting a mounting component or the like. Therefore, a large number of electrode patterns (not shown) having mounting lands at portions other than the four corners are formed on one main surface of the substrate 14, and four bonding lands as further mounting lands are formed at the four corners. Electrode 20 is formed. Predetermined ones of these electrode patterns are formed extending over a large number of terminal electrodes (not shown) formed in a large number of electrode recesses 16 of the substrate 14 and connected to these terminal electrodes. . Further, four through holes 22 are formed in a portion of the substrate 14 where the four bonding electrodes 20 are formed, and the four bonding electrodes 20 are connected to the other main surface of the substrate 14 through the through holes 22. Are connected to a ground electrode (not shown). When a multilayer substrate is used as the substrate 14, the ground electrode connected to the bonding electrode 20 may be formed inside the substrate 14.

基板１４に形成された電極パターンの実装用ランド上には、実装用はんだパターン（図示せず）が形成される。同様に、さらなる実装用ランドとしての接合用電極２０上には、実装用はんだパターン２４が形成される。   A mounting solder pattern (not shown) is formed on the mounting land of the electrode pattern formed on the substrate 14. Similarly, a mounting solder pattern 24 is formed on the bonding electrode 20 as a further mounting land.

さらに、基板１４の一方主面には、２つの嵌合用凹部１８の内側に、補助用ランドとして、たとえば長方形状の２つの補助用電極２６が形成される。これらの補助用電極２６は、基板１４において嵌合用凹部１８が形成される側面に沿って形成される。この場合、基板１４における嵌合用凹部１８と補助用電極２６との隙間は、平面的に見て「０」である。これらの補助用電極２６上には、たとえば厚板状の補助用はんだ塊２８が形成される。補助用はんだ塊２８は、後述する金属ケース３２の爪部３８が嵌合用凹部１８から外れて基板１４の主面に乗り上がることを防止するためのいわゆる土手の役割を担うためのものである。   Furthermore, two auxiliary electrodes 26 having, for example, a rectangular shape are formed as auxiliary lands on one main surface of the substrate 14 inside the two fitting recesses 18. These auxiliary electrodes 26 are formed along the side surfaces of the substrate 14 where the fitting recesses 18 are formed. In this case, the gap between the fitting recess 18 and the auxiliary electrode 26 in the substrate 14 is “0” in plan view. On these auxiliary electrodes 26, for example, thick plate-shaped auxiliary solder lump 28 is formed. The auxiliary solder lump 28 serves to play a role of a so-called bank for preventing a claw portion 38 of the metal case 32 described later from coming off the fitting recess 18 and riding on the main surface of the substrate 14.

基板１４の一方主面に形成された多数の電極パターンの実装用ランドには、それらの上の実装用はんだパターンによって、多数の実装部品３０が接合される。   A large number of mounting components 30 are joined to mounting lands of a large number of electrode patterns formed on one main surface of the substrate 14 by a mounting solder pattern thereon.

さらに、基板１４の一方主面に形成された４つの接合用電極２０には、それらの上の実装用はんだパターン２４によって、金属ケース３２が接合される。金属ケース３２は、基板１４の一方主面より少し小さい大きさの主面を有するたとえば長方形状の天板部３４を含む。天板部３４は、基板１４の一方主面（実装面）に実装されている実装部品３０を保護するために、基板１４の実装面を覆うように基板１４の実装面から所定間隔を隔てて設けられるものである。そのため、天板部３４の４隅には、それぞれ、たとえば台形板状の２つずつの脚部３６が、天板部３４から下方に曲折されるように形成される。この場合、天板部３４の各隅において、２つずつの脚部３６は、接近するとともに、それらの主面が直交するように形成される。そして、それらの脚部３６は、それぞれ、その下部が実装用はんだパターン２４によって接合用電極２０に接合される。また、天板部３４の長手方向における両端には、たとえば板状の２つの爪部３８が、天板部３４から下方に曲折されるように形成される。これらの爪部３８は、それぞれ、たとえば長方形状の中間部４０を含み、中間部４０の中央の下部には、たとえば３角形状の先端部４２が形成されている。これらの爪部３８は、基板１４に対して金属ケース３２を位置決めするために用いられるものであって、先端部４２が基板１４の嵌合用凹部１８に嵌合され、中間部４０が基板１４上に配置される。   Furthermore, the metal case 32 is joined to the four joining electrodes 20 formed on the one main surface of the substrate 14 by the mounting solder pattern 24 thereon. The metal case 32 includes, for example, a rectangular top plate portion 34 having a main surface slightly smaller than one main surface of the substrate 14. The top plate portion 34 is spaced a predetermined distance from the mounting surface of the substrate 14 so as to cover the mounting surface of the substrate 14 in order to protect the mounting component 30 mounted on one main surface (mounting surface) of the substrate 14. It is provided. Therefore, two leg portions 36 each having a trapezoidal plate shape, for example, are formed at the four corners of the top plate portion 34 so as to be bent downward from the top plate portion 34. In this case, at each corner of the top plate portion 34, the two leg portions 36 are formed so as to approach each other and their main surfaces are orthogonal to each other. The lower portions of the leg portions 36 are joined to the joining electrode 20 by the mounting solder pattern 24. Further, for example, two plate-like claw portions 38 are formed at both ends in the longitudinal direction of the top plate portion 34 so as to be bent downward from the top plate portion 34. Each of these claw portions 38 includes, for example, a rectangular intermediate portion 40, and a triangular tip portion 42 is formed at a lower portion in the center of the intermediate portion 40. These claw portions 38 are used for positioning the metal case 32 with respect to the substrate 14, and the tip portion 42 is fitted into the fitting recess 18 of the substrate 14, and the intermediate portion 40 is on the substrate 14. Placed in.

次に、この電子部品１０の製造方法の一例について説明する。   Next, an example of a method for manufacturing the electronic component 10 will be described.

まず、図３に電子部品１０の製造工程を示すように、複数の基板１４を縦横に配列して接続した大きさの親基板が準備される。この親基板の各基板１４には、電極用凹部１６、嵌合用凹部１８およびスルーホール２２が、それぞれ形成されている。   First, as shown in the manufacturing process of the electronic component 10 in FIG. 3, a parent substrate having a size in which a plurality of substrates 14 are arranged in a row and in a row is prepared. Each substrate 14 of the parent substrate is formed with an electrode recess 16, a fitting recess 18 and a through hole 22.

そして、親基板の各基板１４の一方主面には、実装用ランドを有する電極パターン、さらなる実装用ランドとしての接合用電極２０、および補助用ランドとしての補助用電極２６が、所定の位置に同時に形成される。また、親基板の各基板１４の他方主面には、グランド電極が形成される。グランド電極は、親基板に電極パターン、接合用電極２０および補補助用電極２６を形成する前に形成されてもよく後に形成されてもよい。なお、親基板として多層基板が用いられる場合には、グランド電極は、親基板を形成する際に、親基板の内部に形成されてもよい。   An electrode pattern having mounting lands, a bonding electrode 20 as a further mounting land, and an auxiliary electrode 26 as an auxiliary land are placed at predetermined positions on one main surface of each substrate 14 of the parent substrate. Formed simultaneously. A ground electrode is formed on the other main surface of each substrate 14 of the parent substrate. The ground electrode may be formed before or after the electrode pattern, the bonding electrode 20 and the auxiliary electrode 26 are formed on the parent substrate. When a multilayer substrate is used as the parent substrate, the ground electrode may be formed inside the parent substrate when the parent substrate is formed.

それから、電極パターンの実装用ランド、接合用電極２０、および補助用電極２６上には、はんだペーストを印刷することによって、実装用はんだパターン、さらなる実装用はんだパターン２４、および補助用はんだ塊２８が同時に形成される。   Then, a solder paste for printing, a further mounting solder pattern 24, and an auxiliary solder lump 28 are formed on the mounting lands of the electrode pattern, the bonding electrode 20, and the auxiliary electrode 26 by printing a solder paste. Formed simultaneously.

そして、実装用はんだパターンが形成された実装用ランド上には、実装部品３０が搭載される。   Then, the mounting component 30 is mounted on the mounting land on which the mounting solder pattern is formed.

さらに、実装用はんだパターン２４が形成された４つの接合用電極２０上には、金属ケース３２が搭載される。この場合、金属ケース３２の４隅の８つの脚部３６は、それらの下面にはんだフラックスがつけられて、実装用はんだパターン２４が形成された４つの接合用電極２０上に載置される。また、金属ケース３２の爪部３８の先端部４２は、基板１４の嵌合用凹部１８に嵌合される。さらに、金属ケース３２の爪部３８の中間部４０は、基板１４上に配置される。   Furthermore, a metal case 32 is mounted on the four bonding electrodes 20 on which the mounting solder patterns 24 are formed. In this case, the eight leg portions 36 at the four corners of the metal case 32 are placed on the four joining electrodes 20 on which the soldering flux 24 for mounting is formed with solder flux applied to the lower surfaces thereof. Further, the tip end portion 42 of the claw portion 38 of the metal case 32 is fitted into the fitting recess 18 of the substrate 14. Further, the intermediate portion 40 of the claw portion 38 of the metal case 32 is disposed on the substrate 14.

そして、リフローにより、実装部品３０は実装用はんだパターンによって電極パターンの実装用ランドに接合され、金属ケース３２の脚部３６は実装はんだパターン２４によって接合用電極２０に接合される。なお、この場合、金属ケース３２の爪部３８は、補助用はんだ塊２８によって、補助用電極２６に接合されても接合されなくてもよい。   Then, by reflow, the mounting component 30 is bonded to the mounting land of the electrode pattern by the mounting solder pattern, and the leg portion 36 of the metal case 32 is bonded to the bonding electrode 20 by the mounting solder pattern 24. In this case, the claw portion 38 of the metal case 32 may or may not be joined to the auxiliary electrode 26 by the auxiliary solder lump 28.

それから、親基板が各基板１４に切断されることによって、各電子部品１０が製造される。   Then, each electronic component 10 is manufactured by cutting the parent substrate into each substrate 14.

この電子部品１０では、電子部品本体１２において基板１４の実装面上であって嵌合用凹部１８の内側に補助用電極２６が形成され、補助用電極２６上に補助用はんだ塊２８が形成されているので、金属ケース３２の爪部３８の先端部４２が乗り上がろうとする部分の相対高さが補助用電極２６および補助用はんだ塊２８によって高まる。そのため、この電子部品１０を製造する際に金属ケース３２の爪部３８の先端部４２が基板１４の嵌合用凹部１８に嵌合するように金属ケース３２を搭載した後に金属ケース３２の爪部３８が持ち上げられても、基板１４の長手方向において、金属ケース３２の爪部３８の先端部４２の基板１４上への乗り上がりを防止することができ、基板１４に対する金属ケース３２の位置ずれを防止することができる。   In the electronic component 10, an auxiliary electrode 26 is formed on the mounting surface of the substrate 14 in the electronic component main body 12 and inside the fitting recess 18, and an auxiliary solder lump 28 is formed on the auxiliary electrode 26. Therefore, the relative height of the portion where the tip end portion 42 of the claw portion 38 of the metal case 32 is about to climb is increased by the auxiliary electrode 26 and the auxiliary solder lump 28. Therefore, when the electronic component 10 is manufactured, the claw portion 38 of the metal case 32 is mounted after the metal case 32 is mounted so that the tip 42 of the claw portion 38 of the metal case 32 fits into the fitting recess 18 of the substrate 14. Even if the metal plate 32 is lifted, it is possible to prevent the tip portion 42 of the claw portion 38 of the metal case 32 from climbing onto the substrate 14 in the longitudinal direction of the substrate 14 and to prevent the metal case 32 from being displaced relative to the substrate 14. can do.

さらに、この電子部品１０では、金属ケース３２の爪部３８の先端部４２が乗り上がろうとする部分の相対高さが補助用電極２６および補助用はんだ塊２８によって高まるので、基板１４に対する金属ケース３２の位置ずれを防止するためには基板１４の下面から突出するような長い爪部が不要であり、基板１４の下面から金属ケース３２の爪部３８の先端部４２が突出することを防止することができる。   Further, in this electronic component 10, the relative height of the portion where the tip 42 of the claw portion 38 of the metal case 32 is about to climb is increased by the auxiliary electrode 26 and the auxiliary solder lump 28, so that the metal case with respect to the substrate 14. In order to prevent the displacement of the position 32, a long claw portion that protrudes from the lower surface of the substrate 14 is unnecessary, and the front end portion 42 of the claw portion 38 of the metal case 32 is prevented from protruding from the lower surface of the substrate 14. be able to.

また、この電子部品１０では、基板１４における嵌合用凹部１８と補助用電極２６との隙間が金属ケース３２の材料である金属板の板厚以下の「０」であるので、その隙間に金属ケース３２の爪部３８の先端部４２が乗り上がることを防止することができる。このように、基板１４における嵌合用凹部１８と補助用電極２６との隙間は、金属ケース３２の材料である金属板の板厚以下であることが好ましい。   Further, in this electronic component 10, the gap between the fitting recess 18 and the auxiliary electrode 26 in the substrate 14 is “0” which is equal to or less than the thickness of the metal plate that is the material of the metal case 32. It is possible to prevent the tip portion 42 of the 32 claw portions 38 from climbing up. Thus, the gap between the fitting recess 18 and the auxiliary electrode 26 in the substrate 14 is preferably equal to or less than the thickness of the metal plate that is the material of the metal case 32.

上述のように、この電子部品１０では、補助用はんだ塊２８が土手の役割を果たし、金属ケース３２の爪部３８を長く形成することなく、爪部３８が実質的に嵌合する長さを確保することができる。また、補助用電極２６は、実装用ランドと同様に形成することができ、補助用はんだ塊２８も、実装用はんだパターンと同様に形成することができるので、特に新たな工程や特別な処理を施すことなく、基板１４に対する金属ケース３２の位置ずれを防止することができる。   As described above, in this electronic component 10, the auxiliary solder lump 28 serves as a bank, and the length of the claw portion 38 is substantially fitted without forming the claw portion 38 of the metal case 32 long. Can be secured. Further, the auxiliary electrode 26 can be formed in the same manner as the mounting land, and the auxiliary solder block 28 can be formed in the same manner as the mounting solder pattern. Without applying, the displacement of the metal case 32 relative to the substrate 14 can be prevented.

なお、この電子部品１０では、多数の電極用凹部１６に多数の端子用電極を有するので、多端子化に対応することができる。また、この電子部品１０では、各接合用電極２０に金属ケース３２の２つずつの脚部３６が接合されているので、基板１４と金属ケース３２との接合強度が大きい。さらに、この電子部品１０では、金属ケース３２が接合用電極２０などを介してグランド電極に接続されているため、金属ケース３２によるシールド効果を高めることができる。また、接合用電極２０はスルーホール２２を介してグランド電極に接続されているため、接合用電極２０が基板１４から剥がれにくい。そのほか、この電子部品１０では、金属ケース３２の２つずつの脚部３６がそれらの主面が直交するように配置されているので、金属ケース３２は、どの方向から受ける力に対しても変形しにくく撓みにくい。   In addition, since this electronic component 10 has a large number of terminal electrodes in a large number of electrode recesses 16, it can cope with the increase in the number of terminals. Further, in this electronic component 10, since the two leg portions 36 of the metal case 32 are bonded to each bonding electrode 20, the bonding strength between the substrate 14 and the metal case 32 is high. Furthermore, in this electronic component 10, since the metal case 32 is connected to the ground electrode via the bonding electrode 20 or the like, the shielding effect by the metal case 32 can be enhanced. Further, since the bonding electrode 20 is connected to the ground electrode through the through hole 22, the bonding electrode 20 is hardly peeled off from the substrate 14. In addition, in this electronic component 10, since the two leg portions 36 of the metal case 32 are arranged so that their main surfaces are orthogonal, the metal case 32 is deformed with respect to the force received from any direction. Hard to bend.

図４は、この発明にかかる電子部品に用いられる電子部品本体の他の例を示す要部図解図である。図１に示す電子部品１０では、補助用電極２６および補助用はんだ塊２８が長方形状に形成されているが、補助用電極２６および補助用はんだ塊２８は、図４に示すように、嵌合用凹部１８を囲むようにコ字状に形成されてもよい。このように補助用電極２６および補助用はんだ塊２８をコ字状に形成すれば、基板１４の長手方向においてだけでなく、基板１４の幅方向においても、金属ケース３２の爪部３８の先端部４２の基板１４上への乗り上がりを防止することができ、基板１４に対する金属ケース３２の位置ずれを防止することができる。   FIG. 4 is a main part illustrative view showing another example of an electronic component main body used in the electronic component according to the present invention. In the electronic component 10 shown in FIG. 1, the auxiliary electrode 26 and the auxiliary solder lump 28 are formed in a rectangular shape, but the auxiliary electrode 26 and the auxiliary solder lump 28 are for fitting as shown in FIG. It may be formed in a U shape so as to surround the recess 18. If the auxiliary electrode 26 and the auxiliary solder lump 28 are formed in a U shape in this way, the tip of the claw portion 38 of the metal case 32 is not only in the longitudinal direction of the substrate 14 but also in the width direction of the substrate 14. 42 can be prevented from climbing onto the substrate 14, and displacement of the metal case 32 relative to the substrate 14 can be prevented.

図５は、この発明にかかる電子部品の他の例を示す斜視図であり、図６は、図５に示す電子部品に用いられる電子部品本体を示す図解図である。図５に示す電子部品１０では、図１に示す電子部品１０と比べて、基板１４の幅方向において対向する２つの側面およびその内側に、さらなる３組の嵌合用凹部１８、補助用電極２６および補助用はんだ塊２８が形成されているとともに、それらに対応して、金属ケース３２の幅方向における両端に、さらなる３つの爪部３８が形成されている。   FIG. 5 is a perspective view showing another example of the electronic component according to the present invention, and FIG. 6 is an illustrative view showing an electronic component main body used for the electronic component shown in FIG. In the electronic component 10 shown in FIG. 5, compared to the electronic component 10 shown in FIG. 1, three additional sets of fitting recesses 18, auxiliary electrodes 26, and two side surfaces opposed in the width direction of the substrate 14 and the inside thereof are provided. Auxiliary solder masses 28 are formed, and correspondingly, three further claw portions 38 are formed at both ends in the width direction of the metal case 32.

図５に示す電子部品１０は、図１に示す電子部品１０を製造するための上述の方法と同様の方法によって、製造することができる。   The electronic component 10 shown in FIG. 5 can be manufactured by the same method as the above-described method for manufacturing the electronic component 10 shown in FIG.

図５に示す電子部品１０では、図１に示す電子部品１０と比べて、基板１４の幅方向において、金属ケース３２の爪部３８の先端部４２の基板１４上への乗り上がりを防止することができ、基板１４に対する金属ケース３２の位置ずれを防止することができるという効果も奏する。   In the electronic component 10 shown in FIG. 5, compared to the electronic component 10 shown in FIG. 1, the tip portion 42 of the claw portion 38 of the metal case 32 is prevented from climbing onto the substrate 14 in the width direction of the substrate 14. This also has the effect of preventing the displacement of the metal case 32 relative to the substrate 14.

なお、上述の各電子部品１０では、基板１４として両面プリント基板が用いられているが、この発明では、基板として、片面プリント基板が用いられてもよく、また、セラミック基板が用いられてもよい。   In each electronic component 10 described above, a double-sided printed board is used as the board 14, but in the present invention, a single-sided printed board may be used as the board, or a ceramic board may be used. .

また、上述の各電子部品１０では、嵌合用凹部１８が矩形状に形成されているが、この発明では、嵌合用凹部１８は半円形状など他の形成に形成されてもよい。このように嵌合用凹部１８が半円形状に形成される場合には、補助用電極２６および補助用はんだ塊２８は、嵌合用凹部１８を囲むようにＣ字状に形成されてもよい。   Further, in each of the electronic components 10 described above, the fitting recess 18 is formed in a rectangular shape, but in the present invention, the fitting recess 18 may be formed in another shape such as a semicircular shape. In this way, when the fitting recess 18 is formed in a semicircular shape, the auxiliary electrode 26 and the auxiliary solder lump 28 may be formed in a C shape so as to surround the fitting recess 18.

さらに、上述の各電子部品１０では、金属ケース３２の脚部３６が台形板状に形成されているが、金属ケース３２の脚部３６は、矩形板状などの他の板状や図７に示す脚部７のような断面Ｌ字状など他の形状に形成されてもよく、その形状は問わない。   Further, in each of the electronic components 10 described above, the leg portion 36 of the metal case 32 is formed in a trapezoidal plate shape, but the leg portion 36 of the metal case 32 may be formed in another plate shape such as a rectangular plate shape or in FIG. It may be formed in other shapes such as an L-shaped cross section like the leg 7 shown, and the shape is not limited.

また、上述の電子部品１０の製造方法では、リフローにより、実装部品３０と金属ケース３２とが同時に基板１４に接合されているが、実装部品３０が先に基板１４に接合され、金属ケース３２が後で基板１４に接合されてもよい。   Moreover, in the manufacturing method of the electronic component 10 described above, the mounting component 30 and the metal case 32 are simultaneously bonded to the substrate 14 by reflow. However, the mounting component 30 is first bonded to the substrate 14 and the metal case 32 is It may be bonded to the substrate 14 later.

この発明にかかる電子部品は、たとえば携帯電話などの無線通信機器に搭載される無線通信用高周波電子部品などに利用される。   The electronic component according to the present invention is used for a radio communication high frequency electronic component mounted on a radio communication device such as a mobile phone.

この発明にかかる電子部品の一例を示す斜視図である。It is a perspective view which shows an example of the electronic component concerning this invention. 図１に示す電子部品に用いられる電子部品本体を示す図解図である。It is an illustration figure which shows the electronic component main body used for the electronic component shown in FIG. 図１に示す電子部品の製造方法の製造工程を示すフロー図である。It is a flowchart which shows the manufacturing process of the manufacturing method of the electronic component shown in FIG. この発明にかかる電子部品に用いられる電子部品本体の他の例を示す要部図解図である。It is a principal part solution figure which shows the other example of the electronic component main body used for the electronic component concerning this invention. この発明にかかる電子部品の他の例を示す斜視図である。It is a perspective view which shows the other example of the electronic component concerning this invention. 図５に示す電子部品に用いられる電子部品本体を示す図解図である。It is an illustration figure which shows the electronic component main body used for the electronic component shown in FIG. 従来の電子部品の一例を示す斜視図である。It is a perspective view which shows an example of the conventional electronic component. 図７に示す電子部品に用いられる電子部品本体を示す図解図である。It is an illustration figure which shows the electronic component main body used for the electronic component shown in FIG.

符号の説明Explanation of symbols

１０ 電子部品
１２ 電子部品本体
１４ 基板
１６ 電極用凹部
１８ 嵌合用凹部
２０ 接合用電極
２２ スルーホール
２４ 実装用はんだパターン
２６ 補助用電極
２８ 補助用はんだ塊
３０ 実装部品
３２ 金属ケース
３４ 天板部
３６ 脚部
３８ 爪部
４０ 中間部
４２ 先端部 DESCRIPTION OF SYMBOLS 10 Electronic component 12 Electronic component main body 14 Substrate 16 Electrode recessed part 18 Fitting recessed part 20 Joining electrode 22 Through hole 24 Solder pattern for mounting 26 Auxiliary electrode 28 Auxiliary solder lump 30 Mounting part 32 Metal case 34 Top plate part 36 Leg Part 38 Claw part 40 Middle part 42 Tip part

Claims (3)

少なくとも一方主面が実装面となる基板、および前記基板の前記実装面に実装される実装部品を備え、前記基板の側面に電極非形成部を備えた嵌合用凹部と、前記基板の一方主面に接合用電極とが形成された電子部品本体と、
前記基板の前記実装面の少なくとも一部を覆うように前記基板の前記実装面から所定間隔を隔てて設けられる天板部、前記天板部から曲折されるように形成され、前記基板に形成された前記嵌合用凹部に嵌合する爪部、および前記天板部から曲折されるように形成され、前記接合用電極に接合される脚部を備える金属ケースとを含む電子部品であって、
前記電子部品本体において前記基板の前記実装面上であって前記嵌合用凹部の内側に補助用ランドが形成され、
前記補助用ランド上に、前記金属ケースの前記爪部が前記嵌合用凹部から外れて前記基板の主面に乗り上がることを防止するための補助用はんだ塊が形成されている、電子部品。 A substrate having at least one main surface as a mounting surface; and a mounting component mounted on the mounting surface of the substrate; and a fitting recess having an electrode non-forming portion on a side surface of the substrate; and the one main surface of the substrate An electronic component main body formed with a bonding electrode ;
The mounting surface top plate portion provided at a predetermined distance from said mounting surface of said substrate so as to cover at least a portion of said substrate, is formed so as to be bent from the front SL top plate portion, formed on the substrate A claw part that fits into the fitting concave part , and a metal case that is formed to be bent from the top plate part and includes a leg part joined to the joining electrode ,
An auxiliary land is formed on the mounting surface of the substrate in the electronic component main body and inside the recess for fitting,
An electronic component in which an auxiliary solder lump is formed on the auxiliary land to prevent the claw portion of the metal case from coming off the fitting recess and riding on the main surface of the substrate. 前記基板における前記嵌合用凹部と前記補助用ランドとの隙間は、前記金属ケースの材料である金属板の板厚以下である、請求項１に記載の電子部品。   2. The electronic component according to claim 1, wherein a gap between the fitting recess and the auxiliary land in the substrate is equal to or less than a thickness of a metal plate that is a material of the metal case. 請求項１または請求項２に記載の電子部品を製造するための電子部品の製造方法であって、
電子部品本体用の基板に実装用ランドおよび補助用ランドを形成する工程、
前記実装用ランドおよび前記補助用ランド上に実装用はんだパターンおよび補助用はんだ塊を形成する工程、
前記実装用はんだパターンが形成された前記実装用ランドの所定のものの上に実装部品を搭載する工程、
金属ケースの爪部が基板の嵌合用凹部に嵌合するように、前記実装用はんだパターンが形成された前記実装用ランドの他のものの上に金属ケースを搭載する工程、および
リフローにより前記実装部品および前記金属ケースを前記実装用ランドに接合する工程を含む、電子部品の製造方法。 An electronic component manufacturing method for manufacturing the electronic component according to claim 1 or 2,
Forming a mounting land and an auxiliary land on a substrate for an electronic component body;
Forming a mounting solder pattern and an auxiliary solder lump on the mounting land and the auxiliary land,
Mounting a mounting component on a predetermined one of the mounting lands on which the mounting solder pattern is formed;
A step of mounting the metal case on the other of the mounting lands on which the solder pattern for mounting is formed so that the claw portion of the metal case fits into the recess for fitting of the substrate, and the mounting component by reflow And a method of manufacturing an electronic component, comprising joining the metal case to the mounting land.
JP2006180271A 2006-06-29 2006-06-29 Electronic component and manufacturing method thereof Expired - Fee Related JP4844260B2 (en)

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